CN102500858B - System for separating electronic component in waste and old circuit board by utilizing high-frequency induction heating and method - Google Patents
System for separating electronic component in waste and old circuit board by utilizing high-frequency induction heating and method Download PDFInfo
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- 230000006698 induction Effects 0.000 title claims abstract description 65
- 238000010438 heat treatment Methods 0.000 title claims abstract description 58
- 239000002699 waste material Substances 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004064 recycling Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 230000005484 gravity Effects 0.000 claims description 3
- 230000000704 physical effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 231100000614 poison Toxicity 0.000 claims description 2
- 230000007096 poisonous effect Effects 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 5
- 230000000505 pernicious effect Effects 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 2
- 239000000155 melt Substances 0.000 claims 1
- 238000003672 processing method Methods 0.000 claims 1
- 230000002459 sustained effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 20
- 238000011084 recovery Methods 0.000 abstract description 16
- 238000000926 separation method Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 12
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000010793 electronic waste Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 231100000331 toxic Toxicity 0.000 description 3
- 230000002588 toxic effect Effects 0.000 description 3
- 239000002341 toxic gas Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- GKPGEBCMRMQOPF-UHFFFAOYSA-N 2,3-dibromofuran Chemical compound BrC=1C=COC=1Br GKPGEBCMRMQOPF-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- 239000002344 surface layer Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Abstract
一种利用高频感应加热分离废旧电路板中电子元器件的系统及方法，该设备包括高频感应加热线圈、电路板固定夹子、可震动元器件回收网、焊锡回收盒、抽气泵、有害气体处理箱、通风口、可开箱盖、震动马达、感应线圈控制箱、外壳、后机盖；废旧电路板被夹于电路板固定夹子上，通过高频感应加热装置对电子元器件与基板连接的针脚处的焊锡进行加热熔化，通过电路板固定夹子震动使电子元器件与基板脱离。脱落下来的元器件和焊锡掉落到可震动元器件回收网上，可震动回收网通过震动使焊锡与元器件分离并继续下落到焊锡回收盒中进行回收。本发明具有快速、高效分离电子元器件的特点。
A system and method for separating electronic components from waste circuit boards by using high-frequency induction heating. Disposal box, air vent, openable box cover, vibration motor, induction coil control box, casing, rear machine cover; waste circuit boards are clamped on the circuit board fixing clips, and electronic components are connected to the substrate through a high-frequency induction heating device The solder at the pins is heated and melted, and the electronic components are separated from the substrate through the vibration of the circuit board fixing clip. The shed components and solders fall onto the vibrable component recovery net, and the vibratory recovery net separates the solder from the components through vibration and continues to fall into the solder recovery box for recycling. The invention has the characteristics of fast and efficient separation of electronic components.
Description
技术领域： Technical field:
本发明涉及一种利用高频感应加热分离废旧电路板中电子元器件的系统及方法，属于电子器件回收装备领域。The invention relates to a system and method for separating electronic components in waste circuit boards by using high-frequency induction heating, and belongs to the field of electronic device recovery equipment.
背景技术： Background technique:
现代社会发展速度日益加快，信息化发展尤为剧烈，随之而来的是大量电子废弃物的产生。这些电子废弃物给社会和环境带来了严重的危害，废旧印刷电路板就是这些电子废弃物中颇具代表性的一种。废旧印刷电路板主要由基板和焊接其上的各种构件组成，其中含有大量贱金属和部分贵重金属，可经过特殊工艺回收再利用。同时，电路板上的电子元器件经可靠性检测后有些还可重新使用，另外对含有害物质的电子元器件可进行选择性分离并单独处理，这样可以防止污染后续工艺。基于以上几点，对废旧印刷电路板进行合理的回收就显得尤为重要。要对其进行回收，首先就要拆除电路板上的电子元件，在拆除过程中要求，一方面快速拆除电子元器件，另一方面尽量保证电子元件的完好无损，最后还能对焊料进行回收。但是，目前电子元器件的拆除一般由手工完成，可一定程度上保证其元器件的完好无损，但是随着废旧电路板日益增多，手工拆除显然已经不能满足要求。The speed of development of modern society is accelerating day by day, and the development of informatization is particularly intense, followed by the generation of a large amount of electronic waste. These electronic wastes have brought serious harm to the society and the environment, and waste printed circuit boards are a representative type of these electronic wastes. Waste printed circuit boards are mainly composed of substrates and various components welded on them, which contain a large amount of base metals and some precious metals, which can be recycled and reused through special processes. At the same time, some of the electronic components on the circuit board can be reused after reliability testing. In addition, the electronic components containing harmful substances can be selectively separated and processed separately, which can prevent the subsequent process from being polluted. Based on the above points, it is particularly important to recycle waste printed circuit boards reasonably. To recycle it, the electronic components on the circuit board must first be removed. During the dismantling process, it is required to quickly remove the electronic components on the one hand, on the other hand to ensure that the electronic components are intact, and finally to recycle the solder. However, at present, the removal of electronic components is generally done by hand, which can ensure the integrity of the components to a certain extent, but with the increasing number of waste circuit boards, manual removal is obviously not enough to meet the requirements.
