CN101640246A - Enclosure support structure of high-power LED with rectangular light spots - Google Patents
Enclosure support structure of high-power LED with rectangular light spots Download PDFInfo
- Publication number
- CN101640246A CN101640246A CN200910183724A CN200910183724A CN101640246A CN 101640246 A CN101640246 A CN 101640246A CN 200910183724 A CN200910183724 A CN 200910183724A CN 200910183724 A CN200910183724 A CN 200910183724A CN 101640246 A CN101640246 A CN 101640246A
- Authority
- CN
- China
- Prior art keywords
- curved surface
- support structure
- light spots
- power led
- rectangular light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009434 installation Methods 0.000 claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000741 silica gel Substances 0.000 claims abstract description 6
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 6
- 239000000178 monomer Substances 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000037237 body shape Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000000499 gel Substances 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 13
- 238000004020 luminiscence type Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 210000005056 cell body Anatomy 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012053 enzymatic serum creatinine assay Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Abstract
The invention relates to an enclosure support structure of a high-power LED with rectangular light spots, which mainly comprises an installation support, wherein the installation support is provided with an installation cavity penetrating through the upper surface and the lower surface of the installation support, the side wall of the installation cavity is a light-focusing curved surface and alsoa curved surface formed by the upward and outward extension of a base plate, and a reflecting film can be stuck to the light-focusing curved surface according to different requirements; the installation support is provided with a gel filling channel communicated with the installation cavity, and a staircase for supporting a lens is arranged on the installation support; the installation support isa ring body of which the external is a square and the internal is a circle; and silica gel is filled in the installation cavity. The enclosure support structure uses the mode of reflow soldering so as to greatly save the enclosure cost, can meet the requirements of different illuminating light spots and light shapes and has the advantages of high light collecting efficiency, favorable radiating effect and the like.
Description
Technical field
The present invention relates to a kind of enclosure support structure of great power LED of rectangular light spots, specifically the high power LED substrate upper surface of rectangular light spots is provided with tabular mounting bracket.
Background technology
Great power LED is the luminescent device that a class can directly be converted into electric energy visible light and radiant energy, it is low to have operating voltage, power consumption is little, luminous efficiency height, emission response time are extremely short, and be photochromic pure, sound construction, shock resistance, vibration resistance, stable and reliable for performance, in light weight, series of characteristics such as volume is little, and cost is low are in the link of LED industry, the upstream is LED substrate wafer and substrate production, the industry in middle reaches turns to the led chip design and makes and produce, and the LED packaging and testing are returned in the downstream, the research and development low thermal resistance, high-cooling property, excellent optical, high printing opacity, reliable lens.And industrialization the only way which must be passed practical, that move towards market that is that novel large-power LED moves towards of combining with high-cooling property encapsulating structure technology.
About 50% the luminous energy that traditional LED device package lens can only utilize that chip sends, because the epoxy glue of emitting semiconductor and sealing, refractive index between lens differs bigger, cause the inner cirtical angle of total reflection very little, the light that active layer produces has only fraction to be removed, most of between chip, lens, fluorescent material and silica gel, through reflection many times, penetrate again after the diffusion.Meanwhile the part of the light that sends of luminescence chip is absorbed by lens body, becomes the ultra-high brightness LED chip and gets the very low basic reason of optical efficiency.How the luminous energy with different materials refraction, reflection used up 50% between inside and lens is used, and is the problem that current industry need solve, and partly is urgent problem at the absorption luminous energy of these lens wherein.
The problem of the heat radiation of great power LED is a LED industrial circle problem anxious to be solved always simultaneously.Can see in the existing market is plastics and support copper, or more satisfactory present useful pottery makees substrate, is provided with a becket above it, simultaneously lens is placed on the becket, and the heat conduction situation of this mode neither be too desirable.
With the solid-state illumination lamp of light-emitting diode, each corner of the illumination market of big system will be appeared at as new light sources.Will the encapsulation aspect, each big LED manufacturer of the whole world has released various LED products, the early stage patent No. of the CREE company of the U.S. is: the patent of US7264378, introduced a kind of chip directly be placed in the preparation have on the ceramic substrate of circuit, the substrate top is equipped with a metallic support, and electroplate to form reflection cavity, and support of lens and form optical texture at rack surface.But the cavity of this metallic support can't form perfectly reflecting surface because of the characteristic of the density of metal material body.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, provide a kind of can be by the mode of Reflow Soldering, saved the enclosure support structure of great power LED of the rectangular light spots of packaging cost greatly.
According to technical scheme provided by the invention, a kind of enclosure support structure of great power LED of rectangular light spots comprises mounting bracket, offer the installation cavity that penetrates its upper and lower surface on the described mounting bracket, the sidewall of described installation cavity is the optically focused curved surface, and this sidewall is by the substrate outward extending curved surface that makes progress, and also can be stained with reflectance coating according to different requirements on the described optically focused curved surface.
Also can offer on described mounting bracket and the glueing channel that cavity is communicated with is installed according to different requirements, described mounting bracket is provided with the step of support of lens.Described mounting bracket is round outside but spuare inside ring body shape.
Be filled with silica gel in the described installation cavity.
Described optically focused curved surface is spliced for the curved surface monomer that two pairs or more is centrosymmetric.The curved surface monomer that constitutes the optically focused curved surface is the partial sidewall of straight wall or Rotary-table.
The present invention has and can save packaging cost greatly by the mode of Reflow Soldering, can satisfy different luminous spot and the requirement of light shape, has advantages such as the optical efficiency of getting height and good heat dissipation effect simultaneously.
Description of drawings
Fig. 1 is overall structure user mode figure of the present invention.
