CN102548219A

CN102548219A - Circuit board manufacturing method

Info

Publication number: CN102548219A
Application number: CN201010606543XA
Authority: CN
Inventors: 廖建伦; 黄莉
Original assignee: Fukui Precision Component Shenzhen Co Ltd; Zhending Technology Co Ltd
Current assignee: Peng Ding Polytron Technologies Inc; Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Priority date: 2010-12-28
Filing date: 2010-12-28
Publication date: 2012-07-04
Anticipated expiration: 2030-12-28
Also published as: CN102548219B

Abstract

A method for manufacturing a circuit board, comprising the steps of: providing a circuit substrate, the circuit substrate has a conductive pattern layer and an insulating protective layer for protecting the conductive pattern layer, and the circuit board substrate includes a connected product area and an edge area, the conductive pattern layer of the product area includes at least two conductive terminals, the insulating protection layer of the product area has at least two through holes, and the at least two conductive terminals are respectively exposed in the at least two through holes Conductive ink is arranged on the surface of the insulating protective layer to form an ink structure in the product area, and an ink detection structure is formed on the surface of the insulating protective layer in the edge area, and the ink structure is electrically connected to the at least two conductive terminals , the ink detection structure includes a detection wire with a constant width; qualified.

Description

The manufacture method of circuit board

Technical field

The present invention relates to the circuit board making technology, particularly a kind of manufacture method of circuit board of enhancing productivity.

Background technology

Along with progress of science and technology, the application widely that printed circuit board (PCB) obtains at electronic applications.Application about circuit board sees also document Takahashi, A.Ooki, N.Nagai, A.Akahoshi; H.Mukoh, A.Wajima, M.Res.Lab; High density multilayer printed circuit board for HITAC M-880, IEEE Trans.on Components, Packaging; And Manufacturing Technology, 1992,15 (4): 418-425.And electronic products such as computer, mobile phone are being played the part of more and more important effect in people's daily life and automated production.Control and data input to computer, mobile phone etc. realize through button that mainly this shows, the importance of button circuit board is indubitable.

The button circuit board surface is almost full by key contacts row, and the phenomenon that the wiring realization connects on the conductive copper layer of circuit board can't be passed through in the contact that tends to occur being connected together.For solving this type of problem, a kind of wire jumper mode appears, that is, on the conductive copper layer of circuit board, increase insulating barrier earlier, make the contact that need be connected together be exposed to this insulating barrier, on this insulating barrier, increase the cabling rete again to realize the connection of contact.After forming the cabling rete, can form the cover layer that one deck is used to shield above that usually.The thickness of cabling rete is directly connected to the mechanical performance of key contacts and the quality of the conduction property between the key contacts.Usually adopt its square resistance R _ShWhether the thickness of weighing the cabling rete meets the requirements.Therefore, after forming the cabling rete, need test the square resistance of cabling rete.Square resistance R _ShEqual the ratio of resistivity and thicknesses of layers, be ρ/T.Existing a kind of method of measuring square resistance is after forming the cabling rete, before forming cover layer on the cabling rete, adopts FOUR-POINT PROBE METER to test.So, must purchase special instrument, and increase special testing procedure, the waste lot of manpower and material resources is unfavorable for enhancing productivity.

Summary of the invention

The present technique scheme provides a kind of manufacture method of circuit board, to practice thrift cost, to enhance productivity.

A kind of manufacture method of circuit board; Comprise step: circuit substrate is provided; Said circuit substrate has conductive pattern layer and the insulating protective layer that is used to protect said conductive pattern layer, and said circuit board substrate comprises product zone and the marginal zone that is connected, and the conductive pattern layer of said product zone comprises at least two conducting terminals; The insulating protective layer of said product zone has at least two through holes, and said at least two conducting terminals are exposed to respectively in said two through holes at least; At said insulating protection laminar surface electrically conductive ink is set; To form the printing ink structure in said product zone; Insulating protection laminar surface in said marginal zone forms the printing ink detection architecture; Said printing ink structure is electrically connected said at least two conducting terminals, and said printing ink detection architecture comprises the detection lead of constant width; And the conductive pattern layer of product zone carried out electrical detection, and detect the resistance value of lead, to judge according to the resistance value that detects lead whether the printing ink structure that is formed at product zone is qualified.

