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CN102280332B - MIPM (multum in parvo mapping)-type internal field emitting cathode - Google Patents

MIPM (multum in parvo mapping)-type internal field emitting cathode Download PDF

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CN102280332B
CN102280332B CN 201110184514 CN201110184514A CN102280332B CN 102280332 B CN102280332 B CN 102280332B CN 201110184514 CN201110184514 CN 201110184514 CN 201110184514 A CN201110184514 A CN 201110184514A CN 102280332 B CN102280332 B CN 102280332B
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邹宇
展长勇
林黎蔚
任丁
刘波
黄宁康
肖婷
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Sichuan University
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Abstract

本发明的阴极属于真空电子学和材料学领域,尤其涉及一种MIPM型内场发射阴极。本发明的MIPM型内场发射阴极由底电极层、绝缘层、电子储存传输层和顶电极层组成,其主要特征在于电子储存传输层采用多孔硅薄膜材料。在交流驱动模式下,该功能层不仅能输运电子而且能储存电子,从而提高发射效率。与现有技术相比,本发明具有发射电流大、稳定性好等优点,并且这种阴极环境适应能力强,不仅可在气体中工作,也可在液体中工作。

Figure 201110184514

The cathode of the invention belongs to the field of vacuum electronics and material science, and in particular relates to a MIPM type internal field emission cathode. The MIPM internal field emission cathode of the present invention is composed of a bottom electrode layer, an insulating layer, an electron storage and transport layer and a top electrode layer, and its main feature is that the electron storage and transport layer adopts porous silicon film material. In the AC driving mode, the functional layer can not only transport electrons but also store electrons, thereby improving emission efficiency. Compared with the prior art, the invention has the advantages of large emission current, good stability, etc., and the cathode environment adaptability is strong, and it can not only work in gas, but also work in liquid.

Figure 201110184514

Description

一种MIPM型内场发射阴极A MIPM type internal field emission cathode

技术领域 technical field

本发明属于真空电子学和材料学领域,尤其涉及一种MIPM型内场发射阴极。 The invention belongs to the field of vacuum electronics and material science, in particular to an MIPM type internal field emission cathode.

背景技术 Background technique

场致电子发射有三种类型:一是外场致发射,二是内场致发射,三是横向场发射。  There are three types of field electron emission: one is external field emission, the other is internal field emission, and the third is transverse field emission. the

外场致发射阴极有用金属或半导体椎尖、纳米管、纳米线等制备,其原理是利用外部强电场来压抑表面势垒,使势垒的最高点降低,并使势垒的宽度变窄,当冷阴极表面势垒宽度被电场压缩到可以同电子波长相比拟时,因电子的隧道效应,大量电子穿过表面势垒逸出。横向场发射原理是利用不连续薄膜或者纳米狭缝的传导电流形成电子发射被垂直的电场引出,又称为表面传导阴极。内场致发射的原理是利用内部强场使电子从基底进入介质层,并在介质层中加速而获得足够能量,逸出介质层。由于内场发射阴极的内建电场不受外界气氛影响,因此内场致发射对表面形貌和气体吸附等不敏感。目前内场型发射阴极从结构和原理上又可划分包括三种:一种是金属-绝缘层-金属(Metal-Insulator-Metal,MIM)型,另外一种是金属-多孔硅-金属(MPM) 金属-多孔硅-金属型(Metal-Porous Silicon-Metal,MPM)型,第三种是金属-绝缘层-半导体层-金属(Metal-Insulator-Semiconductor-Metal,MISM)型。  External field emission cathodes are made of metal or semiconductor cones, nanotubes, nanowires, etc. The principle is to use an external strong electric field to suppress the surface barrier, reduce the highest point of the barrier, and narrow the width of the barrier. When the width of the barrier on the surface of the cold cathode is compressed by the electric field to be comparable to the wavelength of electrons, a large number of electrons escape through the surface barrier due to the tunneling effect of electrons. The principle of lateral field emission is to use the conduction current of discontinuous film or nano-slit to form electron emission and be drawn out by vertical electric field, also known as surface conduction cathode. The principle of internal field emission is to use the internal strong field to make electrons enter the dielectric layer from the substrate, and accelerate in the dielectric layer to obtain enough energy to escape the dielectric layer. Since the built-in electric field of the internal field emission cathode is not affected by the external atmosphere, the internal field emission is not sensitive to surface morphology and gas adsorption. At present, the internal field emission cathode can be divided into three types from the structure and principle: one is the metal-insulator-metal (Metal-Insulator-Metal, MIM) type, and the other is the metal-porous silicon-metal (MPM) type. ) Metal-Porous Silicon-Metal (MPM) type, and the third type is Metal-Insulator-Semiconductor-Metal (Metal-Insulator-Semiconductor-Metal, MISM) type. the

