CN102081483B - Optical sensing module - Google Patents

Abstract

The invention discloses an optical sensing module, which includes a light conductor, a light source, a light-shielding element, a plurality of light sensors and optical elements. The light conductive member has a light entrance surface and a light exit surface. The light source is adapted to provide light. The light-shielding element is arranged on a partial area of the light-emitting surface. A plurality of light sensors are arranged on the light-shielding element. The optical element is arranged above the light-emitting surface, and the light sensor and the light-shielding element are located between the optical element and the light conductor. The optical element has a contact surface, and the light passes through the optical element after leaving the light conductor from the light exit surface. When an object touches the touch surface, the light is reflected and received by the light sensor.

Description

Optical Sensing Module

technical field

The present invention relates to an optical sensing module, and in particular to a thinned optical sensing module.

Background technique

With the rapid development and application of information technology, wireless mobile communication and information home appliances, many information products, such as smart phones, notebook computers, etc., are equipped with optical finger navigation modules (optical finger navigation, OFN). In the known optical finger navigation modules, most infrared light emitting diodes are used as light sources, and the infrared light emitted by the infrared light emitting diodes is projected onto the user's finger through a prism, and the image of the finger is passed through an image sensor (such as a complementary metal oxide object semiconductor image sensor) capture. Then, after the image of the finger is captured by the image sensor, an image processing method can be used to analyze the differences of the images captured at different time points, so as to determine the direction and distance of the finger movement.

However, in the known optical finger navigation modules, the image sensors (such as complementary metal oxide semiconductor image sensors) are mostly opaque chips, and usually need to be equipped with a lens to capture a good finger image. The arrangement of the image sensor and the lens makes the known optical finger navigation modules have a certain thickness and volume, which is not easy to be thinned. For example, optical finger navigation modules disclosed in US Patent No. 7,045,775, US Patent No. 7,161,682, US Patent No. 6,433,780, US Patent No. 5,686,720, US Patent No. 7,408,718, and US Patent Publication No. Disadvantages that it is not easy to reduce thickness.

Contents of the invention

The invention provides a thinner optical sensing module.

The invention provides an optical sensing module, which includes a light-conducting element, a light source, a light-shielding element, a plurality of light sensors, and an optical element. The light conducting element has a light incident surface and a light exit surface, and there is an included angle between the light incident surface and the light exit surface. The light source is suitable for providing light, and the light enters the light-conducting member from the light-incoming surface and exits the light-conducting member from the light-emitting surface. The light-shielding element is arranged on a partial area of the light-emitting surface. A plurality of light sensors are arranged on the light shielding element. The optical element is arranged above the light-emitting surface, wherein the photosensor and the light-shielding element are located between the optical element and the light-conducting element, the optical element has a touch surface, and the light passes through the optical element after leaving the light-conducting element from the light-emitting surface. When an object touches the touch surface, the light is reflected and received by the light sensor.

In an embodiment of the present invention, the aforementioned light-conducting element further has an optical surface, and the optical surface is opposite to the light-emitting surface.

In an embodiment of the present invention, the aforementioned light-conducting element has a plurality of optical microstructures, and these optical microstructures are located on the optical surface.

In an embodiment of the present invention, the aforesaid plurality of optical microstructures include a plurality of V-shaped grooves or a plurality of scattering dots.

In an embodiment of the present invention, the aforementioned light source includes an invisible light source.

In an embodiment of the present invention, the aforementioned light-shielding element includes a reflective layer or a light-absorbing layer.

In an embodiment of the present invention, the aforementioned shading element includes a plurality of shading patterns arranged in an array and a plurality of light outlet openings defined by the shading patterns, and the light shading patterns and the light outlet openings are alternately arranged along the row direction and the column direction.

In an embodiment of the present invention, the aforementioned light-shielding patterns and light-emitting openings arranged in the same column are alternately arranged along the column direction, and the light-shielding patterns and light-emitting openings arranged in the same row are alternately arranged along the row direction.

