[go: up one dir, main page]

CN102573383A - Air guiding cover and heat radiating device using the same - Google Patents

Air guiding cover and heat radiating device using the same Download PDF

Info

Publication number
CN102573383A
CN102573383A CN2010105808577A CN201010580857A CN102573383A CN 102573383 A CN102573383 A CN 102573383A CN 2010105808577 A CN2010105808577 A CN 2010105808577A CN 201010580857 A CN201010580857 A CN 201010580857A CN 102573383 A CN102573383 A CN 102573383A
Authority
CN
China
Prior art keywords
wind deflector
air
deflector
side plates
wind
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2010105808577A
Other languages
Chinese (zh)
Other versions
CN102573383B (en
Inventor
彭文堂
张广艺
李小政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Scienbizip Consulting Shenzhen Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201010580857.7A priority Critical patent/CN102573383B/en
Priority to US12/981,426 priority patent/US20120145363A1/en
Publication of CN102573383A publication Critical patent/CN102573383A/en
Application granted granted Critical
Publication of CN102573383B publication Critical patent/CN102573383B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置，包括一散热器、及罩设该散热器的一导风罩，所述导风罩包括一导风罩本体及连接于该导风罩本体上的一导风板，该导风罩具有邻近散热器的一气流出口及邻近该导风板的一气流入口，其中气流入口用于供气流流入导风罩，气流出口用于供气流流出导风罩，该导风板的一端枢接于导风罩本体邻近气流入口处，该导风板的另一端可固定在导风罩本体的不同位置，以与不同高度或宽度的散热器配合。本发明的散热装置的导风罩内设置的导风板可通过调节固定在导风罩的不同位置，使得同一个导风罩可与不同高度或宽度的散热器相配合，降低了整个散热装置的设计成本。

Figure 201010580857

A heat dissipation device, comprising a radiator and a wind guide covering the radiator, the wind guide includes a wind guide body and a wind guide plate connected to the wind guide body, the wind guide The air cover has an air outlet adjacent to the radiator and an air inlet adjacent to the air deflector, wherein the air inlet is used for the airflow to flow into the air deflector, the air outlet is used for the air flow to flow out of the air deflector, and one end of the air deflector The other end of the wind deflector can be fixed at different positions of the wind deflector body to cooperate with radiators of different heights or widths. The air guide plate provided in the air guide cover of the heat dissipation device of the present invention can be adjusted and fixed at different positions of the air guide cover, so that the same air guide cover can be matched with radiators of different heights or widths, reducing the overall heat dissipation of the heat dissipation device. design cost.

Figure 201010580857

Description

导风罩及使用该导风罩的散热装置Air guide cover and heat dissipation device using the air guide cover

技术领域 technical field

本发明涉及一种散热装置，尤其涉及一种散热装置的导风罩。The invention relates to a heat dissipation device, in particular to an air guide cover of the heat dissipation device.

背景技术 Background technique

随着电子技术的不断发展，显卡等电子元件集成度较高的电子装置在运行时会产生大量的热量，这些热量如果不能被有效地散去，将直接导致温度急剧上升，而严重影响到电子装置的工作效率。为此，通常在电子装置上安装散热装置来进行散热。With the continuous development of electronic technology, electronic devices with high integration of electronic components such as graphics cards will generate a lot of heat during operation. If the heat cannot be effectively dissipated, it will directly lead to a sharp rise in temperature and seriously affect electronic device efficiency. For this reason, a heat sink is usually installed on the electronic device to dissipate heat.