电子在穿越MIM型阴极的绝缘层时,由于散射作用电子会损失大部分动能,导致大部分电子不能从顶金属电极发射出,因而MIM型阴极的发射效率不高。MPM型是1995年日本的Nobuyoshi Koshida等人提出的(Jpn. J. Appl. Phys. Vol. 34,1995,pp. L705-L707)。多孔硅中有大量纳米硅晶粒,电子在其中穿越时,由于量子隧穿效应,损失的能量比较少。相比MIM型,这种MPM型阴极,栅极工作电压可降低到20 V以内,其阴极电子发射效率目前超过了10%,但是发射效率稳定性不佳。日本最近报道的一种MPM型阴极,栅极电压为16 V,工作5小时后发射效率从2.1%下降到1.6%,下降幅度为23%。 When electrons pass through the insulating layer of the MIM cathode, the electrons will lose most of their kinetic energy due to scattering, resulting in most of the electrons not being emitted from the top metal electrode, so the emission efficiency of the MIM cathode is not high. The MPM type was proposed by Nobuyoshi Koshida et al. in Japan in 1995 (Jpn. J. Appl. Phys. Vol. 34,1995, pp. L705-L707). There are a large number of nano-silicon grains in porous silicon, and when electrons pass through it, due to the quantum tunneling effect, the energy loss is relatively small. Compared with the MIM type, the gate operating voltage of this MPM type cathode can be reduced to less than 20 V, and its cathode electron emission efficiency currently exceeds 10%, but the emission efficiency is not stable. A kind of MPM type cathode recently reported in Japan, the gate voltage is 16 V, and the emission efficiency drops from 2.1% to 1.6% after working for 5 hours, and the drop rate is 23%.

MISM型阴极用交流电驱动,其工作原理如下:在交流驱动电压的负半周,下电极电位为正,电子从上电极注入到半导体层和绝缘体层的界面上,以界面态电子的形式存在界面上。当电压反向时,界面上的电子重新回到半导体层中,并在其中得到加速,然后进入上电极,部分能量大的电子可以克服上电极的表面势垒发射到真空中。这种阴极的优点是电子发射稳定性好,缺点是发射效率不高。国内专利(申请号01140447.7,授权公告号CN 1142572C)对这一结构中的半导体层(此专利中称为电子传输层)进行了改进,采用了从高电子亲和势的组分渐变到低电子亲和势的组分的薄膜作半导体层,发射效率超过0.5%,但发射效率仍不能满足实际应用的需求(如场发射平板显示器),其性能仍需要进一步改进。 The MISM type cathode is driven by alternating current, and its working principle is as follows: in the negative half cycle of the alternating current driving voltage, the potential of the lower electrode is positive, and electrons are injected from the upper electrode to the interface between the semiconductor layer and the insulator layer, and exist on the interface in the form of interface state electrons. . When the voltage is reversed, the electrons on the interface return to the semiconductor layer, where they are accelerated, and then enter the upper electrode, and some electrons with high energy can overcome the surface barrier of the upper electrode and emit into the vacuum. The advantage of this kind of cathode is that the stability of electron emission is good, but the disadvantage is that the emission efficiency is not high. The domestic patent (application number 01140447.7, authorized announcement number CN 1142572C) has improved the semiconductor layer in this structure (referred to as the electron transport layer in this patent), using a gradual change from a high electron affinity component to a low electron The thin film of the component of the affinity is used as a semiconductor layer, and the emission efficiency exceeds 0.5%, but the emission efficiency still cannot meet the needs of practical applications (such as field emission flat panel displays), and its performance still needs further improvement.

发明内容 Contents of the invention

本发明要解决的一个技术问题是现有的MISM型内场发射型阴极发射效率不高,发射电流密度低的缺点。 A technical problem to be solved by the invention is the disadvantages of low emission efficiency and low emission current density of the existing MISM type internal field emission type cathode.

