CN102597782A

CN102597782A - Annular compression systems and methods for sample processing devices

Info

Publication number: CN102597782A
Application number: CN2009801624315A
Authority: CN
Inventors: 威廉姆·拜丁汉姆; 彼得·D·陆德外斯; 杰弗里·C·佩德森; 巴里·W·罗博莱; 克里斯托弗·R·科考伊瑟尔
Original assignee: 3M Innovative Properties Co
Current assignee: 3M Innovative Properties Co
Priority date: 2009-11-13
Filing date: 2009-11-13
Publication date: 2012-07-18
Also published as: WO2011059444A1; EP2499499A1

Abstract

The system can include a base plate adapted to rotate about a rotation axis. The base plate can include at least one first magnetic element. The system can further include an annular cover, and a sample processing device comprising at least one thermal process chamber. The annular cover can include an inner edge, an outer edge, and at least one second magnetic element. The method can include positioning the sample processing device between the base plate and the annular cover, such that the inner edge of the annular cover is positioned inwardly of the at least one thermal process chamber, and such that the at least one first magnetic element attracts the at least one second magnetic element to force the annular cover in a first direction along the z-axis, urging the sample processing device into contact with the base plate.

Description

The annular pressing system and the method that are used for sample processing device

Technical field

The present invention relates to be used to use the system and method for rotary sample treating apparatus with the inhereditary material that for example increases etc.

Background technology

Many different chemistry, biological chemistry and other reaction pair temperature variation are responsive.Heat treated instance includes, but is not limited to polymerase chain reaction (PCR), the order-checking of mulberry lattice etc. in the heredity amplification field.Reduce the time of a plurality of samples of thermal treatment and a method of cost and be to use the device that comprises a plurality of chambers, wherein can handle the different piece of a sample simultaneously or can handle different samples simultaneously.Ask accurate chamber that the instance of chamber temp control, some reactions of temperature transition speed and/or the rapid transformation between the temperature of equity is mutually comprised that for example operating nucleic acid samples breaks genetic code helping possibly.The nucleic acid operative technique comprises: amplification method, for example polymerase chain reaction (PCR); Herbicide-tolerant polynucleotide amplification method, for example self-sustained sequence replication (3SR) and strand displacement amplification (SDA); Based on the method for the amplification of the signal that is attached to herbicide-tolerant polynucleotide, for example " side chain " DNA cloning; Based on the method for the amplification of dna probe, for example ligase chain reaction (LCR) and QB replicase amplification (QBR); Based on the method for transcribing, for example connect to activate transcribe (LAT) and based on the amplification (NASBA) of nucleotide sequence; And various other amplification methods, for example repair chain reaction (RCR) and circle probe reaction (CPR).Other instances of nucleic acid operative technique comprise that for example mulberry lattice order-checking, part combine mensuration etc.

Name is called the United States Patent(USP) No. 6 of MODULAR SYSTEMS AND METHODS FOR USING SAMPLE PROCESSING DEVICES; 889; 468 are called the United States Patent(USP) No. 6 of ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS with name; Among 734,401 (people such as Bedingham) some systems that are used to handle the rotary sample treating apparatus have been described.

Summary of the invention

Some embodiments of the present invention provide the system that is used to handle sample processing device.Said system can comprise substrate, but this substrate is connected in drive system with mode of operation, and wherein drive system makes substrate rotate around rotation, and wherein said rotation limits the z axle.Said system can also comprise heat structure, but this heat structure is connected in substrate with mode of operation, and wherein heat structure comprises the transmission that the exposes surface near the substrate first surface.But said system can also comprise at least one first magnetic part and the sample processing device that comprises at least one thermal chamber that is connected in substrate with mode of operation.Said system can also comprise the ring cover that is suitable for towards transmitting the surface.Ring cover can comprise center, inner edge and outer rim.Sample processing device can be suitable between substrate and ring cover.The inner edge of ring cover for example can be configured to when sample processing device is adjacent with ring cover when being provided with respect to the inboard that is centered close at least one thermal chamber of ring cover.But said system can also comprise at least one second magnetic part that is connected in ring cover with mode of operation.At least one second magnetic part can be configured to attract at least one first magnetic part, on the first direction of z axle, ring cover being applied power, thereby impels at least a portion of sample processing device to contact with the transmission surface of substrate.

