CN101587850B - Load bearing structure and test device - Google Patents

Abstract

The present invention discloses a bearing structure, which is used to bear a wafer portion cut from a wafer and test the wafer portion in combination with a testing device. The bearing structure comprises a body, a first receiving groove, a second receiving groove and a fixing member. The size of the body is substantially equal to that of the wafer. The first receiving groove is arranged on the first surface of the body and can accommodate the wafer portion. The second receiving groove is arranged on the first surface and connected to the first receiving groove. The fixing member is arranged in the second receiving groove and can buckle the side of the wafer portion to fix the wafer portion in the first receiving groove. The bearing structure of the present invention can bear and fix wafer portions such as grains, chips or incomplete wafers cut from a wafer. When the bearing structure together with the wafer portion is placed in a testing device for testing, a more accurate test result can be obtained.

Description

Load bearing structure and test device

technical field

The present invention relates to a carrier structure and a testing device, and in particular, the present invention relates to a carrier structure and a testing device that can be combined with each other to test a diced wafer portion.

Background technique

In recent years, the development of semiconductor technology has led to the rapid growth of the modern electronics industry. From the living environment and working environment where people live, to the study of outer space, they are all closely related to the progress of the electronics industry. Therefore, semiconductor technology can be described as the cornerstone of modern technology.

In semiconductor technology, its basic components start with the production of silicon wafers (wafers), and various structures are formed on the surface of the wafers using processing technologies such as development, etching, and deposition, and then the wafers are cut to form dies. Finally, it is packaged to become a semiconductor basic component. After forming various structures on the surface of the wafer, the wafer will be sent to the testing equipment for testing to obtain the electrical characteristics of each grain on the wafer, thereby improving the original process to obtain a higher pass rate . Therefore, wafer testing is an important technique for verifying processes in semiconductor technology.

A common wafer testing process uses testing equipment and a probe card to test each die on the wafer. The detection head of the probe card can be provided with a probe made of metal, which can be used to contact the solder, bump or other existing different designs that can be used as signal transmission to directly contact the chip. Input signal and read its output value. Wafers or dies with unqualified test results will be marked and screened out. Wafers or dies whose functions are not up to standard after wafer dicing will not proceed to the packaging process.

However, the qualified dies or wafers after the wafer test may still have problems of abnormality or poor efficiency. At this time, the dies or wafers need to be re-inspected to find out the abnormal reason. Because the test equipment used in the market, such as UF200 or UF2000, cannot test the chips or dies that have been cut from the wafer. In the prior art, the retesting of the diced wafers or dies is usually performed by disposing the wafers or dies on a printed circuit board and then testing them with testing equipment.

In the method used in the above-mentioned prior art, wherein the chips or dies are arranged on the printed circuit board, the test environment will be different from the original chips or dies, so the electrical characteristics tested will also be different accordingly. However, the characteristics of the wafer or die cannot be accurately obtained.

Contents of the invention

Therefore, the scope of the present invention is to provide a supporting structure that can be combined with a testing device to perform testing of wafer parts such as dies or wafers.

According to one embodiment, the carrier structure of the present invention is used to carry a wafer portion cut from a wafer, and the wafer portion can be tested in combination with a testing device. The bearing structure of this specific embodiment includes a body, a first receiving groove, a second receiving groove and a fixing member.

In this embodiment, the size of the body of the carrier structure is substantially equal to the size of the wafer from which the wafer portion is cut. The first accommodating groove is arranged on the first surface of the body, and the first accommodating groove can be used to accommodate the wafer part to be tested. The second accommodating groove is also arranged on the first surface and connected to the first accommodating groove. The fixing member is disposed in the second receiving slot, and can engage against the side of the wafer part to fix the wafer part in the first receiving slot.

According to another embodiment, the carrier structure of the present invention is used to carry a wafer portion cut from a wafer, and the wafer portion can be tested in combination with a testing device. The bearing structure of this specific embodiment includes a body, a first receiving groove and a groove.

