CN102563447A - LED (light-emitting diode) backlight module with high process yield and manufacturing method thereof - Google Patents
LED (light-emitting diode) backlight module with high process yield and manufacturing method thereof Download PDFInfo
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- CN102563447A CN102563447A CN2010106224582A CN201010622458A CN102563447A CN 102563447 A CN102563447 A CN 102563447A CN 2010106224582 A CN2010106224582 A CN 2010106224582A CN 201010622458 A CN201010622458 A CN 201010622458A CN 102563447 A CN102563447 A CN 102563447A
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- 238000000034 method Methods 0.000 title claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims abstract description 4
- 230000000712 assembly Effects 0.000 claims description 35
- 238000000429 assembly Methods 0.000 claims description 35
- 239000007769 metal material Substances 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 239000006071 cream Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 230000004927 fusion Effects 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
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Abstract
The invention relates to an LED (light-emitting diode) backlight module with high process yield and a manufacturing method thereof. The LED backlight module comprises a cover body, a copper line layer, a reflecting sheet, a plurality of LED components and a light-guiding plate, wherein the reflecting sheet is provided with a plurality of openings and a plurality of cutting marks; each cutting mark is arranged between the two adjacent openings; the cutting mark has a certain width, so that when the reflecting sheet is heated, the influence of the linear thermal expansion coefficient on the openings of the reflecting sheet can be reduced, and further the whole light-emitting efficiency of the LED backlight module is stabilized; and by the method, the reflecting sheet with the plurality of cutting marks can be manufactured and is assembled in the cover body; and by the cutting marks, the deformation of the reflecting sheet due to heating in the process can be avoided, so that the relative positions of the plurality of openings on the surface of the bottom part of the cover body are ensured and further the process yield of the LED backlight module is increased.
Description
Technical field
The present invention relates to a kind of LED-backlit module and manufacturing approach thereof, particularly relate to a kind of a kind of LED-backlit module and manufacturing approach thereof with advantages of high process yield with reflector plate of a plurality of cut channels.
Background technology
Light emitting diode (Light-Emitting Diode LED) is the luminescence component of present extensive use because it has advantages such as volume is little, long service life, so be widely used in human daily life in.
Light emitting diode (LED) often is used among lighting device and the backlight module; See also Fig. 1 and Fig. 2; Be a kind of side view and stereogram of the existing LED-backlit module of commonly using; As shown in Figure 1, this LED-backlit module 1 ' comprising: a cover body 11 ', a copper wire layer 12 ', a reflector plate 14 ', a plurality of LED assembly 13 ', a LGP 15 ', with an end reflector plate 16 '.This copper wire layer 12 ' by an insulating heat-conductive glue 17 ' and attach this cover body 11 ' inner surface; This reflector plate 14 ' then be arranged at cover body 11 ' interior and be positioned at copper wire layer 12 ' on.This cover body 11 of this a plurality of LED assemblies 13 ' be arranged at ' within and be positioned at copper wire layer 12 ' on, and these a plurality of LED assemblies 13 ' with a plurality of openings 141 of one of which light emitting surface 131 ' pass reflector plate 14 ' had '.This cover body 11 of this LGP 15 ' be placed in ' within and be positioned at LED assembly 13 ' top, LGP 15 ' with the light of one of which light entrance face 151 ' reception LED assembly 13 ' sent.
Above-mentioned this LED-backlit module 1 ' be the backlight module that generally uses at present, its main manufacturing process is: this cover body 11 of (1) punching press making '; (2) by this insulating heat-conductive glue 17 ' with this copper wire layer 12 ' be attached at cover body 11 ' lower surface; (3) coating one glued membrane in this reflector plate 14 ' a non-reflecting surface; (4) with reflector plate 14 ' be attached at cover body 11 ' lower surface; (5) place a scolder to put a scolder placement surface of tool one tin cream; (6) this scolder that reverses is put tool, make this scolder placement surface regard to cover body 11 ' lower surface; (7) move down scolder and put tool, make this tin cream contact cover body 11 ' lower surface; (8) heating cover body 11 ', make tin cream by the scolder placement surface be transferred to cover body 11 ' lower surface; (9) remove scolder and put tool; (10) should put on the tool by a plurality of LED assemblies 13 ' arrangement to one first assembly; (11) using one second assembly to put tool should a plurality of LED assembly 13 ' be adsorbed in its a plurality of first specific regions; (12) move second assembly and put tool, make these a plurality of first specific regions regard to reflector plate 14 ' a plurality of openings 141 '; (13) move down second assembly and put tool, make the tin cream of LED assembly 13 ' contact cover body 11 ' lower surface; (14) heating cover body 11 ', be positioned at the tin cream of cover body 11 ' lower surface with fusion, make this a plurality of LED assemblies 13 ' be welded in simultaneously reflector plate 14 ' these a plurality of openings 141 '; (15) remove this second assembly and put tool.