Some embodiments of the present invention provide the system that is used to handle sample processing device.Said system can comprise substrate, but this substrate is connected in drive system with mode of operation, and wherein drive system makes substrate rotate around rotation, and wherein said rotation limits the z axle.Said system can also comprise heat structure, but this heat structure is connected in substrate with mode of operation, and wherein heat structure comprises the transmission that the exposes surface near the substrate first surface.But said system can also comprise first anchor ring and the sample processing device that comprises at least one thermal chamber that is connected in the magnetic part of substrate with mode of operation.Said system can also comprise the ring cover that is suitable for towards transmitting the surface.Ring cover can comprise inner edge and outer rim.Inner edge can be positioned at the inboard of at least one thermal chamber, and sample processing device can be suitable between substrate and ring cover.But said system can also comprise second anchor ring that is connected in the magnetic part of ring cover with mode of operation.Second anchor ring of magnetic part can be configured to attract first anchor ring of magnetic part, on the first direction of z axle, ring cover being applied power, thereby impels at least a portion of sample processing device to contact with the transmission surface of substrate.

Some embodiments of the present invention provide the method that is used to handle sample processing device.But said method can comprise setting and be connected in the substrate of drive system with mode of operation, but and the heat structure that is connected in substrate with mode of operation is provided.Heat structure can comprise the transmission that the exposes surface near the substrate first surface.Said method can also comprise that setting comprises the sample processing device of at least one thermal chamber, and is provided with towards the ring cover that transmits the surface.Ring cover can comprise inner edge and outer rim.But but said method can also comprise providing with mode of operation and is connected at least one first magnetic part of substrate and is connected at least one second magnetic part of ring cover with mode of operation.Said method can also comprise sample processing device between substrate and ring cover; Make the inner edge of ring cover be positioned at the inboard of at least one thermal chamber; And make at least one first magnetic part attract at least one second magnetic part; On the first direction of z axle, ring cover being applied power, thereby impel at least a portion of sample processing device to contact with the transmission surface of substrate.Said method can also comprise makes substrate rotate around rotation, and wherein said rotation limits the z axle.

Through considering embodiment and accompanying drawing, it is clear that further feature of the present invention and aspect will become.

Description of drawings

Fig. 1 is the decomposition diagram of system according to an embodiment of the invention, and said system comprises lid, sample processing device and substrate.

Fig. 2 is the assembling cross section and perspective of the system of Fig. 1.

Fig. 3 is the assembling close-up cross-sectional view of the system of Fig. 1 and Fig. 2.

Fig. 4 is the face upwarding view of the lid of Fig. 1 to 3.

Fig. 5 is that the part of sample processing device of Fig. 1 to 3 is along the cut-open view of the line 5-5 intercepting of Fig. 1.

Fig. 6 is the close-up plan view of a part of the sample processing device of Fig. 1 to 3 and Fig. 5.

Fig. 7 is the decomposition diagram of system in accordance with another embodiment of the present invention, and said system comprises lid, sample processing device and substrate.

Fig. 8 is the assembling close-up cross-sectional view of the system of Fig. 7.

Fig. 9 is the decomposition diagram of system in accordance with another embodiment of the present invention, and said system comprises lid, sample processing device and substrate.

Figure 10 is the assembling close-up cross-sectional view of the system of Fig. 9.

Figure 11 be the part of substrate of Fig. 1 along the cross section and perspective of the line 11-11 intercepting of Fig. 1, show an embodiment of fexible bias pressure heat structure.

Figure 12 is the skeleton view of an exemplary biasing member, and this biasing member can use with systems incorporate of the present invention.

Figure 13 is the close-up cross-sectional view of system in accordance with another embodiment of the present invention, and said system comprises lid, sample processing device and substrate, and substrate comprises heat structure, and this heat structure has shape transfer surface according to an embodiment of the invention.

Figure 14 is the synoptic diagram of the radial section profile of the heat transfer surface that is shaped in accordance with another embodiment of the present invention.

Figure 15 is the synoptic diagram of the radial section profile of the heat transfer surface that is shaped in accordance with another embodiment of the present invention.

