CN102054821B - Package structure with inner shield and manufacturing method thereof - Google Patents

Abstract

The invention relates to a packaging structure with an inner shielding body and a manufacturing method thereof. The package structure includes a substrate, a plurality of electronic components, a molding compound, an inner shield and a shielding layer. The electronic components are located on the substrate. The sealing colloid is positioned on one surface of the substrate, covers the electronic components and comprises at least one groove. The groove penetrates through the upper surface and the lower surface of the sealing colloid and is positioned between the electronic components, and a distance is reserved between a short edge of the groove and one side surface of the sealing colloid. The inner shield is located in the groove and electrically connected to the substrate. The shielding layer covers the sealing colloid and one side surface of the substrate and is electrically connected with the substrate and the inner shielding body. Therefore, the inner shielding body can enable the electronic components to have low electromagnetic interference and high electromagnetic tolerance.

Description

Package structure with inner shield and manufacturing method thereof

technical field

The present invention relates to a packaging structure and a manufacturing method thereof, in particular, to a packaging structure with an inner shield and a manufacturing method thereof.

Background technique

Referring to FIG. 1 , a schematic cross-sectional view of a known package structure is shown. The known package structure 1 has a substrate 11 , several electronic components 12 , an encapsulant 13 and a shielding layer 14 . The electronic components 12 are located on the substrate 11 . The encapsulant 13 covers a surface 111 of the substrate and the electronic components 12 . The shielding layer 14 covers the encapsulant 13 and a side surface 112 of the substrate 11 , and is electrically connected to the substrate 11 .

The disadvantages of this known package structure 1 are as follows. The substrate 11 and the shielding layer 14 define an accommodating space 15, and the electronic components 12 are located in the accommodating space 15 without any shielding between each other, so there is high electromagnetic interference between the electronic components 12 ( Electromagnetic Interference, EMI) and low electromagnetic tolerance (Electromagnetic Compatibility, EMC).

Therefore, it is necessary to provide a packaging structure with an inner shield and a manufacturing method thereof to solve the above problems.

Contents of the invention

The invention provides a package structure with an inner shield. The packaging structure includes a base plate, several electronic components, sealing colloid, an inner shielding body and a shielding layer. The substrate includes a ground metal layer and at least one ground pad. The substrate has a first surface and a side surface. The ground metal layer is located in the substrate and exposed on the side of the substrate. The ground pad is located in the substrate, exposed on the first surface of the substrate, and electrically connected to the ground metal layer. The electronic components are located on the first surface of the substrate. The sealing body is located on the first surface of the substrate, covers the electronic components, and includes at least one groove, an upper surface, a lower surface and a side surface. The groove runs through the upper surface and the lower surface of the sealing body, and is located between the electronic components, and the groove has a long side and a short side, and there is a distance between the short side and the side surface of the sealing body . The inner shield is located in the trench and electrically connected to the ground pad. The shielding layer covers the sealing body and the side surfaces of the substrate, and is electrically connected to the ground metal layer and the inner shielding body.

The invention provides a package structure with an inner shield. The packaging structure includes a base plate, several electronic components, sealing colloid, an inner shielding body and a shielding layer. The substrate includes a ground metal layer and at least one ground pad. The substrate has a first surface and a side surface. The ground metal layer is located in the substrate and exposed on the side of the substrate. The ground pad is located in the substrate, exposed on the first surface of the substrate, and electrically connected to the ground metal layer. The electronic components are located on the first surface of the substrate. The sealing body is located on the first surface of the substrate, covers the electronic components, and includes at least one groove, an upper surface, a lower surface and a side surface. The groove runs through the upper surface and the lower surface of the sealing body, and is located between the electronic components. The inner shield is located in the trench and electrically connected to the ground pad. The shielding layer covers the sealing body and the side surfaces of the substrate, and is electrically connected to the ground metal layer and the inner shielding body, wherein the ratio of the thickness of the inner shielding body to the thickness of the shielding layer is greater than 25.

