CN101868317A - Reflow furnace - Google Patents
Reflow furnace Download PDFInfo
- Publication number
- CN101868317A CN101868317A CN200780100197A CN200780100197A CN101868317A CN 101868317 A CN101868317 A CN 101868317A CN 200780100197 A CN200780100197 A CN 200780100197A CN 200780100197 A CN200780100197 A CN 200780100197A CN 101868317 A CN101868317 A CN 101868317A
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- China
- Prior art keywords
- smog
- dewfall
- parts
- removing device
- reflow ovens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010438 heat treatment Methods 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 230000000903 blocking effect Effects 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 abstract description 32
- 239000002904 solvent Substances 0.000 abstract description 32
- 238000004140 cleaning Methods 0.000 abstract description 16
- 230000004907 flux Effects 0.000 abstract description 9
- 238000009833 condensation Methods 0.000 abstract description 4
- 230000005494 condensation Effects 0.000 abstract description 4
- 239000003517 fume Substances 0.000 abstract 4
- 230000010485 coping Effects 0.000 abstract 1
- 238000011084 recovery Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 28
- 239000007789 gas Substances 0.000 description 25
- 238000005476 soldering Methods 0.000 description 19
- 238000009835 boiling Methods 0.000 description 18
- 239000002245 particle Substances 0.000 description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 14
- 230000004927 fusion Effects 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000000470 constituent Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 230000009183 running Effects 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 229910020830 Sn-Bi Inorganic materials 0.000 description 2
- 229910018728 Sn—Bi Inorganic materials 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 238000012387 aerosolization Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/002—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by condensation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/38—Removing components of undefined structure
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Environmental & Geological Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Tunnel Furnaces (AREA)
Abstract
The fumes generated in reflow furnace differ from each other in the state of dew condensation depending upon the types of flux solvent and solid contents. The conventional defuming device for reflow furnace is not one capable of coping with fumes from all flux varieties, and cleaning of the defuming device having fume solid contents adhering thereto has needed tremendous workload. [MEANS FOR SOLVING PROBLEMS] In the provided reflow furnace, the defuming device includes a combination of unitized various dew condensation means. Accordingly, not only can recovery suitable for all flux fumes be attained but also cleaning of the dew condensation means is easy to thereby enable complete cleaning.
Description
Technical field
The present invention relates to a kind of reflow ovens, remove the device of the smog of the solder flux that in stove, produces when this reflow ovens is provided with the printed circuit board (PCB) that has applied solder(ing) paste carried out soldering.
Background technology
Use solder(ing) paste when usually, in reflow ovens, carrying out the soldering of printed circuit board (PCB).When the soldering of using solder(ing) paste, at first utilize printing equipment, distributor that solder(ing) paste is coated to the soldering portion of printed circuit board (PCB), on this painting part, load electronic unit.Then, utilize reflow ovens that the printed circuit board (PCB) that has loaded electronic unit is heated, the fusion weld tin cream carries out soldering between printed circuit board (PCB) and electronic unit thus.
The reflow ovens of printed circuit board (PCB) being carried out soldering constitutes by preheating zone, main heating region, cooled region.The printed circuit board (PCB) that is coated with solder(ing) paste is carried by the heater that preheats the zone and is preheated while being transferred band, and quilt is led heating by the heater of main heating region, is cooled off by the cooler of cooled region, carries out soldering thus.
Solder(ing) paste is mixed into the pasty state with viscosity with soldering tin powder and solder flux and obtains.The solder flux that is used in this solder(ing) paste is dissolved into the solid constituent of rosin, activating agent, thixotropic agent etc. in the solvent and obtains.Thereby, when utilizing reflow ovens that the printed circuit board (PCB) that is coated with solder(ing) paste is heated, at first, utilize the heater that preheats the zone to be heated to after 100～150 ℃ solvent evaporates in the solder(ing) paste and solid constituent fusion.Solid constituent reduction after the fusion is removed attached to the oxide on the printed circuit board (PCB), thus cleaning soldering portion.Then, when the heater that utilizes main heating region is heated to printed circuit board (PCB) more than 200 ℃, during the fusion weld tin powder, soak in the soldering portion that expands to after the cleaning.Then, the scolding tin after the fusion soaks into fully and expands to after the soldering portion, utilizes after the cooler of cooled region cools off, and fusion scolding tin solidifies, and finishes soldering thus.