Figure 16 A-16C shows alternative marginal texture of the hold-down ring that is used to cover of other embodiment according to the present invention.

Embodiment

Before specifying any embodiment of the present invention, be to be understood that CONSTRUCTED SPECIFICATION and the parts setting shown in that the present invention mentions in it is used, being not limited to describe hereinafter or the attached drawings.The present invention can have other embodiment, and can operate in many ways or implement.Should be understood that in addition the used term and the purpose of term are in order to describe, should not to be considered to restrictive among this paper." comprising ", " comprising " or " having " and their version used among this paper are intended to contain cited thereafter project and are equal to project and addition item.Only if otherwise provide or limit, term " installation " and " connection " and variant thereof use by broad sense, all contain direct and indirect installation and connection.In addition, " connection " be not limited to physics or connection mechanically.Should be appreciated that and to utilize other embodiment, and can make structure or logical changes without departing from the scope of the invention.In addition; Term such as " front portion ", " rear portion ", " top " and " bottom " etc. only is used to describe element; Because they are relative to each other, and the present invention described herein will used, install, show or locate to the orientation or the appointment that are intended to the essential or necessary equipment of particular orientation, indication or the hint of the equipment of addressing absolutely not how in use.

Relate generally to annular pressing system of the present invention and the method that is used for sample processing device.The annular pressing system of this type can comprise open area (like the open centre zone); Make annular pressing system can carry out and/or help required the heat control function and the spinfunction of sample processing device, at least a portion that allows to touch sample processing device simultaneously.For example, some existing systems cover the top surface of sample processing device, so that remain on the rotary plate sample processing device and/or heat control and isolate the each several part (for example be isolated from each other and/or with environment isolate) of sample processing device.Yet; Annular pressing system of the present invention and method provide required location and keep function and required heat control function; Also allow the part of sample processing device to be exposed to other devices or system simultaneously, this possibly be desirable for directly touching sample processing device.For example, in certain embodiments, can after sample processing device is between ring cover and substrate, send (as manually or automatically moving liquid) by the realization sample.As other instance; In certain embodiments; The part of sample processing device can be (for example as far as the electromagnetic radiation) that optics touches; For example this can make it possible to sample processing device is carried out more effective laser addressed, and perhaps this can be used for optical interrogation (like absorption, reflection, fluorescence etc.).Such laser addressed can be used for the for example fluid of the sample of sample processing device (like microfluid) operation.

In addition, in certain embodiments, annular pressing system of the present invention and method can make it possible to the various piece of sample processing device is carried out unique temperature control.For example; Fluid (like air) can be on the exposed surface of sample processing device needs to flow in the quick cooled zones, and temperature required zone can be covered and isolate with other parts of sample processing device and/or with surrounding environment and need be heated or remain on.

In addition; In certain embodiments; Annular pressing system of the present invention and method can allow the part of sample processing device to expose interacting with other (as outside or inner) devices or equipment, said other devices or equipment for for example robot workstation, transfer pipet, inquire after instrument or the like or their combination.Similarly, annular pressing system of the present invention can protect the required part of sample processing device to avoid being contacted with method.

The result; At least a portion of " touching " sample processing device can refer to various treatment steps, and can include, but is not limited to: physically or mechanically touch sample processing device (for example send or fetch sample, move or operate sample in the sample processing device etc. via direct or indirect contact via direct or indirect contact); Touch sample processing device (for example laser addressed) optically; Touch sample processing device (for example optionally heating or cool off the expose portion of sample processing device) or the like calorifics; And their combination.

The present invention is provided for the method and system of sample processing device; It can be used for the heat-treating methods that relates to of sensitive chemical process for example, for example polymerase chain reaction (PCR) amplification, transcriptive intermediate amplification (TMA), the amplification (NASBA) based on nucleotide sequence, ligase chain reaction (LCR), supports sequence replicating, enzyme dynamics, even part bonding more complicated biological chemistry or other processes measuring and need accurate thermal control and/or Rapid Thermal to change certainly.Except realization was controlled the temperature of the specimen material in the process chamber on the device, sample processing system can also be realized the synchronous rotation of sample processing device.

