CN102385426A - Flow guiding device - Google Patents
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Abstract
Description
技术领域 technical field
本发明涉及一种伺服器散热结构,尤其是一种能解决伺服器中风扇失效问题的导流装置。The invention relates to a heat dissipation structure of a server, in particular to a flow guiding device capable of solving the failure problem of a fan in the server.
背景技术 Background technique
图1为公知的伺服器散热结构。该伺服器100中包括多个电子元件,例如中央处理器等,皆为散发热量的热源110。为了控制该伺服器的温度,伺服器通常具有一排风扇阵列120,而其中的多个风扇121、122及123可用来产生吹往该等热源的气流,借以适当地排除该热源所散发的热量。FIG. 1 is a known heat dissipation structure of a server. The
为说明伺服器的风扇阵列中风扇失效所导致的散热问题,请参照图1及图2,其中图1绘示当伺服器散热结构正常运作时的气流状态,而图2则绘示风扇阵列120当中一风扇122失效时气流的变化。伺服器通常具有半封闭的机壳,而风扇阵列的进风侧常因其他物件(例如密集排放的硬碟130)而形成高流阻(flow resistance)。当风扇阵列120中的风扇122失效时,正常运作的风扇121及123与高流阻物件所形成的气压分布,会迫使风扇121及123送出的气流不断地往失效的风扇122回流,如图所示。其中,上述往复回流的气流将会使热源110所产生的热量无法排除而蓄积于伺服器110之中。To illustrate the heat dissipation problem caused by the failure of the fan in the fan array of the server, please refer to FIG. 1 and FIG. 2, wherein FIG. 1 shows the airflow state when the server cooling structure is in normal operation, and FIG. 2 shows the
在实际运作上,风扇阵列中的各个风扇皆可能会因为各种因素而失效并停止运转,导致伺服器在散热上出现问题,进而妨碍伺服器正常运作。某些机房中的伺服器被要求必须永不间断地运作,一旦此类伺服器因风扇失效而瘫痪,往往会导致严重的后果。In actual operation, each fan in the fan array may fail and stop running due to various factors, resulting in problems in heat dissipation of the server, thereby hindering the normal operation of the server. The servers in some computer rooms are required to operate continuously. Once such servers are paralyzed due to fan failure, it will often lead to serious consequences.
公知技术中采用两种风扇冗余(fan redundant)手段克服前述问题。其一为「双阵列(double fan array)」设计,意即在原风扇阵列外增设备用的第二排风扇阵列。其二为「双马达(double motor)」设计,意即在风扇阵列的各个风扇中增设备用的第二马达。虽然两种作法皆可解决前述风扇突然失效的问题,但皆会大量增加伺服器占用的空间以及制造成本。In the known technology, two kinds of fan redundant means are adopted to overcome the foregoing problems. One is the "double fan array" design, which means adding a second row of fan arrays for equipment outside the original fan array. The second is the "double motor" design, which means adding a second motor for equipment to each fan in the fan array. Although both methods can solve the aforementioned problem of sudden failure of the fan, both will greatly increase the space occupied by the server and the manufacturing cost.
因此,需要一种能够有效解决伺服器中风扇失效问题,并同时节省伺服器空间及制造成本的新设计。Therefore, there is a need for a new design that can effectively solve the problem of fan failure in the server and save the space and manufacturing cost of the server.
发明内容 Contents of the invention
本发明的目的是在于提供一种导流装置,以解决伺服器中风扇失效的问题,节省伺服器空间及制造成本。The purpose of the present invention is to provide a flow guiding device to solve the problem of failure of the fan in the server and save the space and manufacturing cost of the server.
为此,本发明提供一种导流装置,配置于伺服器的风扇阵列上,其中该风扇阵列具有平行排列的至少两风扇,而该风扇阵列用以产生气流而为该伺服器中至少一热源散热,该导流装置包括:一枢轴,配置于该两风扇之间;以及一导流体,连接至该枢轴,并受该风扇阵列所产生的气流驱使而以该枢轴为轴心摆动,用以当该风扇阵列中一风扇失效时摆向该失效的风扇,以抑制该风扇阵列所产生的气流回流至该失效的风扇。For this reason, the present invention provides a kind of air guiding device, is arranged on the fan array of server, and wherein this fan array has at least two fans that are arranged in parallel, and this fan array is used for generating air flow as at least one heat source in this server For heat dissipation, the air guide device includes: a pivot, arranged between the two fans; and a deflector, connected to the pivot, and driven by the airflow generated by the fan array to swing around the pivot is used for swinging towards the failed fan when a fan in the fan array fails, so as to prevent the airflow generated by the fan array from flowing back to the failed fan.
