CN102412359A - Light emitting diode device for miniature projection system - Google Patents
Light emitting diode device for miniature projection system Download PDFInfo
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- CN102412359A CN102412359A CN201010289811XA CN201010289811A CN102412359A CN 102412359 A CN102412359 A CN 102412359A CN 201010289811X A CN201010289811X A CN 201010289811XA CN 201010289811 A CN201010289811 A CN 201010289811A CN 102412359 A CN102412359 A CN 102412359A
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- emitting diode
- diode assembly
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- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000011521 glass Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- 238000013461 design Methods 0.000 description 19
- 230000000087 stabilizing effect Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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Abstract
The invention provides a light emitting diode device for a miniature projection system, comprising a bottom substrate, an anode part, at least one cathode part, at least one light emitting diode (LED) chip and a light-transmitting element, wherein the anode part and the at least cathode part are respectively arranged on the bottom substrate; the at least LED chip is arranged on the anode part and is electrically connected with the at least cathode part; and the light-transmitting element is arranged on the bottom substrate in a covering manner so as to define a cavity. Or the light emitting diode device can comprise a surrounding substrate which is provided with a surrounding part and a hollow part; and the light-transmitting element is directly arranged on the surrounding substrate instead of the bottom substrate in a covering manner so as to define the cavity by the hollow part.
Description
Technical field
The invention relates to a kind of light-emitting diode assembly, particularly about a kind of light-emitting diode assembly that can be applicable in the micro projection system, so as to making the more miniaturization of micro projection system bulk.
Background technology
Market is to the compact demand trend of electronic product now in order to adapt to, and traditional projector also begins towards microminiaturized development.The user demand of minitype projection machine (Pico Projector) is to be set to be convenient to carry; Not only process outside the minitype projection machine that to take; More be applied on the various existing electronic product; Be built in for example mobile phone, multimedia player, personal digital assistant (Personal Digital Assistant, PDA), notebook computer etc., so as to expanding the functional diversity of electronic product.
Simplify light weight demand and optic brightness performance based on structural; Minitype projection machine adopts ruddiness, green glow, the trichromatic light-emitting diode of blue light as light source more at present; (Digital Micromirro Device DMD) is carried out to picture directly three coloured light lines to be projected to digital micro-mirror device.So compare down with general projector; Minitype projection machine has been save colored filter (color filter) and has been waited other optical elements; Significantly reduce volume, reduce manufacturing cost, more bring into play advantages such as long service life, color expression range are big because of each item characteristic of light-emitting diode.
Yet apply at present receive the restriction of light-emitting diode assembly in the minitype projection machine of electronic product, it is excessive and heavy that volume is all disliked slightly, and electric load is also not enough to some extent.
In sum, develop a kind ofly on volume, being more suitable for being applied in minitype projection machine, and the light-emitting diode assembly with certain luminous efficiency, color representation and application of elastic is the target that this industry is needed effort badly.
Summary of the invention
A purpose of the present invention is to provide a kind of light-emitting diode assembly that is used for a micro projection system, and it has compact volume, and favorable luminance and color representation can be provided, and is convenient to be applied in the portable micro projection system.
For reaching above-mentioned purpose; The present invention proposes a kind of light-emitting diode assembly that is used for a micro projection system; Comprise a bottom substrate, an anode portion, at least one negative pole part, at least one light-emitting diode (light emittingdiode, LED) chip and a translucent element.Anode portion and at least one negative pole part all are arranged on the bottom substrate, and at least one led chip is arranged on the anode portion and with anode portion and at least one negative pole part and electrically connects, and translucent element is covered on the bottom substrate, to define a cavity.
For reaching above-mentioned purpose, the present invention proposes a kind of light-emitting diode assembly that is used for a micro projection system, comprises a bottom substrate, an anode portion, at least one negative pole part, at least one led chip, around a substrate and a translucent element.Anode portion and at least one negative pole part all are arranged on the bottom substrate; At least one led chip is arranged on the anode portion and with anode portion and at least one negative pole part and electrically connects; Have one around a portion and a hollow bulb around substrate; Translucent element is directly to be covered in around on the substrate, defines cavity with hollow bulb.
