CN102489817B - Apparatus for removing a half semiconductor chip - Google Patents

Abstract

The invention discloses a device for removing half semiconductor chip, which comprises a heating part and a pushing part, wherein the heating part is provided with a heating surface; the pushing part extends from one end of the heating part downwards; one side of the pushing part close to the heating surface is provided with a pushing surface; and the pushing surface is approximately vertical to the heating surface. Due to the adoption of the heating device, an object which is originally fixed on a base material can be rapidly removed, and the object is effectively prevented from being damaged or broken.

Description

A device for removing a semiconductor chip

technical field

The invention relates to a heating device, in particular to a heating device which can effectively prevent objects from being damaged and broken. the

Background technique

Semiconductor chips are used in many electronic products, and these semiconductor chips are usually fixed on a substrate by solder or anisotropic conductive adhesive film. When the electrical connection between the semiconductor chip and the substrate is poor or the semiconductor chip itself has defects, it is necessary to remove the semiconductor chip fixed on the substrate. the

In the prior art, there is no proper device or equipment to remove the semiconductor chips fixed on the substrate. Usually, a heating device is used to heat the semiconductor chip manually, and then a jig is used to remove the semiconductor chip. During the above operation process, the semiconductor chip is likely to be broken and damaged, making subsequent analysis or rework impossible. the

On the other hand, in many electronic products, semiconductor chips are surrounded by other components. If the semiconductor chip is removed manually, it often happens that other surrounding components are damaged when the semiconductor chip is removed. the

In view of this, how to design a brand-new device to remove the semiconductor chips fixed on the substrate is a problem that technicians in the industry need to solve urgently. the

Contents of the invention

Aiming at the defect in the prior art that manually removing the semiconductor chip will damage other surrounding components, the present invention provides a heating device. the

According to one aspect of the present invention, there is provided a heating device capable of removing an object fixed on a substrate and effectively preventing the object from being damaged or broken during the removal process. The heating device includes a heating part and a pushing part. The heating part has a heating surface for heating the object to be removed. The pushing portion extends downward from one end of the heating portion, and the pushing portion has a pushing surface on a side adjacent to the heating surface, and the pushing surface is substantially perpendicular to the heating surface. the

Preferably, the abutment surface adjoins the heating surface. the

Preferably, the heating surface and the pushing surface are substantially plane. the

Preferably, the heating part has a plurality of first air holes, and each of the first air holes has an opening on the heating surface. the

Preferably, the pushing portion has a plurality of second air holes, and each of the second air holes has an opening on the pushing surface. the

Preferably, the heating device further includes a connection part, the connection part is physically connected to the heating part, and is used for transferring heat energy to the heating part. the

Preferably, a width of the heating surface is 1 mm to 5 mm, and a length of the heating surface is 0.5 cm to 3 cm. the

Preferably, the pushing portion has a bottom surface connected to the pushing surface, and the bottom surface is perpendicular to the pushing surface. the

Preferably, the side of the pushing portion away from the heating surface has an inclined surface, and a bottom of the pushing portion has a thickness of 0.5 mm to 3 mm. the

According to another aspect of the present invention, there is provided an apparatus for removing a semiconductor chip fixed on a substrate through a conductive layer. The device includes a heating part and a pushing part. The heating part has a heating surface for contacting and heating an upper surface of the semiconductor chip, thereby causing the conductive layer to be heated and melted. The pushing portion extends downward from one end of the heating portion, and the pushing portion has a pushing surface adjacent to the heating surface, and the pushing surface is substantially perpendicular to the heating surface, and the pushing portion is used to exert a contact force on the semiconductor chip, to remove the semiconductor chip. the

The invention can quickly remove the object originally fixed on the base material, and effectively prevent the object from being damaged and broken. the

Description of drawings

Readers will have a clearer understanding of various aspects of the present invention after reading the detailed description of the present invention with reference to the accompanying drawings. in,

Fig. 1 shows a schematic perspective view of a heating device according to an embodiment of the present invention. the

Fig. 2 shows a schematic cross-sectional view of a heating device according to another embodiment of the present invention. the

Fig. 3 shows a schematic cross-sectional view of a heating device according to another embodiment of the present invention. the

Fig. 4 shows a schematic cross-sectional view of a heating device according to yet another embodiment of the present invention. the

