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CN101767079B - Plate loading machine, circuit board production system and method for manufacturing base plate - Google Patents

Plate loading machine, circuit board production system and method for manufacturing base plate Download PDF

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Publication number
CN101767079B
CN101767079B CN2009103000430A CN200910300043A CN101767079B CN 101767079 B CN101767079 B CN 101767079B CN 2009103000430 A CN2009103000430 A CN 2009103000430A CN 200910300043 A CN200910300043 A CN 200910300043A CN 101767079 B CN101767079 B CN 101767079B
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CN
China
Prior art keywords
workpiece
width
substrate
servo motor
liquid
Prior art date
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Expired - Fee Related
Application number
CN2009103000430A
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Chinese (zh)
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CN101767079A (en
Inventor
陈文村
廖新治
廖道明
沈家弘
连云飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Peng Ding Polytron Technologies Inc
Avary Holding Shenzhen Co Ltd
Original Assignee
Honsentech Co Ltd
Fukui Precision Component Shenzhen Co Ltd
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Publication date
Application filed by Honsentech Co Ltd, Fukui Precision Component Shenzhen Co Ltd filed Critical Honsentech Co Ltd
Priority to CN2009103000430A priority Critical patent/CN101767079B/en
Priority to US12/636,886 priority patent/US8464734B2/en
Publication of CN101767079A publication Critical patent/CN101767079A/en
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Publication of CN101767079B publication Critical patent/CN101767079B/en
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/08Apparatus, e.g. for photomechanical printing surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/022Cleaning travelling work
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736Methods for applying liquids, e.g. spraying
    • H05K2203/075Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1509Horizontally held PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Conveyors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)

Abstract

本发明提供一种电路板生产系统,其包括传送装置、两个相对设置的两个拍板机构、包括液体添加装置的湿处理装置以及控制装置。该两个拍板机构均包括感应板与伺服马达。该伺服马达用于驱动该两个拍板机构相互靠近或远离,以使感应板与放置在传送装置上的工件接触。该伺服马达上装有编码器,用于提供表征该伺服马达转动的编码信息。该控制装置用于依据第一、第二编码器提供的编码信息计算该工件的宽度或面积以及加工该工件的液体用量。本发明还提供一种电路板生产系统以及制作基板的方法,以保证制作的稳定性。

The invention provides a circuit board production system, which includes a conveying device, two clapper mechanisms arranged oppositely, a wet processing device including a liquid adding device and a control device. The two clapper mechanisms both include induction plates and servo motors. The servo motor is used to drive the two clapper mechanisms to approach or move away from each other, so that the induction plate contacts the workpiece placed on the conveying device. The servomotor is provided with an encoder for providing coded information representing the rotation of the servomotor. The control device is used for calculating the width or area of the workpiece and the amount of liquid used for processing the workpiece according to the coding information provided by the first and second encoders. The invention also provides a circuit board production system and a method for producing the substrate, so as to ensure the stability of the production.

Description

Plate putting machine, circuit board production system and the method for making substrate
Technical field
The present invention relates to the wet process technical field, particularly a kind of plate putting machine, circuit board production system and the method for making substrate.
Background technology
Wet process (Wet Process) is as the production process of making in the circuit boards; be with treatment fluid; be sprayed on the circuit substrate surface as various chemical liquids or water, to realize plated-through-hole, copper facing, etching, development, stripping, to be coated with technological processes such as organizational security cuticula, surface modification or cleaning.Document K.W.Lee, A.Viehbeck, Wet Process Surface Modification of Dielectric Polymers, IBM J.Research﹠amp; Development, 1994,38 (4) introduce and a kind ofly by wet process insulating barrier in the circuit board and adhesive layer are carried out surface modifying method, to improve the adhesion of insulating barrier and metal interlevel in the circuit board.
At present, common usage level wet treater in the circuit board making, its principle is: according to making needs, as development, etching, wet treater is to the circuit board surface sprinkling different chemical liquid of level by this wet treater, this chemical liquid is provided by liquid supplying apparatus, makes to finish the corresponding wet process of circuit board.In order to improve the utilization rate of chemical liquid, chemical liquid adopts the mode that recycles chemical liquid, promptly reclaims the chemical liquid of ejection, and offers wet treater by liquid supplying apparatus and reuse.Yet chemical liquid concentration in recycling can reduce gradually, and the chemical liquid product concentration that each wet process is sprayed can not remain unanimity, thereby causes the wet process bad stability, the quality of product after the reduction wet process.