In this embodiment, the size of the body of the carrier structure is substantially equal to the size of the wafer from which the wafer portion is cut. The first accommodating groove is arranged on the first surface of the body, and the first accommodating groove can be used to accommodate the wafer part to be tested. The groove is disposed on the second surface of the body, and the second surface is opposite to the first surface. In addition, there is a hole in the groove that runs through the body from the second surface to the first surface. When the carrying structure of this embodiment is combined with the testing device to test the wafer portion, the testing device can generate suction air pressure on the carrying structure to attract the wafer from the groove and the hole and fix the wafer portion in the first receiving groove.

According to the carrying structure of the present invention, it further includes at least one third receiving groove, and the first receiving groove and the third receiving groove are arranged and arranged on the first surface according to rules.

According to the carrying structure of the present invention, wherein the wafer portion is selected from a group consisting of a wafer, a die and a defective wafer.

Another scope of the present invention is to provide a testing device for testing wafer portions cut from a wafer.

According to a specific embodiment, the test device of the present invention comprises a load-bearing structure and a probe member. Wherein the supporting structure can be used to support the wafer part, and the wafer part can be tested through the probe member.

In this specific embodiment, the carrying structure further includes a body, a first receiving groove, a second receiving groove and a fixing member. The size of the body of the carrier structure is substantially equal to the size of the wafer from which the wafer portion is cut. The first accommodating groove is arranged on the first surface of the body, and the first accommodating groove can be used to accommodate the wafer part to be tested. The second accommodating groove is also arranged on the first surface and connected to the first accommodating groove. The fixing member is disposed in the second receiving slot, and can engage against the side of the wafer part to fix the wafer part in the first receiving slot. After the carrier structure secures the wafer portion, the probe structure can then test the wafer portion.

According to the testing device of the present invention, wherein the bearing structure further includes a groove disposed on the second surface of the body opposite to the first surface, and the position of the groove is opposite to the first receiving groove.

According to the testing device of the present invention, there is a hole in the groove penetrating the main body from the second surface to the first surface.

The testing device according to the present invention further includes: an air pressure generating element, corresponding to the hole, for generating suction air pressure to attract and fix the wafer part.

According to the testing device of the present invention, wherein the bearing structure further includes at least one third receiving groove, and the first receiving groove and the third receiving groove are regularly arranged and arranged on the first surface.

According to the testing device of the present invention, wherein the wafer portion is selected from a group consisting of wafers, dies and defective wafers.

According to another specific embodiment, the testing device of the invention comprises a load-bearing structure and a probe member. The supporting structure can be used to support and fix the wafer part, and the wafer part can be tested through the probe member. The difference from the previous specific embodiment is that the carrying structure of this specific embodiment includes a body, a first receiving groove and a groove.

In this embodiment, the size of the body of the carrier structure is substantially equal to the size of the wafer from which the wafer portion is cut. The first accommodating groove is arranged on the first surface of the body, and the first accommodating groove can be used to accommodate the wafer part to be tested. The groove is disposed on the second surface of the body, and the second surface is opposite to the first surface. In addition, there is a hole in the groove that runs through the body from the second surface to the first surface. When the carrying structure of this embodiment is combined with the testing device to test the wafer portion, the testing device can generate suction air pressure on the carrying structure to attract the wafer from the groove and the hole and fix the wafer portion in the first receiving groove.

According to the testing device of the present invention, wherein, the bearing structure further includes: a second receiving groove disposed on the first surface, the second receiving groove connected to the first receiving groove; and a fixing member disposed on the second receiving groove In the groove, the fixing member presses against the side of the wafer part to fix the wafer part in the first receiving groove.

According to the testing device of the present invention, wherein the bearing structure further includes at least one third receiving groove, and the first receiving groove and the third receiving groove are regularly arranged and arranged on the first surface.

According to the testing device of the present invention, wherein the wafer portion is selected from a group consisting of wafers, dies and defective wafers.

The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.

Description of drawings

Fig. 1 shows a schematic diagram of a bearing structure according to a specific embodiment of the present invention.

Fig. 2A shows a schematic front view of a bearing structure according to another specific embodiment of the present invention.

FIG. 2B shows a schematic view of the back side of the carrying structure of FIG. 2A .

FIG. 2C shows a schematic cross-sectional view of the bearing structure in FIG. 2A along the section line A-A.