Usually, as mentioned above, the solid constituent of dissolution with solvents rosin, activating agent, thixotropic agent etc., and when carrying out mixing with soldering tin powder, make it have suitable viscosity and print coating, distributor easily and apply.Solvent in the tin cream then no longer needs after applying until the coating solder(ing) paste all needs before.Therefore, when utilizing reflow ovens that the printed circuit board (PCB) that is coated with solder(ing) paste is carried out soldering, at first, in preheating, make heating object adapt to thermal environment so that after the main high temperature that heats in can not be subjected to thermal shock in, make solvent evaporates.That is to say, in solder reflow soldering,, then add the scolding tin of pining for fusion and can make the solvent bumping and fusion scolding tin is dispersed the master if when main heating, have solvent.Thereby the solvent in the solder(ing) paste must preheat middle volatilization, becomes complete non-existent state when main heating.
The solvent that is used in this solder flux comprises low boiling point solvent and the higher high boiling solvent of boiling point that boiling point is lower, suitably selects according to the fusing point of soldering tin powder.That is to say, solvent must volatilize before the soldering tin powder fusion in solder(ing) paste, therefore corresponding to the lower Sn-Bi class fusing point of fusing point: 135 ℃) such scolding tin, adopt low boiling point solvent, corresponding to the such scolding tin of the higher Sn-Bi class of fusing point (fusing point: 240 ℃), adopt high boiling solvent.
In addition, when use is coated to the solder(ing) paste of printed circuit board (PCB), in preheating the zone, solvent evaporates and become smog, and when the solid constituent of fusion exposes at high temperature in main heating region in preheating the zone, still become smog and swim in the stove.When temperature is lower in the smog of these solvents, solid constituent and the stove part, for example in stove, carry printed circuit board (PCB) conveyer belt, be used to make hot air circulation fan, constitute stove framework, be arranged on when maze-type structure that being used on the gateway of stove prevent that ambient atmos from entering etc. contacts and be cooled and dewfall, and when temperature descends, become and have adhesive solids.
So can produce the solids that these smog become (below be called the smog solids) in a large number attached to this problem on the member that constitutes reflow ovens.That is to say, when the smog solids in a large number attached to the conveyer belt that is used to carry printed circuit board (PCB) on the time, printed circuit board (PCB) adheres on the conveyer belt and when sending, printed circuit board (PCB) can not separate from conveyer belt, but be rolled on the sprocket of conveyer belt, printed circuit board (PCB) breakage thus, when the smog solids in a large number attached to the fan of the heater that blows out hot blast on the time, the rotation of fan is slack-off and blowing out of hot blast dies down, when the smog solids in a large number attached on the time as the framework of the structure of reflow ovens, the smog solids of piling up drops on the printed circuit board (PCB) of carrying and the printed circuit board (PCB) of making dirty, when a large amount of attached to the maze-type structure of gateway on the time, smog solids contact print circuit board and cause electronic unit to come off from the position of regulation.
The problem that produces in view of adhering to of these smog solids in the past, had proposed a plurality of reflow ovens that are provided with the device of removing the smog in the stove.(patent documentation 1～8)
In addition, the gas that the smog of solder flux is not exclusively aerified, but the material that all size particle and gas mix.Therefore, the smog removing device of reflow ovens in the past can be filter element, labyrinth type dewfall parts and heat exchange type dewfall parts etc.Filter element is to utilize filter to filter the particle of smog; Labyrinth type dewfall parts are upside and the downsides that a plurality of plates are arranged on path, particle is contacted with this plate cool off, and come dewfall thus; Heat exchange type dewfall parts are that a plurality of fin are installed on the pipe of flow system cryogen, particle is contacted with this fin cool off, and make the smog dewfall thus.
As the smog removing device, filter removing component and can filter bigger particle in the smog, but can pass through, so removal effect is not good less than the particle of the eyelet of filter.And, on filter, as long as adhere to the smog solids a little, will hinder and contain passing through of smog gas, the circulation variation of reflow ovens and removal device.In addition, if use labyrinth type dewfall parts, then bigger particle contacts with plate easily in the smog, therefore can remove, but flow along with smog stream than granule, is not easy contact plate, and therefore similarly removal effect is not good with filter.And if use heat exchange type dewfall parts, though then the bigger particle in the smog all contacts with a plurality of fin with smaller particles, roughly can dewfall, often can't fully remove corresponding to different types of solder flux.
