CN101788612B - Resistance measurement module of printed circuit board and its measurement method - Google Patents
Resistance measurement module of printed circuit board and its measurement method Download PDFInfo
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Abstract
Description
技术领域 technical field
本发明涉及一种印刷电路板的阻值测量模块及其测量方法，特别涉及用以测量阻值的误差值小于0.1欧姆的印刷电路板的一种阻值测量模块及其测量方法。The invention relates to a resistance measuring module of a printed circuit board and a measuring method thereof, in particular to a resistance measuring module and a measuring method thereof for a printed circuit board whose resistance error value is less than 0.1 ohm.
背景技术 Background technique
图1为公知阻值测量模块的测量示意图。请参阅图1，公知阻值测量模块10包括第一上接触针头11、第二上接触针头12、第一下接触针头13、第二下接触针头14以及阻值测量仪15，第一上接触针头11连接第一上电力线16，第二上接触针头12连接第二上电力线17，第一下接触针头13连接第一下电力线18，而第二下接触针头14连接第二下电力线19。当欲检测待测量印刷电路板20时，第一上接触针头11与第二上接触针头12会同时设置于待测量印刷电路板20的锡球21上，而第一下接触针头13与第二下接触针头14同时设置于待测量印刷电路板20的金属垫22上。由于接触针头具有针径(约为50μm)，而接触针头的设置距离为70μm，因此锡球21直径最小只能到达73-75μm。FIG. 1 is a measurement schematic diagram of a known resistance measurement module. Please refer to Fig. 1, the known
由于目前电子产品不断地微小化，因此电路板的设计也随之变小，锡球21的直径也需要跟着缩减，为求测试更小的锡球21，因此必须制作更小的接触针头的针径以及缩减接触针头的设置距离，可能大幅增加成本以及加工困难度。Due to the continuous miniaturization of current electronic products, the design of the circuit board is also reduced accordingly, and the diameter of the
发明内容 Contents of the invention
为了解决上述问题，本发明的目的是提供一种印刷电路板的阻值测量模块，包括上接触针头、第一下接触针头、第二下接触针头以及阻值测量仪(例如三用电表中的阻值测量功能)。上接触针头同时与第一上电力线以及第二上电力线电性连接，第一下接触针头与第一下电力线电性连接，第二下接触针头与第二下电力线电性连接，而阻值测量仪与第一上电力线、第二上电力线、第一下电力线以及第二下电力线电性连接。In order to solve the above problems, the object of the present invention is to provide a resistance measuring module of a printed circuit board, comprising an upper contact needle, a first lower contact needle, a second lower contact needle and a resistance measuring instrument (for example, in a three-purpose electric meter resistance measurement function). The upper contact needle is electrically connected to the first upper power line and the second upper power line at the same time, the first lower contact needle is electrically connected to the first lower power line, the second lower contact needle is electrically connected to the second lower power line, and the resistance measurement The instrument is electrically connected with the first upper power line, the second upper power line, the first lower power line and the second lower power line.
应注意的是，本发明的印刷电路板的阻值测量模块还包括多个上开关以及多个下开关，所述上开关分别设于第一上电力线以及第二上电力线上，而所述下开关分别设于第一下电力线以及第二下电力线上。It should be noted that the resistance measurement module of the printed circuit board of the present invention also includes a plurality of upper switches and a plurality of lower switches, the upper switches are respectively arranged on the first upper power line and the second upper power line, and the lower The switches are respectively arranged on the first lower power line and the second lower power line.
本发明的目的在于提供一种印刷电路板的阻值测量模块，包括上接触针头、下接触针头以及阻值测量仪。上接触针头与第一上电力线以及第二上电力线连接，下接触针头同时与第一下电力线以及第二下电力线连接，而阻值测量仪与第一上电力线、第二上电力线、第一下电力线以及第二下电力线电性连接。The object of the present invention is to provide a resistance measuring module of a printed circuit board, which includes an upper contact needle, a lower contact needle and a resistance measuring instrument. The upper contact needle is connected with the first upper power line and the second upper power line, the lower contact needle is connected with the first lower power line and the second lower power line at the same time, and the resistance measuring instrument is connected with the first upper power line, the second upper power line, the first lower power line The power line and the second lower power line are electrically connected.
