CN102373407A - Coating processing method - Google Patents

Abstract

The invention discloses a coating processing method. The method comprises the following steps of: providing a workpiece, wherein the workpiece is provided with a first surface on which patterns are to be processed; depositing a coating on the first surface by adopting a physical vapor deposition method; providing a mask, wherein the shape of the mask is as same as that of the patterns to be formed, and the mask magnetically attracts the workpiece; adsorbing the mask to the first surface to shield a predetermined area of the coated first surface; removing the coating beyond the predetermined area of the first surface by using magnetic grinding; and removing the mask to obtain the patterns on the first surface of the workpiece.

Description

Coating processing method

technical field

The invention relates to a coating processing method, in particular to a method for forming a predetermined pattern on the surface after film deposition.

Background technique

In the traditional coating technology field, the method of processing the workpiece surface to form a pattern is usually to cover the predetermined pattern area and directly coat the predetermined pattern area. However, since the mask covering the non-patterned area has a certain thickness, after coating the patterned area, the thickness of the mask causes some reactive particles to adhere, resulting in unclear edges of the pattern and uneven thickness of the entire pattern. Unclear edges appear as fuzzy edges under a high-power microscope, that is, the pattern accuracy is too low, especially when the surface to be plated has a complex shape, it is more difficult to form a high-precision pattern. The uneven thickness of the pattern will cause poor physical properties of the pattern, such as deterioration of hardness and wear resistance.

Contents of the invention

In view of this, it is necessary to provide a high-precision coating processing method.

A coating processing method, which includes the following steps: providing a workpiece, the workpiece has a first surface to be processed to form a pattern; using a physical vapor deposition method to deposit a film layer on the first surface; providing a mask, the mask The shape of the mask is the same as the shape of the pattern to be formed, and the mask and the workpiece can be magnetically attracted; the mask is adsorbed to the first surface and covers a predetermined area of the first surface that has been coated; it is removed by magnetic grinding The film layer outside the predetermined area of the first surface; removing the mask to obtain the pattern on the first surface of the workpiece.

Compared with the prior art, the coating processing method adopted in the present invention uses a mask to cover the pattern area on the basis of physical vapor deposition coating, and performs magnetic grinding on the non-pattern area, thereby avoiding the occurrence of direct coating on the pattern area. The edge of the pattern is not clear and the defects of vignetting are generated. Moreover, since the magnetic grinding can be used to precisely grind the area outside the edge of the pattern, the definition of the edge of the pattern can be further improved. Since the thin film is first deposited on the surface where the pattern is located, the uniformity of the thickness of the film layer can be guaranteed to the greatest extent, so that the physical properties of the pattern are better.

Description of drawings

FIG. 1 is a schematic perspective view of a coated workpiece provided by an embodiment of the present invention.

FIG. 2 is a schematic perspective view of a coated workpiece with a mask adsorbed thereon according to an embodiment of the present invention.

Fig. 3 is a schematic perspective view of the workpiece showing the pattern after the film layer in the non-pattern area has been ground and removed.

Description of main component symbols

Workpiece 10

First Surface 101

Film layer 20

Mask 30

pattern 40

Detailed ways

The present invention will be described in further detail below in conjunction with the accompanying drawings.

Referring to Fig. 1, the coating processing method provided by the embodiment of the present invention at least includes the following steps:

First, a workpiece 10 is provided, and the workpiece 10 has a first surface 101 . The workpiece 10 is made of metals or alloys that can be attracted by magnetic substances, specifically, the workpiece 10 can be made of metals, such as iron and nickel; or made of alloys containing metals, such as stainless steel.

Secondly, a film layer 20 is deposited on the first surface 101 by physical vapor deposition (Physical Vapor Deposition, PVD). The physical vapor deposition method is a process technology that deposits thin films by physical mechanisms without involving chemical reactions, and has low pollution. Physical vapor deposition methods generally include vacuum evaporation, sputtering evaporation and ion evaporation. In this embodiment, a single cavity is used for the reactive magnetron sputtering coating method, and other methods may also be used.

In this embodiment, the film layer 20 is a metal single-layer film, which has a high metal texture and vivid and full colors. In other embodiments, the film layer may comprise a multilayer film.