The smog removing device filters the particle in the smog or its dewfall is removed, but smog becomes the smog solids after adhering to, so the smog solids is attached on the smog removing device.When this smog solids is attached on the smog removing device in a large number, the smog removing deleterious.Therefore, the smog removing device must in time clean accompanying smog solids termly or according to attachment state.The smog solids is dissolved in the ethanol easily, therefore uses ethanol to clean the smog removing device as cleaning fluid.
Patent documentation 1: Japanese kokai publication hei 4-13475 communique
Patent documentation 2: Japanese kokai publication hei 4-46667 communique
Patent documentation 3: Japanese kokai publication hei 4-251661 communique
Patent documentation 4: Japanese kokai publication hei 7-77346 communique
Patent documentation 5: Japanese kokai publication hei 7-212028 communique
Patent documentation 6: Japanese kokai publication hei 10-335807 communique
Patent documentation 7: Japan opens clear 54-41411 communique in fact
Patent documentation 8: Japan opens clear 64-20964 communique in fact
Summary of the invention
In the reflow ovens of in the past band smog removing device, the smog that promptly allows to remove low boiling point solvent also can't be removed the smog of high boiling solvent, and perhaps, on the contrary, the smog that promptly allows to remove high boiling solvent also can't be removed the smog of low boiling point solvent.In addition, about the smog removing device in the reflow ovens in the past, under the situation that the smog removing device that is attached with the smog solids is in a large number cleaned, if only be smog removing device with single removing component, still removing component can be pulled down and be impregnated in the cleaning fluid, and for the smog removing device that combines by a plurality of removing components, its removal device main body is bigger, and be set on the narrower region between position, for example Muffle furnace and the top cover that can not hinder the maintenance of reflow ovens, therefore be difficult to clean.
Even the reflow ovens that the object of the present invention is to provide a kind of smog that has used the solder(ing) paste of high boiling solvent, low boiling point solvent also can remove and can extremely easily carry out the cleaning of smog removing device fully.
The inventor pays close attention to following aspect and waits and finished the present invention: smog is pressed the size of particle, as the solvent of mist source and the boiling point of solid constituent, smog conditions such as softening point and be divided into varied, therefore a kind of dewfall parts can't be fit to all smog conditions, if but combination meets the dewfall parts of various smog conditions, then can remove smog expeditiously, and, when cleaning is cleaned thing, usually, being cleaned the mode that cloth that liquid soaks comes wiping to be cleaned thing with use compares, the cleaning way that thing is impregnated in the cleaning fluid is not only respond well with being cleaned, and carry out washing and cleaning operation easily, and in the dewfall parts, make it meet best smog condition by temperature adjustment to the part that smog contacted.
The present invention is a kind of reflow ovens, it is characterized in that, be formed with in the Muffle furnace of reflow ovens (muffle) and will contain the suction inlet that smog gas is discharged to the outer outlet of stove and sucks the gas that was purified by the outer smog removing device of stove, this outlet is connected with the inflow chamber that is arranged on outside smog removing device, this suction inlet is connected with the delivery chamber of smog removing device, and is flowing into a plurality of dewfall parts that dispose blocking between chamber and the delivery chamber.
The smog removing device of reflow ovens of the present invention is by being combined by a plurality of dewfall parts of blocking, and therefore the dewfall parts that can select to meet the smog condition make up, and can carry out smog removing expeditiously thus.In addition, the dewfall parts of the smog removing device of reflow ovens of the present invention are by blocking, therefore adhere to a large amount of smog solids and during needs cleaning in the dewfall components interior, can be in cleaning fluid with dewfall parts direct impregnation, can clean fully thus, and can extremely easily carry out washing and cleaning operation.And, reflow ovens of the present invention plays the not available following preferable effect of reflow ovens in the past: by the aqueous cold plate cast dewfall parts of packing into, be adjusted at the coolant-temperature gage that flows in the coil pipe, the temperature of the coil portions that smog contacts and smog condition met carry out smog removing expeditiously.
Description of drawings
Fig. 1 is the main cutaway view of reflow ovens of the present invention.
