CN101564805A - Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste - Google Patents
Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste Download PDFInfo
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- CN101564805A CN101564805A CNA2009100862055A CN200910086205A CN101564805A CN 101564805 A CN101564805 A CN 101564805A CN A2009100862055 A CNA2009100862055 A CN A2009100862055A CN 200910086205 A CN200910086205 A CN 200910086205A CN 101564805 A CN101564805 A CN 101564805A
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- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 4
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
低银SnAgCu无铅焊膏用新型环保型助焊剂属于无铅焊料助焊剂领域。本发明的目的在于提供一种适用于低银SnAgCu无铅焊膏的助焊剂。本发明助焊剂的组成及含量为：活化剂5.0－13.0％、溶剂32.0－41.0％、缓蚀剂0.8－5.0％、触变剂1.0－6.0％、成膏剂2.0－9.0％、稳定剂0.3－2.5％、表面活性剂0.5－5.0％、改性松香35.0－48.0％。活化剂采用多种有机酸复配，沸点分布区间广，能够在整个焊接过程中都起到较好的活性作用，并且在钎焊温度下能够大部分挥发、升华或分解，确保焊后无腐蚀。本发明具有不含卤素、助焊性能好、焊后残留少且为硬质膜状、绝缘电阻高等优点。The invention discloses a novel environment-friendly flux for low-silver SnAgCu lead-free solder paste and belongs to the field of lead-free solder flux. The object of the present invention is to provide a flux suitable for low-silver SnAgCu lead-free solder paste. The composition and content of the flux of the present invention are: activator 5.0-13.0%, solvent 32.0-41.0%, corrosion inhibitor 0.8-5.0%, thixotropic agent 1.0-6.0%, paste forming agent 2.0-9.0%, stabilizer 0.3- 2.5%, surfactant 0.5-5.0%, modified rosin 35.0-48.0%. The activator is compounded with a variety of organic acids, with a wide range of boiling point distribution, which can play a good active role in the whole welding process, and most of it can volatilize, sublimate or decompose at the brazing temperature, ensuring no corrosion after welding . The invention has the advantages of no halogen, good soldering performance, less residue after soldering, hard film shape, high insulation resistance and the like.
Description
技术领域 technical field
本发明属于无铅焊料助焊剂领域，具体涉及一种助焊剂，尤其是适用于低银SnAgCu无铅焊膏用的助焊剂。The invention belongs to the field of lead-free solder flux, in particular to a flux, in particular to a flux suitable for low-silver SnAgCu lead-free solder paste.
背景技术 Background technique
近年来，电子封装和表面组装技术的无铅化要求促进了无铅钎料研究工作的快速发展。在众多被研究的无铅钎料之中，SnAgCu钎料由于具有较好的综合性能，而被视为较理想的SnPb钎料的替代品之一。但是由于低银SnAgCu无铅钎料合金的熔化温度范围较大，熔点高且偏离共晶点，使钎焊温度升高，对回流焊接过程提出更大的挑战。因此，无铅钎焊对助焊剂的性能也提出了更高的要求。需要重新评估焊膏的化学成分在较高的工艺温度下的变化，如助焊剂的挥发等。为了缩小与国外产品的差距，急需开发出性能优越、环保的无铅焊膏，而研制与无铅钎料匹配的助焊剂也就成为了必然要求。In recent years, the lead-free requirements of electronic packaging and surface mount technology have promoted the rapid development of lead-free solder research. Among the many researched lead-free solders, SnAgCu solder is regarded as one of the ideal substitutes for SnPb solder because of its better comprehensive properties. However, due to the large melting temperature range of the low-silver SnAgCu lead-free solder alloy, the melting point is high and deviates from the eutectic point, which increases the brazing temperature and poses a greater challenge to the reflow soldering process. Therefore, lead-free soldering also puts forward higher requirements on the performance of the flux. Changes in the chemical composition of the solder paste at higher process temperatures, such as flux volatilization, need to be re-evaluated. In order to narrow the gap with foreign products, it is urgent to develop a lead-free solder paste with superior performance and environmental protection, and the development of a flux that matches the lead-free solder has become an inevitable requirement.
由于无铅钎料的焊接温度比锡铅钎料要高，并且前者的润湿性能也相对较差，因此，目前适用于锡铅钎料的助焊剂无法满足无铅钎料的焊接要求。选择合适的助焊剂可以改善钎料的钎焊性能。除了具有常规助焊剂应该具备的性能，无铅钎剂还对活化温度、抗氧化能力、活性强度以及热稳定性等有不同的要求。对于无铅钎料而言，要求与其匹配的助焊剂具有更好的抗氧化性、更强的活性以及更高的热稳定性。总之，助焊剂必须能够完全承受整个再流焊过程。Since the soldering temperature of lead-free solder is higher than that of tin-lead solder, and the wettability of the former is relatively poor, the current flux suitable for tin-lead solder cannot meet the soldering requirements of lead-free solder. Choosing the right flux can improve the brazing performance of the solder. In addition to the properties that conventional fluxes should have, lead-free fluxes also have different requirements for activation temperature, oxidation resistance, activity strength, and thermal stability. For lead-free solder, the matching flux is required to have better oxidation resistance, stronger activity and higher thermal stability. In conclusion, the flux must be able to fully withstand the entire reflow process.
