CN101556034A - Light source device - Google Patents

Abstract

The present invention relates to a light source device, which comprises: an insulator, the insulator has an accommodating groove; a heat conductor, which is arranged in the insulator and is opposite to the accommodating groove; The bearing part at the bottom of the groove; a flat first electrode and a flat second electrode, the first electrode and the second electrode are respectively embedded in the insulator and both extend into the accommodating groove, and are connected to the heat conductor Phase separation; a light emitting diode chip, which is directly arranged on the bearing part of the heat conductor; and metal wires, the first electrode and the second electrode are respectively electrically connected to the light emitting diode chip through the metal wires.

Description

Light source device

technical field

The invention relates to a light source device, in particular to a light source device with solid-state light-emitting elements such as light-emitting diode chips.

Background technique

Now, light-emitting diodes (Light Emitting Diode, LED) have been widely used in many fields. Here, a new type of light-emitting diode can be found in the document IEEE Journal on Selected Topics in Quantum Electronics, Vol.8, No. .2, Illumination With Solid State Lighting Technology in March/April 2002. LEDs can generally emit light of specific wavelengths, such as visible light, but most of the energy received by LEDs is converted into heat, and the rest of the energy is actually converted into light energy. Therefore, the heat generated by the light-emitting diodes must be dissipated to ensure the normal operation of the light-emitting diodes.

As shown in FIG. 1 , a light source device 10 includes a casing 11 , a light source module 12 and a lampshade 13 . The light source module 12 is disposed in the casing 11 , and the lampshade 13 is disposed above the light source module 12 to protect the light source module 12 . The light source module 12 includes: a printed circuit board (Printed Circuit Board, PCB) 121, a metal circuit layer 122 and a plurality of light emitting elements 123 (such as light emitting diode chips) arranged on the printed circuit board 121, and covering The package body 124 of the light emitting element 123 . The plurality of light emitting elements 123 are electrically connected to the metal circuit layer 122 . However, the heat generated by the plurality of light emitting elements 123 cannot be removed from the casing 11 effectively in time, thereby reducing the luminous efficiency of the plurality of light emitting elements 123 . It can be seen that it is necessary to provide a light source device with high heat dissipation efficiency.

Contents of the invention

A light source device with high heat dissipation efficiency will be described below with an embodiment.

A light source device with a light-emitting diode chip, which includes: an insulator, the insulator has an accommodating groove; a heat conductor, which is arranged in the insulator and is opposite to the accommodating groove, the heat conductor has a The bearing part at the bottom of the accommodating tank; a flat first electrode and a flat second electrode, the first electrode and the second electrode are respectively embedded in the insulator and both extend into the accommodating tank, and are connected with the The thermal conductor is phase-separated; a light-emitting diode chip is directly arranged on the bearing part of the thermal conductor; and metal wires, the first electrode and the second electrode are respectively electrically connected to the light-emitting diode chip through the metal wires.

Compared with the prior art, the light-emitting diode chip in the light source device is directly arranged on the bearing part of the heat conductor and forms a good thermal connection with the heat conductor, so the heat generated when the light-emitting diode chip emits light can be directly conducted to the heat conductor, Then the heat conductor conducts the absorbed heat to the outside air, thereby reducing the temperature of the LED chip, improving the heat dissipation efficiency of the light source device, and the luminous efficiency and service life of the LED chip. In addition, the first electrode and the second electrode are respectively embedded in the insulator and both extend into the accommodating groove, so that the external circuit electrically connected with the light source device is located above the light source device; The heat conductor is thermally connected, so that the heat conduction direction of the light source device is downward, thereby effectively avoiding the external circuit, thereby reducing the thermal resistance of the light source device and improving its heat dissipation efficiency.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional light source device.

FIG. 2 is a schematic top view of the light source device provided by the first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view along III-III of the light source device shown in FIG. 2 .

FIG. 4 is a schematic cross-sectional view of a through hole at the bottom of the heat conductor of the light source device shown in FIG. 2 .

FIG. 5 is a schematic cross-sectional view of the heat conductor of the light source device shown in FIG. 2 having a rectangular parallelepiped structure.

FIG. 6 is a schematic top view of a light source device provided by a second embodiment of the present invention.

FIG. 7 is a schematic cross-sectional view along VII-VII of the light source device shown in FIG. 6 .

FIG. 8 is a schematic cross-sectional view of a light source device provided by a third embodiment of the present invention.