Via above-mentioned, can learn, in this LED-backlit module 1 ' manufacturing process in, comprise the cover body heating process twice.Yet, because cover body 11 ' manufactured materials be aluminium, and this reflector plate 14 ' manufactured materials be PETG (Polyethylene terephthalate; PET) compound; So, well imagine that the thermal linear expansion coefficient of aluminium and PET compound has certain difference.Therefore, in through after twice cover body heating process, variations in temperature and thermal linear expansion coefficient will change reflector plate 14 ' both measured lengths, and then change this a plurality of openings 141 ' in the relative position of cover body 11 ' lower surface; So, possibly make this copper wire layer 12 of this a plurality of LED assemblies 13 ' can't be soldered to accurately ' on, cause this LED-backlit module 1 ' the technology yield not good; Perhaps, make these a plurality of LED assemblies 13 ' in copper wire layer 12 ' on produce displacement, and then LED-backlit module 1 ' whole lighting efficiency is impacted.
Therefore, via above-mentioned, can learn that the existing LED-backlit module of commonly using and its process still have shortcoming with not enough; In view of this, this case inventor studies with doing one's utmost, develops a kind of LED-backlit module and manufacturing approach thereof with advantages of high process yield finally.
This shows that above-mentioned existing light emitting diode obviously still has inconvenience and defective, and demands urgently further improving in method and use.Therefore how to found a kind of new LED-backlit module and manufacturing approach thereof with advantages of high process yield, also becoming the current industry utmost point needs improved target.
Summary of the invention
The objective of the invention is to; Overcome the defective that existing light emitting diode exists; And a kind of new LED-backlit module and manufacturing approach thereof with advantages of high process yield are provided, and technical problem to be solved is that its reflector plate that will have a plurality of cut channels and a plurality of openings is integrated among the LED-backlit module, this cut channel has certain width; Can, slow down by this reflector plate the influence that variations in temperature and thermal linear expansion coefficient are caused for reflector plate length when repeatedly being heated; So, can avoid the reflector plate length variations to cause the displacement of the LED assembly in the LED-backlit module, to stablize the luminous efficiency of LED-backlit module whole.
Another object of the present invention is to, overcome the defective that existing light emitting diode exists, and a kind of new LED-backlit module and manufacturing approach thereof with advantages of high process yield are provided; Technical problem to be solved is to make it can make the reflector plate with a plurality of cut channels; And it is assembled within the cover body of LED-backlit module, and, by the setting of this cut channel; Can avoid reflector plate in the technology of LED-backlit module, to produce deformation, to improve the technology yield of LED-backlit module because of being heated.
The object of the invention and solve its technical problem and adopt following technical scheme to realize.A kind of LED-backlit module with advantages of high process yield according to the present invention proposes comprises: a cover body; One copper wire layer is arranged within this cover body by an insulating heat-conductive glue; One reflector plate is arranged within the cover body and is positioned on this copper wire layer, and this reflector plate also has a plurality of openings; A plurality of LED assemblies are arranged within the cover body and are welded on the copper wire layer, and this LED assembly passes these a plurality of openings of reflector plate with the one of which light emitting surface; An and LGP; Be placed within the cover body and be positioned at this a plurality of LED assemblies top, this LGP receives the light source that the LED assembly is sent with the one of which light entrance face, wherein; When the light source incident light plane of incidence, it can be distributed in an exiting surface of this LGP equably; Wherein, This reflector plate has a plurality of cut channels, and each cut channel is arranged between two adjacent openings, and; Therefore this cut channel has certain width, can when reflector plate is heated, slow down variations in temperature and thermal linear expansion coefficient to deformation phenomenon that reflector plate and its opening caused.
The object of the invention and solve its technical problem and also can adopt following technical measures further to realize.
Aforesaid LED-backlit module with advantages of high process yield, the wherein said end reflector plate that more comprises is arranged within the cover body and is positioned at a side surface of LGP, and wherein, this side surface is vertical each other with this light entrance face.
Aforesaid LED-backlit module, the face shaping of wherein said this cover body with advantages of high process yield can be following any: L shaped or ㄇ shape.
Aforesaid LED-backlit module, the material of wherein said this cover body with advantages of high process yield can be following any: aluminium, stainless steel and copper.
