CN102502253B - Conveying system for wafer-shaped object - Google Patents
Conveying system for wafer-shaped object Download PDFInfo
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- CN102502253B CN102502253B CN201110370142.3A CN201110370142A CN102502253B CN 102502253 B CN102502253 B CN 102502253B CN 201110370142 A CN201110370142 A CN 201110370142A CN 102502253 B CN102502253 B CN 102502253B
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- wafer
- shaped article
- processing unit
- mechanical hands
- conveying system
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- 238000000151 deposition Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000007704 transition Effects 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a conveying system for a wafer-shaped object, which belongs to the technical field of semiconductor wafer manufacture. The conveying system comprises at least two processing units (1) and mechanical hands (2), wherein, the distances between the mechanical hands (2) and the processing units (1) are equivalent, and the mechanical hands (2) are used for placing the wafer-shaped object to be processed in the processing units (1) and taking out the wafer-shaped object that is processed. The conveying system can store and take out the wafer-shaped object through the self-rotation and the lifting of the two mechanical hands by enabling the distances between the mechanical hands (2) and the processing units (1) to be equivalent, and can adopt a temporary storage platform to transit so as to achieve one wafer transition process or directly convey wafers to processing unit areas with the help of the movement of the mechanical hands on guiding rails after taking wafers from cassette areas by adopting the mechanical hands provided with the guiding rails; the two manners achieve simple motion path and are rapid and reliable to store and take out; and meanwhile, the conveying system can effectively reduce the occupied track area by compared with the same type of equipment.
Description
Technical field
The present invention relates to semiconductor crystal wafer manufacturing technology field, relate in particular to a kind of delivery system of wafer-shaped article.
Background technology
In prior art for delivery of the device of wafer-shaped article, its processing unit is linear arrangement, monosymmetric normally, and adopt a solid mechanical hand-screw to turn and get sheet (or sheet is got in a band guide mechanism hand cooperation) and place temporary platform, between processing of wafers unit and temporary platform, pick and place wafer by another one linear drive apparatus.
This mode relates to one and rotatablely moves and rotatablely move with another one and the compounding practice of the compound motion of straight-line motion composition, and kinematic accuracy design comparison complexity, affects access sheet speed, and access wafer movement path complexity.
Summary of the invention
(1) technical matters that will solve
The technical problem to be solved in the present invention is: a kind of delivery system of wafer-shaped article is provided, and its access sheet speed is fast, and the motion path of access wafer-shaped article is simple.
(2) technical scheme
For addressing the above problem, the invention provides a kind of delivery system of wafer-shaped article, comprise at least two processing units, manipulator, described manipulator, equate with the distance of each processing unit, for pending wafer-shaped article is placed into described processing unit, and the wafer-shaped article being disposed is taken out.The centre of gration of described manipulator equates with the distance of each processing unit processing enter.
Preferably, described processing unit is circumference or equilateral polygon array layout.
Preferably, also comprise at least one card casket, for the wafer-shaped article of depositing pending wafer-shaped article and being disposed.
Preferably, be describedly positioned at guide rail when the part in processing unit region with guide mechanism hand, make describedly to equate with the distance at each processing unit center with guide mechanism Shou center.
Preferably, described manipulator comprises: the card casket zone machines hand and the processing unit zone machines hand that is positioned at processing unit region that are positioned at card casket region.
Preferably, also comprise temporary platform, for the wafer-shaped article of depositing pending wafer-shaped article or being disposed temporarily.
(3) beneficial effect
The present invention is by making manipulator equate with the distance of each processing unit, rely on two manipulator self rotations and lifting to realize wafer-shaped article accessing operation, and can carry out transition by temporary platform and complete piece delivery process one time, or adopt with get from card casket region with guide mechanism hand sheet directly by by manipulator the movement on guide rail deliver to processing unit region, these two kinds of mode motion paths are simple, access fast and reliable, the present invention can effectively reduce shared footprint area compared with equipment of the same type simultaneously.
Brief description of the drawings
Fig. 1 is the structural representation that adopts the delivery system of the wafer-shaped article of temporary platform described in embodiment of the present invention;
Fig. 2 is the structural representation that adopts the delivery system of the wafer-shaped article with guide mechanism hand described in embodiment of the present invention.
Detailed description of the invention
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples are used for illustrating the present invention, but are not used for limiting the scope of the invention.
As shown in Figure 1-2, the delivery system of wafer-shaped article of the present invention, comprise at least two processing units 1, manipulator 2, described manipulator 2, equate with the distance of each processing unit 1, for pending wafer-shaped article is placed into described processing unit 1, and the wafer-shaped article being disposed is taken out.The access arm center of described manipulator 2 equates with the distance of each processing unit processing enter.
Preferably, described processing unit 1 is circumference or equilateral polygon array layout.
Preferably, also comprise at least one card casket 3, for the wafer-shaped article of depositing pending wafer-shaped article and being disposed.