The invention further provides a manufacturing method of the packaging structure with the inner shield. The manufacturing method includes the following steps: providing a substrate and several electronic components, the substrate includes a ground metal layer and at least one ground pad, the substrate has a first surface and a side surface, the ground metal layer is located in the substrate, And exposed on the side of the substrate, the ground pad is located in the substrate, exposed on the first surface of the substrate, and electrically connected to the ground metal layer, the electronic components are located on the first surface of the substrate; forming a The sealing body is on the first surface of the substrate to cover the electronic components, the sealing body includes an upper surface, a lower surface and a side surface; part of the sealing body is removed to form at least one groove, the groove penetrating through the upper surface and the lower surface of the sealing body, and located between the electronic components; filling an inner shield in the groove, and the inner shield is electrically connected to the grounding pad; cutting the substrate and the and forming a shielding layer to cover the side surfaces of the sealing body and the substrate, and electrically connect the grounding metal layer and the inner shielding body.

In this way, the inner shield can make the electronic components have low electromagnetic interference and high electromagnetic tolerance. At the same time, electronic components with various functions can be integrated into the packaging structure of the present invention, so as to reduce the number of components in the final system product and reduce the size of the product.

Description of drawings

Figure 1 shows a schematic cross-sectional view of a known package structure;

2 to 11 are schematic diagrams showing the manufacturing method of the first embodiment of the packaging structure with the inner shielding body of the present invention; and

12 to 24 are schematic diagrams showing the manufacturing method of the second embodiment of the packaging structure with an inner shield according to the present invention.

Detailed ways

Referring to FIG. 2 to FIG. 11 , there are schematic diagrams showing the manufacturing method of the first embodiment of the packaging structure with the inner shield according to the present invention. Referring to FIG. 2 , a substrate 21 and several electronic components (Electrical Element) 22 are provided. The substrate 21 includes a ground metal layer 212 , at least one ground pad 214 , an upper ground metal region 215 and a solder resist layer 213 . The substrate 21 has a first surface 2111 and a side surface 2112 . The ground metal layer 212 is located in the substrate 21 and exposed on the side surface 2112 of the substrate 21 . The ground pad 214 is located in the substrate 21 , exposed on the first surface 2111 of the substrate 21 , and electrically connected to the ground metal layer 212 .

The upper ground metal region 215 is located in the substrate 21 and exposed on the first surface 2111 of the substrate 21 . In this embodiment, the upper ground metal region 215 is electrically connected to the ground metal layer 212 . However, in other applications, the upper ground metal region 215 is located on the ground metal layer 212 . The solder resist layer 213 is located on the first surface 2111 of the substrate 21 and has at least one opening 2131 exposing a portion of the upper ground metal region 215 to form the ground pad 214 . In this embodiment, the width W ₁ of the ground pad 214 is 300 μm. The electronic components 22 are located on the first surface 2111 of the substrate 21 . The electronic components 22 are active components or passive components. Specifically, the electronic components 22 can be digital circuits, analog circuits or active components formed on the first surface 2111 of the substrate 21 with copper foil.