Aforesaid LED-backlit module with advantages of high process yield, wherein said this cover body are the metal cover body with thermal conduction characteristic and heat sinking function.
Aforesaid LED-backlit module with advantages of high process yield, wherein said this copper wire layer has a plurality of pads, and per two pads are with respect to a LED assembly.
Aforesaid LED-backlit module with advantages of high process yield, wherein said this ㄇ shape cover body have more a cover body base, the long limit of a cover body and a cover body minor face, and this cover body minor face can be assembled with facility by bending.
Aforesaid LED-backlit module, the face shaping of wherein said this reflector plate with advantages of high process yield can be following any: L shaped or ㄇ shape.
Aforesaid LED-backlit module with advantages of high process yield, wherein said this ㄇ shape reflector plate have more a reflector plate base, a reflection length of a film limit and a reflector plate minor face, and this reflector plate minor face can be assembled with facility by bending.
The object of the invention and solve its technical problem and also adopt following technical scheme to realize.A kind of manufacturing approach with LED-backlit module of advantages of high process yield according to the present invention proposes comprises: prepare a metal material; One copper wire layer that will have a plurality of pads by an insulating heat-conductive glue is attached at the surface of this metal material; One reflector plate that will have a plurality of openings and a plurality of cut channels is attached on this copper wire layer; This metal material of punching press is to make a cover body; Put tool by a scolder, a scolder is changeed the lower surface that is welded to cover body; Remove this scolder by the lower surface of cover body and put tool; Use one first assembly to put tool and one second assembly is put tool, a plurality of LED assemblies side by side are placed in the lower surface of cover body; The heating cover body is positioned at this scolder of cover body lower surface with fusion, makes each LED assembly can accurately be welded on the pad of this copper wire layer; Remove this second assembly and put tool; And a LGP and an end reflector plate be assembled within the cover body.
The object of the invention and solve its technical problem and also can adopt following technical measures further to realize.
Aforesaid manufacturing approach with LED-backlit module of advantages of high process yield, wherein said this step (3) more comprises following detailed step: a centrifugal paper is attached on this reflector plate; On reflector plate, make these a plurality of openings and these a plurality of cut channels; And reflector plate is attached on this copper wire layer.
Aforesaid manufacturing approach with LED-backlit module of advantages of high process yield, wherein said this step (5) more comprises following detailed step: place this scolder to put a scolder placement surface of tool in this scolder; The counter-rotating scolder is put tool, makes this scolder placement surface regard to the lower surface of this cover body; Move down scolder and put tool, make scolder contact the lower surface of cover body; And the heating cover body, make scolder be transferred to the lower surface of cover body by the scolder placement surface.
Aforesaid manufacturing approach with LED-backlit module of advantages of high process yield, wherein said this step (7) more comprises following detailed step: should put on the tool by a plurality of LED assemblies arrangements to this first assembly; Use this second assembly to put tool and should be adsorbed in its a plurality of first specific regions by a plurality of LED assemblies; Move second assembly and put tool, make these a plurality of first specific regions regard to the lower surface of this cover body; And move down second assembly and put tool, make the scolder of these a plurality of LED assemblies contact cover body lower surface.
Aforesaid manufacturing approach, the material that wherein said this scolder is put tool with LED-backlit module of advantages of high process yield can be following any: aluminium, stainless steel and glass.
Aforesaid manufacturing approach, wherein said this scolder with LED-backlit module of advantages of high process yield can be following any: low temperature tin cream and high temperature tin cream.
The present invention compared with prior art has tangible advantage and beneficial effect.Can know that by above technical scheme major technique of the present invention thes contents are as follows: propose a kind of LED-backlit module, comprising: a cover body, a copper wire layer, a reflector plate, a plurality of LED assembly and a LGP with advantages of high process yield.This copper wire layer is arranged within this cover body by an insulating heat-conductive glue; This reflector plate is arranged within the cover body and is positioned on this copper wire layer, and reflector plate also has a plurality of openings; These a plurality of LED assemblies are arranged within the cover body and are welded on the copper wire layer, and this LED assembly passes these a plurality of openings of reflector plate with the one of which light emitting surface; This LGP is placed within the cover body and is positioned at this a plurality of LED assemblies top, and LGP receives the light source that the LED assembly is sent with the one of which light entrance face, and wherein, when the light source incident light plane of incidence, it can be distributed in an exiting surface of this LGP equably.And reflector plate has a plurality of cut channels, and each cut channel is arranged between two adjacent openings, and this cut channel has certain width, can when reflector plate is heated, slow down the influence that opening caused of thermal linear expansion coefficient to reflector plate.And in order to reach another object of the present invention, the inventor of this case proposes a kind of manufacturing approach with LED-backlit module of advantages of high process yield, and this method may further comprise the steps: (1) preparation one metal material; (2) one copper wire layer of a plurality of pads is attached at the surface of this metal material by an insulating heat-conductive glue; One reflector plate that (3) will have a plurality of openings and a plurality of cut channels is attached on this copper wire layer; (4) this metal material of punching press is to make a cover body; (5) put tool by a scolder, a scolder is changeed the lower surface that is welded to cover body; (6) remove this scolder by the lower surface of cover body and put tool; (7) use one first assembly to put tool and one second assembly is put tool, a plurality of LED assemblies side by side are placed in the lower surface of cover body; (8) the heating cover body is positioned at this scolder of cover body lower surface with fusion, makes each LED assembly can accurately be welded on the pad of this copper wire layer; (9) remove this second assembly and put tool; And (10) are assembled to a LGP and an end reflector plate within the cover body.