目前，国内适用于低银SnAgCu无铅焊膏用助焊剂的研究较少，本发明就是针对低银SnAgCu无铅焊膏配制的需要，开发新型的松香型无卤素免清洗助焊剂。At present, there are few domestic researches on flux suitable for low-silver SnAgCu lead-free solder paste. The present invention aims at the preparation of low-silver SnAgCu lead-free solder paste and develops a new type of rosin-type halogen-free no-clean flux.
发明内容 Contents of the invention
本发明的目的在于解决现有的技术问题，提供一种助焊性能良好、抗氧化性能强、热稳定性高、焊后无腐蚀的低银SnAgCu无铅焊膏用新型环保型助焊剂。The purpose of the present invention is to solve the existing technical problems and provide a new environment-friendly flux for low-silver SnAgCu lead-free solder paste with good soldering performance, strong oxidation resistance, high thermal stability and no corrosion after soldering.
本发明所提供的低银SnAgCu无铅焊膏用新型环保型助焊剂的组成及其质量百分含量为：The composition and the mass percentages thereof of the new environment-friendly soldering flux for the low-silver SnAgCu lead-free solder paste provided by the present invention are:
活化剂 5.0-13.0％Activator 5.0-13.0%
溶剂 32.0-41.0％Solvent 32.0-41.0%
缓蚀剂 0.8-5.0％Corrosion inhibitor 0.8-5.0%
触变剂 1.0-6.0％Thixotropic agent 1.0-6.0%
成膏剂 2.0-9.0％Paste 2.0-9.0%
稳定剂 0.3-2.5％Stabilizer 0.3-2.5%
表面活性剂 0.5-5.0％Surfactant 0.5-5.0%
改性松香 35.0-48.0％Modified rosin 35.0-48.0%
其中，所述的活化剂为有机酸，选自二元羧酸、三元羧酸或羟基酸，可以是同一类酸中的两种以上混合，也可以是不同类酸中的两种以上混合；所述二元羧酸为丁二酸、戊二酸、己二酸、顺丁烯二酸、衣康酸，所述三元羧酸为柠檬酸，所述羟基酸为DL-苹果酸、水杨酸中的两种以上混合。活化剂是助焊剂的灵魂。本发明所选用的活化剂具有清除钎焊金属和钎料表面氧化膜的足够能力，在整个钎焊过程发挥活化作用，对提高润湿性起着关键的作用。同时，活化剂又决定着助焊剂及其残留物的腐蚀性能。本发明中的活化剂在钎焊温度下能够大部分挥发、升华或分解，使印刷电路板焊后的有机酸残留物少，无腐蚀。Wherein, the activator is an organic acid, selected from dicarboxylic acid, tricarboxylic acid or hydroxy acid, which can be a mixture of two or more of the same type of acid, or a mixture of two or more of different types of acid ; The dicarboxylic acid is succinic acid, glutaric acid, adipic acid, maleic acid, itaconic acid, the tricarboxylic acid is citric acid, and the hydroxy acid is DL-malic acid, A mixture of two or more of the salicylic acids. Activator is the soul of flux. The activator selected in the present invention has sufficient ability to remove the oxide film on the surface of the brazing metal and the brazing filler metal, plays an activation role in the whole brazing process, and plays a key role in improving the wettability. At the same time, the activator determines the corrosion performance of the flux and its residues. The activator in the present invention can be mostly volatilized, sublimated or decomposed at the brazing temperature, so that the printed circuit board has less organic acid residue and no corrosion after soldering.
所述的溶剂为有机溶剂，为至少一种醇类和至少一种醚类的混合；所述的醇选自丙三醇、乙二醇、二甘醇、2-乙基-1，3己二醇；所述的醚选自乙二醇单甲醚、二乙二醇单乙醚、二乙二醇单丁醚、二乙二醇单己醚、二乙二醇单辛醚。溶剂是助焊剂的载体，使助焊剂各组分溶于溶剂中，形成均匀的黏稠态。本发明所选用的有机溶剂具有合适的沸点，既不会过快蒸发，又能有利于焊后保护膜的干燥成形。并且，所选用的有机溶剂具有一定的黏度，便于印刷以及元件的粘附。The solvent is an organic solvent, which is a mixture of at least one alcohol and at least one ether; the alcohol is selected from glycerol, ethylene glycol, diethylene glycol, 2-ethyl-1,3-hexane Diol; the ether is selected from ethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monooctyl ether. The solvent is the carrier of the flux, so that the components of the flux are dissolved in the solvent to form a uniform viscous state. The organic solvent selected in the present invention has a suitable boiling point, can not evaporate too quickly, and can be beneficial to the drying and forming of the protective film after welding. Moreover, the selected organic solvent has a certain viscosity, which is convenient for printing and adhesion of components.