Referring to FIG. 3 , a sealing body 23 is formed on the first surface 2111 of the substrate 21 to cover the electronic components 22 . The sealing body 23 includes an upper surface 232 , a lower surface 234 and a side surface 233 . Referring to FIG. 4 , part of the encapsulant 23 is removed to form at least one groove 231 , the groove 231 runs through the upper surface 232 and the lower surface 234 of the encapsulant 23 and is located between the electronic components 22 . In this embodiment, the trench 231 exposes a portion of the ground pad 214 . The width W ₂ of the groove 231 is smaller than the width W ₁ of the ground pad 214 , preferably, the width W ₂ of the groove 231 is 50 μm to 200 μm, more preferably, the width W ₂ of the groove 231 is 100 μm to 200 μm. 5 to 7, wherein, FIG. 5 is a top view of FIG. 4, FIG. 6 is a perspective view of FIG. 4, and FIG. 7 is a partially enlarged view of FIG. It has a long side 2313 and a short side 2312, and the short side 2312 and the long side 2313 intersect. The length of the short side 2312 is equal to the width W ₂ of the trench 231 , and the length L ₁ of the long side 2313 is slightly smaller than the length L ₂ of the substrate 21 and greater than the length of the short side 2312 . There is a distance between the short side 2312 and the side surface 233 of the sealing body 23 , that is, the groove 231 does not penetrate through the two side surfaces 233 of the sealing body 23 . In this embodiment, a part of the sealant 23 is removed by a laser method to form the groove 231. Not shown) the included angle is 1.8° to 9°. However, in other embodiments, the top view shape of the groove 231 may be a curved line segment instead of a straight line, as shown in FIG. 8 .

Referring to FIG. 9 , an inner shield 24 is filled in the groove 231 , and the inner shield 24 is electrically connected to the ground pad 214 . In this embodiment, the inner shield 24 is formed by using a screen printing method, the inner shield 24 directly contacts the ground pad 214, and the material of the inner shield 24 is a conductive material, such as solder ( Solder) or Conductive Epoxy. The width W ₂ of the inner shield 24 is equal to the width W ₂ of the groove 231 , that is, the width W ₂ of the inner shield 24 is at least 50 μm. According to the principle of electromagnetic shielding, the lower the frequency of the signal, the longer the wavelength, and the larger the width W ₂ required by the inner shield 24 is. For example, for signals with a frequency above 1 MHz, the width W ₂ of the inner shield 24 should be at least 50 μm. Therefore, in the present invention, the inner shield 24 is at least 50 μm, and can be applied to signals with a frequency above 1 MHz.

Referring to FIG. 10 , the substrate 21 and the encapsulant 23 are cut along at least one cutting line L. Referring to FIG. 11, a shielding layer (Conformal Shield) 25 is formed to cover the sealing body 23 and the side surface 2112 of the substrate 21, and electrically connect the grounding metal layer 212 and the inner shielding body 24. Therefore, in the present invention, the shielding body 24 and the shielding layer 25 are not electroplated at the same time. In this embodiment, the shielding layer 25 is formed by sputtering, the thickness of the shielding layer 25 is 1 μm to 2 μm, the ratio of the thickness of the inner shield 24 to the thickness of the shielding layer 25 is greater than 25, and the shielding layer 25 is made of nickel. However, in other applications, the masking layer 25 can be formed by electroplating, the material of the masking layer 25 can be copper, and an anti-oxidation layer (not shown) can be formed by sputtering to cover the masking layer 25. Layer 25. Preferably, the anti-oxidation layer (not shown in the figure) has a thickness of 40nm and is made of stainless steel. In this way, the anti-oxidation layer (not shown in the figure) can prevent the shielding layer 25 from being oxidized, thereby improving product yield.

Thereby, the inner shield 24 can isolate the electronic components 22, so the shield 24 can make the electronic components 22 have low electromagnetic interference (Electromagnetic Interference, EMI) and high electromagnetic tolerance (Electromagnetic Compatibility, EMC). ). At the same time, electronic components 22 with various functions can be integrated into the packaging structure 2 to reduce the number of components in the final system product and reduce the size of the product.

Referring again to FIG. 11 , it shows a schematic cross-sectional view of the first embodiment of the package structure with the inner shield of the present invention. The package structure 2 with an inner shield includes a substrate 21 , several electronic components 22 , an encapsulant 23 , an inner shield 24 and a shielding layer 25 . The substrate 21 includes a ground metal layer 212 , at least one ground pad 214 , an upper ground metal region 215 and a solder resist layer 213 . The substrate 21 has a first surface 2111 and a side surface 2112 . The ground metal layer 212 is located in the substrate 21 and exposed on the side surface 2112 of the substrate 21 . The ground pad 214 is located in the substrate 21 , exposed on the first surface 2111 of the substrate 21 , and electrically connected to the ground metal layer 212 .