The manufacture method of the circuit board that the present technique scheme provides is distinguished on the edge of to form when product zone is made the printing ink structure and is comprised that width detects the printing ink detection architecture of lead uniformly.Within the specific limits whether the resistance value of the detection lead that records through judgement can be learnt whether the printing ink detection architecture is qualified, and then learn whether the printing ink structure of product zone is qualified.Use the manufacture method of the circuit board of present technique scheme, need not special detecting instrument, can carry out simultaneously, help practicing thrift cost, enhance productivity with the electrical testing process of circuit board.

Description of drawings

Fig. 1 is the structural representation of the circuit substrate that provides of present technique scheme first embodiment.

Fig. 2 is the structural representation after applying electrically conductive ink on the foregoing circuit substrate.

Fig. 3 is the phantom of Fig. 2 along the III-III line.

Fig. 4 carries out the structural representation of electrical detection to the foregoing circuit substrate.

Fig. 5 is the structural representation that is provided with on the circuit substrate that provides of present technique scheme second embodiment behind the electrically conductive ink.

Fig. 6 is the phantom of Fig. 5 along the VI-VI line.

Fig. 7 is the vertical view of printing ink detection architecture.

The main element symbol description

Circuit substrate

10,20

Product zone 101,201

Marginal zone 102,202

Basalis 11

Conductive pattern layer 12

Conducting terminal 120

Lead 121

Insulating

protective layer

13,23

Through hole 130

Printing ink structure 140,240

Printing ink detection architecture 141,241

Printing ink terminal 142

Connecting line 143

Detection terminal 144,244

Detect lead 145,245

First detects conducting line segment 246

Joint detection conducting line segment 247

Second detects conducting line segment 248

Electrical measurement machine 100

Detector probe 103

Controller 104

Embodiment

To combine the manufacture method of the circuit board that accompanying drawing and a plurality of embodiment provide the present technique scheme to do further explain below.

Present technique scheme first embodiment provides a kind of manufacture method of circuit board, and it may further comprise the steps:

The first step sees also Fig. 1, and circuit substrate 10 is provided.Said circuit substrate 10 can be the cuboid plate, and it comprises the product zone 101 and marginal zone 102 that is connected.In the present embodiment, said product zone 101 is positioned at circuit substrate 10 middle parts, and its shape of cross section is rectangle, and said marginal zone 102 is around being connected in around the product zone 101, ringwise.

Said circuit substrate 10 is the single face copper-clad base plate, and it comprises basalis 11, conductive pattern layer 12 and the insulating protective layer 13 that stacks gradually.Basalis 11 can only comprise a layer insulating, also can comprise at least one layer of line layer and at least one layer insulating alternately arranged.In the present embodiment, circuit substrate 10 is the single face copper-clad base plate, and basalis 11 only comprises a layer insulating.

The conductive pattern layer 12 of said product zone 101 comprises at least two conducting terminals 120 and at least one lead 121.In the present embodiment, said conductive pattern layer 12 comprises two conducting terminals 120 and three leads 121.Said two conducting terminals 120 are intervally arranged.Said three leads 121 laterally arrange, and between said two conducting terminals 120.Certainly, to the circuit board product of different model, said conductive pattern layer 12 can correspondingly be other structures also.Certainly, it will be understood by those skilled in the art that the quantity of conducting terminal 120, lead 121 is not limit, the concrete formation of conductive pattern layer 12 is not limit yet, and conductive pattern layer 12 can also comprise structures such as other pad, edge connector or All other routes.Fig. 1 only is the structure that schematically illustrates conductive pattern layer 12.

Said insulating protective layer 13 is used to protect said conductive pattern layer 12.The insulating protective layer 13 of said product zone 101 covers the lead 121 of said conductive pattern layer 12 and fills the space of said conductive pattern layer 12, and exposes conducting terminal 120.Said insulating protective layer 13 offers at least two through holes 130, and said at least two through holes 130 are corresponding one by one with said at least two conducting terminals 120, and said at least two conducting terminals 120 are exposed to respectively in said two through holes 130 at least.

Second step; On said insulating protective layer 13 surfaces electrically conductive ink is set; To form printing ink structure 140 in said product zone 101; Insulating protective layer 13 surfaces in said marginal zone 102 form the printing ink detection architecture 141 that is electrically connected said at least two conducting terminals 120, thereby obtain structure as shown in Figure 2.

Said electrically conductive ink can be carbon ink, and printing ink structure 140 can be formed at said insulating protective layer 13 through the mode of screen painting or coating with printing ink detection architecture 141.In the present embodiment, printing ink structure 140 all is formed at said insulating protective layer 13 surfaces through screen painting with printing ink detection architecture 141.