本发明的目的在于提供一种印刷电路板的阻值测量模块的测量方法，其步骤包括：提供印刷电路板的阻值测量模块与待测量印刷电路板电性连接，该阻值测量模块包括同时与第一上电力线以及第二上电力线电性连接的上接触针头、与第一下电力线电性连接的第一下接触针头、与第二下电力线电性连接的第二下接触针头、与第一上电力线、第二上电力线、该第一下电力线以及第二下电力线电性连接的阻值测量仪、分别设于第一上电力线以及第二上电力线上的多个上开关以及分别设于第一下电力线以及第二下电力线上的多个下开关，其中，测量模块及待测量印刷电路板的系统内电阻R4W3P＝2*[(上开关内电阻Rus+上电力线的内电阻Ruw+上电力线接头至上接触针头绕线点之间的电阻Rj)+(下接触针头与待测量印刷电路板的接触电阻Rdc+下电力线接头至下接触针头之间的电阻Rdj+下电力线的内电阻Rdw+下开关内电阻Rds)]；导通与上接触针头电性连接的第一上电力线以及第一下电力线，而第二上电力线以及第二下电力线为断路，测量此一步骤的电阻值R1＝(上开关内电阻Rus+第一上电力线的内电阻Ruw+第一上电力线接头至上接触针头绕线点之间的电阻Rj)+上接触针的电阻Rt+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+待测量印刷电路板的内电阻Rp+(下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc+第一下电力线接头至下接触针头之间的电阻Rdj+第一下电力线的内电阻Rdw+下开关内电阻Rds)；导通与上接触针头电性连接的第二上电力线以及第二下电力线，而第一上电力线以及第一下电力线为断路，测量此一步骤的电阻值R2＝(上开关内电阻Rus+第二上电力线的内电阻Ruw+第二上电力线接头至上接触针头绕线点之间的电阻Rk)+上接触针的电阻Rt+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+待测量印刷电路板的内电阻Rp+(下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc+第二下电力线接头至下接触针头之间的电阻Rdj+第二下电力线的内电阻Rdw+下开关内电阻Rds)；以及计算(电阻值R1+电阻值R2-测量模块及待测量印刷电路板的系统内电阻R4W3P)/2，求得待测量印刷电路板的内电阻Rp+该上接触针的电阻Rt+上接触针头与该待测量印刷电路板上锡球面的接触电阻Ruc。The object of the present invention is to provide a method for measuring a resistance measuring module of a printed circuit board, the steps of which include: providing a resistance measuring module of a printed circuit board electrically connected to the printed circuit board to be measured, the resistance measuring module comprising a simultaneous The upper contact needle electrically connected with the first upper power line and the second upper power line, the first lower contact needle electrically connected with the first lower power line, the second lower contact needle electrically connected with the second lower power line, and the first lower contact needle electrically connected with the second lower power line. An upper power line, a second upper power line, a resistance measuring instrument electrically connected to the first lower power line and the second lower power line, a plurality of upper switches respectively arranged on the first upper power line and the second upper power line, and respectively arranged on A plurality of lower switches on the first lower power line and the second lower power line, wherein, the system internal resistance R 4W3P of the measurement module and the printed circuit board to be measured=2*[(the internal resistance Rus of the upper switch internal resistance Rus+the upper power line Ruw+the upper power line The resistance Rj between the connector and the winding point of the upper contact needle) + (the contact resistance Rdc between the lower contact needle and the printed circuit board to be measured + the resistance Rdj between the lower power line connector and the lower contact needle + the internal resistance of the lower power line Rdw + the internal resistance of the lower switch Rds)]; conducting the first upper power line and the first lower power line electrically connected with the upper contact pin, while the second upper power line and the second lower power line are disconnected, and the resistance value R1=(in the upper switch) is measured in this step Resistance Rus + internal resistance Ruw of the first upper power line + resistance Rj) between the first upper power line connector and the winding point of the upper contact pin + resistance Rt of the upper contact pin + contact resistance Ruc between the upper contact pin and the solder spherical surface on the printed circuit board to be measured + Internal resistance Rp of the printed circuit board to be measured + (contact resistance Rdc between the lower contact needle and the metal pad on the printed circuit board to be measured + resistance Rdj between the first lower power line connector and the lower contact needle + internal resistance Rdw of the first lower power line + lower switch internal resistance Rds); conducting the second upper power line and the second lower power line electrically connected with the upper contact pin, while the first upper power line and the first lower power line are disconnected, measuring the resistance value of this step R2=(upper switch Internal resistance Rus + internal resistance Ruw of the second upper power line + resistance Rk between the second upper power line connector and the winding point of the upper contact needle + resistance Rt of the upper contact needle + contact resistance between the upper contact needle and the solder spherical surface on the printed circuit board to be measured Ruc + the internal resistance Rp of the printed circuit board to be measured + (the contact resistance Rdc between the lower contact needle and the metal pad on the printed circuit board to be measured + the resistance Rdj between the second lower power line connector and the lower contact needle + the internal resistance Rdw of the second lower power line + lower switch internal resistance Rds); and calculation (resistance value R1+resistance value R2-measurement module and the system internal resistance R 4W3P of the printed circuit board to be measured)/2, obtain the internal resistance Rp of the printed circuit board to be measured+the upper contact pin The contact resistance Ruc between the contact needle on the resistance Rt+ and the solder spherical surface on the printed circuit board to be measured.