Some instances of the appropriate samples treating apparatus that can be used in combination with method and system of the present invention are found in following document: for example name is called U.S. Patent Publication No.2007/0010007 people such as () Aysta of the co-assigned of SAMPLE PROCESSING DEVICE COMPRESSION SYSTEMS AND METHODS; Name is called U.S. Patent Publication No.2007/0009391 people such as () Bedingham of COMPLIANT MICROFLUIDIC SAMPLE PROCES SING DISKS; Name is called U.S. Patent Publication No.2008/0050276 people such as () Bedingham of MODULAR SAMPLE PROCESSING APPARATUS KITS AND MODULES; Name is called the United States Patent(USP) No. 6,734,401 people such as () Bedingham of ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS; And name is called the United States Patent(USP) No. 7,026,168 people such as () Bedingham of SAMPLE PROCESSING DEVICES.Other available device construction are found in: for example, name is called ENHANCED SAMPLE PROCESSING DEVICES, the United States Patent(USP) No. 7,435,933 of SYSTEMS AND METHODS people such as () Bedingham; The name of submitting on October 2nd, 2000 is called SAMPLE PROCESSING DEVICES, the U.S. Provisional Patent Application Serial No.60/237 of SYSTEMS AND METHODS, 151 people such as () Bedingham; And name is called the United States Patent(USP) No. 6,814,935 people such as () Harms of SAMPLE PROCESSING DEVICES AND CARRIERS.Other maybe device construction be found in: for example, name is called the United States Patent(USP) No. 6,627,159 people such as () Bedingham of CENTRIFUGAL FILLING OF SAMPLE PROCES SING DEVICES; The PCT patent that name is called METHODS FOR NUCLEIC ACID AMPLIFICATION is announced No.WO2008/134470 people such as () Parthasarathy; And name is called ENHANCED SAMPLE PROCESSING DEVICES, the U.S. Patent Publication No.2008/0152546 of SYSTEMS AND METHODS people such as () Bedingham.

Some embodiment of sample processing system of the present invention can comprise substrate, and this substrate thinks that substrate rotates and the mode that is equipped with attaches to drive system around rotation.When sample processing device was fixed on the substrate, sample processing device can rotate with substrate.Substrate can comprise can be used at least one heat structure of each several part of heated sample treating apparatus; And can comprise multiple miscellaneous part equally, for example temperature sensor, electric resistance heater, electrothermal module, light source, photodetector, transmitter, receiver etc.

Other elements and the characteristic that are used to handle the system and method for sample processing device are found in the patented claim No.________________ (attorney docket No.65917US002) that submits on the same day with the application, and this patented claim is incorporated this paper into way of reference in full.

Fig. 1 to 6 and Figure 11 and 12 show an exemplary sample processing system 100.Shown in Fig. 1 to 3, system 100 can comprise substrate 110, and this substrate 110 is around rotation 111 rotations.Substrate 110 can also for example be attached to drive system 120 via axle 122.Yet, should be appreciated that substrate 110 can be connected in drive system 120 through any suitable alternative structure, band of for example directly on substrate 110, operating or driving wheel etc.

Also show the sample processing device 150 and ring cover 160 that can be used in combination among Fig. 1 with substrate 110, of the back literary composition.In some cases, when sample processing device be that in fact system of the present invention can not comprise sample processing device when being used to carry out the consumables that various tests etc. are dropped then.Therefore, system of the present invention can use with multiple different samples treating apparatus.

Shown in Fig. 1 to 3, illustrated substrate 110 comprises heat structure 130, and this heat structure 130 can comprise the heat transfer surface 132 on the top surface 112 that is exposed to substrate 110." exposure " refers to, and the transmission of heat structure 130 surface 132 can be configured to contact with a part of physics of sample processing device 150, makes heat structure 130 and sample processing device 150 thermal couplings, with through conducting transferring heat energy.In certain embodiments, the transmission of heat structure 130 surface 132 is under the selected part that can be set at sample processing device 150 during the sample preparation.For example, in certain embodiments, the selected part of sample processing device 150 can comprise one or more process chambers, and for example thermal chamber 152.Said process chamber for example can be included in name and be called those chambers of discussing in the United States Patent(USP) No. 6,734,401 people such as () Bedingham of ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS.As other instance; Sample processing device 150 can comprise various characteristics and element, and for example name is called characteristic and the element described in U.S. Patent Publication No.2007/0009391 people such as () Bedingham of COMPLIANT MICROFLUIDIC SAMPLE PROCES SING DISKS.