In an embodiment of the present invention, the aforementioned light exit openings are distributed between the light sensors.

In one embodiment of the present invention, the aforementioned optical element is a micro-lens array substrate (micro-lensarray substrate), and this micro-lens array substrate has a touch surface and a micro-lens surface opposite to the touch surface, and the micro-lens surface Face the light-emitting surface.

In an embodiment of the present invention, the aforementioned optical element includes a cover plate and a microlens array substrate. The cover has a touch surface. The microlens array substrate is disposed between the cover plate and the light-conducting element. The microlens array substrate has a microlens surface, and the microlens surface faces the cover plate.

In an embodiment of the present invention, when the aforementioned light exits from the light-emitting surface, its divergence angle is less than 40 degrees, the optical element includes a cover plate, and the cover plate has a touch surface.

In an embodiment of the present invention, the aforementioned optical element includes a collimated lens.

In an embodiment of the present invention, the aforementioned light-conducting element is a color filter substrate or an active device array substrate.

Based on the above, in the optical sensing module of the present invention, the optical sensing module of the present invention can be effectively thinned by disposing the light sensor on part of the light-emitting surface of the light-conducting member.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

1 is a schematic cross-sectional view of an optical sensing module according to a first embodiment of the present invention;

FIG. 2 is a schematic top view of the light shielding element according to the first embodiment of the present invention;

3, FIG. 4A, FIG. 4B, FIG. 5A, and FIG. 5B are schematic cross-sectional views of an optical sensing module according to an embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of an optical sensing module according to a second embodiment of the present invention.

Among them, reference signs

100, 300: Optical sensing module 100d: Touch surface

110: Light-conducting part 110a, 110a': Light incident surface

110b: Light-emitting surface 110c: Optical surface

112: Optical microstructure 120: Light source

130: shading element 132: shading pattern

H: Light exit opening 140: Light sensor

150: Optical Components 152: Microlens Array Substrate

154: Cover Plate 200: Display Panel

C: Color filter substrate T: Active element array substrate

S: Microlens surface θ, θ1, θ2, α: included angle

L, L’: light rays F: objects

P: Focus A: Touch point

D: Cover Thickness K: Fingerprint Road Clearance

Detailed ways

【The first embodiment】

FIG. 1 is a schematic cross-sectional view of an optical sensing module according to a first embodiment of the present invention. Referring to FIG. 1 , the optical sensing module 100 of this embodiment may include a light-conducting element 110 , a light source 120 , a light-shielding element 130 , a plurality of light sensors 140 and an optical element 150 . The light conducting element 110 has a light incident surface 110a and a light exit surface 110b, and an included angle θ exists between the light incident surface 110a and the light exit surface 110b. In detail, the light incident surface 110a and the light exit surface 110b can be connected, and there is an included angle θ between the light incident surface 110a and the light exit surface 110b, and the included angle θ is, for example, 90°. However, the present invention is not limited thereto, and the angle θ between the light-incident surface 110 a and the light-exit surface 110 b can be designed differently according to actual needs.

The light-conducting member 110 further has an optical surface 110c, and the optical surface 110c is opposite to the light-emitting surface 110b. The light guide 110 may further have a plurality of optical microstructures 112 located on the optical surface 110c. These optical microstructures 112 may include a plurality of V-shaped grooves or a plurality of scattering dots. These V-shaped grooves or scattering dots can make the light L emitted by the light source 120 evenly exit from the light-emitting surface 110b. In this embodiment, the material of the light-conducting member 110 can be polymethylmethacrylate (polymethylmethacrylate, PMMA), polycarbonate (polycarbonate, PC), polyethylene terephthalate (polyethylene terephthalate, PET) or glass , but the present invention is not limited thereto.

The light source 120 is adapted to provide light L, and the light L enters the light-conducting member 110 from the light-incident surface 110a, and exits the light-conducting member 110 from the light-emitting surface 110b. In detail, after the light L enters the light-conducting member 110 from the light-incident surface 110a, it can be reflected by the optical microstructure 112 to exit from the light-exit surface 110b. In this embodiment, the light source 120 includes an invisible light source. For example, the light source 120 is, for example, an infrared light-emitting diode (infrared ray light-emitting diode, IR LED), but the present invention is not limited thereto.