By technique scheme, LED-backlit module and manufacturing approach thereof that the present invention has advantages of high process yield have advantage and beneficial effect at least:
1, this reflector plate has a plurality of cut channels, and wherein, each cut channel is arranged between two adjacent openings; And this cut channel has certain width, and therefore, cut channel can slow down the influence that variations in temperature and thermal linear expansion coefficient are caused reflector plate length when reflector plate is heated, so but steady reflection sheet and this are opened on the relative position of cover body lower surface; So, in these a plurality of LED assemblies of welding, can make that these a plurality of LED assemblies are soldered on this copper wire layer accurately, to promote the technology yield of LED-backlit module.
2, through this manufacturing approach with LED-backlit module of advantages of high process yield, can make reflector plate and it is assembled within the cover body with a plurality of cut channels, and; Be provided with by this cut channel; Can avoid that reflector plate produces deformation in the technology because of being heated, so, can guarantee this a plurality of relative positions that are opened on the cover body lower surface; And then increase the accuracy that the LED assembly is soldered to copper wire layer, and then improve the technology yield of LED-backlit module.
3, the LED-backlit module with advantages of high process yield of the present invention has various embodiments, can supply the application of different LED backlight module.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention; Understand technological means of the present invention in order can more to know; And can implement according to the content of specification, and for let above and other objects of the present invention, feature and advantage can be more obviously understandable, below special act preferred embodiment; And conjunction with figs., specify as follows.
Description of drawings
Fig. 1 is a kind of side view of the existing LED-backlit module of commonly using;
Fig. 2 is the stereogram of the existing LED-backlit module of commonly using;
Fig. 3 is a kind of explosive view with LED-backlit module of advantages of high process yield of the present invention;
Fig. 4 is the side view with LED-backlit module of advantages of high process yield;
Fig. 5 is the side view of one second embodiment of a kind of LED-backlit module with advantages of high process yield of the present invention;
Fig. 6 is the side view of one the 3rd embodiment of a kind of LED-backlit module with advantages of high process yield of the present invention;
Fig. 7 A and Fig. 7 B are a kind of manufacturing approach flow charts with LED-backlit module of advantages of high process yield of the present invention;
Fig. 8 A to Fig. 8 G is the manufacturing process sketch map with LED-backlit module of advantages of high process yield;
Fig. 9 is the detailed step flow chart of step (703);
Figure 10 is the detailed step flow chart for step (705);
Figure 11 is the detailed step flow chart of step (707);
Figure 12 A and Figure 12 B are the manufacturing process sketch mapes of step (703);
Figure 13 is the manufacturing process sketch map of step (705); And
Figure 14 is the manufacturing process sketch map of step (707).
1: LED-backlit module with advantages of high process yield
1 ': LED-backlit module 10: metal material
11,11 ': cover body 111: cover body base
112: the long limit 113 of cover body: cover body minor face
12,12 ': copper wire layer 121: pad
13,13 ': LED assembly 131,131 ': light emitting surface
14,14 ': reflector plate 141,141 ': opening
142: reflector plate base 143: reflection length of a film limit
144: reflector plate minor face 145: cut channel
15,15 ': LGP 151,151 ': light entrance face
152: exiting surface 153: side surface
16,16 ': end reflector plate 17,17 ': insulating heat-conductive glue
2: pressing equipment 21: mold
22: bed die 3: scolder is put tool
31: scolder placement surface 4: scolder
Assembly was put 61: the first specific regions of tool in 6: the second
6a: first assembly is put tool 7: centrifugal paper
701～710,7031～7033,7051～7054,7071～7074: method step
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention; Below in conjunction with accompanying drawing and preferred embodiment; To the LED-backlit module with advantages of high process yield and its specific embodiment of manufacturing approach, method, step, characteristic and the effect thereof that proposes according to the present invention, specify as after.