所述的缓蚀剂为有机胺类缓蚀剂，三乙胺、三乙醇胺中的一种或两种混合。缓蚀剂可以作为辅助活性剂和酸度调节剂进行复配，用于减少助焊剂对印刷电路板的腐蚀。The corrosion inhibitor is an organic amine corrosion inhibitor, one or a mixture of triethylamine and triethanolamine. Corrosion inhibitors can be compounded as auxiliary active agents and acidity regulators to reduce the corrosion of soldering flux on printed circuit boards.
所述的触变剂为氢化蓖麻油。添加触变剂的作用是给焊膏提供恰当的流变性能，并保证焊膏流变性能的稳定性。Described thixotropic agent is hydrogenated castor oil. The role of adding a thixotropic agent is to provide proper rheological properties to the solder paste and ensure the stability of the rheological properties of the solder paste.
所述的成膏剂为聚乙二醇1000，聚乙二醇2000或乙二撑双硬脂酸酰胺的一种或多种混合。成膏剂的作用是增强松香溶胶成黏稠膏状的能力。The ointment is one or more mixtures of polyethylene glycol 1000, polyethylene glycol 2000 or ethylene bis-stearamide. The function of the paste-forming agent is to enhance the ability of the rosin sol to form a thick paste.
所述的稳定剂为石蜡。稳定剂在焊膏存储过程中，能够保持助焊剂的黏稠稳定性，不会出现分层。Described stabilizer is paraffin. The stabilizer can maintain the viscous stability of the flux during the storage of the solder paste without delamination.
所述的表面活性剂为辛基酚聚氧乙烯醚、异辛基酚聚氧乙烯醚或壬基酚聚氧乙烯醚中的一种或多种混合。表面活性剂可以促进助焊剂中各种组分的溶解，可以降低焊料与印刷电路板表面的界面张力，协同助焊剂改进助焊性能。The surfactant is one or more mixtures of octylphenol polyoxyethylene ether, isooctylphenol polyoxyethylene ether or nonylphenol polyoxyethylene ether. Surfactants can promote the dissolution of various components in the flux, reduce the interfacial tension between the solder and the surface of the printed circuit board, and cooperate with the flux to improve the fluxing performance.
所述的改性松香为聚合松香、氢化松香、全氢化松香、水白松香、松香KE-604或无铅松香中的一种或多种混合。松香本身是一种弱酸，在助焊剂中能起到一定的活性作用。本发明所选用的改性松香具有较高的软化点，不易结晶，抗氧化性强，酸值较低，并且结构稳定，这些优点都促使所配制的助焊剂具有较为稳定的性能。松香只有在加热到钎焊温度时才有活性，能清除金属表面的氧化膜，增加钎料的润湿性能；由于松香能溶解在有机溶剂中，在再流焊时，当溶剂蒸发后，能够形成薄的膜状物，保护金属表面。The modified rosin is one or more mixtures of polymerized rosin, hydrogenated rosin, fully hydrogenated rosin, water white rosin, rosin KE-604 or lead-free rosin. Rosin itself is a weak acid, which can play a certain active role in the flux. The modified rosin selected in the present invention has a high softening point, is not easy to crystallize, has strong oxidation resistance, low acid value, and stable structure. These advantages all make the prepared soldering flux have relatively stable performance. Rosin is only active when heated to the brazing temperature, which can remove the oxide film on the metal surface and increase the wetting performance of the solder; because rosin can be dissolved in organic solvents, when the solvent evaporates during reflow soldering, it can Forms a thin film to protect metal surfaces.
与现有助焊剂产品相比，本发明所提供的低银SnAgCu无铅焊膏用新型环保型助焊剂具有以下特点：①不含卤素，焊后残留少，符合环保要求；②针对低银SnAgCu无铅焊料熔化温度偏离共晶点、结晶温度区间大的特点，本发明所选用的活化剂为多种有机酸的复配，沸点分布区间较大(130～337℃)，能够保证在整个回流焊接过程中都起到较好的活性作用；③由于活化剂在钎焊温度下能够大部分挥发、升华或分解，有机酸类物质残留很少，确保焊后无腐蚀；④用本发明所提供的助焊剂配制的焊膏保湿性好，存储和使用寿命较长。Compared with existing flux products, the new environment-friendly flux for low-silver SnAgCu lead-free soldering paste provided by the present invention has the following characteristics: ① does not contain halogen, has little residue after soldering, and meets environmental protection requirements; ② targets low-silver SnAgCu The melting temperature of lead-free solder deviates from the eutectic point and the crystallization temperature range is large. The activator selected in the present invention is a compound of various organic acids, and the boiling point distribution range is relatively large (130-337 ° C), which can ensure that the entire reflow During the welding process, it plays a good active role; ③ since most of the activators can volatilize, sublime or decompose at the brazing temperature, there are few organic acid residues, ensuring no corrosion after welding; The solder paste formulated with the flux has good moisture retention, long storage and service life.