The light shielding element 130 covers a partial area of the light emitting surface 110b. For example, the light shielding element 130 may include a plurality of light shielding patterns 132 arranged in an array and a plurality of light outlet openings H defined by the light shielding patterns 132 , and the light shielding patterns 132 and the light outlet openings H are arranged alternately along the row direction and the column direction. Specifically, the light-shielding patterns 132 and the light-emitting openings H arranged in the same column are alternately arranged along the column direction, while the light-shielding patterns 132 and the light-emitting openings H arranged in the same row are alternately arranged along the row direction. The openings H are alternately arranged in a checkered pattern, as shown in FIG. 2 , for example. However, the present invention is not limited thereto. In other embodiments, the shading element 130 can also be one or more shading plates with multiple openings, and the aforementioned openings are evenly distributed in the shading plates, for example.

It is worth mentioning that the light L emitted by the light source 120 is not completely blocked by the light-shielding element 130 , that is, the light L can still exit the light-emitting surface 110 b through the light-emitting opening H for sensing purposes. In this embodiment, the light-shielding element 130 is, for example, a reflective layer or a light-absorbing layer. The material of the light-shielding element 130 is preferably a material capable of reflecting or absorbing light, such as metal, white reflective sheet, or light-absorbing resin.

A plurality of light sensors 140 are disposed on the light shielding element 130 . For example, each light sensor 140 can be respectively disposed on each light-shielding pattern 132 . In other words, the light exit openings H defined by the light-shielding pattern 132 are distributed among the light sensors 140 . It is worth mentioning that the light sensor 140 can be integrated on the light-conducting member 110 through the above-mentioned configuration, so that the optical sensing module 100 of this embodiment can be effectively reduced in thickness.

The optical element 150 is disposed above the light-emitting surface 110 b , wherein the light sensor 140 and the light-shielding element 130 are located between the optical element 150 and the light-conducting element 110 . The optical element 150 has a touch surface 100d. The light L will pass through the optical element 150 after leaving the light-conducting member 110 from the light-emitting surface 110b. When an object F touches the touch surface 100d, the light L will be reflected by the object and be sensed by light. Received by the detector 140.

For example, the optical element 150 can be a micro-lens array substrate 152 (micro-lens array substrate), this micro-lens array substrate has a touch surface 100d and a micro-lens surface S opposite to the touch surface 100d, and the micro-lens surface S faces The light-emitting surface 110b. In this way, after the light L leaves the light-conducting member 110 from the light-emitting surface 110b, the light L can be effectively converged to a plurality of focal points P through a plurality of microlenses in the microlens array substrate, and these focal points P are located on the touch surface 100d . In this way, when the object F touches the touch surface 100d, the light beam L' reflected from a certain touch point A on the object F has a smaller divergence degree. In other words, the light L' reflected from a touch point A on the object F can be accurately projected onto the light sensor 140 around the touch point A, so that the optical sensing module 100 of this embodiment can accurately The shape, moving direction and position of the object F can be accurately sensed.

In other embodiments, the optical element 150 may include a microlens array substrate 152 and a cover plate 154 . The cover plate 154 has a touch surface 100d, the microlens array substrate 152 is disposed between the cover plate 154 and the light-conducting member 110, the microlens array substrate 152 has a microlens surface S, and the microlens surface S faces the cover plate 154, such as shown in Figure 3. It is worth mentioning that the position of the touch surface 100 d of the cover plate 152 is located on the focal plane of the microlens array substrate 152 , for example. In this way, the light L can be focused on the touch surface 100d after passing through the microlens array substrate 152 . In this way, when the object F touches the touch surface 100d, the light L′ reflected from a certain touch point A on the object F can be more accurately projected to the light sensor 140 around the touch point A. In this way, the sensing sensitivity and accuracy of the optical sensing module 100 are further improved.