应注意的是，上接触针的电阻Rt为已知条件，而上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc可忽略不记，故待测量印刷电路板的内电阻Rp＝[(电阻值R1+电阻值R2-测量模块及待测量印刷电路板的系统内电阻R4W3P)/2]-上接触针的电阻Rt。It should be noted that the resistance Rt of the upper contact pin is a known condition, and the contact resistance Ruc between the upper contact pin and the tin spherical surface of the printed circuit board to be measured can be ignored, so the internal resistance Rp of the printed circuit board to be measured = [ (resistance value R1+resistance value R2-system internal resistance R 4W3P of the measuring module and the printed circuit board to be measured)/2]-resistance Rt of the upper contact pin.
应注意的是，待测量印刷电路板的测量阻值误差值小于0.1欧姆。It should be noted that the measured resistance error of the printed circuit board to be measured is less than 0.1 ohm.
应注意的是，待测量印刷电路板包括上表面以及下表面，上表面包括多个锡球，而下表面包括多个金属垫，并且上接触针头分别与锡球电性连接，而第一下接触针头以及第二下接触针头分别与金属垫连接。It should be noted that the printed circuit board to be measured includes an upper surface and a lower surface, the upper surface includes a plurality of solder balls, and the lower surface includes a plurality of metal pads, and the upper contact pins are respectively electrically connected to the solder balls, while the first lower surface The contact needle and the second lower contact needle are respectively connected to the metal pad.
本发明的目的在于提供一种印刷电路板的阻值测量模块的测量方法，其步骤包括：提供印刷电路板的阻值测量模块与待测量印刷电路板电性连接，阻值测量模块包括同时与第一上电力线以及第二上电力线连接的上接触针头、同时与第一下电力线以及第二下电力线连接的下接触针头、与第一上电力线、第二上电力线、第一下电力线以及第二下电力线电性连接的阻值测量仪、分别设于第一上电力线以及第二上电力线上的多个上开关以及分别设于第一下电力线以及第二下电力线上的多个下开关，其中，测量模块及待测量印刷电路板的系统内电阻R4W2P＝2*[(上开关内电阻Rus+上电力线的内电阻Ruw+上电力线接头至上接触针头绕线点之间的电阻Rj)+(下电力线接头至下接触针头绕线点之间的电阻Rjd+下电力线的内电阻Rdw+下开关内电阻Rds)]；导通与上接触针头电性连接的第一上电力线以及第一下电力线，而第二上电力线以及第二下电力线为断路，测量此一步骤的电阻值R1＝(上开关内电阻Rus+第一上电力线的内电阻Ruw+第一上电力线接头至上接触针头绕线点之间的电阻Rj)+上接触针的电阻Rt+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+待测量印刷电路板的内电阻Rp+下接触针的电阻Rtd+下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc+(第一下电力线接头至下接触针头绕线点之间的电阻Rjd+第一下电力线的内电阻Rdw+下开关内电阻Rds)；导通与上接触针头电性连接的第二上电力线以及第二下电力线，而第一上电力线以及第一下电力线为断路，测量此一步骤的电阻值R2＝(上开关内电阻Rus+第二上电力线的内电阻Ruw+第二上电力线接头至上接触针头绕线点之间的电阻Rj)+上接触针的电阻Rt+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+待测量印刷电路板的内电阻Rp+下接触针的电阻Rtd+下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc+(第二下电力线接头与下接触针头绕线点之间的电阻Rjd+第二下电力线的内电阻Rdw+下开关内电阻Rds)；以及计算(电阻值R1+电阻值R2-测量模块及待测量印刷电路板的系统内电阻R4W2P)/2，求得待测量印刷电路板的内电阻Rp+上接触针的电阻Rt+下接触针的电阻Rtd+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc。The object of the present invention is to provide a method for measuring a resistance measuring module of a printed circuit board, the steps of which include: providing a resistance measuring module of a printed circuit board electrically connected to the printed circuit board to be measured, the resistance measuring module including The upper contact needle connected to the first upper power line and the second upper power line, the lower contact needle connected to the first lower power line and the second lower power line at the same time, the first upper power line, the second upper power line, the first lower power line and the second A resistance measuring instrument electrically connected to the lower power line, a plurality of upper switches respectively arranged on the first upper power line and a second upper power line, and a plurality of lower switches respectively arranged on the first lower power line and the second lower power line, wherein , the system internal resistance R 4W2P of the measurement module and the printed circuit board to be measured = 2*[(the internal resistance Rus of the upper switch + the internal resistance Ruw of the upper power line + the resistance Rj between the upper power line connector and the winding point of the upper contact needle) + (lower power line The resistance Rjd+internal resistance Rdw+lower switch internal