为解决上述问题,本发明用多孔硅替换MISM型阴极中的普通半导体层形成一种MIPM型(Metal-Insulator-Semiconductor-Metal,金属-绝缘层-多孔硅-金属)的内场发射阴极,从下到上包括紧密结合的四个功能薄膜层:底电极层1、绝缘层2、电子储存传输层3和顶电极层4,其特征在于,所述的底电极层材料为金属或合金,厚度≧10 nm,所述的顶电极层材料为低电子亲和势能的金属、合金、掺杂的类金刚石或半导体,厚度为5 nm~500 nm,所述的绝缘层材料为金属氧化物、第四族元素氧化物、陶瓷或云母,厚度为100 nm~1 μm,所述的电子储存传输层材料为n型多孔硅,厚度为10 μm~500 μm。 In order to solve the above problems, the present invention replaces the common semiconductor layer in the MISM type cathode with porous silicon to form a MIPM type (Metal-Insulator-Semiconductor-Metal, metal-insulator-porous silicon-metal) internal field emission cathode, from From bottom to top, it includes four functional thin film layers that are closely combined: bottom electrode layer 1, insulating layer 2, electron storage and transport layer 3 and top electrode layer 4. It is characterized in that the material of the bottom electrode layer is metal or alloy, and the thickness ≧10 nm, the material of the top electrode layer is metal, alloy, doped diamond-like carbon or semiconductor with low electron affinity potential energy, the thickness is 5 nm~500 nm, the material of the insulating layer is metal oxide, the second Group IV element oxides, ceramics or mica, with a thickness of 100 nm to 1 μm, and the electron storage and transport layer material is n-type porous silicon, with a thickness of 10 μm to 500 μm.

所述的MIPM型内场发射阴极,其特征在于,所述的n型多孔硅的平均电导率为0.005 Ω×cm~3 Ω×cm, 平均孔隙率为5%~80%,平均孔径为1 nm~100 μm。 Described MIPM type internal field emission cathode is characterized in that, the average conductivity of described n-type porous silicon is 0.005 Ω × cm ~ 3 Ω × cm, the average porosity is 5% ~ 80%, and the average pore size is 1 nm~100μm.

当阴极受交流驱动工作在负半周,即下电极电位为正时,对传统的MISM型内场发射阴极而言,电子从上电极注入到半导体层和绝缘体层的界面上,以界面态电子的形式存在界面上;对本发明提供的MIPM型内场发射阴极而言,电子不仅可以存储在半导体层和绝缘体层的界面上而且可以存储在多孔硅层中,从而保证了效率和发射电流的密度。这是因为多孔硅中大量存在的纳米晶的晶界可以捕获大量电子,当工作在交流的负偏压时多孔硅可被“充电”。当工作电压反向时电子被内场驱动即可形成大电流发射。这种工作模式既保证了内场发射阴极的发射效率,也保证了工作的稳定性。这种内场发射阴极不仅能液体、大气或真空中工作,而且能在高温、高辐射等极端条件下工作。 When the cathode is driven by AC and works in the negative half cycle, that is, when the potential of the lower electrode is positive, for the traditional MISM type internal field emission cathode, electrons are injected from the upper electrode to the interface between the semiconductor layer and the insulator layer, and the electrons in the interface state The form exists on the interface; for the MIPM type internal field emission cathode provided by the present invention, electrons can be stored not only on the interface between the semiconductor layer and the insulator layer but also in the porous silicon layer, thereby ensuring the efficiency and the density of the emission current. This is because the grain boundaries of nanocrystals that exist in large quantities in porous silicon can trap a large number of electrons, and porous silicon can be "charged" when working under an AC negative bias. When the working voltage is reversed, the electrons are driven by the internal field to form a large current emission. This working mode not only ensures the emission efficiency of the internal field emission cathode, but also ensures the stability of the work. This internal field emission cathode can not only work in liquid, atmosphere or vacuum, but also work in extreme conditions such as high temperature and high radiation.

附图说明 Description of drawings

图1  MIPM型内场发射阴极的结构示意图。 Figure 1 Schematic diagram of the structure of the MIPM type internal field emission cathode.

具体实施方式 Detailed ways

下面将结合附图对本发明作进一步说明。 The present invention will be further described below in conjunction with accompanying drawing.

实施例1 Example 1

参阅图1,该底电极1的材料为金,厚度为500 nm;该绝缘层2的材料为SiO2,厚度为100 nm;该电子储存传输层3材料为多孔硅,厚度为40 μm,其平均电导率为0.01 Ω,平均孔隙率为50%、平均孔径为30 nm;该顶电极4材料为金,厚度为15 nm。在10-5 torr气压下,测得发射效率为1.5%,连续工作20小时后束流衰减1%。 Referring to Fig. 1, the material of the bottom electrode 1 is gold with a thickness of 500 nm; the material of the insulating layer 2 is SiO 2 with a thickness of 100 nm; the material of the electron storage and transport layer 3 is porous silicon with a thickness of 40 μm. The average conductivity is 0.01 Ω, the average porosity is 50%, and the average pore diameter is 30 nm; the material of the top electrode 4 is gold, and the thickness is 15 nm. Under the pressure of 10 -5 torr, the measured emission efficiency is 1.5%, and the beam decays by 1% after 20 hours of continuous operation.