Preferably, described manipulator 2 is band guide mechanism hand, is describedly positioned at guide rail 4 when the part in processing unit region with guide mechanism hand, makes describedly to equate with the distance at each processing unit 1 center with guide mechanism Shou center.
Preferably, described manipulator 2 comprises: the card casket zone machines hand and the processing unit zone machines hand that is positioned at processing unit region that are positioned at card casket region.
Preferably, also comprise temporary platform 5, for the wafer-shaped article of depositing pending wafer-shaped article or being disposed temporarily.
In the present invention, the motion path of wafer-shaped article has two kinds:
The motion path one of wafer-shaped article: fetch wafer-shaped article by card casket zone machines hand from card casket 3 and be placed on temporary platform 5; Fetching wafer-shaped article by processing unit zone machines hand from temporary platform 5 is placed into processing unit 1;
The motion path two of wafer-shaped article: band guide mechanism hands movement fetches wafer-shaped article to card casket region from card casket 3; Band guide mechanism hand clamping wafer-shaped article moves to processing unit region together; Band guide mechanism hand is put into wafer-shaped article in processing unit 1.
Above embodiment is only for illustrating the present invention; and be not limitation of the present invention; the those of ordinary skill in relevant technologies field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (3)
1. the delivery system of a wafer-shaped article, comprise at least two processing units (1), manipulator (2), it is characterized in that, described manipulator (2), equate with the distance of each processing unit (1), for pending wafer-shaped article is placed into described processing unit (1), and the wafer-shaped article being disposed is taken out;
Described processing unit (1) is circumference or equilateral polygon array layout;
Also comprise at least one card casket (3), for the wafer-shaped article of depositing pending wafer-shaped article and being disposed;
Described manipulator (2) is band guide mechanism hand, and described band guide mechanism hand is positioned at guide rail (4) in the time of the part in processing unit region, and described band guide mechanism Shou center is equated with the distance at each processing unit (1) center.
2. the delivery system of wafer-shaped article as claimed in claim 1, is characterized in that, also comprises temporary platform (5), for the wafer-shaped article of depositing pending wafer-shaped article or being disposed temporarily.
3. the delivery system of wafer-shaped article as claimed in claim 2, is characterized in that, described temporary platform comprises the temporary platform (6) of at least one pending wafer-shaped article and the temporary platform (7) of at least one wafer-shaped article that is disposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110370142.3A CN102502253B (en) | 2011-11-18 | 2011-11-18 | Conveying system for wafer-shaped object |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110370142.3A CN102502253B (en) | 2011-11-18 | 2011-11-18 | Conveying system for wafer-shaped object |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102502253A CN102502253A (en) | 2012-06-20 |
| CN102502253B true CN102502253B (en) | 2014-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110370142.3A Active CN102502253B (en) | 2011-11-18 | 2011-11-18 | Conveying system for wafer-shaped object |
Country Status (1)
| Country | Link |
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| CN (1) | CN102502253B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400789B (en) * | 2013-08-01 | 2018-01-26 | 上海集成电路研发中心有限公司 | Equipment platform system and its wafer transfer method |
| CN106315210B (en) * | 2015-07-10 | 2019-07-23 | 上海微电子装备（集团）股份有限公司 | A kind of film magazine access arrangement and method |
| CN106910702B (en) * | 2017-03-02 | 2019-05-03 | 泉州市憬承光电科技有限公司 | A kind of automatic wafer transporter and transport method |
| CN113071795B (en) * | 2021-03-31 | 2022-08-26 | 江苏创源电子有限公司 | Material storage box mechanism and material storage device |
| CN114204409A (en) * | 2022-02-18 | 2022-03-18 | 武汉锐晶激光芯片技术有限公司 | Chip cavity surface processing device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5944940A (en) * | 1996-07-09 | 1999-08-31 | Gamma Precision Technology, Inc. | Wafer transfer system and method of using the same |
| US7207766B2 (en) * | 2003-10-20 | 2007-04-24 | Applied Materials, Inc. | Load lock chamber for large area substrate processing system |
| US7534080B2 (en) * | 2005-08-26 | 2009-05-19 | Ascentool, Inc. | Vacuum processing and transfer system |
| JP4812660B2 (en) * | 2007-03-09 | 2011-11-09 | 信越ポリマー株式会社 | Substrate handling equipment and substrate handling method |
| CN101383311B (en) * | 2007-09-04 | 2010-12-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Wafer transmission system |
| JP4989398B2 (en) * | 2007-09-27 | 2012-08-01 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP5107122B2 (en) * | 2008-04-03 | 2012-12-26 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| CN202363437U (en) * | 2011-11-18 | 2012-08-01 | 北京七星华创电子股份有限公司 | Conveying system for wafer-shaped objects |
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2011
- 2011-11-18 CN CN201110370142.3A patent/CN102502253B/en active Active
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| Publication number | Publication date |
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| CN102502253A (en) | 2012-06-20 |
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