CN102423951A - Method for attaching protective film to fine-pitch film circuit - Google Patents
Method for attaching protective film to fine-pitch film circuit Download PDFInfo
- Publication number
- CN102423951A CN102423951A CN2011103200129A CN201110320012A CN102423951A CN 102423951 A CN102423951 A CN 102423951A CN 2011103200129 A CN2011103200129 A CN 2011103200129A CN 201110320012 A CN201110320012 A CN 201110320012A CN 102423951 A CN102423951 A CN 102423951A
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- China
- Prior art keywords
- film
- diaphragm
- thin space
- circuit
- circuit applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000001681 protective effect Effects 0.000 title abstract 7
- 239000012790 adhesive layer Substances 0.000 claims abstract description 5
- -1 polyethylene terephthalate Polymers 0.000 claims description 11
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 10
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 claims description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000003814 drug Substances 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 8
- 238000011161 development Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract 3
- 238000005516 engineering process Methods 0.000 description 13
- 238000003384 imaging method Methods 0.000 description 10
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229920006267 polyester film Polymers 0.000 description 5
- 240000005002 Erythronium dens canis Species 0.000 description 4
- 210000002469 basement membrane Anatomy 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 229920002689 polyvinyl acetate Polymers 0.000 description 4
- 239000011118 polyvinyl acetate Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 2
- 210000004379 membrane Anatomy 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
A method for attaching a protective film to a fine-pitch film circuit comprises the following steps: a) firstly, a film sticking machine is used for sticking a protective film containing an adhesive layer on a film to be protected; b) and then placing the film pasted with the protective film in an autoclave with the pressure of 0-1 MPa, and placing the film at the temperature of 0-100 ℃ for 0-24 hours to remove micro bubbles and improve the resolution of the precise film circuit. The method has simple process, the laminating process is not limited by laminating equipment, equipment process parameters and the protective film, and the film pasted with the protective film is placed in the high-pressure kettle as a bubble removing process, so that the problem of bubbles disturbing the corners of the thin-pitch line of the protective film laminating film can be effectively solved, the production efficiency is improved, and the influence of the bubbles on the exposure and development resolution is solved.
Description
Technical field
The present invention relates to a kind of method of thin space film circuit applying diaphragm, more particularly, the present invention relates to the diaphragm applying method of a kind of PCB of being applied to wiring board field thin space film film.
Background technology
In recent years, along with the fast development of PCB wiring board industry, electronic product is more and more microminiaturized, requires circuit more and more accurate.In process of production; Film film is unavoidable artificial scratching or the erosion of green oil solvent to occur, thus the service life of reducing film, and increase the repairing rate of wiring board; In order to improve this present situation, present most producers take to fit method of diaphragm is protected film.
Diaphragm in the market can only satisfy the requirement that general film circuit is fitted mostly, and still there are many problems in the accurate circuit of thin space.Wherein, the corner of silver salt sheet film circuit is easy to generate many minute bubbles behind the applying diaphragm; And for the diazo sheet film, because some diazo sheet rough surface are prone to more residual micro-bubbles at recess.The anaclasis that the existence of this micro-bubble will cause causes the reduction of exposure back image analytic degree, and the influence of the accurate circuit of thin space is seemed serious.For this reason, many producers are the air bubble problem after actively thinking is devoted to solve applying all, and the employing that has is constantly adjusted abutted equipment pressure roller level or adjusted technologies such as laminate pressure, applying speed, adjustment cornerite and reduce the bubble of circuit corner; The producer that has fits through the exploitation flexible glue diaphragm supplier and fills the purpose that the bubble space reaches reduction circuit corner bubble to improve flowability; The producer that has adopts through the film behind the applying diaphragm and places a period of time with reduction circuit corner bubble, or the like.Although these ways more or less have some improvement; But cause many wastes that repeat to fit and inefficiency; Simultaneously can't reach the purpose that the corner circuit does not have bubble completely all the time, can't improve the resolution of circuit, big limitations in the application of thin space film circuit.
Summary of the invention
The object of the invention aims to provide a kind of method of thin space film circuit applying diaphragm; More precisely; A kind of technology of the film diaphragm of fitting is provided; Can better remove the bubble of accurate film circuit corner behind the applying diaphragm, enhance productivity, eliminate the influence of bubble the exposure imaging resolution.