resistance Rds)] between the connector and the winding point of the lower contact needle; the first upper power line and the first lower power line electrically connected to the upper contact needle are turned on, and the second The upper power line and the second lower power line are disconnected, and the resistance value of this step is measured R1=(internal resistance Rus of the upper switch+internal resistance Ruw of the first upper power line+resistance Rj between the first upper power line connector and the winding point of the upper contact needle) + resistance Rt of the upper contact pin + contact resistance Ruc between the upper contact pin and the solder spherical surface on the printed circuit board to be measured + internal resistance Rp of the printed circuit board to be measured + resistance Rtd of the lower contact pin + lower contact pin and the metal pad on the printed circuit board to be measured contact resistance Rdc+(resistance Rjd between the first lower power line connector and the winding point of the lower contact needle+internal resistance Rdw of the first lower power line+internal resistance Rds of the lower switch); the second upper contact electrically connected to the upper contact needle is turned on The power line and the second lower power line, while the first upper power line and the first lower power line are disconnected, measure the resistance value of this step R2=(upper switch internal resistance Rus+second upper power line internal resistance Ruw+second upper power line connector to upper contact The resistance Rj) between the needle winding points + the resistance Rt of the upper contact pin + the contact resistance Ruc between the upper contact pin and the solder spherical surface on the printed circuit board to be measured + the internal resistance Rp of the printed circuit board to be measured + the resistance Rtd of the lower contact pin + the lower contact The contact resistance Rdc+(the resistance Rjd+the internal resistance Rdw+lower switch internal resistance Rds of the second lower power line between the second lower power line connector and the lower contact needle winding point) of the needle head and the metal pad on the printed circuit board to be measured; and calculation ( Resistance value R1+resistance value R2-system internal resistance R 4W2P )/2 of the measurement module and the printed circuit board to be measured, and the internal resistance Rp of the printed circuit board to be measured+resistance Rt of the upper contact pin+resistance Rtd of the lower contact pin+upper contact The contact resistance Ruc between the needle and the tin spherical surface on the printed circuit board to be measured + the contact resistance Rdc between the lower contact needle and the metal pad on the printed circuit board to be measured.
应注意的是，上接触针的电阻Rt与下接触针的电阻Rtd为已知条件，而上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc以及下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc可忽略不记，故待测量印刷电路板的内电阻Rp＝[(电阻值R1+电阻值R2-测量模块及待测量印刷电路板的系统内电阻R4W2P)/2]-(上接触针的电阻Rt+下接触针的电阻Rtd)。It should be noted that the resistance Rt of the upper contact pin and the resistance Rtd of the lower contact pin are known conditions, while the contact resistance Ruc between the upper contact pin and the solder spherical surface on the printed circuit board to be measured and the contact resistance Ruc between the lower contact pin and the printed circuit board to be measured The contact resistance Rdc of the upper metal pad can be ignored, so the internal resistance Rp of the printed circuit board to be measured=[(resistance value R1+resistance value R2-system internal resistance R 4W2P of the measurement module and the printed circuit board to be measured)/2] -(resistance Rt of the upper contact pin + resistance Rtd of the lower contact pin).