FIG. 3 shows a schematic diagram of the portion of the carrying structure in FIG. 2C combined with the test device for fixing the wafer.

Fig. 4A shows a schematic front view of a bearing structure according to another specific embodiment of the present invention.

FIG. 4B shows a schematic view of the back of the carrying structure of FIG. 4A .

Fig. 5 shows a schematic diagram of a testing device according to a specific embodiment of the present invention.

Fig. 6 shows a schematic diagram of a testing device according to another specific embodiment of the present invention.

Detailed ways

Please refer to FIG. 1 , which shows a schematic diagram of a bearing structure 1 according to a specific embodiment of the present invention. The carrying structure 1 of this specific embodiment can be used to test the wafer part 2 in combination with a test device (not shown in the figure), wherein, the wafer part 2 is cut out from the wafer (not shown in the figure), and in practice Among them, the wafer part 2 can be a wafer, a die or a defective wafer. As shown in FIG. 1 , the carrying structure 1 includes a body 10 , a first receiving groove 12 , a second receiving groove 14 and a fixing member 16 .

In this specific embodiment, the body 10 has a first surface 100 , the first receiving groove 12 and the second receiving groove 14 are both disposed on the first surface 100 , and the second receiving groove 14 is connected to the first receiving groove 12 . The fixing member 16 is disposed in the second receiving groove 14 , and the fixing member 16 can be pressed against the side of the wafer portion 2 , thereby fixing the wafer portion 2 in the first receiving groove 12 .

Please note that in this embodiment, the size of the body 10 is substantially equal to the size of the wafer. That is, in practice, the size of the body 10 can be substantially equal to existing wafers such as 4-inch wafers, 5-inch wafers, 6-inch wafers, 8-inch wafers, and 12-inch wafers. Round part 2 depends on the size of the wafer and the acceptable specifications of the test equipment. In practice, the appearance of the body 10 may also be substantially the same as the wafer. In addition, in this specific embodiment, the first receiving groove 12 is located at the central part of the body 10, however, in practice, the first receiving groove 12 can also be provided on other parts of the first surface 100 of the body 10, without limitation. In this specific embodiment.

In addition, in practice, on the first surface 100 of the body 10, a plurality of first receiving grooves 12 and second receiving grooves 14 connected to these first receiving grooves 12 and disposed in the second receiving grooves 14 may be further provided. The fixing member 16. These first receiving grooves 12 can be arranged on the first surface 100. In practice, the first receiving grooves 12 can be arranged according to the position of the wafer part 2 on the original wafer before dicing, or according to the position of the testing device. The probes can be aligned in position.

In the above specific embodiments, after the fixing member 16 fixes the wafer part 2 in the first receiving groove 12, the testing device can align its probes and contact the wafer part 2 and the electrical contacts (electrical contacts) thereon, The electrical characteristics of the wafer portion 2 were further measured.

Please refer to Fig. 2A to Fig. 2C, Fig. 2A shows the front schematic view of the carrying structure 3 according to another specific embodiment of the present invention; Fig. 2B shows the back schematic view of the carrying structure 3 of Fig. 2A; A schematic cross-sectional view of the bearing structure 3 along the section line A-A. The carrying structure 3 of this specific embodiment is used for testing the wafer portion 2 in combination with a testing device. As shown in FIGS. 2A to 2C , the carrying structure 3 includes a body 30 , a first receiving groove 32 and a groove 34 .

In this specific embodiment, the body 30 has a first surface 300 and a second surface 302 opposite to the first surface 300 , and the size of the body 30 is substantially equal to the size of the wafer from which the wafer part 2 is cut. The first receiving groove 32 is disposed on the first surface 300 and can be used for receiving the wafer part 2 . In addition, the groove 34 is disposed on the second surface 302 . A hole 340 is formed in the groove 34 , and the hole 340 passes through the body 30 from the second surface 302 to the first surface 300 .