Description of drawings
For let above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, elaborate below in conjunction with the accompanying drawing specific embodiments of the invention, wherein:
Figure 1A is the light-emitting diode assembly top view of first embodiment of the invention;
Figure 1B is the light-emitting diode assembly stereogram of first embodiment of the invention;
Fig. 1 C is the light-emitting diode assembly profile of first embodiment of the invention;
Fig. 1 D is the top view of another enforcement aspect of light-emitting diode assembly of first embodiment of the invention;
Fig. 2 is the light-emitting diode assembly top view of second embodiment of the invention;
Fig. 3 A is the light-emitting diode assembly top view of third embodiment of the invention;
Fig. 3 B is the light-emitting diode assembly stereogram of third embodiment of the invention;
Fig. 3 C is the light-emitting diode assembly profile of third embodiment of the invention;
Fig. 3 D is the top view of another enforcement aspect of light-emitting diode assembly of third embodiment of the invention;
Fig. 4 A is the light-emitting diode assembly top view of fourth embodiment of the invention;
Fig. 4 B is the top view of another enforcement aspect of light-emitting diode assembly of fourth embodiment of the invention;
Fig. 5 is the light-emitting diode assembly top view of fifth embodiment of the invention;
Fig. 6 A is the light-emitting diode assembly top view of sixth embodiment of the invention;
Fig. 6 B is the light-emitting diode assembly stereogram of sixth embodiment of the invention;
Fig. 6 C is the light-emitting diode assembly profile of sixth embodiment of the invention;
Fig. 6 D is the top view of another enforcement aspect of light-emitting diode assembly of sixth embodiment of the invention;
Fig. 7 A is the light-emitting diode assembly top view of seventh embodiment of the invention;
Fig. 7 B is the top view of another enforcement aspect of light-emitting diode assembly of seventh embodiment of the invention;
Fig. 8 A is the light-emitting diode assembly top view of eighth embodiment of the invention;
Fig. 8 B is the light-emitting diode assembly stereogram of eighth embodiment of the invention;
Fig. 8 C is the light-emitting diode assembly profile of eighth embodiment of the invention;
Fig. 8 D is the top view of another enforcement aspect of light-emitting diode assembly of eighth embodiment of the invention;
Fig. 9 is the light-emitting diode assembly top view of nineth embodiment of the invention;
Figure 10 A is the profile that one of light-emitting diode assembly of the present invention is used aspect;
Figure 10 B is the profile of the Another Application aspect of light-emitting diode assembly of the present invention;
Figure 11 A is the profile of the another application aspect of light-emitting diode assembly of the present invention; And
Figure 11 B is the profile of an application aspect again of light-emitting diode assembly of the present invention.
[main element symbol description]
1: light-emitting diode assembly 1 ': light-emitting diode assembly
101: bottom substrate 103: anode portion
105: negative pole part 107: light-emitting diode chip for backlight unit
109: around substrate 109a: around portion
109b: hollow bulb 111: translucent element
113: Zener diode 2: light-emitting diode assembly
201: anode portion 203: negative pole part
3: light-emitting diode assembly 3 ': light-emitting diode assembly
301: bottom substrate 303: anode portion
305: negative pole part 307: light-emitting diode chip for backlight unit
309: around substrate 311: translucent element
313: Zener diode 4: light-emitting diode assembly
4 ': light-emitting diode assembly 403: anode portion
405: negative pole part 413: Zener diode
5: light-emitting diode assembly 6: light-emitting diode assembly
6 ': light-emitting diode assembly 601: bottom substrate
603: anode portion 605: negative pole part
607: light-emitting diode chip for backlight unit 609: around substrate
611: translucent element 613: Zener diode
7: light-emitting diode assembly 7 ': light-emitting diode assembly
703: anode portion 705: negative pole part
713; Zener diode 8; Light-emitting diode assembly
8 '; Light-emitting diode assembly 801; Bottom substrate
803; Anode portion 805; Negative pole part
807; Light-emitting diode chip for backlight unit 809; Around substrate
811; Translucent element 813; Zener diode
9; Light-emitting diode assembly 10a; Light-emitting diode assembly
10b; Light-emitting diode assembly 11a; Light-emitting diode assembly
11b; Light-emitting diode assembly
Embodiment
Below will explain light-emitting diode assembly of the present invention through embodiment, yet, be merely explaination the present invention about the explanation of embodiment, but not in order to restriction the present invention.In following examples and the accompanying drawing, omit and do not illustrate with the non-directly related element of the present invention; And in the accompanying drawing each size of component and relative position relation only in order to signal so that understand, non-in order to restriction actual ratio and size.
