CN102478930A - Case back plate with liquid metal heat dissipation mechanism - Google Patents
Case back plate with liquid metal heat dissipation mechanism Download PDFInfo
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- CN102478930A CN102478930A CN2010105636123A CN201010563612A CN102478930A CN 102478930 A CN102478930 A CN 102478930A CN 2010105636123 A CN2010105636123 A CN 2010105636123A CN 201010563612 A CN201010563612 A CN 201010563612A CN 102478930 A CN102478930 A CN 102478930A
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Abstract
一种带液态金属散热机构的机箱背板，其特征是：机箱背板为内设第一流道并带有一液态金属散热机构的机箱背板；液态金属散热机构由冷板和驱动泵及连接管道组成：冷板为内设有第二流道的平板；机箱背板的第一流道的两端流道口分别与冷板的第二流道的两端流道口通过连接管道相连通并形成流通回路，其相连通并形成流通回路的流道内流动有液体金属；用于连通机箱背板的第一流道与冷板的第二流道的至少一条连接管道上安装驱动泵，驱动泵驱动液体金属在流通回路中流动。本发明充分利用机箱背板散热面，可有效节省机箱内散热器空间；同时，液态金属导热介质的引入，使其具备优秀的热输运能力，且结构简单易于集成，是一种实现芯片高效散热的机箱背板。
A chassis back plate with a liquid metal heat dissipation mechanism, characterized in that: the chassis back plate is a chassis back plate with a first flow channel and a liquid metal heat dissipation mechanism; the liquid metal heat dissipation mechanism is composed of a cold plate, a driving pump and a connecting pipe: the cold plate is a flat plate with a second flow channel; the two end flow channel openings of the first flow channel of the chassis back plate are respectively connected with the two end flow channel openings of the second flow channel of the cold plate through connecting pipes to form a circulation loop, and liquid metal flows in the flow channels that are connected to form the circulation loop; a driving pump is installed on at least one connecting pipe for connecting the first flow channel of the chassis back plate and the second flow channel of the cold plate, and the driving pump drives the liquid metal to flow in the circulation loop. The present invention makes full use of the heat dissipation surface of the chassis back plate, which can effectively save the space of the radiator in the chassis; at the same time, the introduction of the liquid metal heat-conducting medium enables it to have excellent heat transport capacity, and the structure is simple and easy to integrate, and it is a chassis back plate that realizes efficient heat dissipation of chips.
Description
Technical field
The present invention relates to a kind of cabinet backboard, particularly a kind of integrated liquid metal heat radiation mechanism, the cabinet backboard that liquid metal capable of using is derived chip heat and utilize the wide area of metal cabinet backboard to dispel the heat.
Background technology
Existing cabinet backboard generally only realizes going along with sb. to guard him defencive function.For guaranteeing good electromagnetic screen and reliable package quality, metal material is used the most extensive.Simultaneously, the most important problem of cabinet inside be efficiently, stablize, chip cooling management cheaply.Current, individual chips heating radiator on the market (like air-cooled, heat pipe, water-cooled etc.) is for guaranteeing enough area of dissipations, all can bring bulkyly, occupies the cabinet volume, simultaneously a difficult problem such as inconvenient installation.In fact; If can chip heat be exported to metal cabinet backboard; High-termal conductivity and the sufficient area of dissipation of cabinet backboard by metal material dispel the heat; To bring excellent more heat dispersion undoubtedly, and realize comfortable user experience more such as the saving of space and material, and zero noise low energy consumption.Yet; The selection of suitable cooling working medium is the key that chip heat is conducted to the cabinet backboard; Reasonably working medium must possess outstanding heat transfer potential, be easy to integrated and efficiently type of drive, must be difficult for that evaporation is leaked, physico-chemical property is stable, safety non-toxic simultaneously.
2002, (Liu Jing, Monday was glad, a kind of radiating device of chip radiation, grant number: propose first 02257291.0) near the liquid metals of fusing point room temperature is used for chip cooling in patent for we.Because liquid metals has the thermal conductivity far above nonmetal fluid such as water, air and even other mixing materials, thereby it during as the heat eliminating medium of die terminals, can be realized very excellent heat transfer potential.Particularly, because liquid metals has high conductivity, thereby can adopt the electromagnetic pump of no any moving component to drive, it is simple in structure, and power consumption is extremely low, and is very easy to realize microminiaturized and integrated on a large scale.