Summary of the invention
Therefore, the method that is necessary to provide a kind of plate putting machine, circuit board production system and makes substrate, to address the above problem, the amplitude of variation of strength of fluid improves the stability of making when reducing wet process in the circuit board making.
Below will a kind of plate putting machine, circuit board production system and the method for making substrate be described with embodiment.
A kind of plate putting machine, it comprises that the workpiece that is used for being placed on it is along the conveyer of first direction transmission, the first clappers mechanism and second clappers mechanism and the control device that two are oppositely arranged.This first clappers mechanism comprises first tablet and first servo motor, this second clappers mechanism comprises second tablet and second servo motor, this first servo motor and second servo motor be respectively applied for drive this first, second clappers mechanism mutually near or away from so that this first tablet and second tablet respectively be placed on conveyer on the relative both sides of workpiece contact.On this first, second servo motor first, second encoder is housed respectively, this first, second encoder is respectively applied for to provide and characterizes the coded message that this servo motor rotates.This control device comprises width computing module and liquid consumption computing module, described width computing module, the coded message that the signal that is used for foundation first tablet and second tablet reads first, second encoder to be provided is calculated the width of this workpiece, and described liquid consumption computing module is used for calculating the liquid consumption that is used to process this workpiece according to the width of this workpiece.
A kind of method of making substrate, it may further comprise the steps: at first, conveyer transmits substrate to the precalculated position.Secondly, control device reads the data of first, second encoder, calculating substrate width according to the signal of first tablet and second tablet.At last, control device calculates the liquid consumption according to substrate width.
A kind of circuit board production system, it comprises plate putting machine, liquid appending apparatus and wet treater.This plate putting machine comprises that the workpiece that is used for being placed on it is along the conveyer of first direction transmission, the first clappers mechanism and second clappers mechanism and the control device that two are oppositely arranged.This first clappers mechanism comprises first tablet and first servo motor, this second clappers mechanism comprises second tablet and second servo motor, this first servo motor and second servo motor be respectively applied for drive this first, second clappers mechanism mutually near or away from so that this first tablet and second tablet respectively be placed on conveyer on the relative both sides of workpiece contact.On this first, second servo motor first, second encoder is housed respectively, this first, second encoder is respectively applied for to provide and characterizes the coded message that this servo motor rotates.This control device comprises width computing module, liquid consumption computing module and control module.This width computing module is used for calculating according to the coded message that first, second encoder provides the width of this workpiece.This liquid consumption computing module is used for calculating the liquid consumption that is used to process this workpiece according to the width of this workpiece.This control module is used for controlling this liquid appending apparatus according to this liquid consumption and adds liquid to wet treater.
Compared with prior art, this plate putting machine, circuit board production system and the method for making substrate can calculate the width of pending workpiece, and calculate the consumption of required liquid according to this width gauge.Thus, can be at any time the liquid of this consumption be replenished follow-up wet treater, the concentration of the liquid that this circuit board production system uses can be consistent.
Description of drawings
Fig. 1 is the structural representation of the plate putting machine that provides of the technical program first embodiment.
Fig. 2 is the control program module map of the control device of Fig. 1.
Fig. 3 is the user mode figure of the plate putting machine that provides of the technical program first embodiment.
Fig. 4 is the control program module map of the control device that provides of the technical program second embodiment.
Fig. 5 is the control program module map of the control device of the circuit board production system that provides of the technical program embodiment.
The specific embodiment
Below in conjunction with accompanying drawing and a plurality of embodiment, plate putting machine, circuit board production system and production method that the technical program is provided are described in further detail.
See also Fig. 1 to Fig. 3, the plate putting machine 1 that the technical program first provides, it comprises conveyer 10, two first clappers mechanisms 12 and second that are oppositely arranged have the final say mechanism 14 and control device 16.
This conveyer 10 is used to transmit pending workpiece, and its structure can be selected according to actual needs, for example: horizontal conveyer (for example conveyer belt, delivery roller), lift conveyer.In the present embodiment, conveyer 10 comprises delivery roller 100 and lifting roller 102.This delivery roller 100 is used for workpiece placed thereon is transmitted along first direction (Fig. 1 directions X), and it comprises the parallel and roller set that be provided with at interval of a plurality of turning cylinders, and each roller set comprises a plurality of rollers that are arranged at same turning cylinder.This lifting roller 102 is used for workpiece placed thereon along second direction (Fig. 1 Y direction) transmission, and it comprises that a plurality of turning cylinders are parallel and is arranged at roller between the adjacent delivery roller 100.The turning cylinder of each roller in this lifting roller 102 is perpendicular to the turning cylinder of delivery roller 100, and can transmit certainly and rise to delivery roller 100 tops between the roller 100.