The method of thin space film circuit applying diaphragm according to the invention, its steps in sequence comprises:
The diaphragm that a) at first will contain bonding glue-line with laminator fits on the film film that needs protection;
B) then this film that posts diaphragm is placed the autoclave of pressure at 0～1Mpa, temperature can will be removed micro-bubble at 0～100 ℃ of held 0-24 hour, improve the resolution of accurate film circuit.
Above-mentioned film diaphragm is made up of three-decker, is respectively basement membrane, bonding glue-line, peel ply; Basement membrane generally is by transparent base, for example polyethylene film, polypropylene screen, ethylene-propylene copolymer film, polyester film, PETG film, polychloroethylene film, polyvinyl acetate film, preferably PETG film; Its transparent basement membrane thickness is from 3um～25um, preferred 6～12um.
The adhesive layer of film diaphragm is the substratum transparent with certain bonding force, can be epoxies, polyurethanes, acrylic compounds, preferred C
4 ~ 12The alkylacrylate polymer.
The peel ply of film diaphragm; It also is the transparent membrane of on base material film, doing release processing; For example polyethylene film, polypropylene screen, ethylene-propylene copolymer film, polyester film, PETG film, polychloroethylene film, polyvinyl acetate film, preferred PETG film; Transparent basement membrane thickness is from 6um～100um, preferred 12～50um.In addition, the surface of antiseized stripping film must adopt suitable surface treatment method to handle, and selects for use the primary coat mould release to handle usually and obtains required peel strength; The primary coat mould release has Silicon-contained and non-silicon series, preferred non-silicon series primary coat mould release.
The accurate circuit film of above-mentioned thin space is meant that mainly live width and line-spacing weigh, 1mil/1mil for example, and 2mil/2mil, 3mil/3mil, 4mil/4mil, 5mil/5mil, 6mil/6mil is preferably less than the accurate circuit of 5mil/5mil.
Film film can be silver salt sheet, diazo sheet; Wherein the ground of film film can be a transparent polyester film, for example the PETG film; Polychloroethylene film; The polyvinyl acetate film, clear glass, preferred PETG film; It is shaped as sheet and web-like.
Above-mentioned autoclave, it can be the canister of unlike material, for example metallic iron, stainless steel, preferably stainless steel; Shape can be that cube is square, cylindrical, for the preferred cubic type container of the sheet film, and for the web-like film, the pref. cylindrical container; Pressure in the autoclave, preferred 0.01～1Mpa scope, preferred 0～50 ℃ of temperature range, preferred 0～12 hour of time range.
The method of thin space film circuit applying diaphragm according to the invention, its advantage is:
Attaching process is not limited to abutted equipment, apparatus and process parameter and diaphragm itself; Place autoclave as de-bubble technology through the film that will post diaphragm; Can effectively solve the air bubble problem of puzzlement diaphragm applying film thin space circuit corner; Not only improved production efficiency, and solved the influence of bubble the exposure imaging resolution.
The specific embodiment
Further specify the present invention through concrete instance below, but do not explain that this invention only is confined to this.
Embodiment 1
Film attaching process
Film diaphragm is installed on the laminator, A) gets the standard testing silver salt sheet film and use laminator to paste diaphragm, B) get the diazo sheet film, after film cleaning agent cleaning, use laminator to paste diaphragm with film cleaning agent cleaning back; Pad pasting parameter: speed 1.5m/min, pressure: 0.2MPa.
Film de-bubble technology:
The film that posts diaphragm is put into high-pressure bottle, take out after placing 5min at room temperature, 0.20MPa pressure.
Exposure imaging technology:
(the brush Plate grinder of wearable carries out nog plate for thickness of slab 1.6mm, end copper HOZ, uses dry film laminator applying dry film then, pad pasting speed 2.5m/min, pad pasting pressure 2.5kgf/cm to get the FR4 hardboard that size is not less than 300mm * 300mm
2Use exposure machine to make public (time for exposure 8S, Exposing Lamp 5KW) with the film after the high pressure defoaming treatment, (developer solution, 1% sodium carbonate liquor, developing powder 1.5m/min, development pressure 1.2Kgf/cm develop after the exposure
2)
Embodiment 2
Film de-bubble technology is put into high-pressure bottle for the film that will post diaphragm, takes out after placing 3min at 40 ℃, 0.8MPa pressure.
Embodiment 3
Film de-bubble technology is put into high-pressure bottle for the film that will post diaphragm, takes out after placing 4min at 30 ℃, 0.4MPa pressure.