Shown in Figure 1A to Fig. 1 C; The first embodiment of the present invention is a kind of light-emitting diode (light emitting diode that is used for a micro projection system; LED) device 1, light-emitting diode assembly 1 comprise a bottom substrate 101, an anode portion 103, two negative pole parts 105, a light-emitting diode chip for backlight unit 107, around a substrate 109 and a translucent element 111.Because the light-emitting diode assembly 1 of present embodiment only has single light-emitting diode chip for backlight unit 107, so can claim the monocrystalline light-emitting diode assembly again.
As shown in the figure, anode portion 103 and two negative pole parts 105 all are arranged on the bottom substrate 101.Light-emitting diode chip for backlight unit 107 is arranged on the anode portion 103, and light-emitting diode chip for backlight unit 107 electrically connects with lead-in wire respectively with anode portion 103 and one of them negative pole part 105.Have one around a 109a of portion and a hollow bulb 109b around substrate 109, translucent element 111 be directly be covered in around substrate 109 around on the 109a of portion, 109b defines cavity with hollow bulb.
Because in the present embodiment, each light-emitting diode assembly 1 only comprises a light-emitting diode chip for backlight unit 107, for obtaining good projection light source quality, the light-emitting diode assembly 1 of several present embodiments capable of being combined during application.For example, can adopt the light-emitting diode assembly of three present embodiments in the micro projection system, and these light-emitting diode assemblies comprise the trichromatic light-emitting diode chip for backlight unit of ruddiness, green glow and blue light respectively.In addition, the quantity of light-emitting diode assembly also can be adjusted in response to demand.
Fig. 1 D is the top view of another enforcement aspect of light-emitting diode assembly of first embodiment of the invention.Consider when using and to have the too high problem of operating current, so in this enforcement aspect, light-emitting diode assembly 1 ' more comprises a Zener diode (Zener diode) 113, so as to making the circuit voltage stabilizing of light-emitting diode assembly 1 '.Zener diode 113 is to be arranged on the anode portion 103 of light-emitting diode assembly 1 ', and with lead-in wire and the electric connection wherein of two negative pole parts 105.In this enforcement aspect, be to carry out the voltage stabilizing of single light-emitting diode chip for backlight unit, but the present invention is not as limit with single Zener diode 113.In the light-emitting diode assembly 1 ' of this enforcement aspect, all the other elements all light-emitting diode assembly 1 with first embodiment are identical, so do not give unnecessary details in addition in this.
Fig. 2 is the light-emitting diode assembly top view of second embodiment of the invention; The light-emitting diode assembly 2 of present embodiment and the light-emitting diode assembly 1 of first embodiment are similar; Different place only is the quantity and the external form of electrode part; With present embodiment, light-emitting diode assembly 2 only comprises an anode portion 201 and a negative pole part 203.
Shown in Fig. 3 A to Fig. 3 C; The third embodiment of the present invention also is a kind of light-emitting diode assembly 3 that is used for a micro projection system; Light-emitting diode assembly 3 comprises a bottom substrate 301, an anode portion 303, two negative pole parts 305, two light-emitting diode chip for backlight unit 307, electrically connect with two light-emitting diode chip for backlight unit 307 respectively around substrate 309 and a translucent element 311, two negative pole parts 305.Because the light-emitting diode assembly 3 of present embodiment has two light-emitting diode chip for backlight unit 307, so can claim the twin crystal light-emitting diode assembly again.The element of present embodiment relation is also of first embodiment, so in this other tautology not.