In the present embodiment, plate putting machine also comprises position sensor 11, is used for responding to workpiece and whether has reached the precalculated position in transmission course, and signal is delivered to control device 16 for processing.This position sensor 11 is positioned at the below of delivery roller 100, and corresponding with the workpiece upstream end of lifting roller 102, is used to respond to workpiece and whether is positioned at lifting roller 102 tops.Certainly, this position sensor 11 also can be positioned at the top of delivery roller 100.The bottom of this lifting roller 102 also can be provided with position sensor (figure does not show), is used to respond to the position after lifting roller 102 rises or descends.Certainly, also can be at other location settings sensors, to determine the position of workpiece.
This first clappers mechanism 12 comprises first tablet 120 and first servo motor 122.This first servo motor 122 be used to drive this first tablet 120 near or away from the workpiece that is placed on the conveyer.This first servo motor 122 is equipped with first encoder (figure does not show), is used to provide the coded message that characterizes these first servo motor, 122 rotations.For example first encoder can be photoelectric encoder, and first servo motor 122 is as long as rotate, and first encoder just continues to send the information that alternately changes (for example alternately change 0 and 1), and every information represents that first servo motor turns over certain angle.In the present embodiment, first tablet 120 is for being built-in with the plate body of sensor, be used for when its when workpiece on being positioned at conveyer 10 contacts, send activation signal to control device 16.Certainly, first tablet 120 also can be the plate body that the surface is provided with sensor, if when its when workpiece on conveyer 10 contacts, can send activation signal to control device 16 and get final product.
The structure of this second clappers mechanism 14 and the structure of the first clappers mechanism 12 are roughly the same, and it comprises second tablet 140 and second encoder, second servo motor 142 of (figure does not show) is housed.This second tablet 140 is for being built-in with the plate body of sensor, be used under the driving of second servo motor 142, match with first tablet 120 do mutually near or away from motion, and on being positioned at workpiece when side with respect to first tablet 120 contacts, send activation signal to control device 16.This second encoder is used to provide the coded message that characterizes these second servo motor, 142 rotations.
In the present embodiment, first, second clappers mechanism 12,14 is before doing, and the initial spacing of first tablet 120 and second tablet 140 is D.The position of these two clappers mechanisms 12,14 is corresponding with the position of lifting roller 102, it is corresponding from transmitting the height that rises between the roller 100 with lifting roller 102 from transmitting the height that roller 100 stretches out, and can contact with the workpiece that is positioned over lifting roller 102 when guaranteeing that these two clappers mechanisms 12,14 are close mutually.
Control device 16 is used for controlling simultaneously the motion of conveyer 10 and first, second clappers mechanism 12,14.Control module and computing unit included in this control device 16 can determine according to actual design.
See also Fig. 2, the control program module map of the control device 16 of the technical program first embodiment.This control device 16 comprises transmit control unit 160, clappers mechanism controls unit 162 and width computing module 164.
This transmit control unit 160 is used for the signal according to the position sensor 11 that is received, and the delivery roller 100 of control conveyer 10 and lifting roller 102 conveying work pieces are to desired location.This clappers mechanism kinematic control module 162 is used for the activation signal that signal and first, second tablet 120,140 according to the position sensor 11 that is received send, control first, second tablet 120,140 mutually near or away from motion.This width computing module 164 is used for calculating according to the coded message that the activation signal that first, second tablet 120,140 sends reads first, second encoder and provides the width of this workpiece.
See also Fig. 2 and Fig. 3, describe the course of work of the use the technical program first embodiment plate putting machine 1 making substrate 2 below with reference to the control program module map of control device 16 in detail.
At first, the delivery roller 100 of the transmit control unit 160 control conveyers 10 of control device 16 transmits substrate 2 with default transfer rate v and enters lifting roller 102 regions.When position sensor 11 is sensed substrate 3 and left, that is: this substrate 2 is positioned at lifting roller 102 tops.These transmit control unit 160 control lifting rollers 102 rise to desired height.
Secondly, after clappers mechanism kinematic control module 162 receives the signal of position sensor of the bottom that is arranged at lifting roller 102, control 122,142 motions of first, second servo motor, make relative two tablets 120,140 close, with the relative two sides contact of substrate 2.Behind the activation signal that clappers mechanism kinematic control module 162 first, second tablets 120,140 of reception send, stop first, second servo motor 122,142 motions.