Of course, the optical element 150 may also include a collimated lens 156 (collimated lens), such as shown in FIG. 4A and FIG. 4B . The function of the collimated lens 156 is similar to that of the microlens array substrate 152 . It should be noted that when the optical microstructure 112 does not overlap with the light sensor 140 (such as shown in FIG. 4B ), the collimating lens 156 can collect the light L reflected by the optical microstructure 112 to the touch surface 100d. , and then transmit the light L′ reflected by the object F to the light sensor 140 , so that the optical sensing module 100 of this embodiment can perform the sensing action smoothly.

The optical sensing module 100 of this embodiment can be further integrated into the display panel 200 . In detail, the light-conducting member 110 of this embodiment may be a color filter substrate C in the display panel 200, as shown in FIG. 5A. Of course, in other embodiments, the active device array substrate T in the display panel 200 may also be selected as the light-conducting member 110 , as shown in FIG. 5B . It is worth mentioning that if the active element array substrate T is used as the light-conducting element 110 , a part of the color filter substrate C can be further used to make a microlens array 152 and use it as the optical element 150 . In this way, the thickness and volume of the display panel 200 using the optical sensing module 100 can be optimized.

【Second Embodiment】

FIG. 6 is a schematic cross-sectional view of an optical sensing module 300 according to a second embodiment of the present invention. The optical sensing module 300 of this embodiment is similar to the optical sensing module 100 of the first embodiment, and only the differences between the two will be described below, and the similarities will not be repeated.

Referring to FIG. 6 , the optical sensing module 300 of this embodiment includes a light-conducting element 110 , a light source 120 , a light-shielding element 130 , a plurality of light sensors 140 and an optical element 150 . The light conducting element 110 has a light incident surface 110a and a light exit surface 110b, and an included angle θ exists between the light incident surface 110a and the light exit surface 110b. The light source 120 is adapted to provide light L, and the light L enters the light-conducting member 110 from the light-incident surface 110a, and exits the light-conducting member 110 from the light-emitting surface 110b. The light shielding element 130 is disposed on a partial area of the light emitting surface 110b. A plurality of light sensors 140 are disposed on the light shielding element 130 . The optical element 150 is disposed above the light-emitting surface 110b, wherein the photosensor 140 and the light-shielding element 130 are located between the optical element 150 and the light-conducting member 110, the optical element has a touch surface 100d, and the light L leaves the light-conducting from the light-emitting surface 110b The component 110 then passes through the optical element 150 , and when the object F touches the touch surface 100 d, the light L is reflected and received by the light sensor 140 .

It is worth mentioning that, in this embodiment, when the light L emitted by the light source 120 exits the light-emitting surface 110b, its divergence angle α is lower than 40 degrees. The optical element 150 of this embodiment is, for example, a cover plate 154, and The cover plate 154 has a touch surface 100d. In detail, since the light source 120 of this embodiment is a directional light source, and the optical microstructure 112 of this embodiment has a special angle design, the light L can have a smaller divergence angle α (a more consistent direction) away from the light-emitting surface 110b. In this way, even in the absence of the microlens array substrate 152, when the object F touches the touch surface 100d, the light L' reflected from a certain touch point A on the object F can still be accurately projected on the On the corresponding light sensor 140 , the optical sensing module 300 of this embodiment can correctly sense the shape, moving direction and position of the object F without using the microlens array substrate 152 . For example, when the thickness D of the cover plate 154 is 0.1 cm, and the gap K between the fingerprints is less than 0.1 cm, the divergence angle α of the light L when leaving the light-emitting surface 110 b can be lower than 40 degrees, so that the optical sensitivity of this embodiment can be improved. The detection module 300 has a good sensing effect. However, the present invention is not limited thereto, and the above-mentioned divergence angle α can also be appropriately designed depending on the thickness D of the cover plate 154 and the size of the gap K between the fingerprint paths.

