CN102504741A - High-heat conductivity and electric conductivity die bonding adhesive for carbon nano tube-filled high-power light-emitting diode (LED) - Google Patents
High-heat conductivity and electric conductivity die bonding adhesive for carbon nano tube-filled high-power light-emitting diode (LED) Download PDFInfo
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- CN102504741A CN102504741A CN2011103295203A CN201110329520A CN102504741A CN 102504741 A CN102504741 A CN 102504741A CN 2011103295203 A CN2011103295203 A CN 2011103295203A CN 201110329520 A CN201110329520 A CN 201110329520A CN 102504741 A CN102504741 A CN 102504741A
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Abstract
The invention relates to a high-heat conductivity and electric conductivity die bonding adhesive for a carbon nano tube-filled high-power light-emitting diode (LED), which belongs to the technical field of LED packaging materials, and comprises the following raw materials in weight percentage: 15-25 percent of epoxy resin, 0.5-1.5 parts of carbon nano tube, 1-2 parts of coupling agent, 1.2-2 percent of curing agent, 0.4-0.7 percent of curing accelerator and 75-80 percent of electric conduction filler. The raw materials are evenly mixed and stirred, and vacuum defoaming is performed so as to obtain the high-heat conductivity and electric conductivity die bonding adhesive for the carbon nano tube-filled high-power LED. In the high-heat conductivity and electric conductivity die bonding adhesive for the carbon nano tube-filled high-power LED, the epoxy resin with low viscosity is adopted, thereby, the system viscosity of the resin is improved, and the dispersion of the electric conduction filler is promoted, and moreover, the electric conductivity and the heat conductivity of the electrically conductive adhesive are improved through adding the carbon nano tube. The prepared electrically conductive adhesive has better electric conductivity, heat conductivity and shearing strength after being cured.
Description
Technical field
The present invention relates to mixture type conductive adhesive, especially relate to a kind of carbon nano-tube filled type great power LED with high heat-conductivity conducting crystal-bonding adhesive stick; Be applicable to the solid brilliant package application occasion of great power LED, mainly play mechanics and fix, be electrically connected and heat conduction effectiveness.The invention still further relates to the preparation method of above-mentioned tackiness agent.
Background technology
LED is as a kind of special opto-electronic semiconductor module because have that antidetonation is shock-resistant, speed of photoresponse fast, characteristics such as power saving and life-span are long, be widely used in various indoor, outdoor display screens, automobile, aspects such as backlight; With the development of power-type LED, possesses one of the industry of giving priority to of LED illumination the becoming countries in the world of energy-conserving and environment-protective characteristic.Yet the common problem of current great power LED manufacturing industry is a radiating management, and the solid brilliant packaged material of the LED of exploitation high thermal conductivity becomes one of gordian technique that solves LED manufacturing industry bottleneck problem.
Epoxy resin has good cementability, thermotolerance, chemical resistance and physical strength, and price is relatively cheap, in the thermosetting resin field, is in dominant position.Yet it mainly is the low and poor toughness of thermal conductivity that epoxy resin uses its shortcoming as polymeric matrix.Present the most frequently used heat-conductivity conducting crystal-bonding adhesive also is an epoxy resin-base in the LED industry, has the low characteristic that reaches poor toughness of thermal conductivity equally.
Summary of the invention
The object of the present invention is to provide a kind of carbon nano-tube filled type great power LED with high heat-conductivity conducting crystal-bonding adhesive stick, research and develop the crystal-bonding adhesive stick of a kind of high thermal conductivity, strong mechanical performance for the heat dissipation problem that solves great power LED.
In addition, the invention still further relates to the preparation method of above-mentioned tackiness agent.
The object of the invention is realized through following technical measures: a kind of carbon nano-tube filled type great power LED is with high heat-conductivity conducting crystal-bonding adhesive stick, and it comprises following component by mass percent:
Epoxy resin 15～25%
Thinner 0.5～1.5%
Carbon nanotube 0.5～1%
Solidifying agent 1.2～2%
Amides curing catalyst 0.4～0.7%
Coupling agent 1～2%
Conductive filler material 75～80%
Above composition is mixed vacuum defoamation.
