CN101630186B - Modular device and method of assembling same - Google Patents
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Abstract
Description
技术领域 technical field
本发明涉及一种模块化装置及其组装方法,特别是涉及一种可补偿公差的模块化装置及其组装方法。The invention relates to a modular device and its assembly method, in particular to a tolerance-compensable modular device and its assembly method.
背景技术 Background technique
迷你计算机系统由于有内部空间上的限制与有加强组装便利性的需求,其各个储存组件(如硬盘机、光驱等)会采用模块化的设计概念,并且利用一界面卡(Riser Card)连接各个储存组件的电源与电子信号,以组成一储存组件模块(Storage Device Module)。一般而言,迷你计算机系统包含一上盖、一预先固定于上盖内侧的储存组件模块、一底板,及一预先固定于底板的系统本体。Due to the limitation of the internal space of the mini computer system and the need to enhance the convenience of assembly, its various storage components (such as hard drives, optical drives, etc.) will adopt a modular design concept, and use an interface card (Riser Card) to connect each The power supply and electronic signal of the storage component are used to form a storage component module (Storage Device Module). Generally speaking, the mini computer system includes a top cover, a storage component module pre-fixed inside the top cover, a bottom plate, and a system body pre-fixed on the bottom plate.
当需要组装计算机系统时,只要将储存组件模块盖合于系统本体,并同时将储存组件模块的界面卡插入系统本体的插槽(Socket)中即可完成。前述的设计方式可免除整理排线的步骤、减少组装的时间,并提高使用者的便利性。When the computer system needs to be assembled, it only needs to cover the storage component module on the system body, and insert the interface card of the storage component module into the slot (Socket) of the system body at the same time. The foregoing design method can eliminate the steps of arranging and arranging cables, reduce assembly time, and improve user convenience.
参阅图1与图2,公知一种迷你计算机系统1包含一个上盖11、一个预先固定于上盖11内侧的储存组件模块12、一个底板13,及一个预先固定于底板13的系统本体14。储存组件模块12包括一个固定于上盖11上的支架121,以及固定于支架121上的至少一个储存组件122与一个界面卡123。Referring to FIGS. 1 and 2 , a known
但是,当储存组件模块12的各组件121、122、123彼此以螺丝锁附组装以及支架121组装于上盖11时,各个组件121、122、123的尺寸公差与前述组装时所造成的组装公差累积起来会造成界面卡123的偏移量。However, when the
因此,当组装储存组件模块12于系统本体14时,前述的公差所造成的偏移量会使储存组件模块12的界面卡123位置偏移,因而无法插入插槽141中或是歪斜地插入插槽141中,影响电子信号的传输,进而造成计算机系统1的失效。Therefore, when the
发明内容 Contents of the invention
因此,本发明的目的,即在于提供一种可补偿公差的模块化装置。It is therefore the object of the present invention to provide a modular arrangement which can compensate for tolerances.
本发明的另一目的,即在于提供一种可补偿公差的模块化装置的组装方法。Another object of the present invention is to provide a method for assembling a modular device that can compensate for tolerances.
于是,本发明模块化装置是包含一座体、一第一组装单元、一盖体,及一第二组装单元。该第一组装单元固定于该座体上,且该第一组装单元包括一第一卡合部。该盖体可移除地盖合于该座体。该第二组装单元可相对该盖体移动地设于该盖体底面,且该第二组装单元包括一用以与该第一卡合部形状互补配合的第二卡合部。藉由该第二组装单元可相对于该盖体移动以补偿公差所造成的偏移量,使该盖体对应盖合固定于该座体时,该第二卡合部可被调整而对应卡合于该第一卡合部。Therefore, the modular device of the present invention includes a base, a first assembly unit, a cover, and a second assembly unit. The first assembly unit is fixed on the base body, and the first assembly unit includes a first engaging portion. The cover is removably covered on the base. The second assembling unit is arranged on the bottom surface of the cover so as to be movable relative to the cover, and the second assembling unit includes a second engaging portion for complementary matching with the first engaging portion. Since the second assembly unit can move relative to the cover to compensate for the offset caused by the tolerance, when the cover is fixed on the seat correspondingly, the second engaging portion can be adjusted to correspond to the locking fit to the first engaging portion.