FIG. 9 is an exploded schematic cross-sectional view of a light source device provided by a fourth embodiment of the present invention.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings.

2 and 3, a light source device 20 provided by the first embodiment of the present invention includes an insulator 21, a heat conductor 22, a first electrode 23, a second electrode 24, a light emitting diode chip 25, and a metal wire 26 .

The insulator 21 includes a support portion 210 and a reflective portion 212 integrally formed with the support portion 210 . The reflective portion 212 is located on one side of the support portion 210 , and in this embodiment, the reflective portion 212 is located above the support portion 210 . The reflective portion 212 has a receiving groove 2120 , the bottom of the receiving groove 2120 extends to the support portion 210 , that is, the portion of the supporting portion 210 opposite to the receiving groove 2120 is exposed at the bottom of the receiving groove 2120 . The accommodating groove 2120 has a conical sidewall 2102 , and a reflective layer 2104 can be disposed on the conical sidewall 2102 . The material used for the insulator 21 can be plastic, such as polyphthalamide (Polyphthalamide, PPA), liquid crystal polymer (Liquid crystal polymer, LCP) and so on.

The heat conductor 22 is embedded in the support portion 210 of the insulator 21 along a direction close to the reflective portion 212 and is opposite to the accommodating groove 2120 . The heat conductor 22 has a carrying portion 220 exposed at the bottom of the receiving groove 2120 and a bottom 221 opposite to the carrying portion 220 , the carrying portion 220 is used for carrying the LED chip 25 . In this embodiment, the width d of the carrying portion 220 is smaller than the width D of the bottom 221 . The material used for the heat conductor 22 can be copper, aluminum and other metals with good thermal conductivity, or heat conductive materials such as silica gel and ceramics.

The first electrode 23 and the second electrode 24 are both flat plates, that is, both of them have no bends, so that when they are subjected to a large external force, they will not be broken due to their own stress changes, and the improvement will be improved. The reliability of the first electrode 23 and the second electrode 24 is improved. One end of the first electrode 23 and one end of the second electrode 24 are respectively embedded in the junction of the support portion 210 and the reflective portion 212 of the insulator 21 and both extend into the accommodating groove 2120 , and respectively have The portion of the bottom of the slot 2120. The other end of the first electrode 23 and the other end of the second electrode 24 both extend out of the accommodating groove 2120 for connecting with an external circuit (not shown). Both the first electrode 23 and the second electrode 24 are electrically insulated from the heat conductor 22 . In addition, the first electrode 23 and the second electrode 24 are respectively arranged on the left and right sides of the light emitting diode chip 25. Here, the light emitting diode chip 25 is respectively connected to the first electrode 23 and the second electrode 24 through two metal wires 26. The portion exposed at the bottom of the accommodating groove 2120 forms an electrical connection.

The light-emitting diode chip 25 is arranged on the bearing portion 220 of the heat conductor 22, where the light-emitting diode chip 25 can form a thermal connection with the heat conductor 22 by bonding, for example, between the light-emitting diode chip 25 and the bearing portion 220 of the heat conductor 22 Viscose glue such as silver glue and conductive glue is provided. It can be understood that the light emitting diode chip 25 can also be thermally connected to the heat conductor 22 in other ways, such as eutectic bonding. The light emitted by the light emitting diode chip 25 is emitted through the opening of the accommodating groove 2120, and the light incident on the side wall 2102 of the accommodating groove 2120 can be reflected by the reflective layer 2104 on the side wall 2102 and then pass through the accommodating groove 2120 The opening of the light emitting diode chip 25 improves the light extraction efficiency.

The light source device 20 also includes a package body 27, the package body 27 is arranged in the accommodating groove 2120 of the insulator 21 to cover the light-emitting diode chip 25 and the metal wire 26, so as to prevent the light-emitting diode chip 25 and the metal wire 26 from being in contact with water vapor. Oxidized. The outer surface 270 of the package body 27 can be a convex curved surface or a concave curved surface, so as to change the angle at which the light emitted by the LED chip 25 exits through the outer surface 270 , so as to change the irradiation range of the light source device 20 . A light wavelength conversion substance, such as phosphor, may also be disposed in the package body 27 . If the package body 27 is doped with yellow phosphor, when the blue light emitted by the LED chip 25 exits through the package body 27, some of the blue light will be converted into yellow light, and the unconverted blue light will combine with the converted yellow light to form white light. The package body 27 is made of epoxy resin, silicone resin or other electrically insulating transparent materials.