Please refer to FIG. 2 together. Then, a mask 30 is provided, the shape of the mask 30 is the same as that of the pattern to be formed, and the mask 30 is just in the shape of the pattern for the masked area of the first surface 101 . The mask is magnetically attracted to the workpiece. For example, the mask 30 has strong magnetism, and the workpiece 10 is made of metal or alloy that can be attracted by magnetic substances. The mask 30 is adsorbed on the first surface 101 and covers a predetermined area of the first surface that has been coated. Since the mask 30 and the workpiece 10 are magnetically attracted, the mask can be quickly and easily adsorbed and fixed on the first surface 101 without moving in the subsequent process, thereby ensuring the accuracy of the pattern to the greatest extent. The pattern can be various marks such as characters, graphics, numbers, letters, etc. In this embodiment, the pattern is a circle.

Then, magnetic grinding is performed on the first surface 101 coated with the film layer 20 to remove the film layer 20 outside the predetermined area.

Magnetic grinding is a grinding process using a magnetic field, which mainly includes magnetic floating grinding and magnetic grinding using magnetic abrasives. The present invention adopts the latter. Specifically, the workpiece 10 is first put into a magnetic field formed by two magnetic poles, and magnetic abrasives are placed in the gap between the workpiece 10 and the magnetic poles. Under the action of the magnetic field force, the abrasives are arranged neatly along the direction of the magnetic force lines to form a soft and rigid "magnetic abrasive brush". When the workpiece 10 rotates in the magnetic field and vibrates axially, the workpiece 10 and the magnetic abrasive will move relative to each other so as to realize the grinding process of the film layer 20 . Magnetic grinding can control the grinding pressure by changing the strength of the magnetic field. Since there is a processing gap (1-4mm) between the magnetic pole and the surface of the workpiece, it can be used for flexible grinding with magnetic abrasives, especially suitable for grinding special-shaped surfaces and free-form surfaces.

Please refer to FIG. 3 together. Then, the mask 30 is removed to reveal the pattern 40 formed on the first surface 101 . The thickness of the pattern 40 can be controlled within 2 micrometers. In FIG. 3 , the thickness of the pattern 40 is increased to clearly show the thickness difference between the pattern 40 and other regions.

After magnetic grinding, before removing the mask 30, the first surface 101 may be polished. The polishing wheel can be used as a tool for polishing. The polishing wheel is made of even and fine degreased wood or special fine felt. Its movement track is a uniform and dense network. The surface roughness after polishing is very low. When magnified 40 times No surface defects were observed under a microscope. In addition, electrolytic polishing can also be used.

After the mask 30 is removed, the edge of the pattern 40 can also be modified.

The coating processing method provided in this embodiment uses a mask to cover the patterned area on the basis of the physical vapor deposition coating, and performs magnetic grinding on the non-patterned area, so as to avoid the unclear edge of the pattern that occurs when the patterned area is directly coated. 1. The defects of vignetting, and because the magnetic grinding can accurately grind the area outside the edge of the pattern, so as to further improve the definition of the edge of the pattern. Since the thin film is first deposited on the surface where the pattern is located, the uniformity of the thickness of the film layer can be guaranteed to the greatest extent, so that the physical properties of the pattern are better.

It can be understood that, to satisfy the requirement that the mask 30 and the workpiece 10 can magnetically attract each other, it is not necessarily required that the mask 30 or the workpiece 10 itself has strong magnetism. After being magnetized under action, they can magnetically attract each other, and the magnetism of the workpiece 10 or the mask 30 does not need to be retained after the external magnetic field is cancelled.

It can be understood that those skilled in the art can also make other changes within the spirit of the present invention, which should be included within the scope of the present invention.

Claims (8)

1. A coating processing method, comprising the following steps: providing a workpiece having a first surface to be patterned; Depositing a film layer on the first surface by physical vapor deposition; providing a mask, the shape of the mask is the same as the shape of the pattern to be formed, and the mask and the workpiece can be magnetically attracted; Adsorbing the mask on the first surface and shielding a predetermined area of the coated first surface; removing the film layer outside the predetermined area of the first surface by magnetic grinding; The mask is removed to obtain the pattern on the first surface of the workpiece. 2. The coating processing method according to claim 1, characterized in that: after the first surface is magnetically ground, before removing the mask, the first surface is polished. 3. The coating processing method according to claim 1, characterized in that: after the mask is removed, the edge of the pattern is modified. 4. The coating processing method according to claim 1, characterized in that: the workpiece is made of metal or alloy that can be attracted by magnetic substances, and the mask is made of magnetic materials. 5. The coating processing method according to claim 4, characterized in that: the workpiece is made of stainless steel. 6. The coating processing method according to claim 1, wherein the film layer is a metal film layer. 7. The coating processing method according to claim 1, characterized in that: the film layer is a single-layer film. 8. The coating processing method according to claim 1, wherein the film layer comprises a multi-layer film.

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