较佳地,该第二组装单元还包括一可移动地连接于该盖体上的支架,该第二卡合部固定于该支架上,该支架上形成有多个导引槽,该盖体底面上形成有多个可相对滑移地插设于这些导引槽的导引勾,藉由这些导引槽与这些导引勾的相互配合以达到该第二组装单元与该盖体间的相对位移。Preferably, the second assembly unit further includes a bracket movably connected to the cover, the second engaging portion is fixed on the bracket, a plurality of guide grooves are formed on the bracket, and the cover A plurality of guide hooks that can be relatively slidably inserted into these guide grooves are formed on the bottom surface, and the interaction between the second assembly unit and the cover is achieved through the mutual cooperation of these guide grooves and these guide hooks. Relative displacement.
较佳地,该模块化装置还包含一弹性组件,该弹性组件的二端分别连接于该盖体与该第二组装单元的支架,且缓冲该盖体与该第二组装单元间的相对位移。Preferably, the modular device further includes an elastic component, and the two ends of the elastic component are respectively connected to the bracket of the cover and the second assembly unit, and buffer the relative displacement between the cover and the second assembly unit .
较佳地,该盖体还包括一直立部,该弹性组件为一中空圆柱型弹性体,该模块化装置还包含一螺丝,该弹性组件卡合于该直立部且一端面抵接于该支架,该螺丝穿设于该弹性组件并螺合于该支架。Preferably, the cover body further includes an upright portion, the elastic component is a hollow cylindrical elastic body, and the modular device further includes a screw, the elastic component is engaged with the upright portion and one end surface abuts against the bracket , the screw is passed through the elastic component and screwed to the bracket.
较佳地,该座体包括二定位孔,该盖体还包括二定位柱,当该盖体对应盖合固定于该座体时,各该定位柱插设于相应的各该定位孔中。Preferably, the seat body includes two positioning holes, and the cover body further includes two positioning posts. When the cover body is correspondingly closed and fixed on the seat body, each of the positioning posts is inserted into each of the corresponding positioning holes.
较佳地,该模块化装置还包含多根螺丝,当该盖体对应盖合固定于该座体且该第二卡合部被调整而对应卡合于该第一卡合部后,这些螺丝将该第二组装单元的支架螺合于该座体。Preferably, the modular device further includes a plurality of screws. When the cover body is correspondingly covered and fixed on the base body and the second engaging part is adjusted to correspondingly engage with the first engaging part, these screws The bracket of the second assembly unit is screwed to the base.
较佳地,该模块化装置还包含二侧板,该二侧板用以固定该盖体相对于该座体的位置。Preferably, the modular device further includes two side plates for fixing the position of the cover relative to the base.
较佳地,该第二组装单元还包括固定于该支架上的至少一储存组件,且该第二卡合部是一连接该储存组件的电源与电子信号的界面卡。Preferably, the second assembly unit further includes at least one storage component fixed on the bracket, and the second engaging portion is an interface card connected to the power supply and electronic signal of the storage component.
较佳地,该第一组装单元还包括一电路板及至少一设置于该电路板上的电子组件,且该第一卡合部是一设置在该电路板上并供该界面卡配合插设的插槽。Preferably, the first assembling unit further includes a circuit board and at least one electronic component disposed on the circuit board, and the first engaging part is a circuit board disposed on the circuit board for mating insertion of the interface card slot.
而本发明模块化装置的组装方法,包含下述步骤:And the assembly method of the modularized device of the present invention comprises the following steps:
提供一座体及一固定于该座体上的第一组装单元,该第一组装单元包括一第一卡合部;Provide a base and a first assembly unit fixed on the base, the first assembly unit includes a first engaging portion;
提供一可移除地盖合于该座体的盖体及一第二组装单元,该第二组装单元包括一用以与该第一卡合部形状互补配合的第二卡合部,并使该第二组装单元可相对该盖体移动地设于该盖体底面;A cover body removably covered on the base body and a second assembling unit are provided, the second assembling unit includes a second engaging portion which is complementary in shape to the first engaging portion, and the The second assembly unit is arranged on the bottom surface of the cover so as to be movable relative to the cover;
对正地卡合该第二卡合部于该第一卡合部;aligningly engage the second engaging portion with the first engaging portion;
调整该盖体相对于该第二卡合部的位置;及adjusting the position of the cover relative to the second engaging portion; and
固定该盖体于该座体。The cover is fixed on the base.
