CN102548348A - Heat abstractor - Google Patents

Abstract

A heat abstractor is used for radiating electronic elements on a circuit board and comprises a radiator attached with the electronic elements, a fan arranged on the radiator, and a cover plate for covering the radiator and the fan, wherein the cover plate is provided with a plurality of vent holes which are arranged above the fan and taken as air inlets when the fan works. In the heat abstractor, the cover plate covers the radiator and the fan, and is provided with the plurality of vent holes which are taken as the air inlets of the centrifugal fan, the vent holes are arranged above the fan, and the heat abstractor can effectively lower the pneumatic noise caused by the work of the fan so as to lower the whole noise caused by the work of the heat abstractor by utilizing the situation that air flows can generate wide-band noise when passing through the vent holes.

Description

heat sink

technical field

The invention relates to a heat dissipation device, in particular to a heat dissipation device including a fan.

Background technique

With the vigorous and rapid development of the electronic industry, the application of electronic components is becoming more and more extensive. The electronic components installed on the circuit board, such as the central processing unit, will generate a lot of heat during operation. If the heat cannot be dissipated in time, the internal temperature of the electronic components will become higher and higher, which will seriously affect the stability of the electronic components. Nowadays, the problem of heat dissipation has become an important factor affecting the performance of computers, and it has also become a bottleneck for the practical application of high-speed processors. Therefore, a heat dissipation device is usually provided on the surface of the electronic component to reduce the operating temperature of the electronic component.

A traditional heat dissipation device includes a substrate attached to electronic components and a fin group connected to the substrate. Sometimes, in order to improve the heat dissipation efficiency of the heat dissipation device, the heat dissipation device is further equipped with a fan to provide forced air flow to the fin set. However, aerodynamic noise is generated when the fan is in operation, which brings troubles to users.

Contents of the invention

In view of this, it is necessary to provide a cooling device capable of suppressing the aerodynamic noise generated when the fan is working.

A heat dissipation device for dissipating heat from electronic components mounted on a circuit board, comprising a radiator attached to the electronic components, a fan arranged on the radiator, and a cover plate covering the radiator and the fan , the cover plate is provided with a number of ventilation holes, and these ventilation holes are located above the fan to serve as air inlets for the fan when it is working.

The cover plate in the heat dissipation device is placed on the radiator and the fan, and the cover plate is provided with a number of ventilation holes as the air inlets of the centrifugal fan. These ventilation holes are located above the fan. The heat dissipation device utilizes airflow Broad-band noise will be generated when passing through the plurality of air holes, which can effectively reduce the aerodynamic noise generated by the fan when it is working, thereby reducing the overall noise generated by the cooling device when it is working.

The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a three-dimensional assembled view of a heat sink according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of the heat sink in FIG. 1 .

Description of main component symbols

Radiator 10

Substrates 12

Heat sink fins 14

Accommodating Department 16

Centrifugal fan 20

Bearing 22

Magnetic Pole 24

Mounting ring 26

Impeller 28

Cover 30

Through hole 32

Vent 34

Detailed ways

Please refer to Fig. 1, the heat dissipation device of the present invention is used to dissipate heat to electronic components (not shown) mounted on the circuit board (not shown), which includes a radiator 10, a centrifugal fan arranged on the radiator 10 20 is used for providing forced airflow to the radiator 10 , and a cover plate 30 covering the radiator 10 and the centrifugal fan 20 .

Please also refer to FIG. 2 , the heat sink 10 is integrally made of a metal with good thermal conductivity, such as copper, aluminum, etc., and its bottom surface is correspondingly attached to the top surface of the electronic component. The heat sink 10 includes a substrate 12 and a plurality of cooling fins 14 formed on the substrate 12 . The heat dissipation fins 14 are spaced apart from each other, and an airflow channel (not shown) is formed between every two adjacent heat dissipation fins 14 . The heat dissipation fins 14 are distributed on the base plate 12 near the periphery, and these heat dissipation fins 14 define an accommodating portion 16 on the base plate 12 for the centrifugal fan 20 to be accommodated therein. The cooling fins 14 are radially arranged relative to the accommodating portion 16 .