Said printing ink structure 140 comprises at least two printing ink terminals 142 and at least one connecting line 143.Said at least two printing ink terminals 142 are corresponding one by one with said at least two conducting terminals 120.The shape of said printing ink terminal 142 is corresponding with the shape of said conducting terminal 120, and each printing ink terminal 142 all is filled in the through hole 130 of a correspondence of said insulating protective layer 13.Each connecting line 143 all is connected between two printing ink terminals 142.Certainly, with the structure of conductive pattern layer 12 accordingly, to the circuit board product of different model, said printing ink structure 140 also can be other structures.The quantity that it will be understood by those skilled in the art that printing ink terminal 142 and connecting line 143 is not limit, and the concrete formation of printing ink structure 140 is not limit yet.Fig. 2 only is the structure that schematically illustrates printing ink structure 140.In the present embodiment, with the structure of said conductive pattern layer 12 accordingly, the quantity of said printing ink terminal 142 also is two, and the quantity of connecting line 143 is merely one.

Please consult Fig. 2 and Fig. 3 in the lump, said printing ink detection architecture 141 comprises two detection terminals 144 and a detection lead 145.Detect the constant width of lead 145.Said two detection terminals 144 are connected in the two ends of said detection lead 145.If the length of said detection lead 145 is L, width is W, and length-width ratio N is L/W.In the present embodiment, each detection terminal 144 is cuboid, and said detection lead 145 is a strip.When printing forms printing ink detection architecture 141, through design, make the length of each detection terminal 144 be 1.2 millimeters to web plate, width is 0.6 millimeter.Said detection lead 145 is connected between two adjacent long limits of said two detection terminals 144.The length L of said detection lead 145 is 20 millimeters, and width W is 0.4 millimeter, and said length-width ratio N is 50.In the present embodiment, the live width of the live width of said detection lead 145 and the connecting line of product zone 143 is unequal.Certainly, the live width of said detection lead 145 also can equal the live width of connecting line 143.

Certainly, after forming printing ink structure 140 and printing ink detection architecture 141, can also form the protective layer that covers said printing ink structure 140 in said product zone 101.

The 3rd step; See also Fig. 4; Conductive pattern layer 12 to said circuit substrate 10 product zone 101 is carried out electrical detection, and detects the resistance value of the detection lead 145 of marginal zone 102, and judges according to the resistance value that detects lead 145 whether the printing ink structure 140 that is formed at product zone 101 is qualified.

Particularly, can take following steps:

At first, electrical measurement machine 100 is provided, it comprises two detector probe 103 and a controller 104.Said two detector probe 103 are corresponding one by one with said two detection terminals 144.

Certainly, electrical measurement machine 100 can also comprise other detector probe that are used for the product zone 101 of circuit substrate 10 is carried out electrical detection.When said electrical measurement machine 100 detects the resistance value of 144 of above-mentioned two detection terminals, also the conductive pattern layer 12 of circuit substrate 10 product zone 101 is carried out electrical detection.

Secondly, make two detector probe 103 and said two detection terminals, 144 corresponding contacts respectively, detect the resistance value R of said detection lead 145.

At last, said controller 104 judges according to the resistance value that detects lead 145 whether the printing ink structure 140 that is formed at product zone 101 is qualified.

The square resistance of supposing said detection lead 145 is R _Sh, and regulation square resistance R _ShValue greater than minimum square resistance R _Sh1, and less than the largest block resistance R _Sh2The time, the detection lead 145 of formation meets the requirements.According to the law of resistance, resistance R=ρ * L/ (T*W)=L*R _Sh/ W.For the printing ink detection architecture 141 of present embodiment, owing to detect the width of the length of lead 145 much larger than detection terminal 144, so ignore the resistance of detection terminal 144.104 pairs of testing results of controller are analyzed, when the resistance value R that records greater than L*R _Sh1/ W and less than L*R _Sh2During/W, then judge the square resistance R of printing ink detection architecture 141 _ShIn the scope of regulation.In the present embodiment, said length-width ratio N is 50, and the minimum square resistance R that sets _Sh1Be 17 ohm of every sides, the largest block resistance R _Sh2Be 20 ohm of every sides.That is to say, in the present embodiment, the resistance value R that records in 850 ohm to 1000 ohm scopes, the square resistance R of printing ink detection architecture 141 then _ShIn the scope of regulation, thereby explanation judges that the thickness of printing ink detection architecture 141 is qualified.Because printing ink detection architecture 141 adopts same technology with the printing ink structure 140 of product zone 101, in same step, forms, and is also qualified thereby explanation is positioned at the printing ink structure 140 of product zone 101.