本发明所提供的低银SnAgCu无铅焊膏用新型环保型助焊剂，可直接采用现有的助焊剂配制方法配制合成。The novel environment-friendly flux for the low-silver SnAgCu lead-free solder paste provided by the present invention can be prepared and synthesized directly by using the existing flux preparation method.
具体实施方式 Detailed ways
下面将结合具体的实施例对本发明作进一步说明。The present invention will be further described below in conjunction with specific examples.
下述实施例中均采用以下方法配制：All adopt the following method to prepare in the following examples:
1)按上述质量百分含量配比称取活化剂、溶剂、缓蚀剂、表面活性剂、触变剂、成膏剂、稳定剂和改性松香等物料；1) Weigh materials such as activator, solvent, corrosion inhibitor, surfactant, thixotropic agent, paste forming agent, stabilizer and modified rosin according to the above-mentioned mass percentage ratio;
2)将改性松香和有机溶剂的混合物在不高于120℃的温度下加热溶解成为透明液态后，加入活化剂，搅拌直至完全溶解，然后停止加热，当温度下降为100℃左右时保温，再加入缓蚀剂、触变剂、成膏剂、稳定剂和表面活性剂，使其充分溶解并搅拌均匀后，在室温下静置冷却，直到冷却至室温，即得本发明的低银SnAgCu无铅焊膏用新型环保型助焊剂。2) Heat and dissolve the mixture of modified rosin and organic solvent at a temperature not higher than 120°C to become a transparent liquid, then add an activator, stir until it is completely dissolved, then stop heating, and keep it warm when the temperature drops to about 100°C. Then add corrosion inhibitor, thixotropic agent, paste forming agent, stabilizer and surfactant, make it fully dissolved and stir evenly, then let it stand and cool at room temperature until it cools down to room temperature, and then the low-silver SnAgCu-free New environment-friendly flux for lead solder paste.
实施例1Example 1
选用的活性剂为丁二酸、水杨酸和DL-苹果酸，溶剂为丙三醇和二乙二醇单乙醚，缓蚀剂为三乙胺，触变剂为氢化蓖麻油，成膏剂为聚乙二醇1000，稳定剂为石蜡，表面活性剂为辛基酚聚氧乙烯醚，改性松香为聚合松香和氢化松香；各组分的质量百分含量(wt％)为：The active agents selected are succinic acid, salicylic acid and DL-malic acid, the solvent is glycerol and diethylene glycol monoethyl ether, the corrosion inhibitor is triethylamine, the thixotropic agent is hydrogenated castor oil, and the ointment is polyethylene glycol. Ethylene glycol 1000, the stabilizer is paraffin, the surfactant is octylphenol polyoxyethylene ether, and the modified rosin is polymerized rosin and hydrogenated rosin; the mass percentage (wt %) of each component is:
丁二酸 1.5Succinic acid 1.5
水杨酸 1.5Salicylic acid 1.5
DL-苹果酸 2.0DL-malic acid 2.0
丙三醇 14.0Glycerol 14.0
二乙二醇单乙醚 18.0Diethylene glycol monoethyl ether 18.0
三乙胺 0.8Triethylamine 0.8
氢化蓖麻油 4.2Hydrogenated castor oil 4.2
聚乙二醇1000 6.0Polyethylene glycol 1000 6.0
石蜡 2.5Paraffin 2.5
辛基酚聚氧乙烯醚 3.5Octylphenol ethoxylate 3.5
聚合松香 24.0polymerized rosin 24.0
氢化松香 22.0Hydrogenated rosin 22.0
实施例2Example 2
选用的活性剂为戊二酸、水杨酸和柠檬酸，溶剂为二甘醇和二乙二醇单丁醚，缓蚀剂为三乙醇胺，触变剂为氢化蓖麻油，成膏剂为聚乙二醇1000，稳定剂为石蜡，表面活性剂为辛基酚聚氧乙烯醚，改性松香为聚合松香和水白松香；各组分的质量百分含量(wt％)为：The active agents selected are glutaric acid, salicylic acid and citric acid, the solvents are diethylene glycol and diethylene glycol monobutyl ether, the corrosion inhibitor is triethanolamine, the thixotropic agent is hydrogenated castor oil, and the ointment is polyethylene glycol. Alcohol 1000, stabilizer is paraffin, surfactant is octylphenol polyoxyethylene ether, and modified rosin is polymerized rosin and water-white rosin; the mass percentage (wt %) of each component is:
戊二酸 2.0Glutaric acid 2.0
水杨酸 2.5Salicylic acid 2.5
柠檬酸 3.0Citric acid 3.0
二甘醇 18.0Diethylene glycol 18.0
二乙二醇单丁醚 18.0Diethylene glycol monobutyl ether 18.0
三乙醇胺 1.5Triethanolamine 1.5
氢化蓖麻油 1.0Hydrogenated castor oil 1.0
聚乙二醇1000 4.4Polyethylene glycol 1000 4.4
石蜡 0.3Paraffin 0.3
辛基酚聚氧乙烯醚 1.3Octylphenol ethoxylate 1.3
聚合松香 24.0polymerized rosin 24.0
水白松香 24.0Water white rosin 24.0
实施例3Example 3
选用的活性剂为己二酸、丁二酸和DL-苹果酸，溶剂为丙三醇和乙二醇单甲醚，缓蚀剂为三乙胺和三乙醇胺，触变剂为氢化蓖麻油，成膏剂为聚乙二醇2000，稳定剂为石蜡，表面活性剂为异辛基酚聚氧乙烯醚，改性松香为全氢化松香和水白松香；各组分的质量百分含量(wt％)为：The active agents selected are adipic acid, succinic acid and DL-malic acid, the solvents are glycerol and ethylene glycol monomethyl ether, the corrosion inhibitors are triethylamine and triethanolamine, and the thixotropic agent is hydrogenated castor oil. The ointment is polyethylene glycol 2000, the stabilizer is paraffin, the surfactant is isooctylphenol polyoxyethylene ether, and the modified rosin is perhydrogenated rosin and water-white rosin; the mass percentage (wt%) of each component for:
己二酸 1.5Adipic acid 1.5
丁二酸 3.0Succinic acid 3.0
DL-苹果酸 4.5DL-malic acid 4.5
丙三醇 16.0Glycerol 16.0
乙二醇单甲醚 20.0Ethylene glycol monomethyl ether 20.0
三乙胺 3.0Triethylamine 3.0
三乙醇胺 2.0Triethanolamine 2.0
氢化蓖麻油 6.0Hydrogenated castor oil 6.0
聚乙二醇2000 2.0Polyethylene glycol 2000 2.0
石蜡 1.0Paraffin 1.0
异辛基酚聚氧乙烯醚 1.0Isooctylphenol ethoxylate 1.0
全氢化松香 20.0Fully hydrogenated rosin 20.0
水白松香 20.0Water white rosin 20.0
实施例4Example 4
选用的活性剂为己二酸、水杨酸和衣康酸，溶剂为乙二醇和二乙二醇单辛醚，缓蚀剂为三乙醇胺，触变剂为氢化蓖麻油，成膏剂为乙二撑双硬脂酸酰胺，稳定剂为石蜡，表面活性剂为辛基酚聚氧乙烯醚和壬基酚聚氧乙烯醚，改性松香为全氢化松香和聚合松香；各组分的质量百分含量(wt％)为：The active agents selected are adipic acid, salicylic acid and itaconic acid, the solvents are ethylene glycol and diethylene glycol monooctyl ether, the corrosion inhibitor is triethanolamine, the thixotropic agent is hydrogenated castor oil, and the ointment is ethylene glycol. Bis stearic acid amide, the stabilizer is paraffin, the surfactant is octylphenol polyoxyethylene ether and nonylphenol polyoxyethylene ether, and the modified rosin is fully hydrogenated rosin and polymerized rosin; the mass percentage of each component Content (wt%) is:
己二酸 1.5Adipic acid 1.5
水杨酸 4.5Salicylic acid 4.5
衣康酸 4.8Itaconic acid 4.8
乙二醇 16.0Ethylene glycol 16.0
二乙二醇单辛醚 18.0Diethylene glycol monooctyl ether 18.0
三乙醇胺 3.0Triethanolamine 3.0
氢化蓖麻油 4.2Hydrogenated castor oil 4.2
乙二撑双硬脂酸酰胺 3.5Ethylene bis stearic acid amide 3.5
石蜡 1.5Paraffin 1.5
辛基酚聚氧乙烯醚 2.5Octylphenol polyoxyethylene ether 2.5
壬基酚聚氧乙烯醚 2.5Nonylphenol polyoxyethylene ether 2.5
全氢化松香 18.0Fully hydrogenated rosin 18.0
聚合松香 20.0polymerized rosin 20.0
实施例5Example 5