本发明的功效:藉由该第二组装单元可相对该盖体移动的设计,可以补偿公差所造成的偏移量,使该盖体对应盖合固定于该座体时,该第二卡合部可被调整而对应卡合于该第一卡合部。Efficacy of the present invention: With the design that the second assembly unit can move relative to the cover body, the offset caused by the tolerance can be compensated, so that when the cover body is correspondingly covered and fixed on the seat body, the second engaging The part can be adjusted to correspondingly engage with the first engaging part.
附图说明 Description of drawings
图1是一立体图,说明公知的迷你计算机系统的一储存组件模块与一上盖;FIG. 1 is a perspective view illustrating a storage component module and a top cover of a known minicomputer system;
图2是一立体图,说明公知的迷你计算机系统;Fig. 2 is a perspective view illustrating a known minicomputer system;
图3是一立体分解图,说明本发明的模块化装置的较佳实施例;Figure 3 is an exploded perspective view illustrating a preferred embodiment of the modular device of the present invention;
图4是一立体图,说明该较佳实施例的一盖体及一第二组装单元;Fig. 4 is a perspective view illustrating a cover and a second assembly unit of the preferred embodiment;
图5是图4的立体分解图;Fig. 5 is a three-dimensional exploded view of Fig. 4;
图6是图4的俯视图;Fig. 6 is the plan view of Fig. 4;
图7是沿图6中的直线VII-VII所取的一剖视图;Fig. 7 is a sectional view taken along the line VII-VII in Fig. 6;
图8是一剖面示意图,说明该较佳实施例;及Figure 8 is a schematic cross-sectional view illustrating the preferred embodiment; and
图9是本发明的模块化装置的较佳实施例的组装流程图。Figure 9 is an assembly flow diagram of a preferred embodiment of the modular device of the present invention.
主要组件符号说明:Description of main component symbols:
2……………模块化装置 611…………导引槽2……………
3……………座体 612…………槽孔3……………
30……………本体 613…………螺孔30………
31……………定位孔 62……………第二卡合部31………
32……………螺孔 63……………储存组件32…………
33……………穿孔 7……………侧板33……………Perforation 7……………Side plate
4……………第一组装单元 71……………凸柱4……………The
41……………第一卡合部 72……………螺孔柱41……………The first engaging
5……………盖体 81……………弹性组件5……………
51……………导引勾 811…………中空部分51………
52……………直立部 82……………螺丝52……………Upright
53……………结合部 821…………大径段53…………Joint
531…………穿孔 822…………小径段531…………
54……………定位柱 83……………螺丝54…………Positioning
6……………第二组装单元 91~97………步骤6…………The
61……………支架61……………Bracket
具体实施方式 Detailed ways
有关本发明的前述及其他技术内容、特点与功效,在以下配合参考附图的一个较佳实施例的详细说明中,将可清楚地呈现。The aforementioned and other technical content, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings.