Fig. 2 is arranged on the main cutaway view Amplified image of the smog removing device on the reflow ovens of the present invention.
Fig. 3 is the stereogram of this smog removing device.
Fig. 4 is the inflow chamber of smog removing device and the stereogram of delivery chamber and lid member.
Fig. 5 is by the stereogram of the aqueous cold plate cast dewfall parts of blocking.
Fig. 6 is by the stereogram of the multitube type dewfall parts of blocking.
Fig. 7 is by the stereogram of the labyrinth type dewfall parts of blocking.
Description of reference numerals
1: reflow ovens; 2: Muffle furnace; 3: stove; 4: conveyer belt; 8,9: outlet; 12: inflow entrance; 13: low temperature smog removing device; 14: high temperature smog removing device; 15,16: flow into the chamber; 17,18: delivery chamber; 23: aqueous cold plate cast dewfall parts; 24: multitube type dewfall parts; 25: labyrinth type dewfall parts; P: preheat the zone; R: main heating region; C: cooled region.
The specific embodiment
In the present invention, contain smog gas by a plurality of dewfall parts, utilize the dewfall parts that are suitable for each smog condition respectively to make the smog dewfall by making.Be used in dewfall parts of the present invention aqueous cold plate cast dewfall parts, multitube type dewfall parts, labyrinth type dewfall parts etc. are arranged.
Aqueous cold plate cast dewfall parts are wound as helical form by thermal conductivity good metal tubulation and form, and water flows pipe is cooled off in pipe.Thereby, can tube-surface be adjusted into the temperature that is suitable for making the smog dewfall by the temperature of adjusting the water that flows in the pipe.By making water pass through cooler, can easily carry out the temperature adjustment to the water that flows in this pipe.Aqueous cold plate cast dewfall parts can come corresponding with low temperature smog, high temperature smog by the temperature of adjusting water.In addition, aqueous cold plate cast dewfall parts are to be wound into helical form by pipe to form, and therefore can make the total length of pipe elongated, and consequently, increase improves the dewfall effect with the contact area of smog.
Multitube type dewfall parts are to make to be provided with under a plurality of pipes connect the state of removal device of boxes to form, and flow cooling tube by making ambient atmos in pipe, cool off the smog that contacts with this tube-surface, make smog in the tube-surface dewfall.Multitube type dewfall parts can sharply not make temperature descend, and therefore are fit to remove the smog that contains low boiling point solvent.In addition, in the device with its removal after making the smog dewfall, compare, be used in respond well that the dewfall parts that are suitable for this temperature when temperature is descended remove with the situation that the temperature that makes high temperature smog sharply descends.Therefore, remove under the situation of smog at a plurality of dewfall parts of combination, expectation with multitube type dewfall component configuration at position that smog passes through at first.
Labyrinth type dewfall parts are established a plurality of sheet materials and are obtained from above-below direction is upright alternately in the smog removing device.Upright when establishing a plurality of sheet material when so alternately, contain smog gas and cool off this and contain smog gas by making through the distance of these sheet materials is elongated, therefore make this contain smog gas dewfall on sheet material.About these labyrinth type dewfall parts, smog contact plate and being cooled, the larger particles of contact plate is removed easily, but smaller particles is not easy contact plate along with flowing of smog, therefore be difficult to remove.Thereby, preferably with labyrinth type dewfall parts and other dewfall parts, the combination of for example aqueous cold plate cast dewfall parts that can remove than granule.
In reflow ovens of the present invention, in Muffle furnace, be formed with and be used to discharge the smog that produces in the stove and the outlet that is connected with the smog removing device and make through smog removing device purified gas and flow into suction inlet in the stove.When outlet is formed on low temperature side and two positions of high temperature side, can balance discharge smog in the stove preferably, therefore can prevent the turbulent flow of furnace gas.When the furnace gas turbulization, in the reflow ovens of having used inert atmosphere, ambient atmos can flow into from the gateway, thereby oxygen concentration improves, thereby hinders tin-welding.
In addition, in reflow ovens of the present invention, be formed with suction inlet, this suction inlet is used to make the gas after the smog removing device is removed smog to flow in the stove.Consider balance, this suction inlet still is preferably formed in the substantial middle of stove, for example preheats between zone and the main heating region.