Therefore, the sample processing device 150 shown in (be merely for example) Fig. 1 to 3 and Fig. 5 and 6 can comprise and is configured to the one or more input wells and/or other chambers (sometimes being called " non-heat " chamber or " non-heat " process chamber) 154 that are communicated with thermal chamber 152 fluids.For example, in certain embodiments, sample can be loaded on the sample processing device 150 via input well 154, can move to other chambers and/or finally move to thermal chamber 152 via passage (for example microfluid passage) and/or valve then.

In certain embodiments, shown in Fig. 1 to 3, input well 154 can be arranged between the center 151 of sample processing device 150 and in the thermal chamber 152 at least one.In addition, ring cover 160 can be configured to allow to touch the part that comprises input well 154 of sample processing device 150, makes to be positioned to adjacent with sample processing device 150 or can to touch input well 154 when connecting when covering 160.

Shown in Fig. 1 to 4, ring cover 160 can compress the sample processing device 150 between them with substrate 110, so that for example strengthen heat structure 130 and the thermal coupling between the sample processing device 150 on the substrate 110.In addition, ring cover 160 can be used for sample processing device 150 is kept and/or maintains on the substrate 110, make sample processing device 150 and/or cover 160 can be along with substrate 110 through drive system 120 around axis 111 rotations and rotate with this substrate.Rotation 111 can limit the z axle of system 100.

As used herein, term " annular " or its derivative can refer to the structure with outer rim and inner edge, make inner edge limit opening.For example, ring cover can have annular or round-shaped (for example annulus) or any other suitable shape, includes, but is not limited to triangle, rectangle, square, trapezoidal, polygon etc. or their combination.In addition, " anchor ring " of the present invention needs not to be symmetrical, but can be for asymmetric or irregularly shaped; Yet symmetry and/or circle can have some advantage.

Utilize the combination of multiple various structure or structure to can be implemented in substrate 110 and cover the snap-in force that produces between 160.An exemplary compressing structure shown in the embodiment of Fig. 1 to 6 is for being positioned at the magnetic part 170 and the magnetic part 172 that is positioned at the correspondence on (but perhaps being connected in mode of operation at least) substrate 110 on (but perhaps being connected in mode of operation at least) lid 160.Magnetic attraction between the

magnetic part

170 and 172 can be used for lid 160 and substrate 110 are drawn over to one's side each other, thereby compresses, remains in the sample processing device 150 between them and/or make sample processing device 150 distortion.Therefore,

magnetic part

170 and 172 can be configured to attract each other, with along the z axle of system 100 at first direction D ₁On the (see figure 1) ring cover is applied power 160, thereby impel at least a portion of treating apparatus 150 to contact with the transmission surface 132 of substrate 110.

As used herein, " magnetic part " is for presenting structure or the goods that magnetic field perhaps receives influence of magnetic field.In certain embodiments, magnetic field can have enough intensity producing required snap-in force, and this snap-in force causes the thermal coupling between the heat structure 130 of sample processing device as described herein 150 and substrate 110.Magnetic part can comprise magnetic material, promptly appear permanent-magnetic field material, can present the material in transient state magnetic field and/or receive the material of permanent or transient state influence of magnetic field.

Some instances of the magnetic material that possibly be fit to for example comprise, magnetic ferrite or be " ferrite " of material that comprises the mixed oxide of iron and one or more other metals, for example nanocrystalline cobalt ferrite.Yet, also can use other ferrite materials.Other magnetic materials that can be used for system 100 can include, but is not limited to, pottery and the flexible magnetic material of being processed by the strontium ferriferous oxide that can be mixed with polymer material (for example plastomer, rubber etc.); Neodymium iron boron (this magnetic material also can comprise dysprosium); The neodymium boride; SmCo (samarium cobalt compounds); Combination with aluminium, nickel, cobalt, copper, iron, titanium etc.; And other materials.Magnetic material can also comprise for example stainless steel, paramagnetic material or other magnetisable materials, and this magnetisable material can be endowed enough magnetic when it stands enough electric fields and/or magnetic field.