In present embodiment, each light-emitting diode assembly 3 comprises two light-emitting diode chip for backlight unit 307, for obtaining good projection light source quality, the light-emitting diode assembly 3 of several present embodiments capable of being combined during application.For example, can adopt the light-emitting diode assembly of three present embodiments in the micro projection system, and these light-emitting diode assemblies comprise the light-emitting diode chip for backlight unit of ruddiness and green glow, green glow and blue light, blue light and ruddiness respectively.Know the LED chip that art technology person also can spread to other colors and close, for example, each light-emitting diode assembly can comprise the light-emitting diode chip for backlight unit of same color, for example is ruddiness, green glow and blue light respectively.In addition, the quantity of light-emitting diode assembly also can be adjusted in response to demand.
Fig. 3 D is the top view of another enforcement aspect of light-emitting diode assembly of third embodiment of the invention.Consider when using and to have the too high problem of operating current, so in this enforcement aspect, light-emitting diode assembly 3 ' more comprises two Zener diodes 313, so as to making the circuit voltage stabilizing of light-emitting diode assembly 3 '.Zener diode 313 all is arranged on the anode portion 303 of light-emitting diode assembly 3 ', and electrically connects with lead-in wire and adjacent negative pole part 305 respectively.In this enforcement aspect, be the voltage stabilizing that is respectively applied for two light-emitting diode chip for backlight unit with two Zener diodes 313; Said based on preamble, also can only adopt single Zener diode, so as to carrying out the voltage stabilizing action of light-emitting diode chip for backlight unit.In the light-emitting diode assembly 3 ' of this enforcement aspect, all the other elements all light-emitting diode assembly 3 with the 3rd embodiment are identical, so do not give unnecessary details in addition in this.
Fig. 4 A is the light-emitting diode assembly top view of fourth embodiment of the invention; The light-emitting diode assembly 4 of present embodiment and the light-emitting diode assembly 3 of the 3rd embodiment are similar; Different place only is the exterior design of electrode part, knows art technology person and should spread to other outward appearance aspects easily.
Fig. 4 B is the top view of another enforcement aspect of light-emitting diode assembly of fourth embodiment of the invention.Consider when using and to have the too high problem of operating current, so in this enforcement aspect, light-emitting diode assembly 4 ' more comprises two Zener diodes 413, so as to making the circuit voltage stabilizing of light-emitting diode assembly 4 '.Zener diode 413 all is arranged on the anode portion 403 of light-emitting diode assembly 4 ', and electrically connects with lead-in wire and adjacent negative pole part 405 respectively.In this enforcement aspect, be the voltage stabilizing that is respectively applied for two light-emitting diode chip for backlight unit with two Zener diodes 413; Said as preamble, also can only adopt single Zener diode, so as to carrying out the voltage stabilizing action of light-emitting diode chip for backlight unit.In the light-emitting diode assembly 4 ' of this enforcement aspect, all the other elements all light-emitting diode assembly 4 with the 4th embodiment are identical, so do not give unnecessary details in addition in this.
Fig. 5 is the light-emitting diode assembly top view of fifth embodiment of the invention; Likewise; The light-emitting diode assembly 5 of present embodiment and the light-emitting diode assembly 3 of the 3rd embodiment are similar; Different place only is the exterior design of electrode part, knows art technology person and also can spread to other outward appearance aspects easily.
Shown in Fig. 6 A to Fig. 6 C, the sixth embodiment of the present invention also is a kind of light-emitting diode assembly 6 that is used for a micro projection system.Light-emitting diode assembly 6 comprises a bottom substrate 601, an anode portion 603, four negative pole parts 605, three light-emitting diode chip for backlight unit 607, one and electrically connects with three negative pole parts 605 wherein respectively around substrate 609 and a translucent element 611, three light-emitting diode chip for backlight unit 607.Because the light-emitting diode assembly 6 of present embodiment has three light-emitting diode chip for backlight unit 607, so can claim three trichite optical diode devices again.The element relation of present embodiment is also of first embodiment, so do not say in addition in this again.
