CN102237308A

CN102237308A - Semiconductor Chip Separation Method

Info

Publication number: CN102237308A
Application number: CN2010101740344A
Authority: CN
Inventors: 吴名清
Original assignee: Domintech Co Ltd
Current assignee: Domintech Co Ltd
Priority date: 2010-05-06
Filing date: 2010-05-06
Publication date: 2011-11-09

Abstract

A method for dividing a semiconductor wafer into multiple chips includes taking a wafer to be cut and a supporting substrate, and then sandwiching a separation layer made of a soluble material between the wafer to be cut and the substrate to form a sandwich. Then, the wafer to be cut is etched to form multiple chips attached to the separation layer; then a device is taken, the device has an internal space and a carrying surface; then the sandwich is fixed in the internal space of the device with the wafer to be cut facing the carrying surface; finally, a dissolving liquid is filled in the internal space of the device to dissolve the separation layer, and each of the multiple chips cut from the wafer to be cut is placed on the carrying surface of the device to complete the division.

Description

The semiconductor chip dividing method

Technical field

The present invention be with will be formed at semiconductor crystal wafer (wafer) on chip (Chip) method of separating, particularly about a kind of method that wafer (wafer) is divided into a plurality of chips (Chip) with non-physics mode.

Background technology

For wafer (wafer) is divided into the technical of a plurality of chips (Chip), all be in the majority at present with physics mode, in more detail, so-called physics mode is exactly to cut with the cutter sawing or with laser mode, for example at United States Patent (USP) the 6th, 121, No. 118, the 6th, 924, No. 210 and the 7th, 550, No. 367 disclosed, these cutting modes in fact have many shortcomings, and with regard to the cutter sawing, the disappearance of its maximum is exactly that chip periphery after the cutting apart powder or the grain bits that can be damaged or be subjected to after the sawing pollute, and with the laser partitioning scheme, its disadvantage is exactly the pollution of chip after the cutting apart ashes of giving birth to can be subjected to high-temperature machining and carry out the time.Moreover these two kinds of cutting modes are unsatisfactory on cutting speed.

Summary of the invention

Main purpose of the present invention promptly is with non-physics mode wafer (wafer) to be divided into the method for a plurality of chips (Chip) providing a kind of, and it does not have the shortcoming that aforementioned each physics cutting mode is given birth to.

For reaching aforesaid purpose, the method that wafer (wafer) is divided into a plurality of chips (Chip) of the present invention, include and take the substrate that a wafer to be cut and supports usefulness, then a separate layer made from the solubility material is folded between this wafer to be cut and the substrate, forms a sandwich-like thing.It forms a plurality of chips that are attached on this separate layer with etching mode with this wafer to be cut again; What continue then is the equipment of taking, and this equipment has an inner space and a loading end; Then this sandwich-like thing is fixedly arranged in the inner space of this equipment in the mode of this wafer to be cut towards this loading end; A last again lysate filling in the inner space that fills in this equipment in order to dissolving this separate layer, and make respectively these a plurality of chips that formed by this wafer cutting to be cut born respectively on the loading end of this equipment and finishes and cut apart.By as can be known aforementioned, cutting method provided by the present invention does not have bits grain or ashes after the cutting, and is that each chip is cut apart simultaneously, and therefore the shortcoming of known dividing method can effectively be solved.

Description of drawings

Below enumerate a preferred embodiment and conjunction with figs., the present invention is described in further detail, wherein:

Fig. 1 is in the implementation step of the inventive method, and a separate layer made from the solubility material is folded between this wafer to be cut and the substrate, forms the schematic diagram of a sandwich-like thing;

Fig. 2 is in the implementation step of the inventive method, with etching mode this wafer to be cut is formed a plurality of schematic diagrames that are attached to the chip on this separate layer;

Fig. 3 is in the implementation step of the inventive method, sandwich-like thing shown in Figure 2 is fixedly arranged in the schematic diagram in the inner space of a tool in this wafer that has been cut mode down;

Fig. 4 is in the implementation step of the inventive method, with tool shown in Figure 3 with and inner sandwich-like thing be soaked in one and contain in the cell body of lysate in order to dissolve the schematic diagram of this separate layer; And

Fig. 5 is in the implementation step of the inventive method, and respectively the chip after this cutting is born the schematic diagram on the loading end of this equipment respectively.