本发明提出的导流装置,在该风扇阵列中一风扇失效时,导流体能充分利用回流的气流所产生的驱动力,摆向该失效的风扇,抑制该风扇阵列所产生的气流回流至该失效的风扇,轻易解决了前述散热问题,进而保证了伺服器能够正常运转,并且节省了伺服器空间及制造成本。In the air guiding device proposed by the present invention, when a fan in the fan array fails, the guiding body can make full use of the driving force generated by the returning air flow to swing towards the failed fan, preventing the air flow generated by the fan array from flowing back to the fan array. The failed fan easily solves the aforementioned heat dissipation problem, thereby ensuring the normal operation of the server, and saving the space and manufacturing cost of the server.
附图说明 Description of drawings
以下附图仅旨在于对本发明做示意性说明和解释,并不限定本发明的范围。其中:The following drawings are only intended to illustrate and explain the present invention schematically, and do not limit the scope of the present invention. in:
图1为公知的伺服器散热结构。FIG. 1 is a known heat dissipation structure of a server.
图2为风扇阵列当中一风扇失效时气流的变化示意图。FIG. 2 is a schematic diagram of changes in air flow when a fan in the fan array fails.
图3A为本发明一实施例的导流装置示意图。FIG. 3A is a schematic diagram of a flow guide device according to an embodiment of the present invention.
图3B为上述风扇阵列中一风扇失效时的气流示意图。FIG. 3B is a schematic diagram of the air flow when a fan in the above fan array fails.
图4A为本发明另一实施例的导流装置示意图。FIG. 4A is a schematic diagram of a flow guide device according to another embodiment of the present invention.
图4B为上述风扇阵列中一风扇失效时的气流示意图。FIG. 4B is a schematic diagram of air flow when a fan in the fan array fails.
主要元件标号说明:Explanation of main component labels:
100 伺服器100 servers
110 热源110 heat source
120 风扇阵列120 fan array
121、122、123 风扇121, 122, 123 fans
300 伺服器300 servers
310 热源310 heat source
320 风扇阵列320 fan array
321、322、323 风扇321, 322, 323 fans
400 伺服器400 server
410 热源410 heat source
420 风扇阵列420 fan array
421、422、423 风扇421, 422, 423 fans
441、442 外侧面441, 442 Outer side
具体实施方式 Detailed ways
为了对本发明的技术特征、目的和效果有更加清楚的理解,现对照附图说明本发明的具体实施方式。各实施例用以说明本发明的原理,但非用以限制本发明。本发明的范围当以权利要求为准。In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described with reference to the accompanying drawings. Each embodiment is used to illustrate the principles of the present invention, but not to limit the present invention. The scope of the present invention should be determined by the claims.
图3A为本发明一实施例的导流装置示意图。类同图1、2所示,本发明的导流装置配置于一伺服器300的一风扇阵列320上,其中风扇阵列320可具有多个平行排列的风扇321~323。必须注意的是,此处风扇的数量仅为例示,本发明不必以此为限,熟悉本领域的技术人员可了解到本发明仅需具有至少两风扇即可实施。其中,该风扇阵列320用以产生气流而为该伺服器中至少一热源310散热。为了方便说明,在下述实施例中,风扇阵列320靠近热源的方向为出风侧,而另一侧则为进风侧。FIG. 3A is a schematic diagram of a flow guide device according to an embodiment of the present invention. Similar to FIGS. 1 and 2 , the air guiding device of the present invention is disposed on a
与公知技术不同的是,本发明不采用「双阵列」或「双马达」的设计,而是采用更为简单有效的导流装置。本发明的导流装置包括一枢轴330及一导流体340。其中该枢轴330配置于两风扇之间,例如图中的风扇321与322之间、以及风扇322与323之间。在较佳的实施例中,该枢轴330应靠近该风扇阵列320的出风侧。该导流体340连接至该枢轴330,并且为一质轻物体,因此可受该风扇阵列320所产生的气流驱使而以该枢轴330为轴心摆动。图3A为伺服器及导流装置的俯视图,由于风扇本身具有一定高度,因此,虽然该图中导流体340显示为长条形,但该导流体340实际上为片状物体,并以其上的一边缘连接至该枢轴330。Different from the known technology, the present invention does not adopt the design of "dual arrays" or "dual motors", but uses a simpler and more effective guide device. The flow guiding device of the present invention includes a
图3A表示上述风扇阵列320正常运作时的情形,在此实施例中,风扇阵列320将风吹向热源310,而本发明的导流体340则因气流作用而自然地摆向与气流方向平行的位置,而将风扇阵列320产生的气流导引至风扇阵列320前方的热源310。Figure 3A shows the situation when the above-mentioned