In present embodiment, each light-emitting diode assembly 6 comprises three light-emitting diode chip for backlight unit 607, for obtaining good projection light source quality, the light-emitting diode assembly 6 of several present embodiments capable of being combined during application.For example; Can adopt the light-emitting diode assembly of at least one present embodiment in the micro projection system; And this kind light-emitting diode assembly all comprises the trichromatic light-emitting diode chip for backlight unit of ruddiness, green glow and blue light, that is single light-emitting diode assembly just can provide trichromatic light.Know the LED chip that art technology person also can spread to other colors and close, for example, each light-emitting diode assembly can comprise the light-emitting diode chip for backlight unit of same color, for example is ruddiness, green glow and blue light respectively.In addition, the quantity of light-emitting diode assembly also can be adjusted in response to demand.
Fig. 6 D is the top view of another enforcement aspect of light-emitting diode assembly of sixth embodiment of the invention.Consider when using and to have the too high problem of operating current, so in this enforcement aspect, light-emitting diode assembly 6 ' more comprises a Zener diode 613, so as to making the circuit voltage stabilizing of light-emitting diode assembly 6 '.Zener diode 613 is arranged on the anode portion 603 of light-emitting diode assembly 6 ', and electrically connects with lead-in wire and the negative pole part 605 that does not electrically connect with light-emitting diode chip for backlight unit 607.In this enforcement aspect, only with of the voltage stabilizing of single Zener diode 613 as three light-emitting diode chip for backlight unit 607; Said based on preamble, also can adopt two or three Zener diodes to carry out the voltage stabilizing of light-emitting diode chip for backlight unit.In the light-emitting diode assembly 6 ' of this enforcement aspect, all the other elements all light-emitting diode assembly 6 with the 6th embodiment are identical, so do not give unnecessary details in addition in this.
Fig. 7 A is the light-emitting diode assembly top view of seventh embodiment of the invention; The light-emitting diode assembly 7 of present embodiment and the light-emitting diode assembly 6 of the 6th embodiment are similar; Different place only is the exterior design of electrode part, knows art technology person and should spread to other outward appearance aspects easily.
Fig. 7 B is the top view of another enforcement aspect of light-emitting diode assembly of seventh embodiment of the invention.Consider when using and to have the too high problem of operating current, so in this enforcement aspect, light-emitting diode assembly 7 ' more comprises two Zener diodes 713, so as to making the circuit voltage stabilizing of light-emitting diode assembly 7 '.Zener diode 713 all is arranged on the anode portion 703 of light-emitting diode assembly 7 ', and electrically connects with lead-in wire and adjacent negative pole part 705 respectively.In this enforcement aspect, be with of the voltage stabilizing of two Zener diodes 713 as three light-emitting diode chip for backlight unit; Said based on preamble, also can adopt single or three Zener diodes carry out the voltage stabilizing action of light-emitting diode chip for backlight unit.In the light-emitting diode assembly 7 ' of this enforcement aspect, all the other elements all light-emitting diode assembly 7 with the 7th embodiment are identical, so do not give unnecessary details in addition in this.
Shown in Fig. 8 A to Fig. 8 C; Eighth embodiment of the invention is all a kind of light-emitting diode assembly 8 that is used for a micro projection system; Light-emitting diode assembly 8 comprises a bottom substrate 801, an anode portion 803, four negative pole parts 805, four light-emitting diode chip for backlight unit 807, electrically connect with four light-emitting diode chip for backlight unit 807 respectively around substrate 809 and a translucent element 811, four negative pole parts 805.Because the light-emitting diode assembly 8 of present embodiment has four light-emitting diode chip for backlight unit 807, so can claim four trichite optical diode devices again.The element relation of present embodiment is also sayed like first embodiment, so do not repeat in addition in this.