常见的散热装置一般包括与电子元件导热接触的一散热器及安装于该散热器附近的一风扇。为了提升风扇气流的利用率，还在散热器上加装一导风罩，以将风扇所产生的气流集中地引导至散热器，使散热器迅速与气流换热。然而，针对不同功率的电子元件，需要合理地搭配不同高度或宽度的散热器，于是针对不同高度或宽度的散热器，需要对应设计不同高度或宽度的导风罩来与散热器相匹配，整体上增加了散热装置的设计成本。A common cooling device generally includes a heat sink in thermal contact with the electronic components and a fan installed near the heat sink. In order to improve the utilization rate of the airflow of the fan, an air guide cover is installed on the radiator to guide the airflow generated by the fan to the radiator in a concentrated manner, so that the radiator can quickly exchange heat with the airflow. However, for electronic components of different power, radiators of different heights or widths need to be reasonably matched. Therefore, for radiators of different heights or widths, it is necessary to design corresponding air ducts of different heights or widths to match the radiators. This increases the design cost of the heat sink.

发明内容 Contents of the invention

有鉴于此，实有必要提供一种可与不同高度或宽度的散热器相配合使用的导风罩及应用该导风罩的散热装置。In view of this, it is necessary to provide an air guide cover that can be used in conjunction with radiators of different heights or widths and a heat dissipation device using the air guide cover.

一种导风罩，包括一导风罩本体及连接于该导风罩本体上的一导风板，该导风罩具有一气流出口及一气流入口，其中气流入口用于供气流流入导风罩，气流出口用于供气流流出导风罩，该导风板的一端枢接于导风罩本体邻近气流入口处，该导风板的另一端可固定在导风罩本体的不同位置。A wind deflector, comprising a wind deflector body and a wind deflector connected to the wind deflector body, the wind deflector has an air outlet and an air inlet, wherein the air inlet is used for the airflow to flow into the wind guide The airflow outlet is used for the airflow to flow out of the windshield, and one end of the windshield is pivotally connected to the airflow inlet of the windshield body, and the other end of the windshield can be fixed at different positions of the windshield body.

一种散热装置，包括一散热器、及罩设该散热器的一导风罩，所述导风罩包括一导风罩本体及连接于该导风罩本体上的一导风板，该导风罩具有邻近散热器的一气流出口及邻近该导风板的一气流入口，其中气流入口用于供气流流入导风罩，气流出口用于供气流流出导风罩，该导风板的一端枢接于导风罩本体邻近气流入口处，该导风板的另一端可固定在导风罩本体的不同位置，以与不同高度或宽度的散热器配合。A heat dissipation device, comprising a radiator and a wind guide covering the radiator, the wind guide includes a wind guide body and a wind guide plate connected to the wind guide body, the wind guide The air cover has an air outlet adjacent to the radiator and an air inlet adjacent to the air deflector, wherein the air inlet is used for the flow of air into the air guide, the air outlet is used for the flow of air out of the air guide, and one end of the air deflector is The other end of the wind deflector can be fixed at different positions of the wind deflector body to cooperate with radiators of different heights or widths.

与现有技术相比，本发明的散热装置的导风罩内设置的导风板可通过调节固定在导风罩的不同位置，使得同一个导风罩可与不同高度或宽度的散热器相配合，降低了整个散热装置的设计成本。Compared with the prior art, the air guide plate provided in the air guide cover of the heat dissipation device of the present invention can be fixed at different positions of the air guide cover through adjustment, so that the same air guide cover can be compatible with radiators of different heights or widths. Cooperate, reduce the design cost of the whole cooling device.

下面参照附图结合实施例对本发明作进一步的描述。The present invention will be further described below with reference to the accompanying drawings and embodiments.

附图说明 Description of drawings

图1是本发明一实施例的散热装置的使用状态图。FIG. 1 is a view of the use state of a heat sink according to an embodiment of the present invention.

图2是图1的分解图。FIG. 2 is an exploded view of FIG. 1 .

图3是散热装置的另一形态的示意图。Fig. 3 is a schematic diagram of another form of the heat sink.