Fig. 2 is a mounting bracket vertical view of the present invention.
Fig. 3 is the A-A cutaway view of Fig. 2.
Embodiment
The invention will be further described below in conjunction with concrete drawings and Examples.
As Fig. 1～shown in Figure 3: comprise substrate 1, mounting bracket 2, lens 3, LED luminescence chip 4, the step 9 that cavity 5, optically focused curved surface 6, reflectance coating 7, glueing channel 8, support of lens are installed, silica gel 10 and phosphor powder layer 11 etc.
When the present invention's integral body is used, employing is provided with tabular mounting bracket 2 at substrate 1 upper surface, offer the installation cavity 5 that penetrates its upper and lower surface on the described mounting bracket 2, the sidewall of described installation cavity 5 is an optically focused curved surface 6, on optically focused curved surface 6, be stained with reflectance coating 7, on mounting bracket 2, offer and the glueing channel 8 that cavity 5 is communicated with is installed, the mounting bracket 2 that cavity 5 tops are installed is provided with the step 9 of support of lens, described lens 3 glands are on the step 9 of support of lens, substrate 1 upper surface in cavity 5 is installed is placed LED luminescence chip 4, is filled with silica gel 10 in the described installation cavity 5.
Described mounting bracket 2 is the torus shape.Described lens 3 are positive hemisphere, big hemisphere, little hemisphere, whole spherical or plate shaped.
Described optically focused curved surface 6 is spliced for the curved surface monomer that two pairs or more is centrosymmetric.The curved surface monomer that constitutes optically focused curved surface 6 is the partial sidewall of straight wall or Rotary-table.
Be coated with phosphor powder layer 11 at LED luminescence chip 4 upper surfaces.Described glueing channel 8 is for running through hole body or the cell body that cavity 5 is installed.Described substrate 1, mounting bracket 2 form by quartzy crystal or glass compacting with lens 3.Substrate 1 lower surface offers some heat radiation irrigation canals and ditches 12.
The employing glass preparation mounting bracket 2 that the present invention is breakthrough also uses the crystal polymorph system to make lens 3 on this basis.Enlarged the core component that the thermal source of great power LED distributes, thus the speed of having accelerated to distribute thermal source.The present invention uses mounting bracket 2, or the characteristic of the refraction that had of substrate 1 body and reflection is made into and has the reflection aggregation feature, adds the guiding of high light, has reduced diffusion and has improved its use value.Mainly strengthened simultaneously the effect of support in whole encapsulation.
Have and the glueing channel 8 that cavity 5 links to each other be installed in two sides of its mounting bracket 2, and utilize simultaneously this glueing channel 8 discharge more than glue, under the prerequisite of airtight cavity, the minimizing glue of maximum possible reduces aging possibility.
By changing the profile of internal stent, its internal reflection surface to be made up of the curved surface monomer that two pairs or more is centrosymmetric, and on its curved surface monomer, to be coated with total reflection film, the light that LED luminescence chip 4 is sent forms a rectangle, or square focus spot.
Claims (6)
1, a kind of enclosure support structure of great power LED of rectangular light spots, comprise mounting bracket (2), offer the installation cavity (5) that penetrates its upper and lower surface on the described mounting bracket (2), the sidewall of described installation cavity (5) is optically focused curved surface (6), is stained with reflectance coating (7) on the described optically focused curved surface (6).
2, the enclosure support structure of the great power LED of a kind of rectangular light spots as claimed in claim 1 is characterized in that offering on the described mounting bracket (2) and the glueing channel (8) that cavity (5) is communicated with is installed.
3, the enclosure support structure of the great power LED of a kind of rectangular light spots as claimed in claim 1 is characterized in that described mounting bracket (2) is provided with the step (9) of support of lens.
4, the enclosure support structure of the great power LED of a kind of rectangular light spots as claimed in claim 1 is characterized in that described mounting bracket (2) is round outside but spuare inside ring body shape.
5, the enclosure support structure of the great power LED of a kind of rectangular light spots as claimed in claim 1 is characterized in that being filled with in the described installation cavity (5) silica gel (10).
6, the enclosure support structure of the great power LED of a kind of rectangular light spots as claimed in claim 1, it is characterized in that described optically focused curved surface (6) is spliced for the curved surface monomer that two pairs or more is centrosymmetric, the curved surface monomer that constitutes optically focused curved surface (6) is the partial sidewall of straight wall or Rotary-table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910183724A CN101640246A (en) | 2009-08-06 | 2009-08-06 | Enclosure support structure of high-power LED with rectangular light spots |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910183724A CN101640246A (en) | 2009-08-06 | 2009-08-06 | Enclosure support structure of high-power LED with rectangular light spots |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101640246A true CN101640246A (en) | 2010-02-03 |
Family
ID=41615138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910183724A Pending CN101640246A (en) | 2009-08-06 | 2009-08-06 | Enclosure support structure of high-power LED with rectangular light spots |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101640246A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544340A (en) * | 2010-11-02 | 2012-07-04 | 嘉盛(马来西亚)私人有限公司 | Leadframe package with recessed cavity for led |
| CN108662452A (en) * | 2018-05-16 | 2018-10-16 | 木林森股份有限公司 | L ED lamp |
-
2009
- 2009-08-06 CN CN200910183724A patent/CN101640246A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544340A (en) * | 2010-11-02 | 2012-07-04 | 嘉盛(马来西亚)私人有限公司 | Leadframe package with recessed cavity for led |
| CN108662452A (en) * | 2018-05-16 | 2018-10-16 | 木林森股份有限公司 | L ED lamp |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Open date: 20100203 |