See also Fig. 3 and Fig. 4, a kind of explosive view and side view of the present invention with LED-backlit module of advantages of high process yield.Like Fig. 3 and shown in Figure 4, this LED-backlit module 1 with advantages of high process yield comprises: a cover body 11, a copper wire layer 12, a reflector plate 14, a plurality of LED assembly 13, a LGP 15, with an end reflector plate 16.Usually, this cover body 11 is for having the L shaped metal cover body of thermal conduction characteristic and heat sinking function, and its manufactured materials can be aluminium, stainless steel or copper; Generally speaking, consider the manufacturing cost of LED-backlit module, understand the manufactured materials of aluminium usually as cover body 11.
Consult Fig. 3 and Fig. 4 unceasingly, this copper wire layer 12 is arranged within this cover body 11 by an insulating heat-conductive glue 17, and it has a plurality of pads 121.This reflector plate 14 is arranged within the cover body 11 and is positioned on the copper wire layer 12, and reflector plate 14 is made by the PET composite, and it is one L shaped that its outward appearance appears, and in addition, reflector plate 14 surfaces are provided with a plurality of openings 141 and a plurality of cut channels 145.These a plurality of LED assemblies 13 are arranged within the cover body 11 and are welded on the copper wire layer 12, and wherein, per two pads 121 are with respect to a LED assembly 13; And after LED assembly 13 was welded in the pad 121 of copper wire layer 12, a light emitting surface 131 of these a plurality of LED assemblies 13 passed these a plurality of openings 141 of reflector plate 14 respectively.
This LGP 15 is placed within this cover body 11 and is positioned at this a plurality of LED assemblies 13 tops; LGP 15 receives the light source that LED assembly 13 is sent with one of which light entrance face 151; And when the light source incident light plane of incidence 151, it can be distributed in an exiting surface 152 of LGP 15 equably.16 of this end reflector plates are arranged within the cover body 11 and are positioned at a side surface 153 of LGP 15, and wherein, this side surface 153 is vertical each other with this light entrance face 151, and end reflector plate 16 in order to prevent incident light the phenomenon of light leak takes place in the side surface 153 of LGP 15.
Among of the present invention this had the LED-backlit module 1 of advantages of high process yield, each cut channel 145 was arranged between two adjacent openings 141, and; This cut channel 145 has certain width, and therefore, cut channel 145 can be when reflector plate 14 be heated; Slow down the influence that variations in temperature and thermal linear expansion coefficient are caused reflector plate 14 length; So but steady reflection sheet 14 and this opening 141 are like this in the relative position of cover body 11 lower surface, in these a plurality of LED assemblies 13 of welding; Can make these a plurality of LED assemblies 13 be soldered to accurately on this copper wire layer 12, to promote the technology yield of integral LED backlight module.In addition,, therefore, also can avoid these a plurality of LED assemblies 13 on copper wire layer 12, to produce displacement because this cut channel 145 can avoid reflector plate 14 to produce deformation because of being heated, and then the luminous efficiency of stable LED-backlit module whole.
In addition, seeing also Fig. 5, is the side view of second embodiment of a kind of LED-backlit module with advantages of high process yield of the present invention.It is as shown in Figure 5,
Can learn that this its most of constituent components of second embodiment with LED-backlit module 1 of advantages of high process yield is same as first embodiment; Wherein, be different from the first embodiment part and be, this reflector plate 14 has more a reflector plate base 142, and reflects a length of a film limit 143 and a reflector plate minor face 144, makes the outward appearance of reflector plate 14 present a ㄇ shape; And as shown in Figure 5, this reflector plate minor face 144 can be beneficial to this LGP 15 is combined within this cover body 11 by bending.
And, see also Fig. 6, be the side view of the 3rd embodiment of a kind of LED-backlit module with advantages of high process yield of the present invention.As shown in Figure 6, can learn that this its most of constituent components of the 3rd embodiment with LED-backlit module 1 of advantages of high process yield is same as first embodiment; Wherein, be different from the first embodiment part and be, this cover body 11 has more a cover body base 111, the long limit 112 of a cover body and a cover body minor face 113, makes the outward appearance of cover body 11 present a ㄇ shape; And as shown in Figure 6, this cover body minor face 113 can be by bending with facility ccontaining this copper wire layer 12 and this LED assembly 13.