In this embodiment, the heat conductor 22, the first electrode 23 and the second electrode 24 are arranged in the insulator 21 through insert-molding technology, which ensures that the first electrode 23 and the second electrode 24 are compatible with heat conduction. The bodies 22 have good electrical insulation performance, and the heat conductor 22 and the insulator 21 have good heat conduction performance.

Since the light-emitting diode chip 25 is directly arranged on the bearing part 220 of the heat conductor 22 and forms a good thermal connection with the heat conductor 22, the heat generated when the light-emitting diode chip 25 emits light can be directly conducted to the heat conductor 22, and then the heat conductor 22 The absorbed heat is transferred to the outside air, thereby reducing the temperature of the LED chip 25 , improving the heat dissipation efficiency of the light source device 20 , as well as the luminous efficiency and service life of the LED chip 25 .

In addition, the first electrode 23 and the second electrode 24 are located on the upper half of the light source device 20, and extend out of the accommodating groove 2120 to be connected to an external circuit (not shown), so that the external circuit is located above the light source device 20; The light-emitting diode chip 25 is thermally connected to the heat conductor 22 below, so that the heat conduction direction of the light source device 20 is downward, thereby effectively avoiding the external circuit, thereby reducing the thermal resistance of the light source device 20 and improving its performance. Cooling performance.

Referring to Fig. 4, the bottom 221 of the heat conductor 22 can also have a through hole 2210, and when the heat conductor 22 is arranged in the support part 210 of the insulator 21 through the embedded injection molding technology, the part of the structure in the support part 210 can be covered. The through hole 2210 improves the contact area and contact reliability between the heat conductor 22 and the supporting part 210 . The width H of the bottom 221 of the heat conductor 22 is greater than the total width h of the first electrode 23 and the second electrode 24 , which effectively improves the heat dissipation efficiency of the heat conductor 22 .

Please refer to FIG. 5 , the heat conductor 22 has a rectangular parallelepiped structure, and part of it is exposed at the bottom of the accommodating groove 2120. The LED chip 25 is arranged on the heat conductor 22 and is thermally connected with the heat conductor 22. Here, the LED chip 25 is located at the bottom of the accommodating groove 2120 .

Please refer to FIG. 6 and FIG. 7, a light source device 30 provided by the second embodiment of the present invention is basically the same as the light source device 20 provided by the first embodiment above, except that the first electrode 33 and the second electrode 34 are elongated, and the two are respectively arranged on opposite sides of the light emitting diode chip 25, and the middle part 330 of the first electrode 33 and the middle part 340 of the second electrode 34 have parts exposed to the accommodating groove 310 of the insulator 31 , the two ends of the first electrode 33 and the two ends of the second electrode 34 respectively extend out of the accommodating groove 310; Contact area and contact reliability. Here, the two ends of the elongated first electrode 33 and the two ends of the elongated second electrode 34 respectively extend out of the accommodating groove 310, which is beneficial to be connected in series or in parallel with an external circuit board, and improves the light source device 30. The practicability and the flexibility of wiring design of the circuit board connected to the light source device 30.

Please refer to FIG. 8 , a light source device 40 provided by the third embodiment of the present invention is basically the same as the light source device 20 provided by the first embodiment above, except that:

The bearing part 420 of the heat conductor 42 is provided with a heat conduction patch (Submount) 48, and the heat conduction patch 48 and the bearing part 420 can be bonded by bonding or eutectic way, and the material used for the heat conduction patch 48 can be Silicon, aluminum nitride, beryllium oxide, silicon dioxide, diamond like carbon, ceramic aluminum substrate, etc.;

The light-emitting diode chip 45 is packaged (Flip chip) on the thermally conductive patch 48 through two metal bumps 49 (such as gold bumps, tin balls, etc.) formed on the positive and negative electrodes of the light-emitting diode chip 45. The metal bumps 49 are respectively connected to the first electrode 43 and the second electrode 44 by wire bonding.

Referring to FIG. 9 , a light source device 50 provided by the fourth embodiment of the present invention includes a circuit board 500 , a plurality of light source devices 20 provided by the first embodiment, and a heat dissipation fin 510 .

The circuit board 500 has a plurality of through holes 501 and a metal connecting layer 502 disposed on one side of the circuit board 500 and between two adjacent through holes 501. through hole 501. The first electrode 23 and the second electrode 24 are electrically connected to the metal connection layer 502 of the circuit board 500 .