主要元件符号说明Description of main component symbols

散热器                  10、10aRadiator 10, 10a

导风罩                  20Windshield 20

电路板                  30Circuit board 30

电子元件                32Electronic Components 32

吸热板                  12Heat absorbing plate 12

鳍片组                  16Fin set 16

热管                    18Heat pipe 18

鳍片                    162Fins 162

导风罩主体              21Main body of wind deflector 21

顶板                    22Top plate 22

侧板                    24side panel 24

开口                    220Opening 220

导风板                  23Air deflector 23

气流入口                25Air inlet 25

气流出口                26Air outlet 26

枢接孔                  240Pivot hole 240

定位孔                  242Positioning hole 242

本体                    232Body 232

枢轴                    234Pivot 234

卡置部                  236Locking Department 236

凸点                    237Bumps 237

具体实施方式 Detailed ways

请参照图1为本发明一实施例的散热装置的使用状态图。本实施例中，该散热装置安装在一电路板30上，用来为该电路板30上的一电子元件32散热。该散热装置包括一散热器10及罩设该散热器10的一导风罩20。Please refer to FIG. 1 , which is a diagram showing a working state of a heat dissipation device according to an embodiment of the present invention. In this embodiment, the heat dissipation device is mounted on a circuit board 30 for dissipating heat from an electronic component 32 on the circuit board 30 . The heat dissipation device includes a radiator 10 and a wind guide cover 20 covering the radiator 10 .

请同时参照图2，该散热器10包括与电子元件32导热接触的一吸热板12、置于吸热板12上方的一鳍片组16、及导热连接吸热板12和鳍片组16的四根热管18。上述鳍片组16由若干鳍片162堆叠而成，该鳍片162由铜等金属材料制成。各鳍片162间隔排列，相邻的鳍片162间形成若干气流通道(未标号)。Please refer to FIG. 2 at the same time, the heat sink 10 includes a heat-absorbing plate 12 in thermal contact with the electronic component 32, a fin set 16 placed above the heat-absorbing plate 12, and a heat-conducting connection between the heat-absorbing plate 12 and the fin set 16 The four heat pipes 18. The above-mentioned fin group 16 is formed by stacking several fins 162 , and the fins 162 are made of metal materials such as copper. The fins 162 are arranged at intervals, and several airflow channels (not labeled) are formed between adjacent fins 162 .