Please refer to FIG. 3 . FIG. 3 shows a schematic diagram of the carrying structure 3 in FIG. 2C combined with the testing device 4 to fix the wafer portion 2 . As shown in Figure 3, when the wafer part 2 is placed in the first receiving groove 32 of the carrier structure 3, and the carrier structure 3 is put into the test device 4 together with the wafer part 2 to test the wafer part 2, the test device 4 can cause suction air pressure to the groove 34 and the hole 340. At this time, if the wafer part 2 is placed on the hole 340 , it will be attracted by the suction air pressure, and then be fixed in the first receiving groove 32 . In practice, the suction air pressure can be generated by evacuating the groove 34 of the carrying structure 3 . In addition, in this specific embodiment, a hole 340 is disposed in the groove 34 . However, in practice, the number of holes 340 is not limited to the specific embodiments listed in this specification, but can be determined according to the needs of users or designers.

In practice, the first surface 300 of the body 30 may further be provided with a plurality of first receiving grooves 32 , and the second surface 302 of the body 30 may also be provided with a plurality of grooves 34 corresponding to the first receiving grooves 32 . Likewise, these grooves 34 can also be provided with holes 340 penetrating through the body 30 . Thus, the carrying structure 3 can carry a plurality of wafer parts 2 at the same time, and when the carrying structure 3 and the plurality of wafer parts 2 are put into the test device 4 for testing, the suction air pressure generated by the test device 4 can simultaneously attract and Fix these wafer parts 2 .

In addition, in practice, when the above-mentioned test device 4 generates suction air pressure, if there are holes 340 on which no wafer parts 2 are placed, adhesive tape or other blocking structures can be used to block these holes 340 where no wafer parts 2 are placed. The holes 340 are used to prevent the suction pressure from attracting outside air through the holes 340 where the wafer part 2 is not placed, and the wafer part 2 cannot be fixed.

In practice, the above-mentioned first receiving grooves 32 can be arranged according to the original position of the wafer part 2 on the wafer before dicing, or according to the position where the probes of the testing device 4 can be aligned.

Please refer to FIG. 4A and FIG. 4B . FIG. 4A shows a schematic front view of a carrying structure 5 according to another embodiment of the present invention; FIG. 4B shows a schematic rear view of the carrying structure 5 in FIG. 4A . The carrying structure 5 of this embodiment is used to test the wafer part 2 in combination with a testing device (not shown in the figure). As shown in FIG. 4A and FIG. 4B , the carrying structure 5 includes a body 50 , a first receiving groove 52 , a second receiving groove 54 , a fixing member 56 and a groove 58 .

In this specific embodiment, the body 50 has a first surface 500 and a second surface 502 opposite to the first surface 500, the first receiving groove 52 and the second receiving groove 54 are respectively provided on the first surface 500, and the second The two receiving slots 54 are connected to the first receiving slot 52 . The fixing member 56 is disposed in the second receiving groove 54 , and the fixing member 56 can be pressed against the side of the wafer part 2 to fix the wafer part 2 in the first receiving groove 52 . In addition, in practical applications, the fixing member 56 itself can be fixed to the main body 50 or the second receiving groove 54 by means of hooks or latches, so as to avoid its own sliding.

In addition, in this specific embodiment, the groove 58 can be disposed on the second surface 502 and its position is relative to the first receiving groove 52 . There is a hole 580 in the groove 58 , which can pass through the body 50 from the second surface 502 to the first surface 500 . In practice, when the carrier structure 5 and the wafer part 2 are put into the test device, the test device can generate suction air pressure, which attracts and fixes the wafer part 2 through the groove 58 and the hole 580 .

The carrying structure 5 of the specific embodiment above can fix the wafer part 2 through the fixing member 56 located in the second receiving groove 54, and when it is placed into the testing device, the suction air pressure generated by the testing device can pass through the groove 58 and the hole 580 attracts and further fixes the wafer part 2 so that the wafer part 2 can be firmly fixed on the carrying structure 5 .

Please refer to FIG. 5 , which shows a schematic diagram of a testing device 6 according to a specific embodiment of the present invention. The test device 6 of this embodiment is used to test the wafer part 2, wherein the wafer part 2 is cut out from a wafer (not shown in the figure). As shown in FIG. 5 , the test device 6 includes a load-bearing structure 60 and a probe member 62 .