Described epoxy resin is a kind of or blend in Bisphenol F type, bisphenol A-type, cycloaliphatic epoxy resin, the aliphatic glycidyl ether based epoxy resin.
Described bisphenol f type epoxy resin is Bisphenol F 170 or Bisphenol F 862 etc.
Described carbon nanotube is single wall or multi-walled carbon nano-tubes.
Described thinner is butyl glycol ether, Diethylene Glycol hexyl ether etc.
Described coupling agent is silane coupling agent KH550, KH560 or KH570.
Described solidifying agent is imidazole curing agent, Dyhard RU 100 or acid anhydride type curing agent.
Described conductive filler material is the blend of silver powder and alloy for dental amalgam.
Described silver powder is flake silver powder, and particle diameter is 2～5 μ m.
Another object of the present invention realizes that through following technical measures the preparation method of above-mentioned tackiness agent: comprising: (1) places acid solution with multi-walled carbon nano-tubes; 10-15h vibrates in UW under 50 ℃; Then the deionized water with 2 times of acid solution volumes dilutes, and utilizes whizzer to filter out multi-walled carbon nano-tubes, and is washed till neutrality with deionized water; Then in 80 ℃ of following vacuum-drying 20-25h, the carbon nano tube products after the surface treatment that obtains;
(2) carbon nanotube after the above-mentioned processing is joined in the resin matrix, utilize centrifugal Defoaming machine to stir.Add other compositions, stir and vacuum defoamation.
Preparing method of the present invention, said carbon nanotube soaks after 20-24 hour in coupling agent KH560 reagent, joins in the resin matrix again.The weightmeasurement ratio of said multi-walled carbon nano-tubes and mixing acid is 1:1.
The present invention at first carries out surface-functionalized processing to carbon nanotube; Carbon nanotube after will handling then joins in the epoxy resin-base that contains certain thinner, utilizes whizzer fully to stir, and then adds components such as solidifying agent, promotor, coupling agent and silver powder; Fully stir; Guarantee the homodisperse of carbon nanotube in polymkeric substance, give full play to its excellent properties, prepare the conductive resin of high heat conduction H.T..It solidifies 1h, volume specific resistance≤10 down at 150 ℃
-4Ω .cm, shear tension intensity is greater than the conductive resin of 12.0Mpa, and thermal conductivity is applicable to the LED encapsulation occasion that heat-conductivity conducting is had higher requirements greater than 20W/M ℃.
The specific examples mode
In order to understand the present invention better, further illustrate content of the present invention below in conjunction with instance, but the present invention not only is confined to following embodiment.
Embodiment 1:
The multi-walled carbon nano-tubes of 100mg is placed 70% vitriol oil of 100ml and the mixing acid that 70% concentrated nitric acid forms (the V vitriol oil: V concentrated nitric acid=3:1); At the 12h that in the 100W UW, vibrates under 50 ℃; Then dilute, utilize whizzer to filter out multi-walled carbon nano-tubes, and be washed till neutrality with deionized water with the 200ml deionized water; Then in 80 ℃ of following vacuum-drying 24h, the carbon nano tube products after the surface treatment that obtains.Component by following weight:
Bisphenol F 170 16g
Butyl glycol ether 0.7 g
Multi-walled carbon nano-tubes 0.5 g
Dyhard RU 100 1.2 g
Amides curing catalyst 0.6 g
Coupling agent KH560 1 g
Flake silver powder 80 g
Butyl glycol ether and Bisphenol F 170 are mixed, and the multi-walled carbon nano-tubes after the above-mentioned processing joins in mixed Bisphenol F 170 resin matrixes, utilizes centrifugal Defoaming machine to stir.Continuing to add successively other each component Dyhard RU 100s, amides curing catalyst, coupling agent KH560, particle diameter is the flake silver powder of 2～5 μ m, stirs and vacuum defoamation, solidifies 1h down at 150 ℃ then, and recording volume specific resistance is 4.9 * 10
-4Ω .cm, shear tension intensity is 12.5Mpa, thermal conductivity is 23W/M ℃.