该导风罩20可采用塑胶等材料制成，其包括一导风罩本体21及一导风板23。该导风罩本体21包括一顶板22及从该顶板22的相对两侧外缘垂直向下延伸的二侧板24。该二侧板24之间的距离大致等于该散热器10的宽度，该散热器10位于二侧板24之间。顶板22的一端开设一矩形开口220，所述散热器10安装于该导风罩20内位于该顶板22远离开口220的另一端处，该导风板23安装于该导风罩本体21内位于该开口220处。该导风罩20邻近开口220的一端具有一气流入口25，导风罩20远离开口220的一端具有一气流出口26。该导风罩20的二侧板24与该顶板22的连接处开设一对相对的枢接孔240，该枢接孔240位于该开口220与该气流入口25之间。该导风罩20的每一侧板24邻近散热器10处间隔开设四个定位孔242，该四个定位孔242在侧板24上呈弧形排列。该二侧板24的定位孔242从上向下分别沿水平方向对齐，形成四对分别对应不同高度散热器的定位孔242。该导风板23包括位于二侧板24之间的一矩形的本体232、自该本体232一端的边缘水平向外延伸的一枢轴234及自该本体232另一端的边缘垂直向下延伸的二卡置部236。每一卡置部236上凸伸出一圆形凸点237。该导风板23的本体232的面积略大于开口220的面积。该导风板23的枢轴234枢接于枢接孔240，该二卡置部236的凸点237对应卡置于该侧板24最上面的一对定位孔242内，以将导风板23固定，并使该导风板23的本体232搭靠在该散热器10顶部，以引导气流沿导风板23吹向散热器10。可以理解的是，该卡置部236上可开设一锁孔，以供螺钉穿过将该卡置部236固定在该侧板24上。The wind deflector 20 can be made of plastic or other materials, and includes a wind deflector body 21 and a wind deflector 23 . The wind deflector body 21 includes a top panel 22 and two side panels 24 vertically extending downward from two opposite outer edges of the top panel 22 . The distance between the two side plates 24 is approximately equal to the width of the heat sink 10 , and the heat sink 10 is located between the two side plates 24 . One end of the top plate 22 is provided with a rectangular opening 220, the radiator 10 is installed in the air guide cover 20 at the other end of the top plate 22 away from the opening 220, the air guide plate 23 is installed in the air guide cover body 21 the opening 220 . An end of the air guide 20 adjacent to the opening 220 has an air inlet 25 , and an end of the air guide 20 away from the opening 220 has an air outlet 26 . A pair of opposite pivot holes 240 are defined between the two side panels 24 of the wind deflector 20 and the top panel 22 , and the pivot holes 240 are located between the opening 220 and the air inlet 25 . Each side plate 24 of the wind deflector 20 is adjacent to the radiator 10 and defines four positioning holes 242 at intervals. The four positioning holes 242 are arranged in an arc on the side plate 24 . The positioning holes 242 of the two side plates 24 are aligned horizontally from top to bottom, forming four pairs of positioning holes 242 respectively corresponding to radiators of different heights. The wind deflector 23 includes a rectangular body 232 located between the two side plates 24, a pivot 234 extending horizontally outward from one edge of the body 232 and a vertically downward extending from the edge of the other end of the body 232. Two clamping parts 236 . A circular protrusion 237 protrudes from each engaging portion 236 . The area of the body 232 of the wind deflector 23 is slightly larger than the area of the opening 220 . The pivot shaft 234 of the wind deflector 23 is pivotally connected to the pivot hole 240, and the convex points 237 of the two locking parts 236 are correspondingly locked in a pair of uppermost positioning holes 242 of the side plate 24, so that the wind deflector 23 is fixed, and the body 232 of the wind deflector 23 rests on the top of the radiator 10 to guide the airflow to blow to the radiator 10 along the wind deflector 23 . It can be understood that a locking hole can be defined on the clamping portion 236 for a screw to pass through and fix the clamping portion 236 on the side plate 24 .

如图3所示，当更换另一高度较小的散热器10a时，仅需沿枢轴234向下旋转导风板23，将卡置部236的凸点237卡置于该侧板24的另一对定位孔242内，使导风板23的本体232搭靠在该散热器10a上。从而将气流向下导引至散热器10内，与散热器10进行充分的热交换。As shown in FIG. 3 , when replacing another heat sink 10a with a smaller height, it is only necessary to rotate the wind deflector 23 downward along the pivot 234, and the convex point 237 of the locking part 236 is locked on the side plate 24. In another pair of positioning holes 242 , the main body 232 of the wind deflector 23 leans against the heat sink 10 a. In this way, the airflow is guided downwards into the radiator 10 to fully exchange heat with the radiator 10 .

可以理解的是，该导风罩20的其中一侧板24底部可向内侧延伸出一凸起，该凸起和顶板22邻近气流入口25处开设该对枢接孔240，上述定位孔242间隔地开设于导风罩20的顶板22邻近散热器10处，该导风板23的枢轴234枢接于枢接孔240，该二卡置部236的凸点237对应卡置于该顶板22的其中一定位孔242内，以将导风板23固定，使该导风板23的本体232搭靠在该散热器10侧部，这样该导风罩20可与不同宽度的散热器相配合。It can be understood that a protrusion can be extended inwardly from the bottom of one side plate 24 of the wind deflector 20 , and a pair of pivot holes 240 are provided between the protrusion and the top plate 22 adjacent to the air inlet 25 , and the positioning holes 242 are spaced apart from each other. The top plate 22 of the wind deflector 20 is located adjacent to the radiator 10, the pivot 234 of the wind deflector 23 is pivotally connected to the pivot hole 240, and the convex points 237 of the two clamping parts 236 are correspondingly locked on the top plate 22. In one of the positioning holes 242, the wind deflector 23 is fixed, so that the body 232 of the wind deflector 23 rests on the side of the radiator 10, so that the wind deflector 20 can be matched with radiators of different widths .