本发明提供四线三针形式以及四线二针形式的阻值测量模块，可大幅降低测量模块的制造成本以及加工困难度。The invention provides resistance measuring modules in the form of four wires and three pins and four wires and two pins, which can greatly reduce the manufacturing cost and processing difficulty of the measuring modules.
为使本发明的上述目的、特征和优点能更明显易懂，下文特举优选实施例并配合附图做详细说明。In order to make the above-mentioned objects, features and advantages of the present invention more comprehensible, preferred embodiments are specifically cited below and described in detail with accompanying drawings.
附图说明 Description of drawings
图1为公知阻值测量模块的测量示意图；Fig. 1 is the measurement schematic diagram of known resistance measuring module;
图2为本发明的印刷电路板的阻值测量模块的测量示意图；Fig. 2 is the measurement schematic diagram of the resistance measuring module of printed circuit board of the present invention;
图3为本发明的印刷电路板的阻值测量模块的测量方法流程图；Fig. 3 is the flow chart of the measurement method of the resistance measurement module of the printed circuit board of the present invention;
图4为本发明的印刷电路板的阻值测量模块的另一实施例测量示意图；以及Fig. 4 is another embodiment measurement schematic diagram of the resistance measuring module of printed circuit board of the present invention; And
图5为本发明的印刷电路板的阻值测量模块的另一实施例测量方法流程图。FIG. 5 is a flow chart of another embodiment of the measurement method of the resistance measurement module of the printed circuit board of the present invention.
上述附图中的附图标记说明如下：The reference numerals in the above-mentioned accompanying drawings are explained as follows:
公知技术Known technology
10～阻值测量模块； 11～第一上接触针头；10～resistance measurement module; 11～the first upper contact needle;
12～第二上接触针头； 13～第一下接触针头；12 ~ the second upper contact needle; 13 ~ the first lower contact needle;
14～第二下接触针头； 15～阻值测量仪；14～the second contact needle; 15～resistance measuring instrument;
16～第一上电力线； 17～第二上电力线；16 ~ the first power line; 17 ~ the second power line;
18～第一下电力线； 19～第二下电力线；18 ~ the first power line; 19 ~ the second power line;
20～待测量印刷电路板； 21～锡球；20～printed circuit board to be measured; 21～solder ball;
22～金属垫。22 ~ metal pad.
本发明this invention
30、60～阻值测量模块； 31、61～上接触针头；30, 60 ~ resistance measurement module; 31, 61 ~ upper contact needle;
32～第一下接触针头； 33～第二下接触针头；32 ~ the first contact with the needle; 33 ~ the second contact with the needle;
34、64～阻值测量仪； 35、65～第一上电力线；34, 64 ~ resistance measuring instrument; 35, 65 ~ the first power line;
36、66～第二上电力线； 37、67～第一下电力线；36, 66 ~ the second power line; 37, 67 ~ the first power line;
38、68～第二下电力线； 40、70～待测量印刷电路板；38, 68 ~ the second power line; 40, 70 ~ the printed circuit board to be measured;
41、71～上表面； 42、72～下表面；41, 71 ~ upper surface; 42, 72 ~ lower surface;
43、73～锡球； 44、75～金属垫；43, 73～solder ball; 44, 75～metal pad;
50、51、80、81～上开关； 52、53、82、83～下开关；50, 51, 80, 81 ~ up switch; 52, 53, 82, 83 ~ down switch;
62～下接触针头。62 ~ lower contact with the needle.