中国发明专利CN200960577Y(公告日2007.10.17)提出了一种拆卸工具，将电路板、待拆卸器件和拆卸工具一起送进回流炉加热，然后利用弹簧回复力将待拆卸器件与电路板分离。其缺点是：电路板整体受热，易变形变软受到破坏，此时与元器件的连接更复杂，单纯靠弹簧的回复力不易使待拆卸器件与电路板分离，拆卸率不高，拆除不彻底，变形的电路板对后期处理也有一定影响。中国发明专利CN201235436Y(公告日2009.5.13)提出了一种电路板拆卸机装置，是在传动网的中部下端设置加热管加热电路板达到拆卸的目的。其缺点是：加热管通过传动网间接加热电路板，其加热效率不高，电路板上电子元器件的针脚不能彻底熔化，元器件与电路板分离不彻底，电路板通过传动网时整体受热极易受到破坏，对后期处理有影响。Chinese invention patent CN200960577Y (announcement date 2007.10.17) proposes a disassembly tool. The circuit board, the device to be disassembled and the disassembly tool are sent to the reflow furnace for heating, and then the device to be disassembled is separated from the circuit board by using the spring restoring force. The disadvantages are: the whole circuit board is heated, easily deformed, softened and damaged. At this time, the connection with the components is more complicated. It is not easy to separate the components to be disassembled from the circuit board simply by the spring’s restoring force. The disassembly rate is not high and the disassembly is not complete. , The deformed circuit board also has a certain influence on the post-processing. Chinese invention patent CN201235436Y (announcement date 2009.5.13) proposes a circuit board dismantling machine device, which is to set a heating tube at the lower end of the transmission network to heat the circuit board to achieve the purpose of dismantling. Its disadvantages are: the heating tube indirectly heats the circuit board through the transmission network, the heating efficiency is not high, the pins of the electronic components on the circuit board cannot be completely melted, the components are not completely separated from the circuit board, and the overall heating of the circuit board is extremely high when passing through the transmission network. Vulnerable to damage and has an impact on post-processing.
高频感应加热是将金属导体放入感应器(线圈)内，当感应器中通入一定频率的交变电流时，周围即产生交变磁场。利用高频感应在金属导体(焊锡)中产生感应电动势，继而产生感应电流，电流在金属导体(焊锡)中根据焦耳定律，发出大量热量使金属导体(焊锡)被加热继而熔化。其优点是对金属材料加热效率最高、速度最快，且低耗环保。它已经广泛应用于各行各业对金属材料的加热处理中。它不但可以对工件整体加热，还能对工件局部针对性加热；可实现工件的深层透热，也可只对其表面、表层集中加热；可实现对金属与非金属区别加热。High-frequency induction heating is to put a metal conductor into the inductor (coil). When an alternating current of a certain frequency is passed into the inductor, an alternating magnetic field is generated around it. Using high-frequency induction to generate induced electromotive force in the metal conductor (solder), and then generate an induced current. The current in the metal conductor (solder) emits a large amount of heat according to Joule's law to heat the metal conductor (solder) and then melt it. Its advantages are the highest heating efficiency and the fastest speed for metal materials, and low consumption and environmental protection. It has been widely used in the heat treatment of metal materials in various industries. It can not only heat the workpiece as a whole, but also heat the workpiece in a targeted manner; it can realize deep heat penetration of the workpiece, or only concentrate on its surface and surface layer; it can realize differential heating of metals and non-metals.