与现有技术相比，本发明的散热装置的导风罩20内设置的导风板23可通过调节固定在导风罩20的不同位置，使得同一个导风罩可与不同高度或宽度的散热器相配合，降低了整个散热装置的设计成本。Compared with the prior art, the wind deflector 23 provided in the wind deflector 20 of the heat dissipation device of the present invention can be fixed at different positions of the wind deflector 20 through adjustment, so that the same wind deflector can be used with different heights or widths. The heat sink cooperates to reduce the design cost of the whole heat dissipation device.

Claims (10)

1.一种导风罩，包括一导风罩本体及连接于该导风罩本体上的一导风板，该导风罩具有一气流出口及一气流入口，其中气流入口用于供气流流入导风罩，气流出口用于供气流流出导风罩，其特征在于：该导风板的一端枢接于导风罩本体邻近气流入口处，该导风板的另一端可固定在导风罩本体的不同位置。1. A wind deflector, comprising a wind deflector body and a wind deflector connected to the wind deflector body, the wind deflector has an airflow outlet and an airflow inlet, wherein the airflow inlet is used for the airflow to flow in The wind deflector, the air outlet is used for the airflow to flow out of the wind deflector. It is characterized in that: one end of the wind deflector is pivotally connected to the air deflector body adjacent to the air inlet, and the other end of the wind deflector can be fixed on the wind deflector. different locations on the body. 2.如权利要求1所述的导风罩，其特征在于：所述导风罩本体包括一顶板及从该顶板的相对两侧外缘向下延伸的二侧板，该二侧板开设一对相对的枢接孔，该导风板包括位于该二侧板之间的一本体、自该本体一端向外延伸的一枢轴，该导风板的枢轴枢接于该二侧板的枢接孔。2. The wind deflector according to claim 1, wherein the wind deflector body comprises a top plate and two side plates extending downward from the opposite sides of the top plate, the two side plates define a For the opposite pivot holes, the wind deflector includes a body located between the two side plates, and a pivot extending outward from one end of the body, the pivot of the wind deflector is pivotally connected to the two side plates Pivot hole. 3.如权利要求2所述的导风罩，其特征在于：每一侧板从上向下开设若干定位孔，二侧板的定位孔从上向下分别沿水平方向对齐，形成若干对分别对应不同高度的定位孔，该导风板还包括自该本体另一端延伸的二卡置部，该导风板的二卡置部对应卡置于二侧板的其中一对定位孔。3. The wind deflector according to claim 2, wherein each side plate is provided with several positioning holes from top to bottom, and the positioning holes of the two side plates are aligned horizontally from top to bottom to form several pairs of Corresponding to the positioning holes of different heights, the wind deflector further includes two clamping parts extending from the other end of the body, and the two clamping parts of the wind deflector are correspondingly clamped in a pair of positioning holes of the two side plates. 4.如权利要求2所述的导风罩，其特征在于：所述顶板的一端开设一开口，该导风板安装于该导风罩本体内位于该开口处。4. The wind deflector as claimed in claim 2, wherein an opening is defined at one end of the top plate, and the wind deflector is installed in the wind deflector body at the opening. 5.一种散热装置，包括一散热器、及罩设该散热器的一导风罩，所述导风罩包括一导风罩本体及连接于该导风罩本体上的一导风板，该导风罩具有邻近散热器的一气流出口及邻近该导风板的一气流入口，其中气流入口用于供气流流入导风罩，气流出口用于供气流流出导风罩，其特征在于：该导风板的一端枢接于导风罩本体邻近气流入口处，该导风板的另一端可固定在导风罩本体的不同位置，以与不同高度或宽度的散热器配合。5. A heat dissipation device, comprising a radiator and a wind deflector covering the radiator, the wind deflector includes a wind deflector body and a wind deflector connected to the wind deflector body, The air guide cover has an air outlet adjacent to the radiator and an air inlet adjacent to the air deflector, wherein the air inlet is used for the air flow to flow into the air guide cover, and the air outlet is used for the air flow to flow out of the air guide cover. It is characterized in that: One end of the air guide plate is pivotally connected to the air guide body adjacent to the air inlet, and the other end of the air guide plate can be fixed at different positions of the air guide body to cooperate with radiators of different heights or widths. 