The centrifugal fan 20 includes a bearing 22 vertically disposed on the base plate 12 of the radiator 10 , a magnetic pole 24 sleeved on the bearing 22 , a mounting ring 26 and an impeller 28 . The impeller 28 is accommodated in the accommodating portion 16 of the radiator 10 and is opposite to the airflow channel of the cooling fin 14 of the radiator 10 , so that the forced airflow generated by the impeller 28 directly passes through the cooling fin 14 .

The above-mentioned cover plate 30 is a flat body made of metal with good thermal conductivity such as copper and aluminum. The outer dimension of the cover plate 30 corresponds to that of the radiator 10 . The bottom surface of the cover plate 30 is attached to the top surface of the heat dissipation fins 14 of the heat sink 10 , thereby sealing the centrifugal fan 20 in the accommodating portion 16 of the heat sink 10 . In use, the cover plate 30 can be combined with the heat dissipation fins 14 of the heat sink 10 by welding, buckling or directly bonding with heat dissipation glue. A through hole 32 is opened in the center of the cover plate 30 , and the through hole 32 is correspondingly located directly above the impeller 28 of the centrifugal fan 20 . A plurality of ventilation holes 34 are also defined on the cover plate 30 . The ventilation holes 34 are uniformly and spaced apart from each other, and are correspondingly located above the impeller 28 , serving as air inlets for the centrifugal fan 20 when it is working. The vent holes 34 are radially arranged with respect to the through holes 32 of the cover plate 30 . It can be understood that the diameter, shape, and number of the ventilation holes 34 can be reasonably adjusted according to the actual usage and usage effect of the heat sink.

To sum up, when the heat dissipation device of the present invention is in operation, the centrifugal fan 20 is accommodated in the accommodating portion 16 surrounded by the heat dissipation fins 14 of the heat sink 10, and the cover plate 30 is placed on the heat dissipation fins. On the sheet 14 and the centrifugal fan 20, several air holes 34 are provided on the cover plate 30 as the air inlets of the centrifugal fan 20. When the air flow passes through the plurality of air holes 34, broadband noise will be generated, which can effectively reduce the centrifugal fan 20. The aerodynamic noise generated during the operation can further reduce the overall noise generated when the cooling device is in operation.

It should be pointed out that the above embodiments are only preferred embodiments of the present invention, and those skilled in the art can also make other changes within the spirit of the present invention. These changes made according to the spirit of the present invention should be included in the scope of protection of the present invention.

Claims (10)

1. heat abstractor; Be used for the electronic component that is installed on the circuit board is dispelled the heat; Comprise that the radiator that is sticked mutually with electronic component, the fan and the lid that are arranged on the radiator place the cover plate on radiator and the fan; It is characterized in that: offer some air vent holes on the said cover plate, these air vent holes are positioned at the top of said fan, the air inlet with as this fan work the time.

2. heat abstractor as claimed in claim 1 is characterized in that: said radiator comprises substrate and is formed at the some radiating fins on the substrate.

3. heat abstractor as claimed in claim 2 is characterized in that: said radiating fin is distributed on the said substrate near peripheral region, and these radiating fins surround a holding part on this substrate, and is ccontaining in it for said fan.

4. heat abstractor as claimed in claim 3 is characterized in that: said radiating fin is radial arrangement with respect to holding part.

5. heat abstractor as claimed in claim 2 is characterized in that: said radiating fin space is provided with, and forms a gas channel between every adjacent two radiating fins.

6. heat abstractor as claimed in claim 5; It is characterized in that: said fan is a centrifugal fan; Comprise the bearing that vertically is arranged on the substrate, be placed on magnetic pole and impeller on the bearing; The gas channel of said impeller and radiating fin faces, so that the forced draft that impeller produces is directly passed the gas channel of radiating fin.

7. heat abstractor as claimed in claim 1 is characterized in that: even each other, the setting at interval of said air vent hole.

8. heat abstractor as claimed in claim 1 is characterized in that: said air vent hole is radial arrangement with respect to the central authorities of cover plate.

9. heat abstractor as claimed in claim 1 is characterized in that: the central authorities of said cover plate also offer through hole, this through hole correspondence be positioned at fan directly over.

10. heat abstractor as claimed in claim 1 is characterized in that: said cover plate perhaps directly is incorporated on the radiator with the bonding mode of thermal paste through welding, buckle.

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