The manufacture method of the circuit board that present technique scheme first embodiment provides is distinguished the printing ink detection architecture 141 that 102 formation comprise the detection lead 145 of constant width on the edge of when product zone 101 is made printing ink structure 140.Whether the resistance value R that only need judge the detection lead 145 that records in the certain limit, can learn whether printing ink detection architecture 141 is qualified, and then learn whether the printing ink structure 140 of product zone is qualified.The manufacture method of the circuit board that use present technique scheme first embodiment provides need not special detecting instrument, can carry out simultaneously with the electrical testing process of circuit board, helps practicing thrift cost, enhances productivity.

Please consult Fig. 5 to Fig. 7 in the lump, the manufacture method of the circuit board that present technique scheme second embodiment provides and first embodiment's is roughly the same, also comprises step:

The first step provides the circuit substrate 20 that comprises product zone 201 and center on the marginal zone 202 that is connected in said product zone 201.

Second step was provided with electrically conductive ink on insulating protective layer 23 surfaces, to form printing ink structure 240 in said product zone 201, formed printing ink detection architecture 241 on insulating protective layer 23 surfaces of said marginal zone 202, obtained structure as shown in Figure 5.

Different with first embodiment is, in the said printing ink detection architecture 241, said detection lead 245 is a broken line, it comprise link to each other successively first detect conducting line segment 246, joint detection conducting line segment 247 and second detects conducting line segment 248.A detection terminal 244 is connected in first and detects conducting line segment 246, and another detection terminal 244 is connected in second and detects conducting line segment 248.Said joint detection conducting line segment 247 and first detects between the conducting line segment 246 has angle.Also has angle between said second detection conducting line segment 248 and the said joint detection conducting line segment 247.In the present embodiment, it is parallel that the said second detection conducting line segment 248 and first detects conducting line segment 246, and joint detection conducting line segment 247 is vertically connected at second and detects between the conducting line segment 248 and the first detection conducting line segment 246.Said first detects conducting line segment 246 and second detects the same side that conducting line segment 248 all is connected in joint detection conducting line segment 247.That is to say that the angle that said joint detection conducting line segment 247 and first detects between the conducting line segment 246 is 90 degree.Angle between said second detection conducting line segment 248 and the said joint detection conducting line segment 247 also is 90 degree.In the present embodiment, the width that the said first detection conducting line segment 246, joint detection conducting line segment 247 and second detect conducting line segment 248 is 0.4 millimeter.First detects the length L of conducting line segment 246 ₁Be 8 millimeters, the length L of said joint detection conducting line segment 247 _CBe 4 millimeters, said second detects the length L of conducting line segment 248 ₂It is 8 millimeters.The total length L of said detection lead 245 _T=L ₁+ L _C+ L ₂, promptly also being 20 millimeters, width W is 0.4 millimeter, said length-width ratio N still is 50.

The 3rd step, said circuit substrate 20 is carried out electrical detection, detect the resistance value of the printing ink detection architecture 241 of marginal zone 202, said controller 104 judges according to the testing result of printing ink detection architecture 241 whether the printing ink structure 240 that is formed at product zone 201 is qualified.

Regulation square resistance R _ShValue greater than minimum square resistance R _Sh1, and less than the largest block resistance R _Sh2The time, the detection lead 245 of formation meets the requirements.According to the law of resistance, resistance R=ρ * L _T/ (T*W)=(L ₁+ L _C+ L ₂) * R _Sh/ W.When the resistance value R that records greater than (L ₁+ L _C+ L ₂) * R _Sh1/ W and less than (L ₁+ L _C+ L ₂) * R _Sh2During/W, then represent the square resistance R of printing ink detection architecture 241 _ShQualified.Though the structure of the detection lead 245 in the present embodiment is different from the detection lead 145 of first embodiment; But owing to detect the length-width ratio N of lead 245 still is 50; When 104 pairs of testing results of said controller are analyzed; Still when the resistance value R that records is in 850 ohm to 1000 ohm scopes, judge that the square resistance Rsh of printing ink detection architecture 241 is qualified, thereby the thickness of explanation printing ink detection architecture 241 is qualified.