For this reason, the present invention proposes a kind of cabinet backboard that utilizes liquid metal that chip heat is derived and utilizes the wide area of metal cabinet backboard to dispel the heat.Based on liquid metal thermotransport ability efficiently and the wide area of dissipation of cabinet backboard, the present invention can realize chip cooling ability efficiently, has effectively simplified the space of independent heating radiator in the cabinet simultaneously.Evaporation is leaked, physico-chemical property is stable because liquid metal is difficult for, safety non-toxic, and the present invention can be long-term, and is stable, efficient operation.
Summary of the invention
The objective of the invention is to utilize the liquid metal of high heat conductance that chip heat is exported to the cabinet backboard and dispel the heat, realize the efficient chip heat management, effectively saved the space of independent heating radiator in the cabinet simultaneously with this.
Technical scheme of the present invention is following:
The cabinet backboard of band liquid metal heat radiation provided by the invention mechanism, as shown in Figure 1, said cabinet backboard 3 is established first flow in being and is had the cabinet backboard of a liquid metal heat radiation mechanism;
Said liquid metal heat radiation mechanism is made up of cold drawing 1 and driving pump 2 and connecting tube 4: said cold drawing 1 is provided with the flat board of second runner in being;
The two ends runner mouth of the first flow of said cabinet backboard 3 is connected through connecting tube 4 with the two ends runner mouth of second runner of said cold drawing 1 respectively and forms flow cycle, and it is connected and forms to flow in the runner of flow cycle has liquid metals; Be used to be communicated with installing drive pump 2 at least one connecting tube of second runner of first flow and said cold drawing 1 of said cabinet backboard 3, said driving pump 2 drives liquid metals and in said flow cycle, flows.
Said cold drawing 1 is made up of plate cold drawing base 7 and the cold drawing lid 6 that is placed on said cold drawing base 7 upper surfaces; Said second runner is located within the said dull and stereotyped cold drawing base 7; Said cold drawing lid 6 is provided with two through hole, and flow-path tube is housed respectively on the two through hole; Said flow-path tube is connected with the two ends runner mouth of second runner of said cold drawing 1 through connecting tube respectively; Installing drive pump 2 at least one connecting tube wherein;
Perhaps
The connecting tube of second runner of first flow and said cold drawing that is used to be communicated with said cabinet backboard is for driving the siphon piping that liquid metals circulates.
Said cold drawing base 7 is copper, aluminium, stainless steel, graphite or adamas with the material of said cold drawing lid 6;
Described cabinet backboard material is copper, aluminium, iron or the stainless steel with high heat conductance.
Said second runner is linear runner, zigzag runner, spiral flow channel or the tree-like runner of branch, and its width of flow path is 1 micron～50 millimeters.
Said first flow is welded on the cabinet back of the body lateral surface or is welded on the cabinet back of the body medial surface; It is linear runner, zigzag runner, spiral flow channel or the tree-like runner of branch, and its width of flow path is 1 micron～500 millimeters.
Described driving pump is a mechanical pump, electromagnetic pump, and piezoelectric pump, electric Wetting pump, or directly realize that through the thermal siphon phenomenon no pump circulation of fluid flows.
Described driving pump is many series connections of pumps or many parallels connection of pumps.
Said connecting line adopts plastic tube or metal tube.
Described liquid metal is to present liquid gallium, mercury, gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy under the room temperature.
Said gallium base bianry alloy is the gallium indium alloy, gallium lead alloy or gallium mercury alloy; Said gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.
In actual motion; Cold drawing 1 in the cabinet backboard of band liquid metal heat radiation of the present invention mechanism is placed near the chip; Liquid metal with outstanding capacity of heat transmission circulates in loop, and liquid metal is at first taken away chip heat through cold drawing 1 in flowing; Subsequently, the liquid metal of intensification brings to heat cabinet backboard 3 and is dispersed in the surrounding air under the driving of driving pump 2, realizes the purpose of chip high efficiency and heat radiation with this.