Embodiment 2:
The multi-walled carbon nano-tubes of 200mg is placed 70% concentrated nitric acid of 200ml; At the 10h that in the 100W UW, vibrates under 50 ℃; Then dilute, utilize whizzer to filter out multi-walled carbon nano-tubes, and be washed till neutrality with deionized water with the 400ml deionized water; Then in 80 ℃ of following vacuum-drying 20h, the carbon nano tube products after the surface treatment that obtains.Component by following weight:
Bisphenol F 862 20g
Butyl glycol ether 1.2 g
Multi-walled carbon nano-tubes 1.0 g
Dyhard RU 100 1.2 g
Amides curing catalyst 0.6 g
Coupling agent KH560 1 g
Flake silver powder 75 g
Butyl glycol ether and Bisphenol F 862 are mixed, and the multi-walled carbon nano-tubes after the above-mentioned processing joins and mixes in Bisphenol F 862 resin matrixes of back, utilizes centrifugal Defoaming machine to stir.Continuing to add successively other each component Dyhard RU 100s, amides curing catalyst, coupling agent KH560, particle diameter is the flake silver powder of 2～5 μ m, stirs and vacuum defoamation, solidifies 1h down at 150 ℃ then, and recording volume specific resistance is 5.9 * 10
-4Ω .cm, shear tension intensity is 13.5Mpa, thermal conductivity is 21W/M ℃.
Embodiment 3:
The multi-walled carbon nano-tubes of 100mg is placed 70% vitriol oil of 100ml; Under the effect of 100W UW, handle 15h in 90 ℃; Then dilute, utilize whizzer to filter out multi-walled carbon nano-tubes, and be washed till neutrality with deionized water with the 200ml deionized water; Then in 80 ℃ of following vacuum-drying 25h, the carbon nano tube products after the surface treatment that obtains.Component by following weight:
Cycloaliphatic epoxy resin TDE-85 18g
Diethylene Glycol hexyl ether 0.7 g
Multi-walled carbon nano-tubes 0.5 g
Dyhard RU 100 1.2g
Amides curing catalyst 0.6g
Coupling agent KH560 1g
Flake silver powder 78g
Diethylene Glycol hexyl ether and TDE-85 are mixed, and the multi-walled carbon nano-tubes of above-mentioned processing joins and mixes in the TDE-85 resin matrix of back, utilizes centrifugal Defoaming machine to stir.Continuing to add successively other each component Dyhard RU 100s, amides curing catalyst, coupling agent KH560, particle diameter is the flake silver powder of 2～5 μ m, stirs and vacuum defoamation, solidifies 1h down at 150 ℃ then, and recording volume specific resistance is 5.4 * 10
-4Ω .cm, shear tension intensity is 12.5Mpa, thermal conductivity is 20W/M ℃.
Embodiment 4:
The multi-walled carbon nano-tubes of 150mg is placed 70% concentrated nitric acid of 150ml; Under the effect of 100W UW,, then dilute, utilize whizzer to filter out multi-walled carbon nano-tubes with the 300ml deionized water in 90 ℃ of processing 15h; And be washed till neutrality with deionized water, then at 80 ℃ of following vacuum-drying 24h.In order to let carbon nanotube better disperse; The exsiccant carbon nanotube is soaked after 20-24 hour (the coupling agent KH560 of this immersion usefulness is not meant the coupling agent KH560 in the component) take out the carbon nano tube products after the surface treatment that obtains in coupling agent KH560 reagent.
Component by following weight:
Bisphenol F 862 19g
Diethylene Glycol hexyl ether 0.5g
Multi-walled carbon nano-tubes 1.2g
Dyhard RU 100 1.2g
Amides curing catalyst 0.6g
Coupling agent KH560 0.5g
Flake silver powder 77g
Diethylene Glycol hexyl ether and Bisphenol F 862 are mixed, and the multi-walled carbon nano-tubes of above-mentioned processing joins and mixes in Bisphenol F 862 resin matrixes of back, utilizes centrifugal Defoaming machine to stir.Continuing to add successively other each component Dyhard RU 100s, amides curing catalyst, coupling agent KH560, particle diameter is the flake silver powder of 2～5 μ m, stirs and vacuum defoamation, solidifies 1h down at 150 ℃ then, and recording volume specific resistance is 3.4 * 10
-4Ω .cm, shear tension intensity is 15.5Mpa, thermal conductivity is 24W/M ℃.