参阅图3与图4,本发明模块化装置2的较佳实施例包含一座体3、一第一组装单元4、一盖体5、一第二组装单元6、二侧板7,及一弹性组件81。在本实施例中,模块化装置2为一迷你计算机系统。3 and 4, a preferred embodiment of the
座体3包括一壳型本体30、二设于本体30顶缘处的定位孔31,以及多个穿设于本体30左右两侧的螺孔32与穿孔33。The
第一组装单元4固定于座体3内部,且第一组装单元4包括一电路板、至少一设置于电路板上的电子组件,及一第一卡合部41。在本实施例中,第一卡合部41是一设置在电路板上的插槽。The first assembly unit 4 is fixed inside the
参阅图3、图4与图5,盖体5可移除地盖合于座体3。盖体5底面上形成有六个导引勾51、一个靠近前方中央的直立部52、二个位于前缘左右两边的结合部53,及二个靠近后方的定位柱54。所述导引勾51中,三个导引勾51位于盖体5底面靠近左侧处,三个导引勾51位于盖体5底面靠近右侧处。直立部52上有一圆形凹口。每一结合部53上形成有一穿孔531。二定位柱54于组装时插设于座体3的定位孔31。Referring to FIG. 3 , FIG. 4 and FIG. 5 , the
参阅图4与图5,第二组装单元6可相对盖体5移动地设于盖体5的底面。第二组装单元6包括一可移动地连接于盖体5上的支架61、一与第一卡合部41形状互补配合且固定于支架61上的第二卡合部62,及至少一固定于支架61上的储存组件63。在本实施例中,第二卡合部62是一连接储存组件63的电源与电子信号且插设于插槽的界面卡,而储存组件63是光驱或硬盘机。Referring to FIG. 4 and FIG. 5 , the
支架61的左侧及右侧各形成有三个供盖体5的导引勾51可相对滑移地插设的导引槽611。藉由这些导引槽611与这些导引勾51的相互配合以达到第二组装单元6与盖体5间前后方向的相对滑动位移。此外,支架61的左侧及右侧各形成有二个槽孔612,且支架61的前侧形成有一螺孔613。Three
虽然在本实施例中,第二组装单元6与盖体5间的相对位移是以导引槽611与导引勾51的相互配合来达到,但是第二组装单元6与盖体5间的相对位移亦可用其他方式(例如滑轨)来达到,并不以本实施例所公开的为限。Although in this embodiment, the relative displacement between the
参阅图5、图6与图7,弹性组件81的二端分别连接于盖体5与第二组装单元6的支架61,弹性组件81缓冲盖体5与第二组装单元6间的相对滑动位移,并限制位移量。在本实施例中,弹性组件81为一中空圆柱型弹性体,其卡合于直立部52的圆形凹口中,且其一端面抵接于支架61。螺丝82包括一大径段821及一直径小于大径段821的直径的小径段822。螺丝82穿过弹性组件81的中空部分811,其大径段821位于中空部分811,并且以小径段822螺合于支架61的螺孔613中。前述的滑动位移量与弹性体的厚度及弹性系数有关,本实施例中的设计值为±0.8mm。此设计值已足够补偿各个组件的尺寸公差与组装时所造成的组装公差。特别要说明的是,利用弹性组件81加以缓冲盖体5与第二组装单元6间的相对滑动位移,还可以避免二者5、6松动时的碰撞所导致使用者产生的质量不良感受。Referring to Fig. 5, Fig. 6 and Fig. 7, the two ends of the
在其他的设计方式中,弹性组件81还可以是分别连接于盖体5与第二组装单元6的支架61的压缩弹簧或是簧片,只要能达到缓冲盖体5与第二组装单元6间的相对位移并限制位移量的,皆应属本发明的专利范围。In other design modes, the
参阅图3与图8,每一侧板7包括向座体3方向延伸的二根凸柱71及二根螺孔柱72。二侧板7以凸柱71穿过座体3的穿孔33与盖体5的穿孔531来固定盖体5相对于座体3的位置。而螺丝83依序穿过侧板7的螺孔柱72、第二组装单元6的支架61的槽孔612并螺合于座体3的螺孔32中。Referring to FIG. 3 and FIG. 8 , each side plate 7 includes two
由于有第二组装单元6可相对盖体5移动的设计,可以补偿公差所造成的偏移量,使模块化装置2组装时,当盖体5对应盖合固定于座体3时,第二卡合部62可被调整而对应卡合于第一卡合部41。Due to the design that the
特别要说明的是,虽然座体3的定位孔31、螺孔32与穿孔33在本实施例中有特定的数目,盖体5的导引勾51、结合部53、穿孔531与定位柱54在本实施例中也有特定的数目,支架61的导引槽611与槽孔612在本实施例中亦有特定的数目,且侧板7的凸柱71与螺孔柱72在本实施例中亦有特定的数目,但是各组件的数目亦可变化,不以本实施例为限。It should be noted that although the positioning holes 31, screw holes 32 and
以下将对模块化装置的组装方法进行说明,参阅图3、图8与图9,图9是本发明模块化装置2的较佳实施例的组装流程图,图9所示的主要流程为:The assembly method of the modular device will be described below, referring to Fig. 3, Fig. 8 and Fig. 9, Fig. 9 is an assembly flowchart of a preferred embodiment of the
步骤91是提供一座体3及一固定于座体3上的第一组装单元4,第一组装单元4包括一第一卡合部41。
步骤92是提供一可移除地盖合于座体3的盖体5及一第二组装单元6,第二组装单元6包括一用以与第一卡合部41形状互补配合的第二卡合部62,并使第二组装单元6可相对盖体5移动地设于盖体5底面。
步骤93是对正地卡合第二卡合部62于第一卡合部41。
步骤94是调整盖体5相对于第二卡合部62的位置。
步骤95是固定盖体5于座体3。
步骤96是盖合二侧板7于盖体5与座体3。
步骤97是螺合第二组装单元6于座体3。