选用的活性剂为戊二酸、衣康酸和DL-苹果酸，溶剂为2乙基-1，3己二醇和二乙二醇单丁醚，缓蚀剂为三乙胺，触变剂为氢化蓖麻油，成膏剂为聚乙二醇2000和乙二撑双硬脂酸酰胺，稳定剂为石蜡，表面活性剂为辛基酚聚氧乙烯醚，改性松香为全氢化松香和无铅松香FE625；各组分的质量百分含量(wt％)为：The active agents selected are glutaric acid, itaconic acid and DL-malic acid, the solvent is 2 ethyl-1,3 hexanediol and diethylene glycol monobutyl ether, the corrosion inhibitor is triethylamine, and the thixotropic agent is Hydrogenated castor oil, ointment is polyethylene glycol 2000 and ethylene bis stearic acid amide, stabilizer is paraffin, surfactant is octylphenol polyoxyethylene ether, modified rosin is fully hydrogenated rosin and lead-free rosin FE625; the mass percentage (wt%) of each component is:
戊二酸 2.0Glutaric acid 2.0
衣康酸 4.0Itaconic acid 4.0
DL-苹果酸 4.0DL-malic acid 4.0
2乙基-1，3己二醇 18.02 ethyl-1,3 hexanediol 18.0
二乙二醇单丁醚 20.0Diethylene glycol monobutyl ether 20.0
三乙胺 2.0Triethylamine 2.0
氢化蓖麻油 3.0Hydrogenated castor oil 3.0
聚乙二醇2000 5.5Polyethylene glycol 2000 5.5
乙二撑双硬脂酸酰胺 3.5Ethylene bis stearic acid amide 3.5
石蜡 1.5Paraffin 1.5
辛基酚聚氧乙烯醚 1.5Octylphenol polyoxyethylene ether 1.5
全氢化松香 18.0Fully hydrogenated rosin 18.0
无铅松香FE625 17.0Lead-free Rosin FE625 17.0
实施例6Example 6
选用的活性剂为丁二酸、柠檬酸和顺丁烯二酸，溶剂为二甘醇和二乙二醇单己醚，缓蚀剂为三乙醇胺，触变剂为氢化蓖麻油，成膏剂为聚乙二醇1000，稳定剂为石蜡，表面活性剂为辛基酚聚氧乙烯醚，改性松香为水白松香和无铅松香FE625；各组分的质量百分含量(wt％)为：The active agents selected are succinic acid, citric acid and maleic acid, the solvents are diethylene glycol and diethylene glycol monohexyl ether, the corrosion inhibitor is triethanolamine, the thixotropic agent is hydrogenated castor oil, and the ointment is polyethylene glycol. Glycol 1000, stabilizer is paraffin, surfactant is octylphenol polyoxyethylene ether, and modified rosin is water white rosin and lead-free rosin FE625; The mass percent composition (wt %) of each component is:
丁二酸 3.0Succinic acid 3.0
柠檬酸 5.0Citric acid 5.0
顺丁烯二酸 5.0Maleic acid 5.0
二甘醇 21.0Diethylene glycol 21.0
二乙二醇单己醚 20.0Diethylene glycol monohexyl ether 20.0
三乙醇胺 1.0Triethanolamine 1.0
氢化蓖麻油 2.0Hydrogenated castor oil 2.0
聚乙二醇1000 3.5Polyethylene glycol 1000 3.5
石蜡 1.0Paraffin 1.0
辛基酚聚氧乙烯醚 0.5Octylphenol polyoxyethylene ether 0.5
水白松香 20.0Water white rosin 20.0
松香KE-604 18.0Rosin KE-604 18.0
将实施例1至实施例6中制备的低银SnAgCu无铅焊膏用新型环保型助焊剂，按照国家标准和电子行业标准进行检测，各项指标如表1所示。The low-silver SnAgCu lead-free solder paste prepared in Examples 1 to 6 was tested according to national standards and electronic industry standards, and the indicators are shown in Table 1.
表1本发明所制备的低银SnAgCu无铅焊膏用新型环保型助焊剂的性能The low-silver SnAgCu lead-free solder paste prepared by the present invention is used for the performance of the novel environment-friendly soldering flux
从表1的性能检测可以看出，本发明所提供的低银SnAgCu无铅焊膏用新型环保型助焊剂具有较为优异的性能：①物理稳定性良好；②不含卤素；③无腐蚀性(焊后残留物少，且为透明硬质膜状物)；④助焊性较好，扩展率能够达到75％以上；⑤印刷板的焊后绝缘电阻较高，且超过109Ω，满足要求。As can be seen from the performance test of table 1, the low-silver SnAgCu lead-free soldering paste provided by the present invention has comparatively excellent performances with novel environment-friendly flux: 1. good physical stability; 2. halogen-free; 3. non-corrosive ( Less residue after welding, and it is a transparent hard film); ④ Good solderability, the expansion rate can reach more than 75%; ⑤ The insulation resistance of the printed board after welding is high, and exceeds 10 9 Ω, which meets the requirements .