The smog removing device that smog removing device that low temperature smog uses and high temperature smog are used preferably is set in reflow ovens.That is to say, as mentioned above,, select to make up the effect that the dewfall parts improve smog removing, therefore special-purpose removal device is set respectively according to the condition of smog about the dewfall parts.Setting gradually multitube type dewfall parts, aqueous cold plate cast dewfall parts, labyrinth type dewfall parts, when on the removal device that high temperature smog is used, setting gradually multitube type dewfall parts, labyrinth type dewfall parts, aqueous cold plate cast dewfall parts, can carry out smog removing expeditiously according to the gas flow direction on the removal device that low temperature smog is used according to the gas flow direction.Yet, can suitably change these according to the smog condition order is set.
Below, reflow ovens of the present invention is described with reference to the accompanying drawings.Fig. 1 is the main cutaway view of reflow ovens of the present invention, Fig. 2 is arranged on the main cutaway view Amplified image of the smog removing device on the reflow ovens of the present invention, Fig. 3 is the stereogram of this smog removing device, Fig. 4 is the inflow chamber of smog removing device and the stereogram of delivery chamber and lid member, Fig. 5 is by the stereogram of the aqueous cold plate cast dewfall parts of blocking, Fig. 6 is by the stereogram of the multitube type dewfall parts of blocking, and Fig. 7 is by the stereogram of the labyrinth type dewfall parts of blocking.
Reflow ovens 1 is covered by Muffle furnace 2, is formed with the stove 3 of tunnel-shaped in inside.Be provided with conveyer belt 4 in stove 3, this conveyer belt 4 is loading printed circuit board (PCB) K and is advancing along the arrow A direction.In addition, the top and the bottom of the stove 3 of reflow ovens 1 have six zones that are provided with six pairs of heaters, that is, being provided with four heater 5u, bottoms on the top that preheats regional P is provided with four heater 5d, is provided with two heater 6u, bottoms on the top of main heating region R and is provided with two heater 6d.In addition, the top and the bottom of cooled region C are provided with a pair of cooler 7u, 7d.And the top that preheats regional P substantial middle place being positioned at of Muffle furnace 2 is formed with low temperature with outlet 8, is formed with high temperature outlet 9 on the top of locating between main heating region R and cooled region C of Muffle furnace 2.Be connected with low temperature on outlet 8 with discharge pipe 10 at low temperature, be connected with high temperature usefulness discharge pipe 11 on outlet 9 at high temperature.In addition, be formed with inflow entrance 12 on the top of locating between regional P and the main heating region R that preheating of Muffle furnace 2.
Above the outside of reflow ovens 1, be provided with low temperature with smog removing device 13 and high temperature with smog removing device 14.Have the chamber 15,16 of inflow and delivery chamber 17,18 in the both sides of these smog removing devices respectively, between inflow chamber 15,16 is with delivery chamber 17,18, dispose a plurality of condensation devices.Low temperature is connected with discharge pipe 10 with low temperature with the inflow chamber 15 of smog removing device 13, and high temperature is connected with discharge pipe 11 with high temperature with the inflow chamber 16 of smog removing device 14.And low temperature is connected with effuser 19 with low temperature with the delivery chamber 17 of smog removing device 13, and high temperature is connected with effuser 20 with high temperature with the delivery chamber 18 of smog removing device 14.This low temperature is connected with effuser 20 with high temperature with effuser 19, is connected with inflow pipe 21 in the middle of both at this.And, on this inflow pipe 21, suction pump 22 being installed, the end of inflow pipe 21 is connected with the inflow entrance 12 of above-mentioned Muffle furnace 2.
Low temperature is aqueous cold plate cast dewfall parts 23, multitube type dewfall parts 24 and labyrinth type dewfall parts 25 with the inflow chamber 15 (16) of smog removing device 14 with a plurality of dewfall parts of configuration between the delivery chamber 17 (18) with smog removing device 13 and high temperature.Suitably change of location disposes these dewfall parts.From disposing multitube type dewfall parts 24, aqueous cold plate cast dewfall parts 23, labyrinth type dewfall parts 25 successively near the position that flows into chamber 15, high temperature disposes multitube type dewfall parts 24, labyrinth type dewfall parts 25, aqueous cold plate cast dewfall parts 23 with smog removing device 14 from the position near inflow chamber 16 to low temperature shown in the embodiment successively with smog removing device 13.