The foregoing description is a preferred implementation of the present invention, but embodiment of the present invention is not restricted to the described embodiments, and also can be a kind of or blend in Bisphenol F type, bisphenol A-type, the aliphatic glycidyl ether based epoxy resin like epoxy resin; Carbon nanotube also can be the single wall wall carbon nano tube; Coupling agent also can be silane coupling agent KH550, KH570 or titante coupling agent; Solidifying agent also can be imidazole curing agent or acid anhydride type curing agent; Conductive filler material also can be the blend of alloy for dental amalgam.Other any do not deviate from change, the modification done under spirit of the present invention and the principle, substitutes, combination, simplify, and all should be the substitute mode of equivalence, is included in protection scope of the present invention.
Claims (10)
1. a carbon nano-tube filled type great power LED is characterised in that with high heat-conductivity conducting crystal-bonding adhesive stick it comprises following component by mass percent:
Epoxy resin 15～25%
Thinner 0.5～1.5%
Carbon nanotube 0.5～1%
Solidifying agent 1.2～2%
Amides curing catalyst 0.4～0.7%
Coupling agent 1～2%
Conductive filler material 75～80%
Mix more than inciting somebody to action, vacuum defoamation promptly gets.
2. a kind of carbon nano-tube filled type great power LED according to claim 1 is characterized in that with high heat-conductivity conducting crystal-bonding adhesive stick: described epoxy resin is a kind of or its blend in Bisphenol F type, bisphenol A-type, cycloaliphatic epoxy resin, the aliphatic glycidyl ether based epoxy resin.
3. a kind of carbon nano-tube filled type great power LED according to claim 2 is characterized in that with high heat-conductivity conducting crystal-bonding adhesive stick: described bisphenol f type epoxy resin is Bisphenol F 170 or Bisphenol F 862 resins.
4. a kind of carbon nano-tube filled type great power LED according to claim 1 is with high heat-conductivity conducting crystal-bonding adhesive stick, and it is characterized in that: described coupling agent is silane coupling agent KH550, KH560 or KH570.
5. a kind of carbon nano-tube filled type great power LED according to claim 1 is with high heat-conductivity conducting crystal-bonding adhesive stick, and it is characterized in that: described solidifying agent is imidazole curing agent, Dyhard RU 100 or acid anhydride type curing agent.
6. a kind of carbon nano-tube filled type great power LED according to claim 1 is with high heat-conductivity conducting crystal-bonding adhesive stick, and it is characterized in that: described conductive filler material is a silver powder, and described silver powder is flake silver powder, and particle diameter is 2～5 μ m.
7. a kind of carbon nano-tube filled type great power LED according to claim 7 is with high heat-conductivity conducting crystal-bonding adhesive stick, and it is characterized in that: described carbon nanotube is single wall or multi-walled carbon nano-tubes.
8. the said a kind of carbon nano-tube filled type great power LED of claim 1 is characterized in that with the preparation method of high heat-conductivity conducting crystal-bonding adhesive stick:
(1) multi-walled carbon nano-tubes is placed acid solution; 10-15h vibrates in UW under 50 ℃; Then the deionized water with 2 times of acid solution volumes dilutes, and utilizes whizzer to filter out multi-walled carbon nano-tubes, and is washed till neutrality with deionized water; Then in 80 ℃ of following vacuum-drying 20-25h, the carbon nano tube products after the surface treatment that obtains;
(2) carbon nanotube after the above-mentioned processing is joined in the resin matrix, utilize centrifugal Defoaming machine to stir, add other compositions, stir and vacuum defoamation.