The upper ground metal region 215 is located in the substrate 21 and exposed on the first surface 2111 of the substrate 21 . In this embodiment, the upper ground metal region 215 is electrically connected to the ground metal layer 212 . However, in other applications, the upper ground metal region 215 is located on the ground metal layer 212 . The solder resist layer 213 is located on the first surface 2111 of the substrate 21 and has at least one opening 2131 exposing a portion of the upper ground metal region 215 to form the ground pad 214 . In this embodiment, the width W ₁ of the ground pad 214 is 300 μm.

The electronic components 22 are located on the first surface 2111 of the substrate 21 . In this embodiment, the electronic components 22 are active components or passive components. Specifically, the electronic components 22 can be digital circuits, analog circuits or active components formed on the first surface 2111 of the substrate 21 with copper foil. components. The encapsulant 23 is located on the first surface 2111 of the substrate 21 and covers the electronic components 22 , and includes at least one groove 231 , an upper surface 232 , a lower surface 234 and a side surface 233 . The groove 231 runs through the upper surface 232 and the lower surface 234 of the encapsulant 23 and is located between the electronic components 22 . In this embodiment, the groove 231 has a long side 2313 and a short side 2312 , and there is a distance between the short side 2312 and the side surface 233 of the sealing body 23 , as shown in FIGS. 5 to 7 .

The inner shield 24 is located in the trench 231 and is electrically connected to the ground pad 214 . In this embodiment, the inner shield 24 is made of conductive material, such as solder or conductive glue. The width W ₂ of the inner shield 24 is smaller than the width W ₁ of the ground pad 214 , preferably, the width W ₂ of the inner shield 24 is 50 μm to 200 μm, more preferably, the width W of the inner shield 24 ₂ is 100 μm to 200 μm.

The shielding layer 25 covers the sealing body 23 and the side surface 2112 of the substrate 21 , and is electrically connected to the ground metal layer 212 and the inner shielding body 24 . In this embodiment, the shielding layer 25 has a thickness of 1 μm to 2 μm, the ratio of the thickness of the inner shielding body 24 to the thickness of the shielding layer 25 is greater than 25, and the shielding layer 25 is made of nickel. However, in other applications, the material of the shielding layer 25 can be copper, and the package structure 2 with the inner shield can further include an anti-oxidation layer (not shown in the figure). The anti-oxidation layer (not shown in the figure) covers the shielding layer 25 . Preferably, the anti-oxidation layer (not shown in the figure) has a thickness of 40nm and is made of stainless steel.

Referring to FIG. 12 to FIG. 24 , there are schematic diagrams showing the manufacturing method of the second embodiment of the package structure with the inner shield of the present invention. The manufacturing method of the packaging structure with an inner shield in this embodiment is substantially the same as the manufacturing method of the packaging structure with an inner shield in the first embodiment ( FIGS. 2 to 11 ), wherein the same components are assigned the same numbers. The difference between this embodiment and the first embodiment is that at least one first solder 26 is further formed on the ground pad 214 when the substrate 21 and the electronic components 22 are provided.

Referring to Fig. 12, the substrate 21 is provided. In this embodiment, the ground pad 214 of the substrate 21 is a continuous and uninterrupted elongated block with a large and complete area, as shown in FIG. 13 . In this way, when the first solder 26 and the inner shield 24 are formed on the ground pad 214 later, the contact area is larger, and the effect of low electromagnetic interference is better. However, when the first solder 26 is formed on the grounding pad 214 later, the first solder 26 needs to be applied to an area that is too large, resulting in inconsistent thicknesses of the bumps after reflowing the first solder 26 . However, in other applications, the ground pad 214 of the substrate 21 may include several sections 2141 , and there is a gap between two adjacent sections 2141 , as shown in FIG. 14 . Thereby, the area of the section 2141 of the ground pad 214 is smaller, so that after the first solder 26 is formed and reflowed, the thickness of the protrusion is relatively consistent.