Simultaneously, width computing module 164 calculates the width W of substrate 2.Particularly, width computing module 164 receives the activation signal while that first, second tablet 120,140 sends, the coded message that first, second servo motor 122,142 of sign that reading first, second encoder respectively provides rotates; Calculate first, second tablet 120,140 move distances according to this coded message again.This width computing module 164 deducts first, second tablet 120,140 move distances with the initial space D of first, second tablet 120,140, can obtain the width W of substrate 2.And the distance of first, second tablet 120,140 motions is as follows via the coded message computational process that first, second servo motor 122,142 run duration encoders provide: encoder whenever sends a signal and represents servo motor to turn over corresponding angle, can count by the coded message that encoder is sent and to calculate the angle that motor turns over, and then obtain the distance of first, second tablet 120,140 motions.That is to say that width computing module 164, begins the encoder information that encoder provides is counted in first, second servo motor 122,142 beginnings, finishes when first, second servo motor 122,142 stop motions after workpiece motion s.After width computing module 164 calculates width, this width can be transferred to other modules and further handle.
See also Fig. 4, the control program module map of the control device 26 of the technical program second embodiment.The framework of this control device 26 and control device 16 are roughly the same, and its difference is that it comprises area computing module 263.
This area computing module 263 comprises width computing module 264 and length computation module 265, is used for calculating the workpiece area according to the width of the workpiece of width computing module 264 acquisitions and the Workpiece length of length computation module 265 acquisitions.This width computing module 264 is used for calculating according to the coded message that the activation signal that first, second tablet 120,140 sends reads first, second encoder and provides the width of this workpiece.This length computation module 265 is used for according to the calculated signals workpiece of position sensor 11 length along first direction of transfer.
In the use, the length computation module 265 of area computing module 263 can calculate the length L of substrate 2 in the process of conveyer transmission substrate 2.For example, sense substrate 2 when position sensor 11 and be positioned at its when below first, the 263 record very first times of area computing module, when position sensor 11 is sensed substrate 2 and is left, 263 second times of record of area computing module.This length computation module 265 can calculate substrate 2 length according to time interval t and the transfer rate v of second time and the very first time.If transfer rate at the uniform velocity the time, L=v * t.When if transfer rate is speed change, substrate 2 length can be calculated according to the percentage speed variation and the time interval.In addition, length also can adopt and calculate the similar mode of first tablet, 120 move distances and obtains.
Secondly, after width computing module 264 calculated the width of substrate 2, area computing module 263 was calculated area according to length and width gauge.Substrate 2 in the present embodiment is a rectangle, and this area computing module 263 obtains the area of substrate 2 according to the width W of the length L of length computation module 265 and width computing module 264.If being shaped as of substrate 2 is irregularly shaped, can input in the control device 16 by angle substrate 2, make area computing module 263 read this angle, calculate acquisition substrate 2 areas according to width W that calculates and length L again.
The live roller 100 that is appreciated that this plate putting machine 1 can be connected with the conveying device in the wet treater (figure does not show), and being used to constitute can be according to the circuit board production system of substrate width control circuit board production.At this moment, the control program module map of the control device 36 of this circuit board production system as shown in Figure 5.
The framework of the control device 26 of the structure of this control device 36 and second embodiment is roughly the same, and its difference is: it comprises interpolation liquid control module 366.This interpolation liquid control module 366 comprises area computing module 363, liquid consumption computing module 367 and control module 368.The workpiece planimeter that this liquid consumption computing module 367 is calculated according to area computing module 363 is calculated the amount of liquid of the required use of this workpiece.This control module 368 is used for controlling liquid appending apparatus and adds the corresponding liquid amount to wet treater.Certainly, the width of the workpiece that also can be calculated according to the width computing module of the control device 16 of first embodiment of this liquid consumption computing module 367 calculates the amount of liquid of the required use of this workpiece.
With substrate 2 is the using method that example illustrates this circuit board production system.Adopt area computing module 363 among second embodiment to calculate the area of substrate 2.Then, liquid consumption computing module 367 reads substrate 2 areas from area computing module 363, thereby in conjunction with transfer rate v and default wet process calculation of parameter fluid body and function amount.Because the needs of each wet process may there are differences, therefore, as long as with parameter input control devices 36 such as wet process time, required strength of fluids, this liquid consumption computing module 367 reads corresponding data and in conjunction with substrate 2 areas, can calculate the liquid consumption before each wet process.