Embodiment 4
Film de-bubble technology is put into high-pressure bottle for the film that will post diaphragm, takes out after placing 2min at 80 ℃, 0.45MPa pressure.
Comparative example 1
The silver salt sheet film is posted diaphragm, place and observe corner circuit bubble after 1 day, do identical exposure imaging technology by embodiment 1 then, investigate resolution;
To post the diaphragm diazo sheet film, place whether observation film surface has micro-bubble after 1 day.
Comparative example 2
The silver salt sheet film is posted diaphragm, angle, observation line roadside bubble; Then with it at 50 ℃ of held 30min, angle, observation line roadside bubble again; By do identical exposure imaging technology by embodiment 1, investigate resolution at last.
Comparative example 3
The silver salt sheet film is posted diaphragm, angle, observation line roadside bubble; Then with it at 30 ℃ of held 12 hours, angle, observation line roadside bubble again; By do identical exposure imaging technology by embodiment 1, investigate resolution at last.
Comparative example 4
The silver salt sheet film is posted diaphragm, angle, observation line roadside bubble; Then with it at 30 ℃ of held 12 hours, angle, observation line roadside bubble again; By do identical exposure imaging technology by embodiment 1, investigate resolution at last.
More than each embodiment and the described diaphragm of Comparative Examples be the PET polyester film; Also can be other transparent membranes, for example polyethylene film, polypropylene screen, ethylene-propylene copolymer film, polyester film, PETG film, polychloroethylene film, polyvinyl acetate film.
Performance evaluation
According to following method circuit corner bubble, the resolution of above instantiation are estimated, evaluation result is as shown in table 1.
Circuit corner bubble
With the sample of the circuit that posts film diaphragm, adopt the number of bubbles at angle, observation line roadside under hundred times of mirrors; If the long bilateral circuit of 2cm corner number of bubbles surpasses 10, be designated as " * "; If angle, roadside, the long bilateral sideline of 2cm number of bubbles is less than 10 more than 1, be designated as " △ "; If the circuit corner does not have bubble fully, be designated as " zero ".
Resolution
Whether the figure behind the inspection exposure imaging is clear, and relatively it is in the difference of film design to measure 2mil and above live width/line-spacing, and whether develop clean, and whether circuit has burr, dog tooth shape.If 2mil and above live width/line-spacing and film design difference greater than 0.2mil, are developed unclean and circuit has burr, dog tooth shape, be designated as: " * "; If 2mil live width/line-spacing and film design difference is not more than 0.2mil, develop comparatively clean and circuit has only a small amount of burr, dog tooth shape, be designated as: " △ "; If clear picture, the design of live width/line-spacing and the film differed at 0.2mil with interior (comprising 0.2mil), develop clean simultaneously and do not have burr, dog tooth shape, be designated as " zero ".
Dimensional stability
With the film of applying film diaphragm, after autoclave vessel is carried out deaeration, adopt the size (round dot centre distance on the test film is divided MD, TD direction) of Quadratic Finite Element tester test film MD, TD direction, the change in size of film before and after the record de-bubble; Change in size is being designated as " zero " below 0.01%, change in size is designated as " △ " 0.01%～0.02%, and change in size is being designated as " * " more than 0.02%.
Table 1 diaphragm performance evaluation
Can find out from table 1; De-bubble technological parameter among the embodiment can thoroughly be removed the film circuit corner bubble of thin space behind the applying diaphragm; Not only improved the resolution behind the exposure imaging; And guaranteed the dimensional stability of film film thoroughly to have solved the unfavorable technical barrier of long-term puzzlement distance between centers of tracks circuit exposure imaging, thereby the Comparative Examples that does not adopt the autoclave pressurization then less stable cause properties of product to descend.
The present invention has carried out detailed description with reference to concrete embodiment, as far as those of ordinary skill in the art, is not deviating under the prerequisite of the present invention, and it is conspicuous can doing various modifications or adjust the de-bubble technological parameter the present invention.
Claims (9)
1. the method for a thin space film circuit applying diaphragm, its step comprises:
The diaphragm that a) at first will contain bonding glue-line with laminator fits on the film film that needs protection;
B) then this film that posts diaphragm is placed the autoclave of pressure at 0～1Mpa, temperature can will be removed micro-bubble at 0～100 ℃ of held 0-24 hour, improve the resolution of accurate film circuit.