Fig. 8 D is the top view of another enforcement aspect of light-emitting diode assembly of eighth embodiment of the invention.Consider when using and to have the too high problem of operating current, so in this enforcement aspect, light-emitting diode assembly 8 ' more comprises four Zener diodes 813, so as to making the circuit voltage stabilizing of light-emitting diode assembly 8 '.Zener diode 813 all is arranged on the anode portion 803 of light-emitting diode assembly 8 ', and electrically connects with lead-in wire and adjacent negative pole part 805 respectively.In this enforcement aspect, be the voltage stabilizing that is respectively applied for four light-emitting diode chip for backlight unit with four Zener diodes 813; Said based on preamble, also can adopt the Zener diode of single or other numbers, so as to carrying out the voltage stabilizing action of light-emitting diode chip for backlight unit.In the light-emitting diode assembly 8 ' of this enforcement aspect, all the other elements all light-emitting diode assembly 8 with the 8th embodiment are identical, so do not give unnecessary details in addition in this.
Fig. 9 is the light-emitting diode assembly top view of nineth embodiment of the invention; The light-emitting diode assembly 9 of present embodiment and the light-emitting diode assembly 8 of the 8th embodiment are similar; Different place only is the exterior design of electrode part, knows art technology person and should spread to other outward appearance aspects easily.
In above-mentioned each embodiment and respectively implementing in the aspect, translucent element is a glass, especially is an anti-anaclasis glass.In other implemented aspects, translucent element also can adopt one according to lens that optics designed; In practical application,, also can only cover with easy lens so that shipment if the micro projection system need not cover clear glass or lens.Moreover the light-emitting diode assembly of above stated specification all has around substrate, and when practical application, also can omit this element.
Said according to leading portion, know art technology person and can spread to respectively: shown in the profile of Figure 10 A, adopt the plate glass of anti-anaclasis and have light-emitting diode assembly 10a around substrate; Shown in the profile of Figure 10 B, adopt the ㄇ shape glass of anti-anaclasis and do not have light-emitting diode assembly 10b around substrate; Shown in the profile of Figure 11 A, adopt convex lens and have light-emitting diode assembly 11a around substrate; Shown in the profile of Figure 11 B, adopt convex lens and do not have light-emitting diode assembly 11b around substrate.
In addition; Above-mentioned each embodiment reaches and respectively implements in the aspect; Around substrate be a LTCC (Lowtemperature co-fired ceramic, LTCC), bottom substrate then is an aluminium nitride (AlN); Aluminium nitride is the non-metal solid that only a few possesses high heat-conduction coefficient and electrical insulating property simultaneously, belongs to a kind of good ceramic substrate material.Owing to all adopt ceramic substrate around substrate and bottom substrate, thermal diffusivity is good, and because of the operating current of light-emitting diode assembly application end is not high, so aspect heat radiation, can not produce any problem.
In addition, supply to produce the registration holes that the line board carries out contraposition around being equipped with on the substrate, this registration holes can design according to producing line board characteristic, and the manufacturing assembling at light-emitting diode assembly will have better precision whereby.
Moreover; In the present invention; Consider electrode part module end eat the tin area, in the light-emitting diode assembly of the present invention, make under the condition that allows electrode part area design with the back side to maximum in existing processing procedure; And heat sink electrodes portion and anode portion is shared, so as to promoting the heat radiation of light-emitting diode chip for backlight unit.
Light-emitting diode chip for backlight unit of the present invention can adopt rectilinear chip or horizontal chip according to application demand.In addition, the electrode of light emitting diode pattern does not also limit, and when two electrodes of light-emitting diode chip for backlight unit laid respectively at the bottom, two electrodes of each light-emitting diode chip for backlight unit can contact with corresponding negative pole part with anode portion in fact, so as to reaching electric connection; And when two electrode systems of light-emitting diode chip for backlight unit laid respectively at the top, two electrodes of each light-emitting diode chip for backlight unit can see through routing respectively and electrically connect with anode portion and corresponding negative pole part.