6.如权利要求5所述的散热装置，其特征在于：所述导风罩本体包括一顶板及从该顶板的相对两侧外缘向下延伸的二侧板，该散热器位于该二侧板之间，该二侧板开设一对相对的枢接孔，该导风板包括位于该二侧板之间的一本体、自该本体一端向外延伸的一枢轴，该导风板的枢轴枢接于该二侧板的枢接孔，该导风板的本体搭靠在该散热器上。6. The heat dissipation device according to claim 5, wherein the wind guide body comprises a top plate and two side plates extending downward from the outer edges of opposite sides of the top plate, and the heat sink is located on the two sides Between the plates, the two side plates define a pair of opposite pivot holes, the wind deflector includes a body located between the two side plates, and a pivot extending outward from one end of the body, the wind deflector The pivots are pivotally connected to the pivot holes of the two side plates, and the body of the wind deflector rests on the radiator. 7.如权利要求6所述的散热装置，其特征在于：每一侧板邻近散热器处从上向下开设若干定位孔，二侧板的定位孔从上向下分别沿水平方向对齐，形成若干对分别对应不同高度的定位孔，该导风板还包括自该本体另一端延伸的二卡置部，该导风板的二卡置部对应卡置于该导风罩的二侧板的其中一对定位孔。7. The heat dissipation device according to claim 6, characterized in that: each side plate adjacent to the radiator is provided with a number of positioning holes from top to bottom, and the positioning holes of the two side plates are aligned horizontally from top to bottom, forming Several pairs of positioning holes respectively corresponding to different heights, the wind deflector also includes two clamping parts extending from the other end of the body, the two clamping parts of the wind deflector are correspondingly clamped on the two side plates of the wind deflector One pair of positioning holes. 8.如权利要求7所述的散热装置，其特征在于：所述定位孔在侧板上呈弧形排列。8. The heat dissipation device according to claim 7, wherein the positioning holes are arranged in an arc on the side plate. 9.如权利要求6所述的散热装置，其特征在于：每一枢接孔位于对应的侧板与顶板的连接处。9 . The heat dissipation device according to claim 6 , wherein each pivot hole is located at a joint between the corresponding side plate and the top plate. 10 . 10.如权利要求6所述的散热装置，其特征在于：所述顶板的一端开设一开口，该导风板安装于该导风罩本体内位于该开口处，所述散热器安装于该导风罩内位于该顶板远离开口的另一端处。10. The heat dissipation device according to claim 6, wherein an opening is opened at one end of the top plate, the air deflector is installed in the body of the air deflector at the opening, and the heat sink is installed on the guide The inside of the windshield is located at the other end of the top plate away from the opening.
CN201010580857.7A 2010-12-09 2010-12-09 Wind scooper and use the heat abstractor of this wind scooper Expired - Fee Related CN102573383B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201010580857.7A CN102573383B (en) 2010-12-09 2010-12-09 Wind scooper and use the heat abstractor of this wind scooper
US12/981,426 US20120145363A1 (en) 2010-12-09 2010-12-29 Fan duct and heat dissipation device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010580857.7A CN102573383B (en) 2010-12-09 2010-12-09 Wind scooper and use the heat abstractor of this wind scooper

Publications (2)

Publication Number Publication Date
CN102573383A true CN102573383A (en) 2012-07-11
CN102573383B CN102573383B (en) 2016-05-25

Family

ID=46198133

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010580857.7A Expired - Fee Related CN102573383B (en) 2010-12-09 2010-12-09 Wind scooper and use the heat abstractor of this wind scooper