In certain embodiments, magnetic part 170 and/or magnetic part 172 can comprise strong ferrimagnet, with reduce through the time magnetic loss, make that magnetic part 170 can be with reliable magnetic force connection with 172, and magnetic force can not lose significantly in time.

In addition; In certain embodiments; Magnetic part of the present invention can comprise electromagnet, and wherein magnetic field can switch to opening and closing between first magnetic state and the second non magnetic state, so that when needed to excite magnetic field in required each zone that is configured in triggering system 100.

In certain embodiments, but

magnetic part

170 and 172 can be with mode of operation be connected in cover 160 with the separate piece of substrate 110, shown in the embodiment of Fig. 1 to 6 and Figure 11 and 12 (wherein

magnetic part

170 and 172 is independent cylindrical product).Yet, in certain embodiments, substrate 110, heat structure 130 and/or cover 160 and can comprise enough magnetic materials (for example, be molded in or otherwise be produced in the structure of parts), making does not need independent discrete magnetic part.In certain embodiments, can adopt the combination of discrete magnetic part and enough magnetic material (for example molded or otherwise make).

Shown in Fig. 1 to 4; Ring cover 160 comprises center 161, inner edge 163 and outer rim 165, in the embodiment shown in Fig. 1 to 6 and Figure 11 and 12, when lid 160 is connected in substrate 110; Center 161 is aimed at rotation 111, and inner edge 163 limits opening 166 at least in part.As stated, even for example when ring cover 160 is positioned to adjacent with sample processing device 150 or connects, opening 166 also can be so that get at least a portion (part that for example comprises input well 154) of sample processing device 150.Shown in Fig. 1 to 3, the inner edge 163 of ring cover 160 for example can be configured to when ring cover 160 and sample processing device 150 are adjacent to be positioned at respect to the center 161 of ring cover 160 inboard (for example radially inner side) of thermal chamber 152.In addition, the inner edge 163 of ring cover 160 can be configured to be positioned at the radial outside of input well 154.In addition, in certain embodiments, shown in Fig. 1 to 4, the outer rim 165 of ring cover 160 can be configured to be positioned at the outside (for example radial outside) outside of input well 154 (and be positioned at) of thermal chamber 152.

Inner edge 163 can be positioned to the center of ring cover 160 161 at a distance of first apart from d ₁(for example first radial distance or " first radius ").In this type embodiment, if ring cover 160 has roughly toroidal, the diameter that has of opening 166 can equal first apart from d so ₁Twice.In addition, outer rim 165 can be positioned to the center of ring cover 160 161 at a distance of second distance d ₂(for example second radial distance or " second radius ").In certain embodiments, first apart from d ₁Can for second distance at least about 50%.In certain embodiments, be at least about 60%, and in certain embodiments, be at least about 70%.In addition, in certain embodiments, first apart from d ₁Can be not more than the about 95% of second distance, in certain embodiments, be not more than approximately 85%, and in certain embodiments, be not more than about 80%.In certain embodiments, first apart from d ₁Can be second distance d ₂About 75%.

In addition, in certain embodiments, outer rim 165 can be positioned to and center 161 standoff distance d ₂(for example radial distance), this can limit first area, and in certain embodiments, the area of opening 166 can for first area at least about 30%, in certain embodiments, be at least about 40%, and in certain embodiments, be at least about 50%.In certain embodiments, opening 166 can be not more than the about 95% of first area, in certain embodiments, is not more than approximately 75%, and in certain embodiments, is not more than about 60%.In certain embodiments, opening 166 can be about 53% of first area.

In addition, ring cover 160 can comprise inwall 162 (for example " inner peripheral wall " or " interior radial wall "; In certain embodiments, it can be used as interior hold-down ring, is described below) and outer wall 164 (for example " outer circle wall " or " outer radial wall "; In certain embodiments, it can be used as the external compression ring, is described below).In certain embodiments; Inwall 162 can comprise or limit inner edge 163 and outer rim 165 respectively with outer wall 164; Make inwall 162 can be set at the inboard of thermal chamber 152 (for example radially inner side), and outer wall 164 can be set at the outside (for example radial outside) of thermal chamber 152.Shown in Fig. 1 to 4, in certain embodiments, inwall 162 can comprise magnetic part 170 for another example, and a part that makes magnetic part 170 form inwall 162 perhaps is connected in inwall 162.For example, in certain embodiments, magnetic part 170 can embed (for example molded) in inwall 162.Shown in Fig. 1 to 4, ring cover 160 can also comprise upper wall 167, and this upper wall 167 can be arranged to cover the part of sample processing device 150, for example comprises the part of thermal chamber 152.