发明内容 Contents of the invention
为了解决拆卸过程中分离不彻底，拆卸率不高的问题，本发明应用高频感应加热效应提出了一种利用高频感应加热分离废旧电路板中电子元器件的方法及系统。In order to solve the problem of incomplete separation and low disassembly rate during the disassembly process, the present invention uses the high-frequency induction heating effect to propose a method and system for separating electronic components in waste circuit boards by using high-frequency induction heating.
高频感应加热分离废旧电路板中电子元器件的系统，其包括：其包括高频感应加热线圈101、电路板固定夹子102、可震动元器件回收网103、焊锡回收盒104、抽气泵105、有害气体处理箱106、通风口107、可开箱盖108、震动马达109、感应线圈控制箱110、外壳111、后机盖112；系统本体由外壳111、连接在外壳顶部的可开箱盖108和位于外壳侧面的后机盖112组成，其构成一个封闭的腔体；高频感应加热线圈101设置于系统本体内部中上方，后机盖112中上部设制有安装高频感应加热线圈101的孔径，并保证其密封性；高频感应加热线圈101的输入端穿过后机盖112与系统本体背部的感应线圈控制箱110连接，构成了系统了高频感应加热装置；震动马达109穿过可开箱盖108与电路板固定夹子102连接，构成了系统的电路板震动固定装置；电路板固定夹子102与高频感应加热线圈101处于同一高度；在外壳111的两侧分别设置通风口107和抽气泵105，抽气泵105穿过外壳111的侧板通过管道与有害气体处理箱106连接，通风口107、抽气泵105和有害气体处理箱106共同组成有毒有害循环处理系统；在系统本体中下方设置可震动元器件回收网103，其底部设置焊锡回收盒104。A system for separating electronic components from waste circuit boards by high-frequency induction heating, which includes: a high-frequency induction heating coil 101, a circuit board fixing clip 102, a vibrating component recovery net 103, a solder recovery box 104, an air pump 105, Hazardous gas treatment box 106, vent 107, openable box cover 108, vibration motor 109, induction coil control box 110, shell 111, rear machine cover 112; system body consists of shell 111, openable box cover 108 connected to the top of the shell It is composed of the rear machine cover 112 located on the side of the shell, which forms a closed cavity; the high-frequency induction heating coil 101 is arranged in the middle and upper part of the system body, and the middle and upper part of the rear machine cover 112 is provided with a high-frequency induction heating coil 101. aperture, and to ensure its tightness; the input end of the high-frequency induction heating coil 101 passes through the rear machine cover 112 and connects with the induction coil control box 110 on the back of the system body, forming a high-frequency induction heating device for the system; the vibration motor 109 passes through the The opening cover 108 is connected with the circuit board fixing clip 102 to form a systematic circuit board vibration fixing device; the circuit board fixing clip 102 is at the same height as the high-frequency induction heating coil 101; vents 107 and Air suction pump 105, the air suction pump 105 passes through the side plate of the shell 111 and is connected with the harmful gas treatment box 106 through the pipeline. A vibrable component recovery net 103 is provided, and a solder recovery box 104 is provided at the bottom thereof.
所述电路板固定夹子102整体由塑料材质制成。The circuit board fixing clip 102 is entirely made of plastic material.
电路板固定夹子102通过连杆连接于震动马达109。The circuit board fixing clip 102 is connected to the vibration motor 109 through a connecting rod.
所述有害气体处理箱106内液体为低温碱性有机溶剂，包括乙醇和乙醚。The liquid in the harmful gas treatment box 106 is a low-temperature alkaline organic solvent, including ethanol and ether.
所述感应线圈控制箱110，其电参数：电流频率50kHz，电流30-50A，对应加热时间6s-10s。The electrical parameters of the induction coil control box 110 are: current frequency 50kHz, current 30-50A, corresponding heating time 6s-10s.