具体实施方式 Detailed ways
图2为本发明的印刷电路板的阻值测量模块的测量示意图。请参阅图2，本发明的印刷电路板的阻值测量模块30包括上接触针头31、第一下接触针头32、第二下接触针头33以及阻值测量仪34。上接触针头31同时与第一上电力线35以及第二上电力线36电性连接，第一下接触针头32与第一下电力线37电性连接，第二下接触针头33与第二下电力线38电性连接，而阻值测量仪34与第一上电力线35、第一下电力线37、第二上电力线36以及第二下电力线38电性连接。FIG. 2 is a measurement schematic diagram of the resistance measurement module of the printed circuit board of the present invention. Please refer to FIG. 2 , the
图3为本发明的印刷电路板的阻值测量模块的测量方法流程图。请搭配参阅图2及图3，当阻值测量模块30用以检测待测量印刷电路板40时，a1.提供印刷电路板的阻值测量模块30与待测量印刷电路板40电性连接，即上接触针头31与待测量印刷电路板40的上表面41的锡球43接触，而第一下接触针头32以及第二下接触针头33则同时与待测量印刷电路板40的下表面42的金属垫44接触。Fig. 3 is a flow chart of the measurement method of the resistance measurement module of the printed circuit board of the present invention. Please refer to FIG. 2 and FIG. 3 together. When the
其中，测量模块及该待测量印刷电路板的系统内电阻R4W3P＝2*[(上开关内电阻Rus+上电力线的内电阻Ruw+上电力线接头至上接触针头绕线点之间的电阻Rj)+(下接触针头与待测量印刷电路板的接触电阻Rdc+下电力线接头至下接触针头之间的电阻Rdj+下电力线的内电阻Rdw+下开关内电阻Rds)]。Wherein, the system internal resistance R 4W3P of the measurement module and the printed circuit board to be measured = 2*[(the internal resistance Rus of the upper switch + the internal resistance Ruw of the upper power line + the resistance Rj between the upper power line connector and the winding point of the upper contact needle)+( Contact resistance Rdc between the lower contact pin and the printed circuit board to be measured + resistance Rdj between the lower power line connector and the lower contact pin + internal resistance Rdw of the lower power line + internal resistance Rds of the lower switch]].
接着，b1.导通第一上电力线35以及第一下电力线37，而第二上电力线36以及第二下电力线38为断路，即导通上开关50及下开关52，而切断上开关51及下开关53。因此可测得电阻值R1＝(上开关内电阻Rus+第一上电力线的内电阻Ruw+第一上电力线接头至上接触针头绕线点之间的电阻Rj)+上接触针头的电阻Rt+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+待测量印刷电路板的内电阻Rp+(下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc+第一下电力线接头至下接触针头之间的电阻Rdj+第一下电力线的内电阻Rdw+下开关内电阻Rds)。Then, b1. Turn on the first
接续，c1.导通第二上电力线36以及第二下电力线38，而第一上电力线35以及第一下电力线37为断路。因此可测得电阻值R2＝(上开关内电阻Rus+第二上电力线的内电阻Ruw+第二上电力线接头至上接触针头绕线点之间的电阻Rj)+上接触针的电阻Rt+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+待测量印刷电路板的内电阻Rp+(下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc+第二下电力线接头至下接触针头之间的电阻Rdj+第二下电力线的内电阻Rdw+下开关内电阻Rds)。Next, c1. The second
最后，d1.计算(电阻值R1+电阻值R2-测量模块及待测量印刷电路板的系统内电阻R4W3P)/2，可求得待测量印刷电路板的内电阻Rp+上接触针头的电阻Rt+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc。应注意的是，上接触针头的电阻Rt为已知条件，而上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc可忽略不记，故得到待测量印刷电路板的内电阻Rp＝[(电阻值R1+电阻值R2-测量模块及待测量印刷电路板的系统内电阻R4W3P)/2]-上接触针头的电阻Rt。另外，待测量印刷电路板40的测量阻值误差值小于0.1欧姆。Finally, d1. Calculate (resistance value R1+resistance value R2-system internal resistance R 4W3P of the measurement module and the printed circuit board to be measured)/2, and the internal resistance Rp of the printed circuit board to be measured+the resistance of the upper contact needle Rt+up The contact resistance Ruc between the contact pin and the tin spherical surface on the printed circuit board to be measured. It should be noted that the resistance Rt of the upper contact pin is a known condition, and the contact resistance Ruc between the upper contact pin and the solder spherical surface of the printed circuit board to be measured can be ignored, so the internal resistance of the printed circuit board to be measured Rp = [(resistance value R1+resistance value R2-system internal resistance R 4W3P of the measuring module and the printed circuit board to be measured)/2]-resistance Rt of the upper contact pin. In addition, the measured resistance error of the printed
图4为本发明的印刷电路板的阻值测量模块的另一实施例测量示意图。请参阅图4，本发明的印刷电路板的阻值测量模块60包括上接触针头61、下接触针头62以及阻值测量仪64。上接触针头61同时与第一上电力线65以及第二上电力线66电性连接，下接触针头62同时与第一下电力线67以及第二下电力线68电性连接，而阻值测量仪64与第一上电力线65、第一下电力线67、第二上电力线66以及第二下电力线68电性连接。FIG. 4 is a measurement diagram of another embodiment of the resistance measurement module of the printed circuit board of the present invention. Please refer to FIG. 4 , the resistance measurement module 60 of the printed circuit board of the present invention includes an upper contact pin 61 , a lower contact pin 62 and a resistance measuring instrument 64 . The upper contact needle 61 is electrically connected with the first upper power line 65 and the second upper power line 66 at the same time, the lower contact needle 62 is electrically connected with the first lower power line 67 and the second lower power line 68 at the same time, and the resistance measuring instrument 64 is connected with the second power line An upper power line 65 , the first lower power line 67 , the second upper power line 66 and the second lower power line 68 are electrically connected.