图3B为上述风扇阵列320中一风扇322失效时的气流示意图,用以说明本发明的导流体340在风扇失效下所呈现的另一种状态。详细地说,当该风扇阵列320中一风扇322失效时,未失效的风扇321及323会使伺服器300中产生送往失效风扇322的回流气流,如图2所示,而在该回流气流形成之际,其气流驱动力即可使本发明的导流体340摆向该失效的风扇322,进而达到抑制该风扇阵列320所产生的气流回流至该失效风扇322的效果。图3B所示为本发明的较佳实施例,其中片状的导流体340的长度设计成略大于风扇322的宽度,使得两导流体340无论是中央风扇322或左右边风扇321、323失效时,皆能将失效的风扇完全遮蔽。然而,实际上,伺服器300的空间常不容许导流体340有过长的尺寸,因而必须牵就空间限制而设计出无法完全遮蔽风扇的导流体。即便如此,长度有限的导流体340仍可破坏回流气流的形成,达到抑制风扇阵列产生的气流回流至失效风扇的效果,因此,本发明不必对导流体340的长度设限,熟悉本领域的技术人员可依据本发明的精神进行最佳化设计。FIG. 3B is a schematic diagram of airflow when a
图4A为本发明另一实施例的导流装置示意图。如同前述实施例,风扇阵列420作为伺服器400中的热源410散热之用,而本发明的导流装置亦配置风扇阵列420之上,同样具有一枢轴430及一导流体440,然而,此实施例的导流体440具有异于前述实施例的形状。图4A为伺服器及导流装置的俯视图,而图中导流体440呈Y形,具有由枢轴430向外延伸的两片状物体。其中该导流体440的两片状物体之间具有一角度大于零的夹角,如图中所示。FIG. 4A is a schematic diagram of a flow guide device according to another embodiment of the present invention. As in the foregoing embodiments, the
略同前述图3A的实施例,在此实施例中,风扇阵列420将风吹向热源410,而本发明的导流体440则因气流作用而自然地摆向与气流大致相同的方向,而将风扇阵列420产生的气流导引至热源410。图4B为上述风扇阵列420中一风扇422失效时的气流示意图,用以说明本发明的导流体440在风扇失效下所呈现的另一种状态。略同前述图3B的实施例,当风扇422失效时,该导流体440两片状物体的外侧面441及442中的一面(此例中为外侧面441),可在当该风扇阵列420中一风扇失效时摆向该失效的风扇422,以抑制该风扇阵列420所产生的气流回流至该失效的风扇422。Similar to the aforementioned embodiment of FIG. 3A , in this embodiment, the
相较于前述图3A的实施例,此实施例中的导流体440的双片设计使得外侧面441及442的另一面(此例中为外侧面442)具有其他功能:该外侧面422可在该风扇阵列420中的该风扇422失效时,将未失效的风扇421、423产生的气流导引至原先位于失效风扇422正前方的热源。同前述实施例的理由,本发明不须限制该导流体440的两片状物体的长度,因为长度有限的导流体仍可破坏回流气流的形成,达到抑制风扇阵列产生的气流回流至失效风扇的效果。此外,本发明亦不须限制此实施例中导流体440的双片构造间夹角的角度大小。熟悉本领域的技术人员可依据伺服器中热源及风扇的尺寸与相对位置,对导流体440的长度及夹角进行最佳化设计。值得注意的是,在理想的实施例中,上述的两个外侧面441、442为流线形的曲面,并且,为了使导流体440更容易于受气流驱动,故采用双片状的设计以减轻导流体440的质量。然而,在其他实施例中,本发明不须限制其形状(举例而言,导流体440的甚至可以是三角柱体、多边形柱体及圆柱体),只要该导流体440具有两个呈适当角度配合的外侧面,并具有可被风扇风力吹动的质量,即可达到本发明的功效。Compared with the aforementioned embodiment of FIG. 3A , the double-piece design of the
以上所述仅为本发明示意性的具体实施方式,并非用以限定本发明的范围。任何本领域的技术人员,在不脱离本发明的构思和原则的前提下所作的等同变化与修改,均应属于本发明保护的范围。The above descriptions are only illustrative specific implementations of the present invention, and are not intended to limit the scope of the present invention. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principle of the present invention shall fall within the protection scope of the present invention.
Claims (10)
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| CN2010102684820A CN102385426A (en) | 2010-08-30 | 2010-08-30 | Flow guiding device |
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| CN2010102684820A CN102385426A (en) | 2010-08-30 | 2010-08-30 | Flow guiding device |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW415603U (en) * | 1998-11-30 | 2000-12-11 | Lite On Enclosure Inc | Ventilation structure of the heat dissipating electric fan |
| CN201416573Y (en) * | 2009-03-24 | 2010-03-03 | 营邦企业股份有限公司 | Return air closing device of fan heat dissipation mechanism |
| US20100089549A1 (en) * | 2008-10-15 | 2010-04-15 | Micro-Star International Co., Ltd. | Exhaust device |
-
2010
- 2010-08-30 CN CN2010102684820A patent/CN102385426A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW415603U (en) * | 1998-11-30 | 2000-12-11 | Lite On Enclosure Inc | Ventilation structure of the heat dissipating electric fan |
| US20100089549A1 (en) * | 2008-10-15 | 2010-04-15 | Micro-Star International Co., Ltd. | Exhaust device |
| CN201416573Y (en) * | 2009-03-24 | 2010-03-03 | 营邦企业股份有限公司 | Return air closing device of fan heat dissipation mechanism |
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Application publication date: 20120321 |