The optical microstructure 112 of this embodiment has a special design. The optical microstructure 112 of this embodiment is, for example, a V-shaped groove. This V-shaped groove has a first surface S1 and a second surface S2, and the first surface S1 and the second surface. The surfaces S2 are connected to form a V-shaped groove, wherein the first surface S1 and the optical surface 110c form an angle θ1, and the second surface S2 and the optical surface 110c form an angle θ2. When the light L only enters the light-conducting member 110 at the light-incident surface 110a, the angle θ1 is preferably between 1°˜10°, and the angle θ2 is preferably between 30°˜45°. In addition, when the light L enters the light-conducting member 110 from the light incident surface 110a and another light incident surface 110a' opposite to the light incident surface 110a respectively, the angle θ1 is preferably less than 35°, and the angle θ2 is preferably less than 50°.

To sum up, in the optical sensing module of the present invention, the optical sensing module of the present invention can be effectively thinned by integrating the light sensor on a partial area of the light-conducting member. In addition, the optical sensing module of the present invention can also configure a cover plate on the microlens array substrate, so that the sensing effect of the optical sensing module of the present invention is better.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (12)

1. an optics sensing module is characterized in that, comprising:

One smooth conducting piece has an incidence surface and an exiting surface, has an angle between this incidence surface and this exiting surface;

One light source is suitable for providing a light, and this light gets into this light conducting piece by this incidence surface, and leaves this light conducting piece from this exiting surface;

One shading element; Be disposed on the subregion of this exiting surface; Wherein this shading element comprises the light-shielding pattern of a plurality of arrayed and a plurality of by the bright dipping opening that these light-shielding patterns defined, and these light-shielding patterns and these bright dipping openings are alternately arranged along line direction and column direction; A plurality of OPTICAL SENSORSs are disposed on this shading element, and wherein this bright dipping aperture distribution is between these OPTICAL SENSORSs; And

One optical element; Be disposed at the top of this exiting surface; Wherein these OPTICAL SENSORSs and this shading element are between this optical element and light conducting piece, and this optical element has a touching surface, and this light can pass this optical element after this exiting surface leaves this light conducting piece; When object touching should be touched the surface, these light were reflected and are received by these OPTICAL SENSORSs.

2. optics sensing module according to claim 1 is characterized in that, this light conducting piece has more an optical surface, and is relative with this exiting surface.

3. optics sensing module according to claim 2 is characterized in that, this light conducting piece has a plurality of optical microstructures, is positioned on this optical surface.

4. optics sensing module according to claim 3 is characterized in that, these optical microstructures comprise a plurality of V-shaped grooves or a plurality of scattering netted dot.

5. optics sensing module according to claim 1 is characterized in that, this light source comprises a non-visible light source.

6. optics sensing module according to claim 1 is characterized in that this shading element comprises reflection horizon or light absorbing zone.

7. optics sensing module according to claim 1; It is characterized in that; These light-shielding patterns and these bright dipping openings that are arranged in same row are alternately arranged along column direction, alternately arrange along line direction and be arranged in these light-shielding patterns and these bright dipping openings of delegation.

8. optics sensing module according to claim 1; It is characterized in that; This optical element is a microlens array substrate, and this microlens array substrate has this touching surface and a lenticule surperficial relative with this touching is surperficial, and this this exiting surface of lenticule faces towards surface.

9. optics sensing module according to claim 1 is characterized in that, this optical element comprises:

One cover plate has this touching surface; And

One microlens array substrate is disposed between this cover plate and this light conducting piece, and this microlens array substrate has lenticule surface, and this this cover plate of lenticule faces towards surface.

10. optics sensing module according to claim 1 is characterized in that, when this light its dispersion angle when this exiting surface leaves is lower than 40 degree, this optical element comprises a cover plate, and that this cover plate has this touching is surperficial.

11. optics sensing module according to claim 1 is characterized in that, this optical element comprises collimation lens.

12. optics sensing module according to claim 1 is characterized in that, this light conducting piece is a colored optical filtering substrates or an active component array base board.

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