For guaranteeing good heat absorption capacity, cold drawing 1 (comprising cold drawing base 7 and cold drawing lid 6) material can adopt copper, aluminium, stainless steel, graphite or the adamas etc. with high heat conductance; Second runner can be arranged as linear runner, zigzag runner, spiral flow channel or the tree-like runner of branch in the cold drawing 1, and its width of flow path is 1 micron～50 millimeters;
The purpose of driving pump 2 is to produce the liquid metal of certain pressure-driven and in flow cycle, circulates; Driving pump 2 can adopt mechanical pump, electromagnetic pump, piezoelectric pump or electric Wetting pump etc.; Different according to processing technology, driving pump 2 profile geometric scales can not wait from the nanometer to the decimetre; Because liquid metal has high conductivity, the electromagnetic pump of movement-less part is that enforcement of the present invention is first-selected; The typical advantage of electromagnetic pump is not have mechanical moving component, drives the efficient height, is convenient to microminiaturization and mass, and with low cost, energy consumption is low, and the life-span is long etc.Typical electromagnetic pump and manufacture craft can be with reference to Chinese invention patent application (a kind of electromagnetic pumps that is used to drive conductive fluid and preparation method thereof, 200810227046.1, Liu Ming, Liu Jing, Monday is glad).
Connecting line 4 can be selected plastic tube or metal tube; Wherein, plastic tube has good pliability, is convenient to install, and can be used as first-selection.
The characteristic feature of liquid metal is can present liquid state under the room temperature among the present invention, and described liquid metal is to present liquid gallium, mercury, gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy under the room temperature.
Said gallium base bianry alloy is the gallium indium alloy, gallium lead alloy, gallium mercury alloy; Said gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite; Gallium-base alloy is because characteristics such as nontoxic, stable in properties can be used as first-selection.
The advantage of the cabinet backboard of band liquid metal heat radiation of the present invention mechanism is: because the present invention has made full use of cabinet backboard radiating surface, therefore can reach more outstanding heat dispersion, and effectively save independent heating radiator space in the cabinet.Simultaneously, because the introducing of liquid metal heat-conducting medium, total system possesses outstanding thermotransport ability, and Drive Structure simply is easy to integrated, is a kind of cabinet backboard of realizing the efficient chip heat radiation.
Description of drawings
Accompanying drawing 1 is the structural representation of the cabinet backboard of band liquid metal heat radiation of the present invention mechanism;
Accompanying drawing 2 is the structural representation of cold drawing 1;
Accompanying drawing 3 is the structural representation of cabinet backboard 3 (a kind of embodiment).
Embodiment
Further describe the present invention below in conjunction with accompanying drawing and specific embodiment.
As shown in the figure, the cabinet backboard of band liquid metal heat radiation provided by the invention mechanism, said cabinet backboard 3 are established first flow in being and are had the cabinet backboard of a liquid metal heat radiation mechanism;
Said liquid metal heat radiation mechanism is made up of cold drawing 1 and driving pump 2 and connecting tube 4: said cold drawing 1 is provided with the flat board of second runner in being;
The two ends runner mouth of the first flow of said cabinet backboard 3 is connected through connecting tube 4 with the two ends runner mouth of second runner of said cold drawing 1 respectively, and forms flow cycle, and it is connected and forms mobilely in the runner of flow cycle has a liquid metals; Be used to be communicated with installing drive pump 2 on the connecting tube of second runner of first flow and said cold drawing 1 of said cabinet backboard 3, said driving pump 2 drives liquid metals and in said flow cycle, flows.
Fig. 2 is the structural representation of cold drawing 1, and cold drawing 1 is made up of plate cold drawing base 7 and the cold drawing lid 6 that is placed on said cold drawing base 7 upper surfaces; Said second runner is located within the said dull and stereotyped cold drawing base 7; Said cold drawing lid 6 is provided with two through hole, and flow-path tube is housed respectively on the two through hole; Said flow-path tube is connected with the two ends runner mouth of second runner of said cold drawing 1 through connecting tube respectively; Installing drive pump 2 at least one connecting tube wherein.
Said cold drawing base 7 all can be copper, aluminium, stainless steel, graphite or adamas (present embodiment is a metallic copper) with the material of said cold drawing lid 6;
The cabinet backboard material of present embodiment is the copper (can certainly adopt aluminium material, the cabinet backboard of iron material matter or stainless steel) with high heat conductance.
Second runner of present embodiment is linear runner, zigzag runner, spiral flow channel or the tree-like runner of branch (present embodiment adopts the zigzag runner, and is as shown in Figure 2), and width of flow path all can 1 micron～50 millimeters scopes.
The first flow of present embodiment takes it is welded on the cabinet back of the body lateral surface (be welded in certainly on the cabinet back of the body medial surface also can); It can take linear runner, zigzag runner, spiral flow channel or the tree-like runner of branch or (present embodiment adopts zigzag stream, and is as shown in Figure 3), and the first flow width all can 1 micron～500 millimeters scopes.