图5为本发明的印刷电路板的阻值测量模块的另一实施例测量方法流程图。请搭配参阅图4及图5，当阻值测量模块60用以检测待测量印刷电路板70时，a2.提供印刷电路板的阻值测量模块60与待测量印刷电路板70电性连接，即上接触针头61与待测量印刷电路板70的上表面71的锡球73接触，而下接触针头62与待测量印刷电路板70的下表面72的金属垫75接触。FIG. 5 is a flow chart of another embodiment of the measurement method of the resistance measurement module of the printed circuit board of the present invention. Please refer to FIG. 4 and FIG. 5 together. When the resistance measurement module 60 is used to detect the printed circuit board 70 to be measured, a2. The resistance measurement module 60 of the printed circuit board is electrically connected to the printed circuit board 70 to be measured, that is The upper contact pins 61 are in contact with the solder balls 73 on the upper surface 71 of the printed circuit board 70 to be measured, while the lower contact pins 62 are in contact with the metal pads 75 on the lower surface 72 of the printed circuit board 70 to be measured.
其中，测量模块及该待测量印刷电路板的系统内电阻R4W2P＝2*[(上开关内电阻Rus+上电力线的内电阻Ruw+上电力线接头至上接触针头绕线点之间的电阻Rj)+(下电力线接头至下接触针头绕线点之间的电阻Rjd+下电力线的内电阻Rdw+下开关内电阻Rds)]。Wherein, the system internal resistance R 4W2P of the measurement module and the printed circuit board to be measured = 2*[(the internal resistance Rus of the upper switch + the internal resistance Ruw of the upper power line + the resistance Rj between the upper power line connector and the winding point of the upper contact needle)+( The resistance Rjd between the lower power line connector and the winding point of the lower contact needle + the internal resistance Rdw of the lower power line + the internal resistance Rds of the lower switch)].
接着，b2.导通第一上电力线65以及第一下电力线67，而第二上电力线66以及第二下电力线68为断路，即导通上开关80及下开关82，而切断上开关81及下开关83。因此可测得电阻值R1＝(上开关内电阻Rus+第一上电力线的内电阻Ruw+第一上电力线接头至上接触针头绕线点之间的电阻Rj)+上接触针头的电阻Rt+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+待测量印刷电路板的内电阻Rp+下接触针头的电阻Rtd+下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc+(第一下电力线接头至下接触针头绕线点之间的电阻Rjd+第一下电力线的内电阻Rdw+下开关内电阻Rds)。Then, b2. connect the first upper power line 65 and the first lower power line 67, and the second upper power line 66 and the second lower power line 68 are disconnected, that is, turn on the upper switch 80 and the lower switch 82, and cut off the upper switch 81 and the lower switch 82. Switch 83 down. Therefore, the measured resistance value R1=(upper switch internal resistance Rus+internal resistance Ruw of the first upper power line+resistance Rj between the first upper power line connector and the winding point of the upper contact needle)+resistance Rt of the upper contact needle+upper contact needle and The contact resistance Ruc of the tin spherical surface on the printed circuit board to be measured + the internal resistance Rp of the printed circuit board to be measured + the resistance Rtd of the lower contact needle + the contact resistance Rdc between the lower contact needle and the metal pad on the printed circuit board to be measured + (the first lower power line connector to The resistance Rjd between the winding points of the lower contact needle + the internal resistance Rdw of the first lower power line + the internal resistance Rds of the lower switch).