实施例2 Example 2

参阅图1,该底电极的材料1为铬,厚度为200 nm;该绝缘层2的材料为HfO2,厚度为300 nm;该电子储存传输层3材料为多孔硅,厚度为40 μm,其平均电导率为0.01 Ω,平均孔隙率为50%、平均孔径为50 nm;该顶电极4材料为Ag,厚度为10 nm。在10-5 torr气压下,测得发射效率为1.5%,连续工作20小时后束流衰减1%。 Referring to Fig. 1, the material 1 of the bottom electrode is chromium with a thickness of 200 nm; the material of the insulating layer 2 is HfO 2 with a thickness of 300 nm; the material of the electron storage and transport layer 3 is porous silicon with a thickness of 40 μm. The average conductivity is 0.01 Ω, the average porosity is 50%, and the average pore diameter is 50 nm; the material of the top electrode 4 is Ag, and the thickness is 10 nm. Under the pressure of 10 -5 torr, the measured emission efficiency is 1.5%, and the beam decays by 1% after 20 hours of continuous operation.

实施例3 Example 3

参阅图1,该底电极1的材料为Ag,厚度为200 nm;该绝缘层2的材料为Ta2O5,厚度为400 nm;该电子储存传输层3材料为多孔硅,厚度为30 μm,其平均电导率为0.01 Ω,平均孔隙率为50%、平均孔径为30 nm;该顶电极4材料为ZrN,厚度为8 nm。在10-5 torr气压下,测得发射效率为1.3%,连续工作20小时后束流衰减1%。 Referring to Fig. 1, the material of the bottom electrode 1 is Ag with a thickness of 200 nm; the material of the insulating layer 2 is Ta 2 O 5 with a thickness of 400 nm; the material of the electron storage and transport layer 3 is porous silicon with a thickness of 30 μm , with an average conductivity of 0.01 Ω, an average porosity of 50%, and an average pore diameter of 30 nm; the top electrode 4 is made of ZrN with a thickness of 8 nm. Under the pressure of 10 -5 torr, the measured emission efficiency is 1.3%, and the beam decays by 1% after 20 hours of continuous operation.

Claims (2)

1.一种MIPM型内场发射阴极,其包括依次连接的四个功能薄膜层:底电极层、绝缘层、电子储存传输层和顶电极层,其特征在于,所述的底电极层材料为金属或合金,厚度≧10 nm,所述的顶电极层材料为低电子亲和势能的金属或半导体,所述的低电子亲和势能的金属或半导体为Au、Ag或ZrN,厚度为5 nm~500 nm,所述的绝缘层材料为金属氧化物、第四族元素氧化物、陶瓷或云母,厚度为100 nm~1 μm,所述的电子储存传输层材料为n型多孔硅,厚度为10 μm~0.5 mm。 1. a kind of MIPM type internal field emission negative electrode, it comprises four functional film layers connected successively: bottom electrode layer, insulating layer, electron storage transport layer and top electrode layer, it is characterized in that, described bottom electrode layer material is Metal or alloy, thickness ≧ 10 nm, the material of the top electrode layer is a metal or semiconductor with low electron affinity potential energy, the metal or semiconductor with low electron affinity potential energy is Au, Ag or ZrN, and the thickness is 5 nm ~500 nm, the material of the insulating layer is metal oxide, group IV element oxide, ceramic or mica, with a thickness of 100 nm~1 μm, and the material of the electron storage and transport layer is n-type porous silicon, with a thickness of 10μm~0.5mm. 2.如权利要求1所述的MIPM型内场发射阴极,其特征在于,所述的n型多孔硅的平均电导率为0.005 Ω×cm~3 Ω×cm, 平均孔隙率为5%~80%,平均孔径为1 nm~100 μm。 2. MIPM type internal field emission cathode as claimed in claim 1, is characterized in that, the average conductivity of described n-type porous silicon is 0.005 Ω * cm ~ 3 Ω * cm, and average porosity is 5% ~ 80 %, the average pore size is 1 nm~100 μm.
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