电路板固定夹子102加持电路板，电路板在高频感应加热线圈101中感应加热，元器件与基板连接的针脚处的焊锡受感应加热并且熔化，同时在电路板震动固定装置的物理作用下脱落，与基板分离；所脱落的电子元器件在重力作用下落到可震动元器件回收网103，熔化脱落的焊锡经过回收网震动又降落到焊锡回收盒104得到回收。The circuit board fixing clip 102 holds the circuit board, and the circuit board is heated by induction in the high-frequency induction heating coil 101, and the solder at the pins connecting the components and the substrate is heated and melted by induction, and at the same time falls off under the physical action of the circuit board vibration fixing device , separated from the substrate; the fallen electronic components fall to the vibrable component recovery net 103 under the action of gravity, and the melted and fallen off solder falls to the solder recovery box 104 for recycling after being vibrated by the recovery net.
本系统在处理过程中，电路板被固定于两个塑料夹子中间，两个塑料夹子中间距离可调节，以适应不同大小的电路板。由所述通风口107、抽气泵105和有害气体处理箱106组成有毒有害循环处理系统。加热过程中所产生有毒有害气体通过抽气泵105进入有害气体处理箱106进行安全处理，通风口107向系统内鼓入空气使整个系统内部空气达到循环，有害气体处理箱106内液体为低温碱性有机溶剂，包括乙醇和乙醚，有毒气体被有机溶剂吸收。During the process of this system, the circuit board is fixed between two plastic clips, and the distance between the two plastic clips can be adjusted to suit circuit boards of different sizes. The toxic and harmful circulation treatment system is composed of the air vent 107, the air pump 105 and the harmful gas treatment box 106. The toxic and harmful gases generated during the heating process enter the harmful gas treatment box 106 through the air pump 105 for safe treatment, and the vent 107 blows air into the system to circulate the air inside the entire system. The liquid in the harmful gas treatment box 106 is low-temperature alkaline Organic solvents, including ethanol and ether, toxic gases are absorbed by organic solvents.
本发明的特点在于通过高频感应加热只对金属焊锡加热，使之熔化，对高分子塑料并不作用，同时与物理震动相结合使电子元器件与电路基板脱落分离，焊锡熔化速度高，电子元器件无损完好。The feature of the present invention is that the high-frequency induction heating only heats the metal solder to make it melt, and has no effect on polymer plastics. At the same time, it combines with physical vibration to separate the electronic components from the circuit substrate, and the solder melting speed is high. Electronics The components are undamaged and intact.
附图说明 Description of drawings
图1为本发明主体结构示意图。Fig. 1 is a schematic diagram of the main structure of the present invention.
图2为本发明高频感应加热装置的主视图。Fig. 2 is a front view of the high-frequency induction heating device of the present invention.
图3为本发明高频感应加热装置的俯视图。Fig. 3 is a top view of the high-frequency induction heating device of the present invention.
图中标号：101、高频感应加热线圈，102、电路板固定夹子，103、可震动元器件回收网，104、焊锡回收盒，105、抽气泵，106、有害气体处理箱，107、通风口，108、可开箱盖，109、震动马达，110、感应线圈控制箱，111、外壳，112、后机盖。Numbers in the figure: 101, high-frequency induction heating coil, 102, circuit board fixing clip, 103, vibrating component recycling net, 104, solder recycling box, 105, air pump, 106, harmful gas treatment box, 107, vent , 108, can open case cover, 109, vibration motor, 110, induction coil control box, 111, shell, 112, rear machine cover.
具体实施方式 Detailed ways
下面依据附图对本发明进行说明。The present invention is described below according to accompanying drawing.