The driving pump 2 that is arranged on the connecting tube can many series connections of pumps or many parallels connection of pumps.Many series connections of pumps need a plurality of pump housings to join end to end, and the liquid that flows out from previous pump continues to flow into an adjacent back pump, are activated power once more and quicken.Many series connections of pumps can realize the repeatedly acceleration of fluid, and the drive ram of loop is promoted significantly, have improved the thermotransport ability.Many parallels connection of pumps need a plurality of pump parallel arranged, a shared import and an outlet.A plurality of pumps produce driving force simultaneously after multiply liquid is extracted in same import, make the liquid of a plurality of passages all be accelerated and outflow outlet simultaneously.Therefore, under same drive ram situation, the flow of loop promotes significantly, has improved the thermotransport ability.Driving pump 2 can be mechanical pump, electromagnetic pump, and piezoelectric pump, electric Wetting pump perhaps directly utilizes the circulation of thermosyphon effect drive fluid, and realizes no pump operation; Utilize thermosyphon effect to make and have two sections vertically arranged pipeline sections in the whole pipeline; And there is temperature difference in fluid in two sections pipeline sections; Utilize the different temperatures fluid to have different densities and the two pipeline section pressure differentials that cause come drive fluid to flow with this, thereby realize the purpose of heat transportation.Present embodiment is a first-selection to adopt electromagnetic pump, and the electromagnetism pump structure is in the applicant's Chinese invention patent application (a kind of electromagnetic pump that is used to drive conductive fluid and preparation method thereof, 200810227046.1; Liu Ming; Liu Jing, Monday is glad) describe to some extent, repeat no more at this.
Said connecting line adopts plastic tube or metal tube.
Described liquid metal is to present liquid gallium, mercury, gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy under the room temperature.
Said gallium base bianry alloy is the gallium indium alloy, gallium lead alloy, gallium mercury alloy; Said gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.
Connecting line 4 can be selected plastic tube or metal tube.Wherein, present embodiment adopts plastic tube to have good pliability, is convenient to install, and can be used as first-selection.
The characteristic feature of liquid metal is can present liquid state under the room temperature, and gallium, mercury, gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy all are applicable to the present invention.
Said gallium base bianry alloy is the gallium indium alloy, gallium lead alloy, gallium mercury alloy; Said gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.Characteristics such as gallium-base alloy (comprising gallium base bianry alloy, gallium based multicomponent alloy) is nontoxic because of it, stable in properties can be used as first-selection.The liquid metal of present embodiment adopts gallium-indium-tin alloy.
The present invention can be used for the heat radiation of all kinds of power systems such as desktop computer, notebook computer, industrial computer, communication base station, laser system cabinet and even mobile phone etc.
What should explain at last is that above embodiment is only unrestricted in order to technical scheme of the present invention to be described.Although the present invention is specified with reference to embodiment; Those of ordinary skill in the art is to be understood that; Technical scheme of the present invention is made amendment or is equal to replacement, do not break away from the spirit and the scope of technical scheme of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (10)
1. the cabinet backboard with liquid metal heat radiation mechanism is characterized in that, said cabinet backboard is established first flow in being and had the cabinet backboard of a liquid metal heat radiation mechanism;
Said liquid metal heat radiation mechanism is made up of cold drawing and driving pump and connecting tube: said cold drawing is provided with the flat board of second runner in being;
The two ends runner mouth of the first flow of said cabinet backboard is connected through connecting tube with the two ends runner mouth of second runner of said cold drawing respectively and forms flow cycle, and it is connected and forms to flow in the runner of flow cycle has liquid metals; Be used to be communicated with installing drive pump at least one connecting tube of second runner of first flow and said cold drawing of said cabinet backboard, said driving pump drives liquid metals and in said flow cycle, flows;
Perhaps
The connecting tube of second runner of first flow and said cold drawing that is used to be communicated with said cabinet backboard is for driving the siphon piping that liquid metals circulates.
2. by the cabinet backboard of the described band liquid metal heat radiation of claim 1 mechanism, it is characterized in that said cold drawing is made up of plate cold drawing base and the cold drawing lid that is placed on the said cold drawing base upper surface; Said second runner is located within the said dull and stereotyped cold drawing base; Said cold drawing covers and is provided with two through hole, and flow-path tube is housed respectively on the two through hole; Said flow-path tube is connected with the two ends runner mouth of second runner of said cold drawing through connecting tube respectively.