For the micro projection system; Inter-chip pitch is more little good more in the encapsulation; Be the limit that can reach in response to basal plate making process and solid brilliant board; The present invention does new design with electrode part, except aspect basal plate making process, not having any problem, and also can be in response to the limit of solid brilliant board and the error of board.For the element quality, anode design altogether of the present invention is easy to detect in addition, and being as good as provides more reliable guarantee of shipment quality.
If will be with the micro projection system combination in mobile phone, the micro projection system bulk be less than 6cc at least, and gross thickness then needs less than 7mm.The encapsulation of this light-emitting diode assembly be designed to cooperate the problem on die size and the processing procedure; And cooperation micro projection system is a guiding to approach; This substrate design extremely can be allowed the minimum dimension of above problem; Width is merely the design of 3.6mm, helps the optical projection system microminiaturization, will occupy the advantage on the size in following mobile phone and other electronic product market in slimming.
The maximum characteristics of this kind of substrate are exactly the electrode part design of crystal bonding area.Since the micro projection systems with the small screen as the basis; So as to amplification imaging is large-screen; Therefore the permissible defect level of micro projection internal system is extremely low; (Etendue=A * Ω) can know, the light source design in the micro projection system mainly focuses on light-emitting area and lighting angle and according to the formula of light exhibition amount (Etendue).
For light-emitting area is dwindled; Must the inter-chip pitch of light-emitting diode be dwindled; That is inter-chip pitch is more little good more for the efficient that promotes the micro projection system; The present invention hereat is designed to the large tracts of land anode portion (that is being total to anode) that can hold several light-emitting diode chip for backlight unit with crystal bonding area, and does not directly distinguish several anode portion.Whereby, in the ability allowed band of volume production board (error of board is approximately ± 40 μ m), just can inter-chip pitch significantly be dwindled (＜0.07mm), can increase the efficient of micro projection system output, more can meet the demand of client application end.The present invention has been contracted to the functional areas area of substrate the limit of processing procedure ability at present, along with following processing procedure progress, certainly will be able to light-emitting diode assembly size of the present invention further be dwindled again again.
To different micro projection systems and inner light path design thereof; Light-emitting diode assembly of the present invention has the packing forms of monocrystalline, two crystalline substances, three crystalline substances and four crystalline substances respectively, for light path design, can be designed to three, two and a light path; Designing for manufacturing manufacturer as far as the micro projection system; Design and material are selected comparatively polynary, need not to cooperate the light path design micro projection system of light-emitting diode assembly, and can go to seek optimal matched combined from the demand of micro projection system.
Moreover; The color of light-emitting diode chip for backlight unit and the encapsulation of light-emitting diode assembly can be arranged in pairs or groups with demand; Know art of the present invention and can spread to multiple collocation mode easily; So the arrangement mode and the color of light-emitting diode chip for backlight unit are not limited to above-mentioned embodiment that provides and aspect, for example can be monocrystalline+two crystalline substances, three monocrystalline etc., so as to cooperating the light source requirements of micro projection system.And interior chip collocation of the encapsulation of each light-emitting diode assembly or arrangement are all selected with demand, collocation elasticity height.
The encapsulation of light-emitting diode assembly of the present invention need not filler, but directly covers the anti-anaclasis glass of a slice, so as to the refraction of effective minimizing light, makes light-emitting diode assembly become a point-source of light rather than an area source, keeps original spotlight effect; So can when volume production, reduce many cost and man-hour; In addition, if change the covering lens into, also can adopt the inner not packaged type of filler equally, to guarantee high-reliability.
It is said to hold epimere, and light-emitting diode assembly of the present invention has multiple packing forms.In response to the requirement on the micro projection system dimension now, directly with the partial design of secondary optics in encapsulation, make light-emitting diode assembly except being that light source also can directly carry out optical design.The lens of different angles and the shape of hereat can arranging in pairs or groups, packaged type has elasticity, is different from the past that light-emitting diode assembly need encapsulate with the visitor and elasticity is less, and this is for all reducing time one on the optical design of micro projection system and the processing procedure.