At this, the employed various dewfall parts of reflow ovens of the present invention are described.Shown in Fig. 5,6,7, each dewfall parts are by top board 26, backboard 27, base plate 28 and constitute, and the cross section is Japanese katakana " コ " font.On each limit of these sheet materials, be formed with flange 29, be pasted with not shown seal on the flange of side becoming.In addition, on the front side surface of each dewfall parts, be formed with the flange 30 that does not have seal.And base plate 28 tilts to central authorities a little from dual-side, and substantial middle becomes bend, penetrates to be provided with porosely 31 on this bend, is connected with the drainpipe 32 of band valve in the bottom in this hole.
Aqueous cold plate cast dewfall parts 23 shown in Fig. 5 are to be reeled and be made as the parts of helical coil 33 by the such metal tube of thermal conductivity good metal pipe, for example copper.Be set side by side with two helical coils 33,33 on the aqueous cold plate cast dewfall parts 23 of embodiment, their bottom links to each other, and the upper end is exposed to the outside after passing backboard 27.Be exposed to outside pipe and be connected with EGR with not shown jar, such as shown by arrows, water flow in the helical coil 33 from the pipe of a side, from the pipe outflow of opposite side.Hold water in the not shown jar of mobile water and controlled by the such temperature control equipment of cooler and make water temperature become fixing, the surface of helical coil 33 becomes the state of cooling.These aqueous cold plate cast dewfall parts can be by controlling any smog condition that is suitable for to the temperature of water mobile in the helical coil.That is to say,, then be suitable for removing the smog of high boiling solvent,, then be suitable for removing the smog of low boiling point solvent if set the temperature of water high slightly if set the temperature of water lower.
Multitube type dewfall parts 24 connect between top board 26 and base plate 28 thicker a plurality of metal tubes 34 are installed ...,, under sealing state, be fixed with hollow casing 35 on the top of top board 26.Being connected with intermediate configurations on this casing has the suction tube 37 of air blast 36.Thereby when running air blast 36, ambient atmos flow in the metal tube 34 from the bottom of the metal tube 34 of perforation base plate 28, and the cool metal pipe 34 thus.These multitube type dewfall parts utilize ambient atmos to come the cool metal pipe, so the surface temperature of metal tube can not become too low.Thereby these multitube type dewfall parts are suitable for removing the smog of low boiling point solvent.
In the labyrinth type dewfall parts 25, suspention is provided with the length a plurality of upper guard-plates 38 shorter than the length between top board 26 and the base plate 28 of starting at from the lower surface of top board 26 ... in addition, on base plate 28, be placed with the upright plate 39 of establishing, this upright establishing on the plate 39 to be positioned at upper guard-plate 38 with level ... between the upright length under shield 40 shorter of starting at that be provided with of mode from the upper surface of base plate 28 than the length between top board 26 and the base plate 28 ...Thereby, as shown in Figure 3, by passing through when smog gas moves up and down between upper guard-plate 38 and under shield 40 containing of labyrinth type dewfall parts.At this moment, the larger particles in the smog contacts and dewfall with the baffle plate of upside and downside.
These dewfall parts are configured in and flow into chamber 15 (16) with between the delivery chamber 17 (18).Also be formed with the flange 29 that similarly is pasted with seal with each dewfall parts at the side that flows into chamber 15 (16) and delivery chamber 17 (18), be formed with the flange 30 that does not have seal on the front side surface.Under the situation that flows into configuration dewfall parts between chamber and the delivery chamber, make and fix after being adjacent between each flange.Fixing about this flange penetrates on the same correspondence position of flange the hole is set, and inserting bolt is utilized nut screwing clamping afterwards this hole in, three limits that perhaps utilize anchor clamps to add to hold flange.Between inflow chamber and delivery chamber, after a plurality of dewfall parts of configuration, utilize the lid member 42 that is pasted with seal 41 to cover the front side surface of each dewfall parts, make it become airtight conditions.