3. by the cabinet backboard of the described band liquid metal heat radiation of claim 2 mechanism, it is characterized in that the material of said cold drawing base and said cold drawing lid is copper, aluminium, stainless steel, graphite or adamas;
Described cabinet backboard material is copper, aluminium, iron or the stainless steel with high heat conductance.
4. by the cabinet backboard of the described band liquid metal heat radiation of claim 1 mechanism, it is characterized in that said second runner is linear runner, zigzag runner, spiral flow channel or the tree-like runner of branch, its width of flow path is 1 micron～50 millimeters.
5. by the cabinet backboard of claim 1 or 2 described band liquid metal heat radiation mechanisms, it is characterized in that said first flow is welded on the cabinet backboard lateral surface or is welded on the cabinet backboard medial surface; It is linear runner, zigzag runner, spiral flow channel or the tree-like runner of branch, and its width of flow path is 1 micron～500 millimeters.
6. by the cabinet backboard of claim 1 or 2 described band liquid metal heat radiation mechanisms, it is characterized in that described driving pump is a mechanical pump, electromagnetic pump, piezoelectric pump or electric Wetting pump.
7. by the cabinet backboard of the described band liquid metal heat radiation of claim 6 mechanism, it is characterized in that described driving pump is many series connections of pumps or many parallels connection of pumps.
8. by the cabinet backboard of claim 1 or 2 described band liquid metal heat radiation mechanisms, it is characterized in that said connecting line adopts plastic tube or metal tube.
9. press the cabinet backboard of the described band liquid metal heat radiation of claim 1 mechanism; It is characterized in that described liquid metal is to present liquid gallium, mercury, gallium base bianry alloy, gallium based multicomponent alloy, indium-base alloy, bismuth-base alloy, mercury-base alloy or Na-K alloy under the room temperature.
10. by the cabinet backboard of the described band liquid metal heat radiation of claim 9 mechanism, it is characterized in that said gallium base bianry alloy is gallium indium alloy, gallium lead alloy or gallium mercury alloy; Said gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin kirsite.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105636123A CN102478930A (en) | 2010-11-24 | 2010-11-24 | Case back plate with liquid metal heat dissipation mechanism |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105636123A CN102478930A (en) | 2010-11-24 | 2010-11-24 | Case back plate with liquid metal heat dissipation mechanism |
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| CN102478930A true CN102478930A (en) | 2012-05-30 |
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| CN2010105636123A Pending CN102478930A (en) | 2010-11-24 | 2010-11-24 | Case back plate with liquid metal heat dissipation mechanism |
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| CN103331754A (en) * | 2013-06-26 | 2013-10-02 | 清华大学 | Metal phase-change based flexible mechanical joint device |
| WO2014166238A1 (en) * | 2013-08-21 | 2014-10-16 | 中兴通讯股份有限公司 | Mobile terminal and heat dissipation method of liquid metal of same |
| CN105530802A (en) * | 2015-12-28 | 2016-04-27 | 联想(北京)有限公司 | Cooling system and electronic equipment |
| CN105555099A (en) * | 2015-12-09 | 2016-05-04 | 江苏大学 | Liquid heat-dissipation device based on tree-shaped fractal flow tube valveless piezoelectric pump |
| CN105636410A (en) * | 2015-12-28 | 2016-06-01 | 联想(北京)有限公司 | Heat pipe and electronic device |
| CN106055048A (en) * | 2016-05-19 | 2016-10-26 | 唐坤剑 | Computer heat-dissipation device |
| CN106376223A (en) * | 2016-11-24 | 2017-02-01 | 北京小米移动软件有限公司 | A liquid cooling system and electronic equipment |
| CN107193354A (en) * | 2017-06-21 | 2017-09-22 | 云南靖创液态金属热控技术研发有限公司 | A kind of liquid metal heat radiation device |