接着将针对前述步骤进行详细说明,在步骤94中,调整盖体5相对于第二卡合部62的位置是指调整盖体5在前后方向的位移。Next, the foregoing steps will be described in detail. In
在步骤95中,是以盖体5的各定位柱54插设于相应的座体3的各定位孔31中以盖合固定盖体5于座体3。盖合之后,盖体5的穿孔531与座体3的穿孔33彼此相连通。In
在步骤96中,盖合二侧板7时,侧板7的凸柱71依序穿过盖体5的穿孔531及座体3的穿孔33,使盖体5与座体3的固定更为确实。In
在步骤97中,以多根螺丝83先穿过侧板7的螺孔柱72,再穿过第二组装单元6的支架61的槽孔612,最后螺合于座体3的螺孔32,以完成模块化装置的组装。此外,步骤97可使第二卡合部62相对于第一卡合部41的正确组装位置能够确保,不会因为外力振动或冲击造成第二卡合部62在前后方向上的偏移。In
上述的组装方法可使一般模块化装置组装时常遇到的公差所造成的偏移量的问题得以解决,避免无法插入或是歪斜地插入的情形,而能够使组装后第二卡合部62对正地卡合于该第一卡合部41,且使盖体5盖合固定于座体3。The above-mentioned assembling method can solve the problem of the offset caused by the tolerance often encountered in the assembly of general modular devices, avoiding the situation of being unable to insert or inserting obliquely, and enabling the second engaging
综上所述,藉由第二组装单元6可相对盖体5移动的设计,可以补偿公差所造成的偏移量,使盖体5对应盖合固定于座体3时,第二卡合部62可被调整而对应卡合于第一卡合部41,避免第二卡合部62组装错误的发生,可以提升模块化装置2的质量与可靠度,所以确实能达成本发明的目的。To sum up, with the design that the
惟以上所述的内容,仅为本发明的较佳实施例而已,应当不能以此限定本发明实施的范围,即凡是依本发明权利要求书范围及发明说明内容所作的简单的等同变化与修饰,皆仍属本发明专利涵盖的范围内。However, the above-mentioned content is only a preferred embodiment of the present invention, and should not limit the implementation scope of the present invention, that is, any simple equivalent changes and modifications made according to the scope of the claims of the present invention and the contents of the description of the invention , all still belong to the scope covered by the patent of the present invention.
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| US6404625B1 (en) * | 2000-02-24 | 2002-06-11 | Aopen Inc. | Supporting module for forming a foldable supporting structure inside a computer housing |
| CN2548190Y (en) * | 2002-04-26 | 2003-04-30 | 陈林 | Block-combined case |
| CN1453681A (en) * | 2002-04-24 | 2003-11-05 | 建碁股份有限公司 | reversible carrier |
| CN2607609Y (en) * | 2003-03-21 | 2004-03-24 | 纬创资通股份有限公司 | Easy-to-detach portable computer host case |
| CN2816895Y (en) * | 2005-07-28 | 2006-09-13 | 上海环达计算机科技有限公司 | Turning-over type fixing module and computer housing with same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6404625B1 (en) * | 2000-02-24 | 2002-06-11 | Aopen Inc. | Supporting module for forming a foldable supporting structure inside a computer housing |
| CN1453681A (en) * | 2002-04-24 | 2003-11-05 | 建碁股份有限公司 | reversible carrier |
| CN2548190Y (en) * | 2002-04-26 | 2003-04-30 | 陈林 | Block-combined case |
| CN2607609Y (en) * | 2003-03-21 | 2004-03-24 | 纬创资通股份有限公司 | Easy-to-detach portable computer host case |
| CN2816895Y (en) * | 2005-07-28 | 2006-09-13 | 上海环达计算机科技有限公司 | Turning-over type fixing module and computer housing with same |
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