2. according to the method for the said thin space film of claim 1 circuit applying diaphragm, it is characterized in that the live width/line-spacing of the thin space circuit film is 1mil/mil, 2mil/2mil, 3mil/3mil, 4mil/4mil, 5mil/5mil or above live width/line-spacing.
3. according to the method for the said thin space film of claim 1 circuit applying diaphragm, it is characterized in that film diaphragm is made up of three-decker, comprise 6um substrate layer, 2～4um adhesive layer and 25um peel ply.
4. according to the method for the said thin space film of claim 3 circuit applying diaphragm, it is characterized in that, the peel ply of diaphragm torn off that the make-up machine with the band rubber roll fits in silver salt sheet or diazo sheet film medicine face with adhesive layer then.
5. according to the method for the said thin space film of claim 4 circuit applying diaphragm, it is characterized in that said film film is silver salt sheet and diazo sheet.
6. according to the method for the said thin space film of claim 5 circuit applying diaphragm, it is characterized in that the film base material of said silver salt sheet and diazo sheet is a transparent polyethylene terephthalate film, it is shaped as sheet or web-like.
7. according to the method for the said thin space film of claim 1 circuit applying diaphragm, it is characterized in that, said autoclave for made can bearing certain pressure difformity container, its material is iron or stainless steel.
8. according to the method for the said thin space film of claim 1 circuit applying diaphragm, it is characterized in that the adhesive layer of film diaphragm is the substratum transparent with certain bonding force, be epoxies, polyurethanes, acrylic compounds.
9. the method for said according to Claim 8 thin space film circuit applying diaphragm is characterized in that said acrylic compounds substratum transparent is C
4～12The alkylacrylate polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103200129A CN102423951A (en) | 2011-10-20 | 2011-10-20 | Method for attaching protective film to fine-pitch film circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103200129A CN102423951A (en) | 2011-10-20 | 2011-10-20 | Method for attaching protective film to fine-pitch film circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102423951A true CN102423951A (en) | 2012-04-25 |
Family
ID=45958022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103200129A Pending CN102423951A (en) | 2011-10-20 | 2011-10-20 | Method for attaching protective film to fine-pitch film circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102423951A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102676081A (en) * | 2012-05-29 | 2012-09-19 | 番禺南沙殷田化工有限公司 | Photosensitive film protective film and preparation method thereof |
| CN102789130A (en) * | 2012-08-06 | 2012-11-21 | 深圳市宏瑞新材料科技有限公司 | Negative film protecting film and production method thereof |
| CN107236468A (en) * | 2016-12-19 | 2017-10-10 | 艾威尔电路（深圳）有限公司 | A kind of resin type liquid protective film and its preparation, application method |
| CN108513461A (en) * | 2018-04-28 | 2018-09-07 | 珠海智锐科技有限公司 | A kind of FPC plates manufacture craft |
| CN114872315A (en) * | 2022-06-13 | 2022-08-09 | 深圳市志凌伟业技术股份有限公司 | Method for protecting film |
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| CN2850204Y (en) * | 2005-11-18 | 2006-12-20 | 上海华仕德电路技术有限公司 | Integrated film sticking machine |
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| WO2009020339A1 (en) * | 2007-08-09 | 2009-02-12 | Shindo Engineering Laboratory Ltd. | Method and apparatus for manufacturing flat panel display |
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2011
- 2011-10-20 CN CN2011103200129A patent/CN102423951A/en active Pending
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102676081A (en) * | 2012-05-29 | 2012-09-19 | 番禺南沙殷田化工有限公司 | Photosensitive film protective film and preparation method thereof |
| CN102789130A (en) * | 2012-08-06 | 2012-11-21 | 深圳市宏瑞新材料科技有限公司 | Negative film protecting film and production method thereof |
| CN107236468A (en) * | 2016-12-19 | 2017-10-10 | 艾威尔电路（深圳）有限公司 | A kind of resin type liquid protective film and its preparation, application method |
| CN107236468B (en) * | 2016-12-19 | 2020-03-31 | 艾威尔电路（深圳）有限公司 | Resin type liquid protective film and preparation and use methods thereof |
| CN108513461A (en) * | 2018-04-28 | 2018-09-07 | 珠海智锐科技有限公司 | A kind of FPC plates manufacture craft |
| CN114872315A (en) * | 2022-06-13 | 2022-08-09 | 深圳市志凌伟业技术股份有限公司 | Method for protecting film |
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Application publication date: 20120425 |