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Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101934440A (en) * | 2010-10-21 | 2011-01-05 | 江苏科技大学 | a welding aid |
| CN102039499A (en) * | 2011-01-17 | 2011-05-04 | 天津大学 | Solid soldering flux for lead-free cored tin wire and preparation method thereof |
| CN102126094A (en) * | 2011-01-15 | 2011-07-20 | 广州市铠特电子材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| CN102398122A (en) * | 2010-09-08 | 2012-04-04 | 北京有色金属与稀土应用研究所 | Water-cleaning low-temperature soldering paste and preparation method thereof |
| CN102513732A (en) * | 2011-12-15 | 2012-06-27 | 中南大学 | Halogen-free cleaning-free rosin flux, and preparation and application thereof |
| CN102513738A (en) * | 2011-12-28 | 2012-06-27 | 东莞优诺电子焊接材料有限公司 | A continuous spot-coating type halogen-free solder paste and its preparation method |
| CN103111773A (en) * | 2012-12-13 | 2013-05-22 | 郴州金箭焊料有限公司 | Scaling powder for lead-free solder paste |
| CN103521952A (en) * | 2012-07-06 | 2014-01-22 | 重庆微世特电子材料有限公司 | Welding-bonding dual-purpose halogen-free electronic addition agent and preparation method thereof |
| CN103551762A (en) * | 2013-10-28 | 2014-02-05 | 北京新立机械有限责任公司 | Hot air leveling-up scaling powder of nonvolatile organic compound and preparation method thereof |
| CN103659053A (en) * | 2012-09-13 | 2014-03-26 | 莫文剑 | Copper welding paste for braze welding and preparation method thereof |
| CN103949803A (en) * | 2014-04-29 | 2014-07-30 | 西安理工大学 | Soldering flux for low-silver lead-free soldering paste and preparation method for soldering flux |
| US8853417B2 (en) | 2009-12-03 | 2014-10-07 | Hunan Astar Biotechnology Ltd. | Non-halogen activating agent used as flux |
| CN104096990A (en) * | 2014-06-20 | 2014-10-15 | 苏州锐耐洁电子科技新材料有限公司 | Novel soldering flux |
| CN104416298A (en) * | 2013-09-06 | 2015-03-18 | 苏州优诺电子材料科技有限公司 | Halogen-free and lead-free low-temperature tin paste soldering flux |
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| CN104889596A (en) * | 2015-06-16 | 2015-09-09 | 广西南宁迈点装饰工程有限公司 | Low-temperature lead-free tin paste and production technique for paste flux thereof |
| CN105598602A (en) * | 2016-03-25 | 2016-05-25 | 昆山成利焊锡制造有限公司 | Halogen-free soldering flux for high-activity tin wire and preparation method thereof |
| CN105921905A (en) * | 2016-06-16 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | Environment-friendly soldering paste and preparing method thereof |
| CN106392381A (en) * | 2016-10-26 | 2017-02-15 | 安徽飞达电气科技有限公司 | High-quality soldering paste |
| CN106624461A (en) * | 2016-10-28 | 2017-05-10 | 广东工业大学 | Composition, preparation method and application of composition in field of soldering flux |
| CN107262968A (en) * | 2016-03-31 | 2017-10-20 | 株式会社田村制作所 | Solder composition and electric substrate |
| CN107570911A (en) * | 2017-10-30 | 2018-01-12 | 厦门理工学院 | A kind of lead-free high-temperature solder(ing) paste for being used for mobile phone, computer main board and preparation method thereof |
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| CN110919180A (en) * | 2018-09-20 | 2020-03-27 | 株式会社田村制作所 | Solder composition for laser welding, electronic substrate, and method for producing electronic substrate |
| CN111001961A (en) * | 2019-12-23 | 2020-04-14 | 北京工业大学 | Method for preparing micro solder balls for electronic packaging in batch based on ball forming paste printing technology and automatic device |
| CN111151910A (en) * | 2020-01-07 | 2020-05-15 | 杭州乔泰电子有限公司 | Lead-free soldering paste |
| CN115103736A (en) * | 2020-02-18 | 2022-09-23 | 千住金属工业株式会社 | Flux and solder paste |
| CN115488546A (en) * | 2022-09-30 | 2022-12-20 | 西南石油大学 | Silver nanowire modified tin-silver-copper composite soldering paste and preparation method thereof |
-
2009
- 2009-05-27 CN CNA2009100862055A patent/CN101564805A/en active Pending
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8853417B2 (en) | 2009-12-03 | 2014-10-07 | Hunan Astar Biotechnology Ltd. | Non-halogen activating agent used as flux |
| CN102398122A (en) * | 2010-09-08 | 2012-04-04 | 北京有色金属与稀土应用研究所 | Water-cleaning low-temperature soldering paste and preparation method thereof |
| CN101934440B (en) * | 2010-10-21 | 2012-08-15 | 江苏科技大学 | Soldering flux |
| CN101934440A (en) * | 2010-10-21 | 2011-01-05 | 江苏科技大学 | a welding aid |
| CN102126094A (en) * | 2011-01-15 | 2011-07-20 | 广州市铠特电子材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| CN102039499A (en) * | 2011-01-17 | 2011-05-04 | 天津大学 | Solid soldering flux for lead-free cored tin wire and preparation method thereof |