Country Status (2)

Country Link
US (1) US20120145363A1 (en)
CN (1) CN102573383B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108563310A (en) * 2018-04-23 2018-09-21 郑州云海信息技术有限公司 A kind of wind scooper for supporting half long half high high power consumption add-on card heat dissipation
CN109357326A (en) * 2018-09-14 2019-02-19 青岛海信日立空调系统有限公司 A kind of wind scooper and electrical box
CN109960380A (en) * 2017-12-22 2019-07-02 鸿富锦精密电子(天津)有限公司 Wind scooper, cabinet and electronic device using the wind scooper
CN110506824A (en) * 2019-09-26 2019-11-29 江苏科技大学 A Cotton Candy Machine Based on Electromagnetic Heating
CN117956770A (en) * 2024-03-26 2024-04-30 杭州威灵自动化科技有限公司 Air-cooled waterproof heat-dissipation box body of driver and manufacturing process thereof

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102958322A (en) * 2011-08-25 2013-03-06 鸿富锦精密工业（深圳）有限公司 Air director
CN103366833A (en) * 2012-03-28 2013-10-23 鸿富锦精密工业（深圳）有限公司 Heat dissipation device combination
CN103809711B (en) * 2012-11-12 2017-07-14 英业达科技有限公司 Electronic installation
CN103857256B (en) * 2012-11-28 2016-08-10 国家电网公司 Air guide cover and electronic device with the same
CN104122953A (en) * 2013-04-24 2014-10-29 鸿富锦精密工业（深圳）有限公司 Chassis
JP1513565S (en) * 2014-06-18 2016-12-05
JP1513564S (en) * 2014-06-18 2016-12-05
JP6407214B2 (en) * 2016-08-02 2018-10-17 株式会社ソニー・インタラクティブエンタテインメント Electronics
CN106502340B (en) * 2016-11-02 2019-06-28 英业达科技有限公司 Server
USD907184S1 (en) * 2017-11-28 2021-01-05 Gree Electric Appliances, Inc. Of Zhuhai Air conditioning apparatus
US10372176B2 (en) * 2018-01-03 2019-08-06 Dell Products, Lp Information handling system with a common air duct for multiple air flow guiding configurations
US11510344B2 (en) * 2019-09-30 2022-11-22 TechnoGuard Inc. Computer server cabinet portable louver system
CN111447799A (en) * 2020-04-29 2020-07-24 水氪(北京)科技发展有限公司 Heat dissipation system for food purifier
DE102023202837A1 (en) 2023-03-28 2024-10-02 Siemens Aktiengesellschaft electronic arrangement

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6005770A (en) * 1997-11-12 1999-12-21 Dell U.S.A., L.P. Computer and a system and method for cooling the interior of the computer
US6155920A (en) * 1998-12-18 2000-12-05 Lite-On Enclosure Inc. Air ducts structure of a radiating fan
US20050219813A1 (en) * 2004-04-05 2005-10-06 Dell Products L.P. Adjustable heat sink shroud
US20070117502A1 (en) * 2005-11-22 2007-05-24 Gateway Inc. Adjustable cooling air duct for use with components of different sizes
US7262964B1 (en) * 2005-04-27 2007-08-28 Hewlett-Packard Development Company, L.P. Airflow control baffle
CN201115221Y (en) * 2007-08-21 2008-09-10 英业达股份有限公司 Wind shield
US7643292B1 (en) * 2008-12-23 2010-01-05 Chenbro Micom Co., Ltd. Adjustable air director