In this specific embodiment, the carrying structure 60 can be used to carry and fix the wafer part 2 , and the carrying structure 60 can include a body 600 , a first receiving groove 602 , a second receiving groove 604 and a fixing member 606 . The first receiving groove 602 and the second receiving groove 604 are respectively disposed on the first surface 6000 of the body 600 , and the second receiving groove 604 is connected to the first receiving groove 602 . The fixing member 606 is disposed in the second receiving groove 604 , and the fixing member 606 can be pressed against the side of the wafer part 2 to fix the wafer part 2 in the first receiving groove 602 .

In this embodiment, the size of the body 600 is substantially equal to the size of the wafer from which the wafer portion 2 is cut. After the carrier structure 60 fixes the wafer part 2 and puts it into the test device 6, the probe member 62 is coupled to the processing unit (not shown in the figure) of the test device 6 and can be controlled to align and contact the wafer part. 2 while testing.

In practice, a plurality of first receiving grooves 602 and corresponding second receiving grooves 604 and fixing members 606 may be provided on the first surface 6000 of the carrying structure 60 . The first receiving grooves 602 can be arranged on the first surface 6000 , and the probe members 62 can be controlled to align with the first receiving grooves 602 to test a plurality of wafer parts 2 accommodated in the first receiving grooves 602 .

Please refer to FIG. 6 , which shows a schematic diagram of a testing device 7 according to another specific embodiment of the present invention. As shown in FIG. 6 , the test device 7 of this embodiment is used to test the wafer part 2 , wherein the wafer part 2 is cut out from a wafer (not shown in the figure). The testing device 7 comprises a carrying structure 70 and a probe member 72 .

In this specific embodiment, the carrying structure 70 can be used to carry the wafer part 2 , which includes a body 700 , a first receiving groove 702 and a groove 704 . The body 700 has a first surface 7000 and a second surface 7002 opposite to the first surface 7000, and the size of the body 700 is substantially equal to the size of the wafer from which the wafer part 2 is cut. The first accommodating slot 702 is disposed on the first surface 7000 and can be used for accommodating the wafer part 2 . In addition, the groove 704 is disposed on the second surface 7002 . There is a hole 7040 in the groove 704 , and the hole 7040 penetrates the body 700 from the second surface 7002 to the first surface 7000 .

In this embodiment, the size of the body 700 is substantially equal to the size of the wafer from which the wafer portion 2 is cut. After placing the carrier structure 70 and the wafer part 2 into the test device 7 , the test device 7 can generate suction air pressure to attract and fix the wafer part 2 through the groove 704 and the hole 7040 . Then, the probe member 72 may be controlled to be aligned with the wafer portion 2 for testing.

Compared with the prior art, the carrying structure of the present invention can carry and fix wafer parts such as crystal grains cut out from the wafer, wafers or defective wafers. When the carrying structure and the wafer part are placed into the test device for testing, since the appearance and size of the carrying structure are roughly equal to the wafer, the test device can directly test the wafer part on the carrying structure, and its test environment Closer to the test environment before uncut wafers, more accurate test results can be obtained.

Through the above detailed description of the preferred specific embodiments, it is hoped that the features and spirit of the present invention can be described more clearly, rather than limiting the scope of the present invention by the preferred specific embodiments disclosed above. On the contrary, the purpose is to include various changes and equivalent arrangements within the scope of protection of the claims of the present invention. Therefore, the protection scope of the claims of the present invention should be interpreted in the broadest way based on the above description, so as to cover all possible changes and equivalent arrangements.

Description of main component symbols

1, 3, 5, 60, 70: load-bearing structure

10, 30, 50, 600, 700: main body

12, 32, 52, 602, 702: the first storage slot

14, 54, 604: the second storage tank

16, 56, 606: fixed components

100, 300, 500, 6000, 7000: the first side

302, 502, 7002: second side 34, 58, 704: groove

340, 580, 7040: hole 2: wafer part

4, 6, 7: Test device 62, 72: Probe components.