| CN107454802A (en) * | 2017-08-11 | 2017-12-08 | 昆明品启科技有限公司 | A kind of heat abstractor and method based on flowing liquid metal |
| CN107844176A (en) * | 2016-09-20 | 2018-03-27 | 凌今 | Passive heat dissipation type water cooling cabinet |
| CN108235664A (en) * | 2018-02-05 | 2018-06-29 | 四川九洲电器集团有限责任公司 | A kind of closed cabinet of liquid metal self-loopa heat dissipation |
| US10031564B2 (en) | 2015-12-28 | 2018-07-24 | Lenovo (Beijing) Limited | Heat dissipation apparatus and system for an electronic device |
| CN108457854A (en) * | 2018-02-12 | 2018-08-28 | 云南靖创液态金属热控技术研发有限公司 | A kind of gear pump |
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| CN112105226A (en) * | 2020-09-10 | 2020-12-18 | 杭州电子科技大学 | High-power chip heat dissipation system with built-in spiral liquid channel and heat dissipation method thereof |
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| CN103331754B (en) * | 2013-06-26 | 2015-07-15 | 清华大学 | Metal phase-change based flexible mechanical joint device |
| CN103331754A (en) * | 2013-06-26 | 2013-10-02 | 清华大学 | Metal phase-change based flexible mechanical joint device |
| WO2014166238A1 (en) * | 2013-08-21 | 2014-10-16 | 中兴通讯股份有限公司 | Mobile terminal and heat dissipation method of liquid metal of same |
| CN105555099A (en) * | 2015-12-09 | 2016-05-04 | 江苏大学 | Liquid heat-dissipation device based on tree-shaped fractal flow tube valveless piezoelectric pump |
| CN105555099B (en) * | 2015-12-09 | 2018-12-14 | 江苏大学 | A kind of liquid heat radiating device based on tree-like fractal flow tube Valveless piezoelectric pump |
| US10031564B2 (en) | 2015-12-28 | 2018-07-24 | Lenovo (Beijing) Limited | Heat dissipation apparatus and system for an electronic device |
| CN105530802A (en) * | 2015-12-28 | 2016-04-27 | 联想(北京)有限公司 | Cooling system and electronic equipment |
| CN105636410A (en) * | 2015-12-28 | 2016-06-01 | 联想(北京)有限公司 | Heat pipe and electronic device |
| CN105636410B (en) * | 2015-12-28 | 2018-10-12 | 联想(北京)有限公司 | Heat pipe and electronic equipment |
| CN105530802B (en) * | 2015-12-28 | 2018-08-10 | 联想(北京)有限公司 | Cooling system and electronic equipment |
| CN106055048A (en) * | 2016-05-19 | 2016-10-26 | 唐坤剑 | Computer heat-dissipation device |
| CN107844176A (en) * | 2016-09-20 | 2018-03-27 | 凌今 | Passive heat dissipation type water cooling cabinet |
| CN106376223A (en) * | 2016-11-24 | 2017-02-01 | 北京小米移动软件有限公司 | A liquid cooling system and electronic equipment |
| CN107193354A (en) * | 2017-06-21 | 2017-09-22 | 云南靖创液态金属热控技术研发有限公司 | A kind of liquid metal heat radiation device |
| CN107454802A (en) * | 2017-08-11 | 2017-12-08 | 昆明品启科技有限公司 | A kind of heat abstractor and method based on flowing liquid metal |
| CN108235664A (en) * | 2018-02-05 | 2018-06-29 | 四川九洲电器集团有限责任公司 | A kind of closed cabinet of liquid metal self-loopa heat dissipation |
| CN108457854A (en) * | 2018-02-12 | 2018-08-28 | 云南靖创液态金属热控技术研发有限公司 | A kind of gear pump |
| CN113170595A (en) * | 2018-09-04 | 2021-07-23 | 克劳斯·辛特雷克 | A device that cools a high-performance computer or circuit by temperature regulation |
| CN109640592A (en) * | 2018-12-29 | 2019-04-16 | 曙光节能技术（北京）股份有限公司 | A kind of radiator of electronic component |
| CN110678030B (en) * | 2019-10-08 | 2020-12-08 | 淄博职业学院 | A computer cooling system |
| CN110678030A (en) * | 2019-10-08 | 2020-01-10 | 淄博职业学院 | Heat dissipation system of computer |
| CN113133270A (en) * | 2020-01-14 | 2021-07-16 | 航天海鹰(哈尔滨)钛业有限公司 | Confined space forced cooling system based on special-shaped diffusion welding water-cooling plate |
| CN111315192A (en) * | 2020-03-11 | 2020-06-19 | 合肥丰蓝电器有限公司 | Liquid cooling type cold plate heat pipe heat exchange device |
| CN112105226A (en) * | 2020-09-10 | 2020-12-18 | 杭州电子科技大学 | High-power chip heat dissipation system with built-in spiral liquid channel and heat dissipation method thereof |
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Application publication date: 20120530 |