As illustrated in fig. 1 and 2, in certain embodiments, upper wall 167 can extend to the inboard (for example radially inner side) of inwall 162 and magnetic part 170.In the embodiment shown in Fig. 1 to 4, upper wall 167 does not extend to the inboard of inwall 162 too much.Yet in certain embodiments, upper wall 167 can extend to the inside (for example towards the center 161 of covering 160) of inwall 162 and/or magnetic part 170, for example makes that the size of opening 166 is littler than the size shown in Fig. 1 to 4.In addition, in certain embodiments, upper wall 167 can limit inner edge 163 and/or outer rim 165.

In certain embodiments, lid at least a portion of 160 can be optically transparent, and this at least a portion for example is one or more in inwall 162, outer wall 164 and the upper wall 167.As used herein, phrase " optically transparent " can refer to scope from infrared to ultraviolet spectrum (for example from about 10nm to the transparent object of electromagnetic radiation of about 10 μ m (10,000nm)); Yet in certain embodiments, phrase " optically transparent " can refer to the transparent object of electromagnetic radiation in the visible spectrum (for example about 400nm is to about 700nm).In certain embodiments, phrase " optically transparent " can refer in above-mentioned wavelength coverage, to have the object at least about 80% transmittance.

This structure of ring cover 160 can be connected in sample processing device 150 or be configured to sample processing device 150 to be used for effectively isolating or significantly isolating when adjacent the thermal chamber 152 of sample processing device 150 at lid 160.For example, lid 160 can be physically, optically and/or the part of calorifics ground isolation sample processing device 150, for example comprises the part of thermal chamber 152.In certain embodiments; As shown in figs. 1 and 6; Sample processing device 150 can comprise one or more thermal chambers 152, in addition, and in certain embodiments; One or more thermal chambers 152 can be arranged in the anchor ring at the center 151 of sample processing device 150, and this anchor ring also can be called " annular processes ring " sometimes.In this type embodiment, ring cover 160 can be suitable for covering and/or isolating the part that comprises annular processes ring or thermal chamber 152 of sample processing device 150.For example, ring cover 160 comprises inwall 162, outer wall 164 and upper wall 167, to cover and/or to isolate the part that comprises thermal chamber 152 of sample processing device 150.In certain embodiments, one or more in inwall 162, outer wall 164 and the upper wall 167 can be continuous wall (as shown in the figure), perhaps can be by forming as inwall or outer wall (hold-down ring or external compression ring perhaps) or a plurality of parts of upper wall together.In certain embodiments, when in inwall 162, outer wall 164 and the upper wall 167 at least one was continuous wall, the entity that can obtain to strengthen was isolated and/or heat is isolated.

In addition; In certain embodiments; Ring cover 160 cover heating process chambers 152 and the ability that the thermal chamber 152 and the effective underground heat of other parts of surrounding environment and/or system 100 are isolated possibly be important; Its reason is: otherwise, cause air to pass thermal chamber 152 fast along with substrate 110 and sample processing device 150 rotate around rotation 111, and this for example possibly desirably not cool off thermal chamber 152 when needs heated chamber 152.Therefore, in certain embodiments, the structure of treating apparatus 150 per sample, one or more in inwall 162, upper wall 167 and the outer wall 164 possibly be important for heat is isolated.

Shown in Fig. 1 to 3 and Fig. 5 and 6, in certain embodiments, sample processing device 150 can also comprise device case or body 153, and in certain embodiments, and body 153 can limit input well 154 or other chambers, any passage, thermal chamber 152 etc.In addition, in certain embodiments, the body 153 of sample processing device 150 can comprise outer lip, flange or wall 155.In certain embodiments, shown in Fig. 1 to 3, outer wall 155 can comprise the part 159 that is suitable for the part 157 that cooperates with substrate 110 and is suitable for cooperating with ring cover 160.For example, shown in Fig. 2 and 3, the size of ring cover 160 (for example outer wall 164) can be confirmed as it is received within outer wall 155 region surrounded by sample processing device 150.As a result, in certain embodiments, the outer wall 155 of sample processing device 150 can cooperate with ring cover 160, to cover and/or isolation thermal chamber 152.Such cooperation can also be convenient to the location of ring cover 160 with respect to sample processing device 150; Make thermal chamber 152 by protection with cover, and ring cover 160 can not be depressed on any part of thermal chamber 152 or contact with any part of thermal chamber 152.