9. preparation method according to claim 8 is characterized in that: said carbon nanotube soaks after 20-24 hour in coupling agent KH560 reagent, joins in the resin matrix again.
10. preparation method according to claim 8 is characterized in that: the weightmeasurement ratio of said multi-walled carbon nano-tubes and mixing acid is 1:1.
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| CN2011103295203A CN102504741A (en) | 2011-10-26 | 2011-10-26 | High-heat conductivity and electric conductivity die bonding adhesive for carbon nano tube-filled high-power light-emitting diode (LED) |
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| CN102732158A (en) * | 2012-06-26 | 2012-10-17 | 深圳市瑞丰光电子股份有限公司 | Solid crystal glue and LED packaging method |
| CN103805118A (en) * | 2014-02-21 | 2014-05-21 | 厦门大学 | Compound conductive adhesive for electronic packaging and preparation method thereof |
| CN104599740A (en) * | 2015-01-08 | 2015-05-06 | 安徽凤阳德诚科技有限公司 | Conductive silver paste with nanocarbon |
| CN105462514A (en) * | 2015-11-24 | 2016-04-06 | 苏州盖德精细材料有限公司 | High-performance polyimide modified epoxy resin conductive adhesive and preparation method thereof |
| CN105802531A (en) * | 2016-04-15 | 2016-07-27 | 安庆市晶科电子有限公司 | Electric-heating flame-retardant conductive silver adhesive for circuit board |
| CN105860901A (en) * | 2016-06-08 | 2016-08-17 | 蚌埠市正园电子科技有限公司 | Composite carbon nano tube filled and modified epoxy pouring sealant for LED display screen |
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| CN110093129A (en) * | 2018-01-31 | 2019-08-06 | 上海宝银电子材料有限公司 | A kind of great power LED high thermal conductivity conductive silver glue |
| CN110734724A (en) * | 2018-10-19 | 2020-01-31 | 嘉兴学院 | Preparation method of epoxy resin heat-conducting glue |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060197066A1 (en) * | 2005-03-07 | 2006-09-07 | Chih-Min Cheng | Low stress conductive adhesive |
| CN101260285A (en) * | 2008-04-21 | 2008-09-10 | 上海大学 | Thermosetting isotropic conductive adhesive and preparation method thereof |
| CN102002336A (en) * | 2010-12-09 | 2011-04-06 | 中国电器科学研究院 | Solvent-free high-performance conductive adhesive |
-
2011
- 2011-10-26 CN CN2011103295203A patent/CN102504741A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060197066A1 (en) * | 2005-03-07 | 2006-09-07 | Chih-Min Cheng | Low stress conductive adhesive |
| CN101260285A (en) * | 2008-04-21 | 2008-09-10 | 上海大学 | Thermosetting isotropic conductive adhesive and preparation method thereof |
| CN102002336A (en) * | 2010-12-09 | 2011-04-06 | 中国电器科学研究院 | Solvent-free high-performance conductive adhesive |
Non-Patent Citations (5)
| Title |
|---|
| 《Composites Science and Technology》 20060627 H.P. Wu et al "Properties investigation on isotropical conductive adhesives filled" 第1182-1186页，第2.2、3.3节，表1 1-10 , 第67期 * |
| 《电子工艺技术》 20110918 万超等 "导电胶研究现状及其在LED产业中的应用" 第268-271页，"1.4 粘接性"部分 1-10 第32卷, 第5期 * |
| H.P. WU ET AL: ""Properties investigation on isotropical conductive adhesives filled"", 《COMPOSITES SCIENCE AND TECHNOLOGY》 * |
| H.P. WU ET AL: ""Properties investigation on isotropical conductive adhesives filled"", 《COMPOSITES SCIENCE AND TECHNOLOGY》, no. 67, 27 June 2006 (2006-06-27) * |
| 万超等: ""导电胶研究现状及其在LED产业中的应用"", 《电子工艺技术》 * |
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| CN108130053A (en) * | 2017-12-21 | 2018-06-08 | 惠州市富济电子材料有限公司 | A kind of heat conduction silver paste and preparation method thereof |
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Application publication date: 20120620 |