接续，c2.导通第二上电力线66以及第二下电力线68，而第一上电力线65以及第一下电力线67为断路。因此可测得电阻值R2＝(上开关内电阻Rus+第二上电力线的内电阻Ruw+第二上电力线接头至上接触针头绕线点的间的电阻Rj)+上接触针头的电阻Rt+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+待测量印刷电路板的内电阻Rp+下接触针头的电阻Rtd+下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc+(第二下电力线接头与下接触针头绕线点之间的电阻Rjd+第二下电力线的内电阻Rdw+下开关内电阻Rds)。Next, c2. The second upper power line 66 and the second lower power line 68 are turned on, while the first upper power line 65 and the first lower power line 67 are disconnected. Therefore, the measured resistance value R2=(upper switch internal resistance Rus+internal resistance Ruw of the second upper power line+resistance Rj between the second upper power line connector and the winding point of the upper contact needle)+resistance Rt of the upper contact needle+upper contact needle and The contact resistance Ruc of the tin spherical surface on the printed circuit board to be measured + the internal resistance Rp of the printed circuit board to be measured + the resistance Rtd of the lower contact needle + the contact resistance Rdc between the lower contact needle and the metal pad on the printed circuit board to be measured + (the second lower power line connector and The resistance Rjd between the winding points of the lower contact needle + the internal resistance Rdw of the second lower power line + the internal resistance Rds of the lower switch).
最后，d2.计算(电阻值R1+电阻值R2-测量模块及待测量印刷电路板的系统内电阻R4W2P)/2，求得待测量印刷电路板的内电阻Rp+上接触针头的电阻Rt+下接触针头的电阻Rtd+上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc+下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc。应注意的是，上接触针头的电阻Rt与下接触针头的电阻Rtd为已知条件，而上接触针头与待测量印刷电路板上锡球面的接触电阻Ruc以及下接触针头与待测量印刷电路板上金属垫的接触电阻Rdc可忽略不记，故待测量印刷电路板的内电阻Rp＝[(电阻值R1+电阻值R2-测量模块及待测量印刷电路板的系统内电阻R4W2P)/2]-(上接触针头的电阻Rt+下接触针头的电阻Rtd)。Finally, d2. Calculate (resistance value R1+resistance value R2-system internal resistance R 4W2P of the measurement module and the printed circuit board to be measured)/2, and obtain the internal resistance Rp of the printed circuit board to be measured+resistance Rt of the upper contact needle+lower contact The resistance Rtd of the needle + the contact resistance Ruc between the upper contact needle and the tin spherical surface on the printed circuit board to be measured + the contact resistance Rdc between the lower contact needle and the metal pad on the printed circuit board to be measured. It should be noted that the resistance Rt of the upper contact needle and the resistance Rtd of the lower contact needle are known conditions, while the contact resistance Ruc between the upper contact needle and the solder spherical surface on the printed circuit board to be measured and the contact resistance Ruc between the lower contact needle and the printed circuit board to be measured The contact resistance Rdc of the upper metal pad can be ignored, so the internal resistance Rp of the printed circuit board to be measured=[(resistance value R1+resistance value R2-system internal resistance R 4W2P of the measurement module and the printed circuit board to be measured)/2] -(resistance Rt of the upper contact pin + resistance Rtd of the lower contact pin).
综上所述，当电子产品不断地微小化，而电路板的设计也随之变小之际，布线密度也随之提高，为求测试高布线密度的电路板，本发明提供四线三针形式以及四线二针形式的阻值测量模块，可能大幅降低测量模块的制造成本以及加工困难度。To sum up, when electronic products continue to be miniaturized and the design of the circuit board becomes smaller, the wiring density also increases. In order to test the circuit board with high wiring density, the present invention provides a four-wire three-pin form and the resistance measurement module in the form of four wires and two pins may greatly reduce the manufacturing cost and processing difficulty of the measurement module.
虽然本发明已以优选实施例公开于上，然其并非用以限定本发明，任何本领域普通技术人员，在不脱离本发明的精神和范围内，当可作些许的更动与润饰，因此本发明的保护范围当视所附的权利要求所界定的范围为准。Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore The scope of protection of the present invention should be determined by the scope defined by the appended claims.
Claims (10)
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| CN102707152B (en) * | 2012-06-04 | 2014-10-08 | 西南交通大学 | On-line detecting device for resistance value of resistance winding machine |
| CN103901275A (en) * | 2013-11-22 | 2014-07-02 | 大连太平洋电子有限公司 | Pressure sensing type conductive ink resistance value tester |
| CN105510758A (en) * | 2015-11-27 | 2016-04-20 | 湖北三江航天红峰控制有限公司 | Device for low resistance conduction |
| CN108089054B (en) * | 2016-11-22 | 2020-04-24 | 北京铁路信号有限公司 | Method for measuring contact resistance of solderless press-in connection |
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