Via above-mentioned three embodiment, the LED-backlit module with advantages of high process yield of the present invention is intactly disclosed, and in addition, a kind of manufacturing approach with LED-backlit module of advantages of high process yield is with being exposed among the following explanation.Seeing also Fig. 7 A and Fig. 7 B, is a kind of manufacturing approach flow chart with LED-backlit module of advantages of high process yield of the present invention, simultaneously, sees also Fig. 8 A to Fig. 8 G, has the manufacturing process sketch map of the LED-backlit module of advantages of high process yield.This manufacturing approach with LED-backlit module of advantages of high process yield comprises following key step:
At first, shown in Fig. 8 A, execution in step (701) prepares a metal material 10; Then, shown in Fig. 8 B, execution in step (702), a copper wire layer 12 that will have a plurality of pads 121 by an insulating heat-conductive glue 17 is attached at the surface of this metal material 10; Then, shown in Fig. 8 C, execution in step (703), a reflector plate 14 that will have a plurality of openings 141 and a plurality of cut channels 145 is attached on this copper wire layer 12.
After this copper wire layer 12 is attached at these metal material 10 surfaces with this reflector plate 14, then continue execution in step (704), this metal material 10 of punching press is to make a cover body 11; Shown in Fig. 8 D, this cover body 11 is made by a pressing equipment 2 punching presses, and wherein, a mold 21 that utilizes this pressing equipment 2 is pressed into this metal material 10 among the one of which bed die 22, so, is about to metal material 10 and strikes out cover body 11.Completing steps (704) afterwards; Shown in Fig. 8 E, then continue execution in step (705), put tool 3 by a scolder; One scolder 4 is changeed the lower surface that is welded to cover body 11; Wherein, the material that this scolder is put tool can be following any: aluminium, stainless steel and glass, and this scolder can be a low temperature tin cream or a high temperature tin cream.Then, execution in step (706) then removes this scolder by the lower surface of cover body 11 and puts tool.
Completing steps (706) then continues execution in step (707) afterwards, uses one first assembly to put tool and one second assembly is put tool, a plurality of LED assemblies 13 side by side is placed in the lower surface of this cover body 11; Shown in Fig. 8 F, these a plurality of LED assemblies 13 are placed in cover body 11 lower surface by putting tool 6 through this second assembly.Then, continue execution in step (708), heating cover body 11 is positioned at this scolders of cover body 11 lower surface with fusion, makes each LED assembly can accurately be welded on the pad 121 of this copper wire layer 12; At last, execution in step (709) removes this second assembly and puts tool 6, and step (710), and a LGP 15 and an end reflector plate 16 are assembled within the cover body 11; So, shown in Fig. 8 G, this LED-backlit module 1 with advantages of high process yield has been made completion.
Among the manufacturing approach of the LED-backlit module with advantages of high process yield of the invention described above, this step (703), this step (705) have more detailed steps flow chart with this step (707).See also Fig. 9, Figure 10 and Figure 11, be respectively the detailed step flow chart of step (703), step (705) and step (707); Simultaneously, see also Figure 12 A to Figure 12 B, the manufacturing process sketch map of step (703).This step (703) comprises following detailed step:
At first, execution in step (7031) is attached at a centrifugal paper 7 on this reflector plate 14; Shown in Figure 12 A, this centrifugal paper 7 is attached on the reflector plate 14.Then, execution in step (7032) shown in Figure 12 B, is made this a plurality of openings 141 and these a plurality of cut channels 145 on reflector plate 14; At last, execution in step (7033) shown in Fig. 8 C, is attached at reflector plate 14 on this copper wire layer 12.
In addition, see also Figure 13, the manufacturing process sketch map of step (705).Shown in figure 10; Among the manufacturing approach of the LED-backlit module with advantages of high process yield of the present invention, this step (705) comprises following detailed step: at first, shown in figure 13; Execution in step (7051) places this scolder to put a scolder placement surface 31 of tool 3 in this scolder 4; Then, execution in step (7052), the counter-rotating scolder is put tool 3, makes this scolder placement surface 31 regard to the lower surface of this cover body 11.Then, shown in Fig. 8 E, execution in step (7053) moves down scolder and puts tool 3, makes scolder 4 contact the lower surface of cover bodies 11; At last, execution in step (7054), heating cover body 11 makes scolder 4 be transferred to the lower surface of cover body 11 by scolder placement surface 31.