【Description of main component symbols】

100: heating device

110: heating department

110a: one end of the heating part

112: heating surface

114: First stomata

114a: opening

120: Pushing Department

120a: Bottom

122: push face

124: second stomata

124a: opening

126: bottom surface

128: Bevel

130: Connecting part

130a: Top

132: Groove

134: air supply channel

140: Semiconductor chip

142: Conductive layer

144: Active array substrate

146: color filter

W: width

L: Length

T: Thickness

F: Arrow

Detailed ways

In order to make the description of the present disclosure more detailed and complete, the following provides illustrative descriptions for the implementation modes and specific examples of the present invention; but this is not the only form for implementing or using the specific embodiments of the present invention. The various embodiments disclosed below can be combined or replaced with each other when beneficial, and other embodiments can also be added to one embodiment, without further description or illustration. the

In the following description, numerous specific details will be set forth in order to enable readers to fully understand the following embodiments. However, embodiments of the invention may be practiced without these specific details. In other instances, well-known structures and devices are only schematically shown in order to simplify the drawings. the

The specific implementation manners of the present invention will be described in further detail below with reference to the accompanying drawings. FIG. 1 shows a schematic perspective view of a heating device 100 according to an embodiment of the present invention. Referring to FIG. 1 , the heating device 100 includes a heating part 110 and a pushing part 120 . the

The heating part 110 has a heating surface 112 for heating an object. The heating part 110 can be made of metal materials such as stainless steel or aluminum alloy, so that the heating part has good thermal conductivity. In one embodiment, the heating surface 112 is substantially flat. The width W of the heating surface 112 may be, for example, 1 mm to 5 mm, specifically about 2 mm. The length L of the heating surface 112 may be, for example, 0.5 cm to 3 cm, specifically 1 to 2 cm. The heating unit 110 can generate a high temperature of 300° C. or higher on the heating surface 112 . the

In one embodiment, the heating device 100 further includes a connecting portion 130 . The connection part 130 is physically connected to the heating part 110 and is used for transferring heat energy to the heating part 110 . For example, the top 130a of the connecting portion 130 can be used to connect to a heat source, such as a heat gun or a soldering iron. Therefore, heat can be transferred to the heating surface 112 of the heating part 110 through the connection part 130 . the

The pushing portion 120 extends downward from the end 110 a of the heating portion 110 . The pushing portion 120 has a pushing surface 122 adjacent to the heating surface 112 , and the pushing surface 122 is substantially perpendicular to the heating surface 112 . In one embodiment, the pushing surface 122 is substantially flat, and the pushing surface 122 is adjacent to the heating surface 112 . In another embodiment, the pushing portion 120 has a bottom surface 126 . The bottom surface 126 is also substantially a plane, and the bottom surface 126 is adjacent to and perpendicular to the pushing surface 122. In other words, the bottom surface 126 is substantially parallel to the heating surface 112 . The vertical distance between the bottom surface 126 and the heating surface 112 may be, for example, 1-3 mm. The thickness T of the pushing portion 120 may be, for example, 0.5-3 mm. the

FIG. 2 shows a schematic cross-sectional view of a heating device 100 according to another embodiment of the present invention. In this embodiment, the heating device 100 has an air supply channel 134 , and the air supply channel 134 extends from the inside of the connection part 130 to the inside of the heating part 110 and the pushing part 120 . The heating part 110 has a plurality of first air holes 114 , and the first air holes 114 have an opening 114 a located on the heating surface 112 . Similarly, the pushing portion 120 has a plurality of second air holes 124 , and the second air holes 124 have an opening 124 a located on the pushing surface 122 . The air supply channel 134 communicates with the first air holes 114 and the second air holes 124 . Therefore, the high-temperature air A can be supplied to the first air hole 114 and the second air hole 124 through the air supply channel 134 , and the high-temperature air A can flow out from the opening 114 a and the opening 124 a to heat an object. In an embodiment, only the first air hole 114 of the heating part 110 may be configured without the second air hole 124 of the pushing part 120 . the

FIG. 3 shows a schematic cross-sectional view of a heating device 100 according to another embodiment of the present invention. In this embodiment, the pushing portion 120 has an inclined surface 128 on a side away from the heating surface 112 . The thickness T of the bottom 120 a of the pushing portion 120 may be, for example, 0.5 mm to 3 mm. the

The heating device 100 of the present invention is used for removing an object fixed on a substrate. In a specific application, the object is a semiconductor chip 140 , and the semiconductor chip 140 is fixed on the active array substrate 144 through the conductive layer 142 , as shown in FIG. 3 . The conductive layer 142 is, for example, an anisotropic conductive layer (ACF). A color filter 146 is also disposed on the active array substrate 144 . When it is necessary to remove the semiconductor chip 140 for analysis or other reasons, the heating device 100 can be used to remove the semiconductor chip. How it works is described in detail below. the