The operating condition of the reflow ovens of the present invention with said structure then, is described.To be coated with solder(ing) paste, after the printed circuit board (PCB) K that this painting part is mounted with electronic unit is loaded on the conveyer belt 4, carry along the arrow A direction.At first, printed circuit board (PCB) is heated to 100～150 ℃ by being arranged on the upside that preheats regional P in the stove 3 and heater 5u, the 5d of downside.At this moment, the solvent evaporates in the solder(ing) paste and become smog, and the solid constituent fusion in the solder(ing) paste.And printed circuit board (PCB) further moves to main heating region R, is heated to 220～250 ℃ by the heater 6u, the 6d that are arranged on upside and downside.At this, the soldering tin powder fusion in the solder(ing) paste and soak into the soldering portion that expands to, and the solid constituent that becomes molten condition exposes at high temperature, so a part becomes smog.The smog of above-mentioned solvent and the smog of solid constituent are floating in stove 3.
When the running reflow ovens, make suction pump 22 runnings that are arranged on the suction tube 21.By the running of suction pump 22, low temperature is attracted to suction tube 21 directions with the gas in the smog removing device 14 with gas in the smog removing device 13 and high temperature.Thereby, becoming negative pressure in each smog removing device 13,14, the smog gas that contains in the stove 3 respectively flow into each inflow chamber 15,16 with outlet 8 and high temperature with outlet 9 from the low temperature that is connected with low temperature discharge pipe 10 and high temperature discharge pipe 11.
Low temperature at first flow into low temperature by 24 pairs of multitube type dewfall parts with smog removing device 13 lowers the temperature with the smog gas that contains that flows into chamber 15, and the low boiling point solvent in the smog is removed after the dewfall on the metal tube surface by the composition of aerosolization.The composition of dewfall remains aqueous on this metal tube surface, therefore wanders along the metal tube surface, accumulates in the bend of base plate 28.Accumulate in a large number if accumulate in the liquid material of this bend, then open the valve of drainpipe 32 and discharge.
Outflow low temperature flow into aqueous cold plate cast dewfall parts 23 with the smog gas that contains of the multitube type dewfall parts 24 of smog removing device 13.At this, further lower the temperature, and contain being removed by after the dewfall of solid constituent in the smog gas by the composition of aerosolization to containing smog gas.At this,, then open the valve of drainpipe 32 and discharge if become the bend that aqueous composition accumulates in base plate 28 in a large number in the smog.
Then, outflow low temperature flow into labyrinth type dewfall parts 25 with the smog gas that contains of the aqueous cold plate cast dewfall parts 23 of smog removing device 13.At this, make not contacted with a plurality of baffle plates 38,40 afterwards and remove by the composition of the larger particles of multitube type dewfall parts 24,23 removals of aqueous cold plate cast dewfall parts.
The gas of being removed smog like this by a plurality of dewfall parts passes through effuser 19 from delivery chamber 17, turns back in the stove 3 from the inflow entrance 12 that is connected with inflow pipe 22.
More than, low temperature smog removing device has been described, high temperature is identical with each the dewfall parts in the smog removing device with low temperature with the smog removing effect of each the dewfall parts in the smog removing device, therefore omits explanation.
In the present invention, various dewfall parts can be pulled down by blocking, therefore the smog solids in a large number attached to the situation on these dewfall parts under, removable undercover member is taken out each dewfall parts and is impregnated in the solvent and cleans.Thereby, utilize like that with in the past cleaning to be cleaned the cloth that liquid soaks and to come the mode of wiping to compare, not only easily the smog solids is cleaned, and can clean completely.
The present invention is suitable for using the reflow ovens of solder(ing) paste, except solder(ing) paste, also can utilize the present invention when producing the material, for example bonding agent, conductive paste etc. of smog when using heating.
Claims (7)
1. reflow ovens, it is characterized in that, be formed with in the Muffle furnace of reflow ovens and will contain the suction inlet that smog gas is discharged to the outer outlet of stove and sucks the gas that was purified by the outer smog removing device of stove, this outlet is connected with the inflow chamber that is arranged on outside smog removing device, this suction inlet is connected with the delivery chamber of smog removing device, and is flowing into a plurality of dewfall parts that dispose blocking between chamber and the delivery chamber.
2. reflow ovens according to claim 1 is characterized in that,
Above-mentioned dewfall parts are aqueous cold plate cast dewfall parts, multitube type dewfall parts, labyrinth type dewfall parts.
3. reflow ovens according to claim 2 is characterized in that,
There is water to flow in the coil pipe of above-mentioned aqueous cold plate cast dewfall parts, controls the temperature of this water by cooler.