Claims (18)

1. bearing structure, the wafer segment that cuts out from wafer in order to carrying, and test described wafer segment in conjunction with testing apparatus, described bearing structure comprises:

Body, the size of described body equates with the size of described wafer;

First holding tank is arranged on first of described body, in order to hold described wafer segment;

Second holding tank is arranged on described first, and described second holding tank connects described first holding tank; And

Fixed component is arranged in described second holding tank, and the deduct side of described wafer segment of described fixed component is to be fixed in described wafer segment in described first holding tank.

2. bearing structure according to claim 1, wherein, described body on described first second, further comprise groove, and the position of described groove is with respect to described first holding tank.

3. bearing structure according to claim 2, wherein, have in the described groove from described second face and run through described body to described first hole, and described testing apparatus can produce and attracts air pressure to come from described groove and described hole attraction and fix described wafer segment.

4. bearing structure according to claim 1 further comprises at least one the 3rd holding tank, and described first holding tank and described the 3rd holding tank are according to the rule setting and be arranged on described first.

5. bearing structure according to claim 1, wherein, described wafer segment is selected from the group of being made up of crystal grain and incomplete wafer.

6. bearing structure according to claim 1, wherein, described testing apparatus is with the described wafer segment of probe component testing.

7. bearing structure, the wafer segment that cuts out from wafer in order to carrying, and test described wafer segment in conjunction with testing apparatus, described bearing structure comprises:

Body, the size of described body equate with the size of described wafer, and described body comprises first and with respect to described first second;

First holding tank is arranged on described first, in order to hold described wafer segment; And

Groove is arranged at described second and goes up and with respect to described first holding tank, and has in the described groove from described second face and run through described body to described first hole;

Wherein said testing apparatus can produce and attract air pressure to come from described groove and described hole attraction and fixing described wafer segment.

8. bearing structure according to claim 7 further comprises at least one the 3rd holding tank, and described first holding tank and described the 3rd holding tank are according to the rule setting and be arranged on described first.

9. bearing structure according to claim 7, wherein, described wafer segment is selected from the group of being made up of crystal grain and incomplete wafer.

10. testing apparatus, in order to the wafer segment that test cuts out from wafer, described testing apparatus comprises:

Bearing structure comprises:

Body, the size of described body equates with the size of described wafer;

First holding tank is arranged on first of described body, in order to hold described wafer segment;

Second holding tank is arranged on described first, and described second holding tank connects described first holding tank; And

Fixed component is arranged in described second holding tank, and the deduct side of described wafer segment of described fixed component is to be fixed in described wafer segment in described first holding tank; And

The probe member is in order to test described wafer segment.

11. testing apparatus according to claim 10, wherein, described bearing structure further comprises groove, be arranged at described body with respect on described first second, and the position of described groove is with respect to described first holding tank.

12. testing apparatus according to claim 11 wherein, has in the described groove from described second face and runs through described body to described first hole.

13. testing apparatus according to claim 12 further comprises:

The air pressure producing component, corresponding described hole attracts air pressure to attract and fixing described wafer segment in order to produce.

14. testing apparatus according to claim 10, wherein, described bearing structure further comprises at least one the 3rd holding tank, and described first holding tank and described the 3rd holding tank are according to the rule setting and be arranged on described first.

15. testing apparatus according to claim 10, wherein, described wafer segment is selected from the group of being made up of crystal grain and incomplete wafer.

16. a testing apparatus, in order to the wafer segment that test cuts out from wafer, described testing apparatus comprises:

Bearing structure comprises:

Body, the size of described body equate with the size of described wafer, and described body comprises first and with respect to described first second;

First holding tank is arranged on described first, in order to hold described wafer segment; And

Groove is arranged at described second and goes up and described relatively first holding tank, and has in the described groove from described second face and run through described body to described first hole;

The air pressure producing component, corresponding described hole attracts air pressure to attract and fixing described wafer segment in order to produce; And

The probe member is in order to test described wafer segment.

17. testing apparatus according to claim 16, wherein, described bearing structure further comprises at least one the 3rd holding tank, and described first holding tank and described the 3rd holding tank are according to the rule setting and be arranged on described first.

18. testing apparatus according to claim 16, wherein, described wafer segment is selected from the group of being made up of crystal grain and incomplete wafer.

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