图1是整个系统的主体视图。整个系统的外壳111由高分子塑料做成，以保证感应线圈对外部框架没有影响。系统本体由外壳111、可开箱盖108和后机盖112组成；高频感应加热线圈101设置于系统内部中上方，系统后机盖112中上部设制有安装高频感应加热线圈101的孔径，并保证其密封性。高频感应加热线圈101穿过后机盖112与系统背部的感应线圈控制箱110连接，二者构成了系统了高频感应加热装置；震动马达109穿过可开箱盖108与电路板固定夹子102连接，二者构成了系统的电路板震动固定装置；在外壳111的两侧分别设置通风口107和抽气泵105，抽气泵105穿过外壳111的侧板通过管道与有害气体处理箱106连接，通风口107、抽气泵105和有害气体处理箱106共同组成有毒有害循环处理系统；在系统内部的中下方设置可震动元器件回收网103，其底部设置焊锡回收盒104。Figure 1 is a main view of the whole system. The shell 111 of the whole system is made of polymer plastics to ensure that the induction coil has no influence on the external frame. The system body is composed of a casing 111, an openable cover 108 and a rear cover 112; the high-frequency induction heating coil 101 is arranged in the middle and upper part of the system, and the middle and upper part of the system rear cover 112 is provided with an aperture for installing the high-frequency induction heating coil 101 , and ensure its tightness. The high-frequency induction heating coil 101 passes through the rear machine cover 112 and is connected with the induction coil control box 110 on the back of the system, and the two constitute a high-frequency induction heating device for the system; the vibration motor 109 passes through the openable case cover 108 and connects with the circuit board fixing clip 102 connected, the two constitute the circuit board vibration fixing device of the system; vents 107 and air pumps 105 are respectively arranged on both sides of the shell 111, and the air pump 105 passes through the side plate of the shell 111 and is connected with the harmful gas treatment box 106 through a pipeline. Ventilation port 107, air pump 105 and harmful gas treatment box 106 together form a toxic and harmful circulation treatment system; a vibrable component recovery net 103 is set in the middle and lower part of the system, and a solder recovery box 104 is set at the bottom.
图2为本发明高频感应加热装置的主视图。图中高频感应加热线圈101的输入线穿过设制有孔径的后机盖112与其后的感应线圈控制箱110连接，构成了系统的高频感应加热装置。Fig. 2 is a front view of the high-frequency induction heating device of the present invention. In the figure, the input line of the high-frequency induction heating coil 101 passes through the rear machine cover 112 provided with an aperture and is connected with the induction coil control box 110 behind, constituting the high-frequency induction heating device of the system.
图3为本发明高频感应加热装置的俯视图。Fig. 3 is a top view of the high-frequency induction heating device of the present invention.
设备工作过程中，被加热电路板会放出一些有毒害气体，如二溴呋喃等，此时在鼓风口107与抽气泵105协同作用下，有毒害气体会完全被抽进抽风口并通过管道进入有害气体处理箱106，使有毒害气体顺利得到处理。During the working process of the equipment, the heated circuit board will release some toxic gases, such as dibromofuran, etc. At this time, under the synergy of the air blast port 107 and the air pump 105, the toxic gas will be completely sucked into the air port and enter through the pipe. Harmful gas processing box 106 makes poisonous gas be processed smoothly.
电路板在高频感应加热线圈101中感应加热，元器件与基板连接的针脚处的焊锡受感应加热并且熔化，同时在电路板震动固定装置的物理作用下脱落，与基板分离。所脱落的电子元器件在重力作用下落到可震动元器件回收网103，熔化脱落的焊锡经过回收网震动又降落到焊锡回收盒104得到回收。The circuit board is heated by induction in the high-frequency induction heating coil 101, and the solder at the pins connecting the components and the substrate is heated and melted by induction, and at the same time falls off under the physical action of the circuit board vibrating fixture, and is separated from the substrate. The shed electronic components fall to the vibrable component recovery net 103 under the action of gravity, and the melted and fallen off solder falls to the solder recovery box 104 after being vibrated by the recovery net to be recovered.
工作过程示例。Example of work process.
示例1。Example 1.
取一废旧电路板，首先对废旧电路板上的插件、卡扣进行清除，并对一些螺纹构件进行拆除，去除一些电线电缆，最后对电路板以大小形状进行分类。Take a waste circuit board, first remove the plug-ins and buckles on the waste circuit board, remove some threaded components, remove some wires and cables, and finally classify the circuit boards by size and shape.