4. reflow ovens according to claim 1 is characterized in that,
Above-mentioned outlet be formed on reflow ovens preheat the zone the substantial middle place and main heating region with locating between the cooled region.
5. reflow ovens according to claim 1 is characterized in that,
Above-mentioned suction inlet is formed on and preheats between zone and the main heating region.
6. reflow ovens according to claim 1 is characterized in that,
Above-mentioned smog removing device is divided into low temperature smog usefulness and high temperature smog is used, the inflow chamber of the smog removing device that low temperature smog is used is connected with the outlet that is formed on the substantial middle place that preheats the zone, and the inflow chamber of the smog removing device that high temperature smog is used is connected with the outlet of locating between the cooled region with main heating region.
7. reflow ovens according to claim 1 and 2 is characterized in that,
On above-mentioned a plurality of dewfall parts,, become sealing state between the flange of adjacent dewfall parts being used for being formed with flange on the junction surface that is connected with adjacent dewfall parts.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2007/065537 WO2009019773A1 (en) | 2007-08-08 | 2007-08-08 | Reflow furnace |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101868317A true CN101868317A (en) | 2010-10-20 |
| CN101868317B CN101868317B (en) | 2013-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200780100197.4A Active CN101868317B (en) | 2007-08-08 | 2007-08-08 | Reflow furnace |
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| Country | Link |
|---|---|
| JP (1) | JP5051231B2 (en) |
| CN (1) | CN101868317B (en) |
| WO (1) | WO2009019773A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108262543A (en) * | 2016-12-30 | 2018-07-10 | 上海朗仕电子设备有限公司 | A kind of scaling powder for reflow soldering is collected and cooling device |
| CN108668462A (en) * | 2017-03-27 | 2018-10-16 | 株式会社田村制作所 | Reflow soldering apparatus |
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| US9198300B2 (en) * | 2014-01-23 | 2015-11-24 | Illinois Tool Works Inc. | Flux management system and method for a wave solder machine |
| CN107838516B (en) * | 2017-12-29 | 2023-10-03 | 山东才聚电子科技有限公司 | Welding mechanism of vacuum welding furnace |
| CN107855623B (en) * | 2017-12-29 | 2023-07-18 | 山东才聚电子科技有限公司 | Vacuum welding furnace control system and control method thereof |
| CN111054173A (en) * | 2018-10-17 | 2020-04-24 | 伊利诺斯工具制品有限公司 | Exhaust gas purification system |
| CN112973289B (en) | 2019-12-12 | 2025-03-07 | 伊利诺斯工具制品有限公司 | Exhaust gas purification device |
| JP7324242B2 (en) * | 2021-03-31 | 2023-08-09 | 株式会社タムラ製作所 | Gas purifying device and transport heating device |
| JP7569348B2 (en) * | 2022-03-28 | 2024-10-17 | 株式会社タムラ製作所 | Transport heating device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3083035B2 (en) * | 1993-12-28 | 2000-09-04 | 日本電熱計器株式会社 | Soldering equipment |
| JP4326212B2 (en) * | 2002-12-16 | 2009-09-02 | 株式会社タムラ製作所 | Heating furnace device |
| JP2005014074A (en) * | 2003-06-27 | 2005-01-20 | Tamura Seisakusho Co Ltd | Reflow device |
| JP4784293B2 (en) * | 2005-12-12 | 2011-10-05 | 千住金属工業株式会社 | Reflow furnace |
-
2007
- 2007-08-08 JP JP2009526300A patent/JP5051231B2/en active Active
- 2007-08-08 WO PCT/JP2007/065537 patent/WO2009019773A1/en active Application Filing
- 2007-08-08 CN CN200780100197.4A patent/CN101868317B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108262543A (en) * | 2016-12-30 | 2018-07-10 | 上海朗仕电子设备有限公司 | A kind of scaling powder for reflow soldering is collected and cooling device |
| CN108668462A (en) * | 2017-03-27 | 2018-10-16 | 株式会社田村制作所 | Reflow soldering apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009019773A1 (en) | 2009-02-12 |
| JP5051231B2 (en) | 2012-10-17 |
| JPWO2009019773A1 (en) | 2010-10-28 |
| CN101868317B (en) | 2013-04-24 |
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