At last, this control module 368 reads the liquid consumption from liquid consumption computing module 367, and adds the liquid of respective amount to wet treater, uses for this substrate 2 of wet process.The kind of the liquid that is provided can be decided according to the wet process needs, as: developer solution, etching solution, copper plating bath etc.
Because during this circuit board production system uses, by calculating substrate 2 required liquid consumptions, and the liquid of this consumption is added to wet treater, the strength of fluid that this circuit board production system is used can remain unanimity.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.

Claims (8)

1.一种放板机,其包括:1. A board machine, comprising: 传送装置,用于将放置在其上的工件沿第一方向传输;a conveying device for conveying the workpiece placed thereon along a first direction; 两个相对设置的第一拍板机构与第二拍板机构,该第一拍板机构包括第一感应板与第一伺服马达,该第二拍板机构包括第二感应板与第二伺服马达,该第一伺服马达与第二伺服马达分别用于驱动该第一、第二拍板机构相互靠近或远离,以使该第一感应板与第二感应板分别与放置在传送装置上的工件的相对两边接触;Two oppositely arranged first clapper mechanism and second clapper mechanism, the first clapper mechanism includes a first induction plate and a first servo motor, the second clapper mechanism includes a second induction plate and a second servo motor, the first clapper mechanism The servo motor and the second servo motor are respectively used to drive the first and second clapper mechanisms to approach or move away from each other, so that the first induction plate and the second induction plate are respectively in contact with opposite sides of the workpiece placed on the conveying device; 控制装置,用于控制该传送装置及第一、第二拍板机构;a control device for controlling the conveying device and the first and second clapper mechanisms; 其特征在于:It is characterized by: 该第一、第二伺服马达上分别装有第一、第二编码器,该第一、第二编码器分别用于提供表征该伺服马达转动的编码信息;The first and second servo motors are respectively equipped with first and second encoders, and the first and second encoders are respectively used to provide coded information representing the rotation of the servo motor; 该控制装置包括宽度计算模块及液体用量计算模块,所述宽度计算模块用于依据第一感应板与第二感应板的信号读取第一、第二编码器提供的编码信息计算该工件的宽度,所述液体用量计算模块用于依据该工件的宽度计算用于加工该工件的液体用量。The control device includes a width calculation module and a liquid consumption calculation module, the width calculation module is used to calculate the width of the workpiece by reading the coded information provided by the first and second encoders according to the signals of the first induction plate and the second induction plate , the liquid consumption calculation module is used to calculate the liquid consumption for processing the workpiece according to the width of the workpiece. 2.如权利要求1所述的放板机,其特征在于,其还包括设置于传送装置入口处的位置传感器,该控制装置包括长度计算模块,该长度计算模块用于根据位置传感器的信号计算工件沿传送方向的长度,所述液体用量计算模块用于依据该宽度计算模块计算得到的宽度以及该长度计算模块计算得到的该工件的长度计算用于加工该工件的液体用量。2. The plate placing machine according to claim 1, characterized in that, it also includes a position sensor arranged at the entrance of the conveying device, and the control device includes a length calculation module, which is used to calculate the length according to the signal of the position sensor The length of the workpiece along the conveying direction, the liquid consumption calculation module is used to calculate the liquid consumption for processing the workpiece according to the width calculated by the width calculation module and the length of the workpiece calculated by the length calculation module. 3.如权利要求1所述的放板机,其特征在于,该传送装置包括传送滚轮与升降滚轮,该传送滚轮用于将放置在其上的工件沿第一方向传输,其包括多个平行间隔设置的滚轮组,每个滚轮组包括设置于同一转动轴的多个滚轮,用于将放置在其上的工件沿第一方向传输,所述升降滚轮用于将放置在其上的工件沿垂直于第一方向的第二方向传输,其包括多个转动轴平行并设置于相邻的传送滚轮之间的滚轮,其转动轴垂直于传送滚轮的转动轴,并可自传送滚轮之间升至传送滚轮上方。3. The plate placing machine according to claim 1, wherein the conveying device comprises conveying rollers and lifting rollers, and the conveying rollers are used to convey the workpiece placed thereon along the first direction, which comprises a plurality of parallel rollers. Roller groups arranged at intervals, each roller group includes a plurality of rollers arranged on the same rotating shaft, used to transport the workpiece placed on it along the first direction, and the lifting rollers are used to transfer the workpiece placed on it along the first direction The second direction of transmission perpendicular to the first direction, which includes a plurality of rollers whose rotation axes are parallel and arranged between adjacent transmission rollers, whose rotation axes are perpendicular to the rotation axes of the transmission rollers, and can be lifted from between the transmission rollers over the transport rollers. 