打开可开箱盖108，在电路板固定夹子102中装入电路板，盖上可开箱盖108，打开鼓风口107和抽风泵105，开启震动马达109，使可震动元器件回收网103处于震动状态，打开感应线圈控制箱110开关，设定高频感应加热设备电流50kHz，30A，加热时间10s，进行感应加热。Open the case cover 108 that can be opened, load the circuit board in the circuit board fixing clip 102, cover the case cover 108 that can be opened, open the blast port 107 and the suction pump 105, open the vibrating motor 109, and make the reclaiming net 103 of the vibrator components be in In the state of vibration, turn on the switch of the induction coil control box 110, set the current of the high-frequency induction heating equipment to 50kHz, 30A, and the heating time to 10s for induction heating.
关闭震动马达，打开可开箱盖108，取下电路板，此时，电路板上电子元器件基本脱落干净。Close the vibrating motor, open the openable case cover 108, and take off the circuit board. At this time, the electronic components on the circuit board basically come off clean.
示例2。Example 2.
打开可开箱盖108，在电路板固定夹子102中装入电路板，盖上可开箱盖108，打开鼓风口107和抽风泵105，开启震动马达109，使可震动元器件回收网103处于震动状态，打开感应线圈控制箱110开关，设定高频感应加热设备电流50kHz，40A，加热时间8s，进行感应加热。Open the case cover 108 that can be opened, load the circuit board in the circuit board fixing clip 102, cover the case cover 108 that can be opened, open the blast port 107 and the suction pump 105, open the vibrating motor 109, and make the reclaiming net 103 of the vibrator components be in In the state of vibration, turn on the switch 110 of the induction coil control box, set the current of the high-frequency induction heating equipment to 50kHz, 40A, and the heating time to 8s for induction heating.
关闭震动马达，打开可开箱盖108，取下电路板，此时，电路板上电子元器件完全脱落干净。Turn off the vibrating motor, open the openable case cover 108, and take off the circuit board. At this time, the electronic components on the circuit board come off completely.
示例3。Example 3.
打开可开箱盖108，在电路板固定夹子102中装入电路板，盖上可开箱盖108，打开鼓风口107和抽风泵105，开启震动马达109，使可震动元器件回收网103处于震动状态，打开感应线圈控制箱110开关，设定高频感应加热设备电流50kHz，50A，加热6s，进行感应加热。Open the case cover 108 that can be opened, load the circuit board in the circuit board fixing clip 102, cover the case cover 108 that can be opened, open the blast port 107 and the suction pump 105, open the vibrating motor 109, and make the reclaiming net 103 of the vibrator components be in In the state of vibration, turn on the switch 110 of the induction coil control box, set the current of the high-frequency induction heating equipment to 50kHz, 50A, and heat for 6s to perform induction heating.
关闭震动马达，打开可开箱盖108，取下电路板，此时，电路板上电子元器件完全脱落干净。电路板稍有软化。Turn off the vibrating motor, open the openable case cover 108, and take off the circuit board. At this time, the electronic components on the circuit board come off completely. The circuit board is slightly softened.
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| CN103484681A (en) * | 2013-10-23 | 2014-01-01 | 吉林大学 | Waste circuit board metal recovering device based on high-frequency induction heating principle |
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| JP3832135B2 (en) * | 1999-04-09 | 2006-10-11 | 松下電器産業株式会社 | Circuit board processing method |
| IT1311303B1 (en) * | 1999-12-07 | 2002-03-12 | Donizetti Srl | PROCEDURE AND EQUIPMENT FOR THE PROCESSING OF WASTE AND THERE ARE THROUGH INDUCED CURRENTS. |
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| CN201380345Y (en) * | 2009-03-20 | 2010-01-13 | 伟翔环保科技发展(上海)有限公司 | Automatic assembly line system for thermal disassembly of circuit board components |
| CN101537522B (en) * | 2009-03-20 | 2011-07-20 | 湖南万容科技有限公司 | Method and equipment for dismantling electronic components of waste printed circuit boards and recycling solder |
| JP2011082282A (en) * | 2009-10-06 | 2011-04-21 | Shigeki Kobayashi | Reflow apparatus |
| CN102069256B (en) * | 2010-12-20 | 2012-09-05 | 北京工业大学 | Electronic component removing device based on final treatment of waste circuit board |
| CN202278278U (en) * | 2011-10-28 | 2012-06-20 | 北京工业大学 | System for separating electronic elements in waste printed circuit boards by high-frequency induction heating |
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