Referring to FIG. 15 , the first solder 26 is formed on the ground pad 214 , and the first solder 26 is electrically connected to the inner shield 24 . Referring to Figure 16, the electronic assemblies 22 are provided. The electronic components 22 are active components, such as chips, which include at least one second solder 27 . Then, reflow the first solder 26 and the second solder 27 to make the surface of the first solder 26 arc-shaped, and use the second solder 27 to arrange the electronic components 22 on the substrate 21 superior. However, in other applications, the electronic components 22 can be passive components, and when the first solder 26 is formed on the ground pad 214 , the second solder 27 is further formed on the upper ground metal region 215 . Referring to FIG. 17 , the sealing body 23 is formed. Referring to FIG. 18 , when part of the encapsulant 23 is removed to form at least one groove 231 , the groove 231 exposes a portion of the first solder 26 . In this way, when a part of the encapsulant 23 is removed by a laser method, the first solder 26 can protect the ground pad 214 and prevent the ground pad 214 from being damaged by the laser. The groove 231 includes several sections 2311 , and there is a distance between two adjacent sections 2311 , as shown in FIGS. 19 to 21 . Thereby, the ratio of length, width and depth of the section 2311 of the trench 231 is small, so that the section 2311 of the trench 231 can be easily filled when forming the inner shield 24 , thereby improving the product yield. Referring to FIG. 22 , when forming an inner shield 24 , the inner shield 24 is electrically connected to the ground pad 214 through the first solder 26 . Referring to FIG. 23 , the substrate 21 and the encapsulant 23 are cut along the cutting line L. Referring to FIG. Referring to FIG. 24, the shielding layer 25 is formed.

Referring again to FIG. 24 , it shows a schematic cross-sectional view of a second embodiment of the packaging structure with an inner shield according to the present invention. The packaging structure 3 with an inner shield of this embodiment is substantially the same as the packaging structure 2 with an inner shield of the first embodiment ( FIG. 11 ), wherein the same components are given the same numbers. The difference between this embodiment and the first embodiment is that the packaging structure 3 with the inner shield further includes at least one first solder 26 . The first solder 26 is located on the ground pad 214 and electrically connected to the inner shield 24 , and the surface of the first solder 26 is arc-shaped. In addition, the inner shield 24 includes several sections 241 , and there is a gap between two adjacent sections 241 .

However, the above-mentioned embodiments are only to illustrate the principles and effects of the present invention, not to limit the present invention. Therefore, those skilled in the art can modify and change the above embodiments without departing from the spirit of the present invention. The scope of rights of the present invention should be listed in the claims.

Claims (18)