Embodiment

See also each accompanying drawing, in fact disclosed method can carry out according to following steps, only it must be appreciated that these steps only are embodiment of this method.

At first, take a wafer 10 to be cut, and one support with substrate 20, present embodiment is to take one to serve as with the wafer of wafer 10 identical sizes to be cut.Then a separate layer 30 is folded in and forms a sandwich-like thing 40 (as shown in Figure 1) between wafer 10 to be cut and the substrate 20.Be that separate layer 30 is can being made by the material of suitably chemical agent dissolving, for example plastic polymer (Polymer) what this must one carries.

Then, be wafer 10 to be cut to be separated into a plurality of chip 12 in etching (Etching) mode, mentioned herein is well-known technology in etching (Etching) mode, therefore not with detailed description, but what must one carry is that each chip 12 after the separation is still and is attached at (as shown in Figure 2) on the separate layer 30.

It takes an equipment again, and present embodiment is to carry out with as shown in Figure 3 tool 50, and tool 50 has a loam cake 52, one bases 54 and and is positioned at the spatial accommodation 56 of the two.Sandwich-like thing 40 is with wafer 10 to be cut down, that is to say the mode towards base 54 seat surfaces 542, is suspended in loam cake 52 inboard end faces 522.In addition, be provided with a plurality of perforation 544 in present embodiment base 54 seat surfaces 542, its effect will illustrate in the back.

Continue it, as shown in Figure 4, be to take a cell body 60, its inside is loaded with solubilized separate layer 30 but can dissolve wafer 10 to be cut and the aqueous chemical medicament 62 of using substrate 20, then sandwich-like thing shown in Figure 2 40 is immersed in the cell body 60, aqueous chemical medicament 62 will enter the spatial accommodation 56 of tool 50 via a plurality of perforations 544 of base 54 seat surfaces 542 at this moment, separate layer 30 is dissolved, when separate layer 30 is melted fully, each chip 12 after the separation will be carried on base 54 seat surfaces 542 (as shown in Figure 4).In addition, what must one carry is that aqueous chemical medicament 62 is to decide on the material of separate layer 30, because this respect also is a known technology, this place also will not describe in detail.

At last, as shown in Figure 5, tool 50 is taken out from cell body 60, then loam cake 52 is opened, each chip 12 that can take out after the separation is used for following process.

Known to aforementioned, method of the present invention is not all treated cutting crystal wafer with sawing or laser mode on the implementation and is processed, and therefore promptly can not produce the shortcoming that this two known method is produced.

Claims

1. one kind is divided into the method for a plurality of chips with semiconductor crystal wafer, includes following step:

Take a wafer to be cut and a substrate;

One separate layer made from the solubility material is folded between this wafer to be cut and the substrate, forms a sandwich-like thing;

This wafer to be cut of etching forms a plurality of chips that are attached on this separate layer;

Take an equipment, this equipment has an inner space and a loading end;

This sandwich-like thing is fixedly arranged in the inner space of this equipment in the mode of this wafer to be cut towards this loading end;

One lysate irritated in the inner space fill in this equipment in order to dissolving this separate layer, and these a plurality of chips are born on the loading end of this equipment and finish and cut apart.

2. as claimed in claim 1 semiconductor crystal wafer is divided into the method for a plurality of chips, wherein this separate layer includes a plastic polymer layer.

3. the method that semiconductor crystal wafer is divided into a plurality of chips as claimed in claim 1, wherein this equipment includes a tool, and this tool has a loam cake, a base, this loam cake be to form a spatial accommodation after this base combines, the seat surface of this base forms this loading end; This sandwich-like thing is that the mode with the seat surface of this wafer to be cut towards this towards this base is fixedly arranged in the inboard end face of this loam cake.

4. as claimed in claim 3 semiconductor crystal wafer is divided into the method for a plurality of chips, wherein the base of this tool is provided with some perforations pouring into and flow out for these lysates.

5. as claimed in claim 4 semiconductor crystal wafer being divided into the method for a plurality of chips, wherein is this tool that is equipped with the sandwich-like thing to be immersed one contain in the cell body of this lysate, makes this lysate can enter this spatial accommodation this separate layer is dissolved.