First, move the heating device 100 to a proper position, make the heating surface 112 of the heating part 110 contact the upper surface of the semiconductor chip 140 , and the contact surface 122 of the contact part 120 contact the side surface of the semiconductor chip 140 . Then, the semiconductor chip 140 is heated by the heating surface 112 of the heating part 110 , the temperature of the semiconductor chip 140 is raised, and the conductive layer 142 under the semiconductor chip 140 is heated and melted by the principle of heat conduction. At this time, move the heating device 100 in the direction of the arrow F, so that the pushing surface 122 of the pushing portion 120 exerts a contact force on the semiconductor chip 140 to remove the semiconductor chip 140 from the active array substrate 144 . the

In the above application, the width of the gap between the semiconductor chip 140 and the color filter 146 is limited, for example, 3mm. Therefore, according to an embodiment of the present invention, the thickness T of the pushing portion 120 is 0.5 mm to 3 mm. In addition, in order to avoid damaging the semiconductor chip 140 during the process of removing the semiconductor chip 140 , the pushing surface 122 is substantially perpendicular to the heating surface 112 . The so-called “approximately vertical” means that the pushing surface 122 is substantially perpendicular to the heating surface 112 , so that the heating surface 112 and the pushing surface 122 can firmly contact the upper surface and the side surface of the semiconductor chip 140 respectively. For example, an included angle formed between the pushing surface 122 and the heating surface 112 is 85-95 degrees, more specifically about 90 degrees. the

FIG. 4 shows a schematic cross-sectional view of a heating device 100 according to yet another embodiment of the present invention. In this embodiment, the pushing surface 122 is not directly adjacent to or connected to the heating surface 112 . Specifically, there is a groove 132 between the pushing surface 122 and the heating surface 112 . The groove 132 is used for accommodating the edge 144 of the semiconductor chip 140 , so as to prevent the edge 144 of the semiconductor chip 140 from being cracked during the process of removing the semiconductor chip 140 . the

From the above embodiments of the present invention, it can be seen that the application of the present invention can quickly remove the object originally fixed on the substrate, and effectively prevent the object from being damaged or broken. According to the embodiment of the present invention, it is applicable to remove the semiconductor chip on the display panel, so as to prevent the semiconductor chip from cracking during the removal process. the

Hereinbefore, specific embodiments of the present invention have been described with reference to the accompanying drawings. However, those skilled in the art can understand that without departing from the spirit and scope of the present invention, various changes and substitutions can be made to the specific embodiments of the present invention. These changes and replacements all fall within the scope defined by the claims of the present invention. the

Claims (11)

1. A device for removing a semiconductor chip, said semiconductor chip being fixed on a base material through a conductive layer, characterized in that said device comprises: a heating device which moves in a direction and is used for removing Except for one object, the heating device includes: a heating part having a heating surface for contacting and heating an upper surface of the semiconductor chip, whereby the conductive layer is heated and melted for heating the object; and a pushing portion extending downward from one end of the heating portion, the pushing portion has a pushing surface adjacent to the heating surface, and the pushing surface is substantially perpendicular to the heating surface, the The pushing part is used to apply a contact force to the semiconductor chip to remove the semiconductor chip, and there is a groove between the pushing surface and the heating surface, and the groove is used to accommodate placed on the edge of the semiconductor chip. the 2. The device of claim 1, wherein the abutment surface abuts the heating surface. the 3. The device of claim 1, wherein the heating surface and the pushing surface are substantially planar. the 4. The device according to claim 1, wherein the heating part has a plurality of first air holes, and each of the first air holes has an opening on the heating surface. the 5. The device according to claim 1, wherein the pushing portion has a plurality of second air holes, and each of the second air holes has an opening positioned on the pushing surface. the 6 . The device according to claim 1 , further comprising a connection part, the connection part is physically connected to the heating part, and is used for transferring heat energy to the heating part. the 7. The device according to claim 1, wherein the pushing portion has a bottom surface connected to the pushing surface, and the bottom surface is perpendicular to the pushing surface. the 8 . The device according to claim 1 , wherein a side of the pushing portion away from the heating surface has an inclined surface, and a bottom of the pushing portion has a thickness of 0.5 mm to 3 mm. the 9. The device according to claim 1, wherein the semiconductor chip is fixed on an active array substrate through a conductive layer, a color filter is configured on the active array substrate, and the color filter There is a gap between the sheet and the semiconductor chip. the 10. The device of claim 9, wherein the heating device moves in a direction away from the color filter. the 11. The device according to claim 9, wherein the thickness of the pushing portion is less than or equal to the width of the gap, and the pushing portion is inserted into the gap so that the pushing surface contacts the gap. The side surface of the semiconductor chip. the