The manufacture method of the circuit board that present technique scheme second embodiment provides is distinguished 202 on the edge of and is formed printing ink detection architecture 241 when product zone 201 is made printing ink structure 240.The detection lead 245 of present embodiment is a broken line, helps improving the space availability ratio of marginal zone 202.

Be appreciated that; It is 50 that the length-width ratio N of said detection lead is not limited to; The shape of said detection lead is not limited to be structures such as straight line or broken line; Can also be other structures such as curve, zigzag, can do corresponding design, only need that its width W everywhere is equal to get final product according to the shape size in the available space, marginal zone of circuit substrate.

It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.

Claims

1. A method for making a circuit board, comprising the steps of:

A circuit substrate is provided, the circuit substrate has a conductive pattern layer and an insulating protective layer for protecting the conductive pattern layer, the circuit board substrate includes a connected product area and an edge area, and the conductive pattern layer of the product area includes At least two conductive terminals, the insulating protective layer of the product area has at least two through holes, and the at least two conductive terminals are respectively exposed in the at least two through holes;

Conductive ink is arranged on the surface of the insulating protective layer to form an ink structure in the product area, an ink detection structure is formed on the surface of the insulating protective layer in the edge area, and the ink structure is electrically connected to the at least two conductive terminals, The ink detection structure includes a detection wire with a constant width; and

Conduct electrical testing on the conductive pattern layer in the product area, and detect the resistance value of the detection wire, so as to judge whether the ink structure formed in the product area is qualified according to the resistance value of the detection wire.

2 . The method for manufacturing a circuit board according to claim 1 , wherein both the ink structure and the ink detection structure are formed on the circuit board by screen printing or coating. 3 .

3. The method for making a circuit board according to claim 1, wherein the ink structure comprises at least two ink terminals and at least one connection line, and the at least two ink terminals are respectively located in the at least two channels. The holes are respectively connected to the at least two conductive terminals, and the at least one connection line is formed on the surface of the insulating protective layer and connected between the at least two ink terminals.

4. The method for manufacturing a circuit board according to claim 1, wherein the detection wire is a straight line.

5. The method for manufacturing a circuit board according to claim 4, wherein, when the resistance value of the detection wire is greater than L*R _sh1 /W and less than L*R _sh2 /W, it is determined that it is formed in the product area The ink structure is qualified, wherein R _sh1 is the minimum sheet resistance, R _sh2 is the maximum sheet resistance, W is the width of the detection wire, and L is the length of the detection wire.

6. The manufacturing method of the circuit board according to claim 1, wherein the detection wire comprises a first detection wire segment connected in sequence, a connection detection wire segment and a second detection wire segment, and the first detection wire segment, the connection detection wire segment, and the second detection wire segment have the same width, the connection detection wire segment has an angle with the first detection wire segment, and the connection detection wire segment has an angle between the second detection wire segment and the connection detection wire segment. Also has angles.

7. The method for making a circuit board according to claim 6, wherein the first detection wire segment and the second detection wire segment are connected to the same side of the connection detection wire segment, and the connection detection wire segment is connected to the same side of the detection wire segment. The included angle between the first detection wire segments is 90 degrees, and the included angle between the second detection wire segment and the connection detection wire segment is also 90 degrees.

8. The method for manufacturing a circuit board according to claim 6, wherein when the resistance value of the detection wire is greater than (L ₁ +L _C +L ₂ )*R _sh1 /W and less than (L ₁ + When L _C +L ₂ )*R _sh2 /W, it is determined that the ink structure formed in the product area is qualified, wherein R _sh1 is the minimum sheet resistance, R _sh2 is the maximum sheet resistance, W is the width of the detection wire, L ₁ is the length of the first detection wire segment, L _C is the length of the connection detection wire segment, and _L2 is the length of the second detection wire segment.

9. The method for making a circuit board according to claim 1, wherein when the ink detection structure includes two detection terminals respectively connected to two ends of the detection wire, the circuit board is electrically detected, Include steps:

An electric measuring machine is provided, which includes two detection probes and a controller, and the two detection probes correspond to the two detection terminals one by one;

Make the two detection probes correspond to the two detection terminals to detect the resistance value of the detection wire; and

The controller judges whether the ink structure formed in the product area is qualified according to the above detection results.

10. The manufacturing method of circuit board according to claim 1, characterized in that, after forming the ink structure and the ink detection structure, before performing electrical detection on the circuit board, forming a cover on the product area Protective layer for the ink structure.