| CN102039499B (en) * | 2011-01-17 | 2013-06-12 | 天津大学 | Solid soldering flux for lead-free cored tin wire and preparation method thereof |
| CN102513732A (en) * | 2011-12-15 | 2012-06-27 | 中南大学 | Halogen-free cleaning-free rosin flux, and preparation and application thereof |
| CN102513738A (en) * | 2011-12-28 | 2012-06-27 | 东莞优诺电子焊接材料有限公司 | A continuous spot-coating type halogen-free solder paste and its preparation method |
| CN103521952A (en) * | 2012-07-06 | 2014-01-22 | 重庆微世特电子材料有限公司 | Welding-bonding dual-purpose halogen-free electronic addition agent and preparation method thereof |
| CN103659053B (en) * | 2012-09-13 | 2016-05-04 | 苏州铜宝锐新材料有限公司 | A kind of soldering copper soldering paste and preparation method thereof and application |
| CN103659053A (en) * | 2012-09-13 | 2014-03-26 | 莫文剑 | Copper welding paste for braze welding and preparation method thereof |
| CN103111773A (en) * | 2012-12-13 | 2013-05-22 | 郴州金箭焊料有限公司 | Scaling powder for lead-free solder paste |
| CN104416298A (en) * | 2013-09-06 | 2015-03-18 | 苏州优诺电子材料科技有限公司 | Halogen-free and lead-free low-temperature tin paste soldering flux |
| CN103551762A (en) * | 2013-10-28 | 2014-02-05 | 北京新立机械有限责任公司 | Hot air leveling-up scaling powder of nonvolatile organic compound and preparation method thereof |
| CN103949803A (en) * | 2014-04-29 | 2014-07-30 | 西安理工大学 | Soldering flux for low-silver lead-free soldering paste and preparation method for soldering flux |
| CN104096990A (en) * | 2014-06-20 | 2014-10-15 | 苏州锐耐洁电子科技新材料有限公司 | Novel soldering flux |
| CN104772581B (en) * | 2015-04-28 | 2016-07-06 | 苏州永创达电子有限公司 | A kind of scaling powder |
| CN104772581A (en) * | 2015-04-28 | 2015-07-15 | 苏州永创达电子有限公司 | Flux |
| CN104889596A (en) * | 2015-06-16 | 2015-09-09 | 广西南宁迈点装饰工程有限公司 | Low-temperature lead-free tin paste and production technique for paste flux thereof |
| CN105598602A (en) * | 2016-03-25 | 2016-05-25 | 昆山成利焊锡制造有限公司 | Halogen-free soldering flux for high-activity tin wire and preparation method thereof |
| CN105598602B (en) * | 2016-03-25 | 2018-02-27 | 昆山成利焊锡制造有限公司 | High activity tin silk halogen-free flux and preparation method thereof |
| CN107262968A (en) * | 2016-03-31 | 2017-10-20 | 株式会社田村制作所 | Solder composition and electric substrate |
| CN107262968B (en) * | 2016-03-31 | 2021-03-02 | 株式会社田村制作所 | Solder composition and electronic substrate |
| CN105921905A (en) * | 2016-06-16 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | Environment-friendly soldering paste and preparing method thereof |
| CN106392381A (en) * | 2016-10-26 | 2017-02-15 | 安徽飞达电气科技有限公司 | High-quality soldering paste |
| CN106624461A (en) * | 2016-10-28 | 2017-05-10 | 广东工业大学 | Composition, preparation method and application of composition in field of soldering flux |
| CN106624461B (en) * | 2016-10-28 | 2019-02-22 | 广东工业大学 | Composition, preparation method and application of composition in field of soldering flux |
| CN107570911A (en) * | 2017-10-30 | 2018-01-12 | 厦门理工学院 | A kind of lead-free high-temperature solder(ing) paste for being used for mobile phone, computer main board and preparation method thereof |
| CN107891232A (en) * | 2017-12-06 | 2018-04-10 | 江苏广昇新材料有限公司 | A kind of lead-free and halogen-free weld-aiding cream and preparation method thereof |
| CN107891232B (en) * | 2017-12-06 | 2020-03-17 | 江苏广昇新材料有限公司 | Lead-free halogen-free soldering paste and preparation method thereof |
| CN110919180A (en) * | 2018-09-20 | 2020-03-27 | 株式会社田村制作所 | Solder composition for laser welding, electronic substrate, and method for producing electronic substrate |
| CN111001961A (en) * | 2019-12-23 | 2020-04-14 | 北京工业大学 | Method for preparing micro solder balls for electronic packaging in batch based on ball forming paste printing technology and automatic device |
| CN111151910A (en) * | 2020-01-07 | 2020-05-15 | 杭州乔泰电子有限公司 | Lead-free soldering paste |
| CN115103736A (en) * | 2020-02-18 | 2022-09-23 | 千住金属工业株式会社 | Flux and solder paste |
| US11826860B2 (en) | 2020-02-18 | 2023-11-28 | Senju Metal Industry Co., Ltd. | Flux and solder paste |
| CN115488546A (en) * | 2022-09-30 | 2022-12-20 | 西南石油大学 | Silver nanowire modified tin-silver-copper composite soldering paste and preparation method thereof |
| CN115488546B (en) * | 2022-09-30 | 2024-01-30 | 西南石油大学 | Silver nanowire modified tin-silver-copper composite soldering paste and preparation method thereof |
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