4.一种使用如权利要求1至3任一项所述的放板机制作基板的方法,其包括以下步骤:4. A method for making a substrate using the board placing machine according to any one of claims 1 to 3, comprising the following steps: 传送装置传送基板到预定位置;The transfer device transfers the substrate to a predetermined position; 控制装置根据第一感应板与第二感应板的信号读取第一、第二编码器的数据,计算基板宽度;The control device reads the data of the first and second encoders according to the signals of the first induction plate and the second induction plate, and calculates the substrate width; 控制装置根据基板宽度计算液体用量。The control unit calculates the amount of liquid to be used according to the width of the substrate. 5.如权利要求4所述的制作基板方法,其特征在于,其还包括通过读取被传送的基板达到与离开同一位置的时间间隔,计算出基板长度,从而依据基板宽度及长度计算基板面积。5. The method for manufacturing a substrate according to claim 4, further comprising calculating the length of the substrate by reading the time interval between when the conveyed substrate reaches and leaves the same position, thereby calculating the substrate area according to the substrate width and length . 6.如权利要求5所述的制作基板方法,其特征在于,其还包括在计算基板面积步骤后,控制装置根据基板面积计算液体用量。6 . The method for manufacturing a substrate according to claim 5 , further comprising, after the step of calculating the substrate area, the control device calculates the amount of liquid used according to the substrate area. 7 . 7.一种电路板生产系统,其包括放板机、液体添加装置及湿处理装置;7. A circuit board production system, which includes a board placing machine, a liquid adding device and a wet processing device; 该放板机包括:The trigger includes: 传送装置,用于将放置在其上的工件沿第一方向传输;a conveying device for conveying the workpiece placed thereon along a first direction; 两个相对设置的第一拍板机构与第二拍板机构,该第一拍板机构包括第一感应板与第一伺服马达,该第二拍板机构包括第二感应板与第二伺服马达,该第一伺服马达与第二伺服马达分别用于驱动该第一、第二拍板机构相互靠近或远离,以使该第一感应板与第二感应板分别与放置在传送装置上的工件的相对两边接触,该第一、第二伺服马达上分别装有第一、第二编码器,该第一、第二编码器分别用于提供表征该伺服马达转动的编码信息;以及Two oppositely arranged first clapper mechanism and second clapper mechanism, the first clapper mechanism includes a first induction plate and a first servo motor, the second clapper mechanism includes a second induction plate and a second servo motor, the first clapper mechanism The servo motor and the second servo motor are respectively used to drive the first and second clapper mechanisms to approach or move away from each other, so that the first induction plate and the second induction plate are respectively in contact with opposite sides of the workpiece placed on the conveying device, The first and second servo motors are respectively equipped with first and second encoders, and the first and second encoders are respectively used to provide coded information representing the rotation of the servo motor; and 控制装置,用于控制该第一、第二拍板机构,其包括:The control device is used to control the first and second clapper mechanisms, which include: 宽度计算模块,用于依据第一、第二编码器提供的编码信息计算该工件的宽度;a width calculation module, configured to calculate the width of the workpiece according to the encoding information provided by the first and second encoders; 液体用量计算模块,用于依据该工件的宽度计算用于加工该工件的液体用量;与The liquid consumption calculation module is used to calculate the liquid consumption for processing the workpiece according to the width of the workpiece; and 控制模块,用于依据该液体用量控制该液体添加装置向湿处理装置添加液体。The control module is used to control the liquid adding device to add liquid to the wet processing device according to the amount of the liquid. 8.如权利要求7所述的电路板生产系统,其特征在于,其还包括设置于传送装置入口处的位置传感器,该控制装置包括长度计算模块,该长度计算模块用于根据位置传感器的信号计算工件沿传送方向的长度,该液体用量计算模块用于依据该工件的宽度与长度计算用于加工该工件的液体用量。8. The circuit board production system according to claim 7, further comprising a position sensor arranged at the entrance of the conveying device, the control device comprising a length calculation module, the length calculation module is used for the signal according to the position sensor Calculate the length of the workpiece along the conveying direction, and the liquid consumption calculation module is used to calculate the liquid consumption for processing the workpiece according to the width and length of the workpiece.
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