1. A packaging structure with an inner shield, comprising: A substrate has a first surface and a side surface, and includes: a grounded metal layer within the substrate and exposed on the side of the substrate; and At least one ground pad is located in the substrate, exposed on the first surface of the substrate, and electrically connected to the ground metal layer; a plurality of electronic components located on the first surface of the substrate; at least one first solder located on the surface of the ground pad; An encapsulant is located on the first surface of the substrate and covers the electronic components, the encapsulant includes at least one groove, an upper surface, a lower surface and a side surface, the groove runs through the upper surface of the encapsulant and the lower surface, and are located between the electronic components, and the groove has a long side and a short side, and there is a distance between the short side and the side of the sealing body; an inner shield located in the trench and electrically connected to the ground pad through the first solder; and A shielding layer covers the sealing body and the side surface of the substrate, and electrically connects the grounding metal layer and the inner shielding body. 2. The package structure according to claim 1, wherein the substrate further comprises an upper ground metal region and a solder resist layer, the upper ground metal region is located in the substrate and exposed on the first surface of the substrate, the solder resist layer It is located on the first surface of the substrate and has at least one opening to expose a part of the upper ground metal region to form the ground pad. 3. The package structure according to claim 1, wherein the long side of the groove is a straight line or a curved line segment. 4. The package structure according to claim 1, wherein the inner shield is made of solder or conductive glue. 5. The package structure of claim 1, further comprising an anti-oxidation layer covering the shielding layer. 6. A packaging structure with an inner shield, comprising: A substrate has a first surface and a side surface, and includes: a grounded metal layer within the substrate and exposed on the side of the substrate; and At least one ground pad is located in the substrate, exposed on the first surface of the substrate, and electrically connected to the ground metal layer; a plurality of electronic components located on the first surface of the substrate; at least one first solder located on the surface of the ground pad; An encapsulant is located on the first surface of the substrate and covers the electronic components, the encapsulant includes at least one groove, an upper surface, a lower surface and a side surface, the groove runs through the upper surface of the encapsulant and the lower surface between the electronic components; an inner shield located in the trench and electrically connected to the ground pad through the first solder; and A shielding layer covers the sealing body and the side surface of the substrate, and electrically connects the grounding metal layer and the inner shielding body, wherein the ratio of the thickness of the inner shielding body to the thickness of the shielding layer is greater than 25. 7. The package structure according to claim 6, wherein the substrate further comprises an upper ground metal region and a solder resist layer, the upper ground metal region is located in the substrate and exposed on the first surface of the substrate, the solder resist layer It is located on the first surface of the substrate and has at least one opening to expose a part of the upper ground metal region to form the ground pad. 8. The package structure of claim 6, wherein the inner shield comprises several sections, and there is a gap between two adjacent sections. 9. The package structure of claim 6, wherein a surface of the first solder is arc-shaped. 10. A method of manufacturing a packaging structure with an inner shield, comprising: A substrate and several electronic components are provided, the substrate has a first surface and a side surface, and includes a ground metal layer and at least one ground pad, the ground metal layer is located in the substrate and exposed on the side of the substrate, The ground pad is located in the substrate, exposed on the first surface of the substrate, and electrically connected to the ground metal layer, and the electronic components are located on the first surface of the substrate; forming at least one first solder on the ground pad; forming a sealant on the first surface of the substrate to cover the electronic components, the sealant comprising an upper surface, a lower surface and a side surface; removing part of the sealing body to form at least one groove, the groove runs through the upper surface and the lower surface of the sealing body, and is located between the electronic components; an inner shield is filled in the trench, and the inner shield is electrically connected to the ground pad through the first solder; cutting the substrate and the encapsulant; and A shielding layer is formed to cover the sealing body and the side surfaces of the substrate, and is electrically connected to the grounding metal layer and the inner shielding body. 11. The method according to claim 10, wherein the substrate further comprises an upper ground metal region and a solder resist layer, the upper ground metal region is located in the substrate and exposed on the first surface of the substrate, the solder resist layer is located The first surface of the substrate has at least one opening exposing a part of the upper ground metal region to form the ground pad. 12. The method of claim 10, further comprising a step of reflowing the first solder after the step of providing a substrate and a plurality of electronic components, so that the surface of the first solder is arc-shaped. 13. The method of claim 10, wherein the trench exposes a portion of the first solder. 14. The method of claim 10, wherein the groove has a long side and a short side, and there is a distance between the short side and the side of the encapsulant. 15. The method of claim 10, wherein the groove comprises a plurality of sections, and there is a gap between two adjacent sections. 16. The method of claim 10, wherein in the step of filling an inner shield in the trench, the inner shield is formed by screen printing. 17. The method of claim 10, wherein the inner shield is made of solder or conductive glue. 18. The method of claim 10, further comprising the step of forming an anti-oxidation layer after the step of forming a masking layer, and the anti-oxidation layer covers the masking layer.

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