Though the present invention discloses as above with preferred embodiment; Right its is not that any those skilled in the art are not breaking away from the spirit and scope of the present invention in order to qualification the present invention; When can doing a little modification and perfect, so protection scope of the present invention is when being as the criterion with what claims defined.
Claims (16)
1. light-emitting diode assembly that is used for a micro projection system comprises:
One bottom substrate;
One anode portion is arranged on this bottom substrate;
At least one negative pole part is arranged on this bottom substrate;
(light emitting diode, LED) chip are arranged on this anode portion and with this anode portion and reach this at least one negative pole part electric connection at least one light-emitting diode; And
One translucent element is covered on this bottom substrate, to define a cavity.
2. light-emitting diode assembly as claimed in claim 1 is characterized in that, this translucent element is glass or lens.
3. light-emitting diode assembly as claimed in claim 2 is characterized in that, this glass is an anti-anaclasis glass.
4. light-emitting diode assembly as claimed in claim 1 more comprises one around substrate, should have one around a portion and a hollow bulb around substrate, and this translucent element is directly to be covered in this around on the substrate, defines this cavity with this hollow bulb.
5. light-emitting diode assembly as claimed in claim 1; It is characterized in that; This at least one led chip has a plurality of led chips, and this at least one negative pole part has a plurality of negative pole parts, and the quantity of said led chip is identical with the quantity of said negative pole part; Said led chip is common and this anode portion electrically connects, and each led chip electrically connects with each negative pole part respectively.
6. light-emitting diode assembly as claimed in claim 5 is characterized in that, said led chip is rectilinear chip or horizontal chip.
7. light-emitting diode assembly as claimed in claim 5 is characterized in that, this at least one led chip be a red LED chip, a green light LED chip and a blue-light LED chip one of them.
8. light-emitting diode assembly as claimed in claim 5 is characterized in that, this at least one led chip has two led chips, and this at least one negative pole part has two negative pole parts, electrically connects with these two led chips respectively.
9. light-emitting diode assembly as claimed in claim 8 is characterized in that, these two led chips are a red LED chip and a green light LED chip, a red LED chip and a blue-light LED chip, or a green light LED chip and a blue-light LED chip.
10. light-emitting diode assembly as claimed in claim 5 is characterized in that, this at least one led chip has three led chips, and this at least one negative pole part has three negative pole parts, electrically connects with these three led chips respectively.
11. light-emitting diode assembly as claimed in claim 10 is characterized in that, these three led chips are a red LED chip, a green light LED chip and a blue-light LED chip.
12. light-emitting diode assembly as claimed in claim 5 is characterized in that, this at least one led chip has four led chips, and this at least one negative pole part has four negative pole parts, electrically connects with these four led chips respectively.
13. light-emitting diode assembly as claimed in claim 12 is characterized in that, these four led chips are a red LED chip, two green light LED chips and a blue-light LED chip.
14. light-emitting diode assembly as claimed in claim 1 more comprises at least one Zener diode (Zenerdiode).
15. light-emitting diode assembly as claimed in claim 1 is characterized in that, this bottom substrate is an aluminium nitride (AlN) substrate.
16. light-emitting diode assembly as claimed in claim 4 is characterized in that, should be a low-temperature co-fired ceramic substrate (LTCC, Low Temperature Co-fired Ceramic) around substrate.
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| CN201010289811.XA CN102412359B (en) | 2010-09-21 | 2010-09-21 | Light-emitting diode assembly for a micro projection system |
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| CN201010289811.XA CN102412359B (en) | 2010-09-21 | 2010-09-21 | Light-emitting diode assembly for a micro projection system |
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| CN102412359B CN102412359B (en) | 2018-12-07 |
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Also Published As
| Publication number | Publication date |
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| CN102412359B (en) | 2018-12-07 |
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