Please consult Figure 14 again, the manufacturing process sketch map of step (707).Shown in figure 11, among the manufacturing approach of the LED-backlit module with advantages of high process yield of the present invention, this step (707) comprises following detailed step: at first, execution in step (7071) should a plurality of LED assemblies 13 be arranged to these first assemblies and is put on the tool 6a; Then, execution in step (7072) is used this second assembly to put tool 6 and should be adsorbed in its a plurality of first specific regions 61 by a plurality of LED assemblies 13; Then, execution in step (7073) moves second assembly and puts tool 6, makes these a plurality of first specific regions 61 regard to the lower surface of this cover body 11; At last, shown in Fig. 8 F, execution in step (7074) moves down second assembly and puts tool 6, makes these a plurality of LED assemblies 13 contact the scolder of cover bodies 11 lower surface.
So, via above-mentioned, the manufacturing approach of the LED-backlit module with advantages of high process yield of the present invention with and the detailed step flow process, intactly disclosed with the mode of collocation process schematic representation.Has the manufacturing approach of the LED-backlit module of advantages of high process yield through this; Can make reflector plate 14 and it is assembled within the cover body 11,, can avoid reflector plate 14 to receive thermal deformation by the setting of this cut channel 145 with a plurality of cut channels 145; So; Can guarantee these a plurality of openings 141 in the relative position of cover body 11 lower surface, and then increase the accuracy that LED assembly 13 is soldered to copper wire layer 12, and then improve the technology yield of integral LED backlight module.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction; Though the present invention discloses as above with preferred embodiment; Yet be not in order to limiting the present invention, anyly be familiar with the professional and technical personnel, in not breaking away from technical scheme scope of the present invention; When the technology contents of above-mentioned announcement capable of using is made a little change or is modified to the equivalent embodiment of equivalent variations; In every case be not break away from technical scheme content of the present invention, to any simple modification, equivalent variations and modification that above embodiment did, all still belong in the scope of technical scheme of the present invention according to technical spirit of the present invention.
Claims (15)
1. LED-backlit module with advantages of high process yield is characterized in that comprising:
One cover body;
One copper wire layer is arranged within this cover body by an insulating heat-conductive glue;
One reflector plate is arranged within the cover body and is positioned on this copper wire layer, and this reflector plate also has a plurality of openings;
A plurality of LED assemblies are arranged within the cover body and are welded on the copper wire layer, and this LED assembly passes these a plurality of openings of reflector plate with the one of which light emitting surface; And
One LGP is placed within the cover body and is positioned at this a plurality of LED assemblies top, and this LGP receives the light source that the LED assembly is sent with the one of which light entrance face, and wherein, when the light source incident light plane of incidence, it can be distributed in an exiting surface of this LGP equably;
Wherein, This reflector plate has a plurality of cut channels, and each cut channel is arranged between two adjacent openings, and; Therefore this cut channel has certain width, can when reflector plate is heated, slow down variations in temperature and thermal linear expansion coefficient to deformation phenomenon that reflector plate and its opening caused.
2. the LED-backlit module with advantages of high process yield as claimed in claim 1 is characterized in that more comprising an end reflector plate, is arranged within the cover body and is positioned at a side surface of LGP, and wherein, this side surface is vertical each other with this light entrance face.
3. the LED-backlit module with advantages of high process yield as claimed in claim 1, the face shaping that it is characterized in that cover body can be following any: L shaped or ㄇ shape.
4. the LED-backlit module with advantages of high process yield as claimed in claim 3, the material that it is characterized in that this cover body can be following any: aluminium, stainless steel and copper.
5. the LED-backlit module with advantages of high process yield as claimed in claim 3 is characterized in that this cover body is the metal cover body with thermal conduction characteristic and heat sinking function.
6. the LED-backlit module with advantages of high process yield as claimed in claim 1 is characterized in that this copper wire layer has a plurality of pads, and per two pads are with respect to a LED assembly.
7. the LED-backlit module with advantages of high process yield as claimed in claim 3 is characterized in that this ㄇ shape cover body has more a cover body base, the long limit of a cover body and a cover body minor face, and this cover body minor face can be assembled with facility by bending.
8. the LED-backlit module with advantages of high process yield as claimed in claim 1, the face shaping that it is characterized in that this reflector plate can be following any: L shaped or ㄇ shape.
9. the LED-backlit module with advantages of high process yield as claimed in claim 8 is characterized in that this ㄇ shape reflector plate has more a reflector plate base, a reflection length of a film limit and a reflector plate minor face, and this reflector plate minor face can be assembled with facility by bending.