The heat dissipation fins 510 are disposed on a side of the plurality of light source devices 20 opposite to the circuit board 500 , and are thermally connected to the heat conductor 22 of each light source device 20 for dissipating heat from the light source device 20 .

Since the plurality of light source devices 20 are disposed between the circuit board 500 and the heat dissipation fins 510 , the first electrode 23 and the second electrode 24 of each light source device 20 are electrically connected to the metal connection layer 502 of the circuit board 500 . Therefore, the circuit board 500 is located above the plurality of light source devices 20, and the heat conductor 22 of each light source device 20 is thermally connected to the heat dissipation fins 510, so that the heat conduction direction of the plurality of light source devices 20 is downward, thereby The circuit board 500 is effectively avoided, thereby reducing the thermal resistance of the light source device 50 and improving its heat dissipation performance.

It can be understood that the light source devices provided in the above-mentioned second and third embodiments can also be applied to the above-mentioned fourth embodiment.

In addition, those skilled in the art can also make other changes within the spirit of the present invention, as long as it does not deviate from the technical effect of the present invention, these changes made according to the spirit of the present invention should be included within the scope of protection claimed by the present invention .

Claims (11)

1. light supply apparatus with light-emitting diode chip for backlight unit, it comprises:

An insulator, this insulator has a storage tank;

A heat carrier, it is arranged in this insulator and is relative with this storage tank, and this heat carrier has a supporting part that is exposed to this storage tank bottom;

Tabular first electrode and tabular second electrode, this first electrode and second electrode are embedded respectively in this insulator and all extend in this storage tank, and are separated with this heat carrier;

A light-emitting diode chip for backlight unit, it is set directly on the supporting part of this heat carrier; And metal wire, this first electrode and second electrode form with this light-emitting diode chip for backlight unit by this metal wire respectively and are electrically connected.

2. light supply apparatus as claimed in claim 1, it is characterized in that: this insulator comprises a support portion and one and the integrated light-reflecting portion in this support portion, this light-reflecting portion is positioned at a side of this support portion, the bottom that this storage tank is arranged in this light-reflecting portion and this storage tank extends to this support portion, and an end of this first electrode and an end of second electrode are embedded in the junction of the support portion of this insulator and light-reflecting portion respectively and all extend in this storage tank.

3. light supply apparatus as claimed in claim 1 is characterized in that: this light supply apparatus also comprises a packaging body, and this packaging body is arranged in this storage tank in order to cover this light-emitting diode chip for backlight unit and this metal wire.

4. light supply apparatus as claimed in claim 1 is characterized in that: this heat carrier has a bottom relative with this supporting part, and the width of the supporting part of this heat carrier is less than the width of the bottom of this heat carrier.

5. light supply apparatus as claimed in claim 4 is characterized in that: the width of this bottom is greater than the overall width of this first electrode and second electrode.

6. light supply apparatus as claimed in claim 4 is characterized in that: this light supply apparatus also comprises a radiating fin, the bottom thermally coupled of this radiating fin and this heat carrier.

7. light supply apparatus as claimed in claim 1, it is characterized in that: this first electrode is strip with second electrode and is separately positioned on the relative both sides of this light-emitting diode chip for backlight unit, the middle part of the middle part of this first electrode and second electrode is exposed in this storage tank, and this storage tank is extended at the two ends of the two ends of this first electrode and second electrode respectively.

8. light supply apparatus as claimed in claim 1 is characterized in that: the inwall of this storage tank is provided with the reflecting layer, in order to reflect the light that this light-emitting diode chip for backlight unit sends.

9. light supply apparatus as claimed in claim 1 is characterized in that: this light-emitting diode chip for backlight unit is to be arranged on the supporting part of this heat carrier by bonding mode or eutectic mode.

10. light supply apparatus as claimed in claim 1 is characterized in that: this light-emitting diode chip for backlight unit be by the metal coupling chip package on the supporting part of this heat carrier, this metal coupling is connected with this first electrode and the second electrode routing.

11. light supply apparatus as claimed in claim 1, it is characterized in that: this light supply apparatus also comprises a circuit board, this circuit board comprises through hole and metallic circuit, and the storage tank of this insulator is located in this through hole, and this first electrode and second electrode are electrically connected with this metallic circuit.

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