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5963424A (en) * 1995-11-07 1999-10-05 Sun Microsystems, Inc. Pulsar desk top system that will produce 500 watts of heat
TW530994U (en) * 2002-01-30 2003-05-01 Foxconn Prec Components Co Ltd Air conduction device of heat sink
JP2005158045A (en) * 2003-11-20 2005-06-16 First Internatl Computer Inc Structure of air guide cover and manufacturing method thereof
US7233493B2 (en) * 2004-08-10 2007-06-19 E. I. Du Pont De Nemours And Company Electronic device having a temperature control system including a ductwork assembly
US20080117569A1 (en) * 2006-11-20 2008-05-22 Jia-Shunn Lee Power-supplying device
US7611402B2 (en) * 2007-03-28 2009-11-03 Adc Dsl Systems, Inc. Apparatus for cooling electronics
CN201336015Y (en) * 2008-10-27 2009-10-28 鸿富锦精密工业（深圳）有限公司 Air guide device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6005770A (en) * 1997-11-12 1999-12-21 Dell U.S.A., L.P. Computer and a system and method for cooling the interior of the computer
US6155920A (en) * 1998-12-18 2000-12-05 Lite-On Enclosure Inc. Air ducts structure of a radiating fan
US20050219813A1 (en) * 2004-04-05 2005-10-06 Dell Products L.P. Adjustable heat sink shroud
US7262964B1 (en) * 2005-04-27 2007-08-28 Hewlett-Packard Development Company, L.P. Airflow control baffle
US20070117502A1 (en) * 2005-11-22 2007-05-24 Gateway Inc. Adjustable cooling air duct for use with components of different sizes
CN201115221Y (en) * 2007-08-21 2008-09-10 英业达股份有限公司 Wind shield
US7643292B1 (en) * 2008-12-23 2010-01-05 Chenbro Micom Co., Ltd. Adjustable air director

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109960380A (en) * 2017-12-22 2019-07-02 鸿富锦精密电子(天津)有限公司 Wind scooper, cabinet and electronic device using the wind scooper
CN108563310A (en) * 2018-04-23 2018-09-21 郑州云海信息技术有限公司 A kind of wind scooper for supporting half long half high high power consumption add-on card heat dissipation
CN109357326A (en) * 2018-09-14 2019-02-19 青岛海信日立空调系统有限公司 A kind of wind scooper and electrical box
CN110506824A (en) * 2019-09-26 2019-11-29 江苏科技大学 A Cotton Candy Machine Based on Electromagnetic Heating
CN117956770A (en) * 2024-03-26 2024-04-30 杭州威灵自动化科技有限公司 Air-cooled waterproof heat-dissipation box body of driver and manufacturing process thereof

Also Published As

Publication number Publication date
US20120145363A1 (en) 2012-06-14
CN102573383B (en) 2016-05-25

Similar Documents

Publication Publication Date Title
CN102573383B (en) Wind scooper and use the heat abstractor of this wind scooper
CN101370370B (en) Heat radiation module
US8355253B2 (en) Electronic apparatus with heat dissipation device
JP2010245526A (en) Heat dissipation device, and method for manufacturing the same
CN102387693A (en) Radiating device and electronic device using same
US20080101035A1 (en) Heat-dissipating assembly structure
CN102262426A (en) Radiating device
TW201143590A (en) Heat dissipation device
CN100499977C (en) Heat sink
JP2011029617A (en) Heat radiation device
CN101123863A (en) Wind scooper
CN101466240A (en) Radiating device
CN102279639A (en) Radiating device and centrifugal fan thereof
TW201144990A (en) Heat dissipation device and centrifugal fan thereof
TW201350683A (en) Heat dissipation structure with double wind directions
CN102036536B (en) Heat sink device
CN204119708U (en) Heat radiator
CN100421052C (en) heat sink
CN107426950A (en) A kind of electronic device natural heat dissipation device
CN101739106A (en) Radiator optimally designed along with wind speed of flow field
CN115190734A (en) Heat sink device
US7558065B2 (en) Air guide with heat pipe and heat sink and electronic apparatus equipped with the same
CN102271479A (en) heat sink
CN101472445B (en) Radiating device
CN100470777C (en) heat sink

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20151029

Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor

Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD.

Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two

Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd.

Applicant before: Hon Hai Precision Industry Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160525

Termination date: 20161209

CF01 Termination of patent right due to non-payment of annual fee