10. manufacturing approach with LED-backlit module of advantages of high process yield is characterized in that comprising:
Prepare a metal material;
One copper wire layer that will have a plurality of pads by an insulating heat-conductive glue is attached at the surface of this metal material;
One reflector plate that will have a plurality of openings and a plurality of cut channels is attached on this copper wire layer;
This metal material of punching press is to make a cover body;
Put tool by a scolder, a scolder is changeed the lower surface that is welded to cover body;
Remove this scolder by the lower surface of cover body and put tool;
Use one first assembly to put tool and one second assembly is put tool, a plurality of LED assemblies side by side are placed in the lower surface of cover body;
The heating cover body is positioned at this scolder of cover body lower surface with fusion, makes each LED assembly can accurately be welded on the pad of this copper wire layer;
Remove this second assembly and put tool; And
One LGP and an end reflector plate are assembled within the cover body.
11. the LED with advantages of high process yield as claimed in claim 10
The manufacturing approach of backlight module is characterized in that this step (3) more comprises following detailed step:
One centrifugal paper is attached on this reflector plate;
On reflector plate, make these a plurality of openings and these a plurality of cut channels; And
Reflector plate is attached on this copper wire layer.
12. the manufacturing approach with LED-backlit module of advantages of high process yield as claimed in claim 10 is characterized in that this step (5) more comprises following detailed step:
Place this scolder to put a scolder placement surface of tool in this scolder;
The counter-rotating scolder is put tool, makes this scolder placement surface regard to the lower surface of this cover body;
Move down scolder and put tool, make scolder contact the lower surface of cover body; And
The heating cover body makes scolder be transferred to the lower surface of cover body by the scolder placement surface.
13. the manufacturing approach with LED-backlit module of advantages of high process yield as claimed in claim 10 is characterized in that this step (7) more comprises following detailed step:
Should put on the tool by a plurality of LED assemblies arrangements to this first assembly;
Use this second assembly to put tool and should be adsorbed in its a plurality of first specific regions by a plurality of LED assemblies;
Move second assembly and put tool, make these a plurality of first specific regions regard to the lower surface of this cover body; And
Move down second assembly and put tool, make these a plurality of LED assemblies contact the scolder of cover body lower surface.
14. the manufacturing approach with LED-backlit module of advantages of high process yield as claimed in claim 10, it is characterized in that this scolder put the material of tool can be following any: aluminium, stainless steel and glass.
15. the manufacturing approach with LED-backlit module of advantages of high process yield as claimed in claim 10, it is characterized in that this scolder can be following any: low temperature tin cream and high temperature tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106224582A CN102563447A (en) | 2010-12-30 | 2010-12-30 | LED (light-emitting diode) backlight module with high process yield and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106224582A CN102563447A (en) | 2010-12-30 | 2010-12-30 | LED (light-emitting diode) backlight module with high process yield and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN102563447A true CN102563447A (en) | 2012-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106224582A Pending CN102563447A (en) | 2010-12-30 | 2010-12-30 | LED (light-emitting diode) backlight module with high process yield and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025189557A1 (en) * | 2024-03-15 | 2025-09-18 | 瑞仪光电(南京)有限公司 | Backlight module having reflective sheet limiting function and display device |
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| CN1504810A (en) * | 2002-12-03 | 2004-06-16 | 三星电子株式会社 | Backlight assembly |
| CN1918488A (en) * | 2004-04-12 | 2007-02-21 | 古河电气工业株式会社 | light reflector |
| CN1991237A (en) * | 2005-12-28 | 2007-07-04 | 三菱电机株式会社 | Surface light source device and display device using same |
| CN101573654A (en) * | 2006-12-29 | 2009-11-04 | Lg伊诺特有限公司 | Backlight unit and display device having the same |
| CN101661192A (en) * | 2008-08-28 | 2010-03-03 | 株式会社日立显示器 | Backlight for liquid crystal display device and liquid crystal display device using the same |
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| JPH11281977A (en) * | 1998-03-31 | 1999-10-15 | Toshiba Lighting & Technology Corp | Backlight and display device |
| CN1504810A (en) * | 2002-12-03 | 2004-06-16 | 三星电子株式会社 | Backlight assembly |
| CN1918488A (en) * | 2004-04-12 | 2007-02-21 | 古河电气工业株式会社 | light reflector |
| CN1991237A (en) * | 2005-12-28 | 2007-07-04 | 三菱电机株式会社 | Surface light source device and display device using same |
| CN101573654A (en) * | 2006-12-29 | 2009-11-04 | Lg伊诺特有限公司 | Backlight unit and display device having the same |
| CN101661192A (en) * | 2008-08-28 | 2010-03-03 | 株式会社日立显示器 | Backlight for liquid crystal display device and liquid crystal display device using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2025189557A1 (en) * | 2024-03-15 | 2025-09-18 | 瑞仪光电(南京)有限公司 | Backlight module having reflective sheet limiting function and display device |
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