In certain embodiments; The outer wall 155 of sample processing device 150 and the one or more input wells 154 in the body 153 of sample processing device 150 that form can (for example in the top surface of sample processing device 150) limit recess (for example annular recess) 156 effectively in sample processing device 150, at least a portion of ring cover 160 can be arranged in this recess 156.For example, shown in Fig. 1 to 3, when ring cover 160 was positioned at the top of sample processing device 150 or is connected in sample processing device 150, inwall 162 (for example comprising magnetic part 170) and outer wall 164 can be arranged in the recess 156 of sample processing device 150.Therefore, in certain embodiments, outer wall 155, input well 154 and/or recess 156 can be reached and cover the 160 reliable location with respect to sample processing device 150.

In certain embodiments, shown in Fig. 1 to 4, magnetic part 170 can be arranged in the anchor ring, and anchor ring or cover 160 the part that comprises magnetic part 170 and can comprise inner edge (for example radially edge) 173 and outer rim (for example outer radial edge) 175.Shown in Fig. 1 to 3, lid 160 and/or magnetic part 170 can be constructed such that inner edge 173 and outer rim 175 all can be positioned at inboard (for example radially inner side) with respect to thermal chamber 152.

Therefore; In certain embodiments; Magnetic part 170 can be limited in covering certain zone of 160; In this zone, magnetic part 170 is set at the outside (for example radial outside) of input well 154 (or the formation thing in other convexities, chamber, recess or the body 153) and the inboard (for example radially inner side) of thermal chamber 152.In this class formation, magnetic part 170 can be considered to be constructed such that the open area maximization that can be touched or can be used in other functions by other devices of sample processing device 150.In addition, in this type embodiment, magnetic part 170 can be configured to not interrupt or disturb the processing of the sample that is arranged in thermal chamber 152.

In certain embodiments; Shown in Fig. 1 to 4; The magnetic part 170 of lid 160 can form at least a portion of inwall 162 or be connected in inwall 162; Make that magnetic part 170 can be as at least a portion of interior hold-down ring 162, compress, keep sample processing device 150 and/or make sample processing device 150 distortion with heat transfer surface 132 against the heat structure 130 of substrate 110.Shown in Fig. 1 to 4, one in the

magnetic part

170 and 172 or the two can for example be arranged in the anchor ring around rotation 111.In addition, in certain embodiments, at least one in the

magnetic part

170 and 172 can comprise around the equally distributed basically magnetic force of this anchor ring.

In addition, layout and magnetic part 172 in substrate 110 the corresponding layout of magnetic part 170 in lid 160 can provide with respect to one in sample processing device 150 and substrate 110 or the additional assist location of the two for covering 160.For example; In certain embodiments;

Magnetic part

170 and 172 can comprise the part with alter polarity and/or the peculiar structure or the configuration of magnetic part separately; Make the magnetic part 172 " amalgamation " each other cover 160 magnetic part 170 and substrate 110, can be positioned at the required orientation position, angle of rotation 111 (for example with respect to) reliably with respect in sample processing device 150 and the substrate 110 at least one so that cover 160.

In certain embodiments, be described below and shown in Fig. 7 and 8, ring cover 160 can not comprise outer wall 164.In this type embodiment, thermal chamber 152 can for expose with palp, perhaps upper wall 167 can cover this part of sample processing device 150 separately.In addition, be described below and shown in Fig. 9 and 10, in certain embodiments, ring cover 160 can not comprise upper wall 167.In certain embodiments, if desired, can mainly provide the heat of thermal chamber 152 to isolate separately through sample processing device 150.Said with reference to figure 7 to 10 as follows, ring cover of the present invention can be suitable for cooperating with the several samples treating apparatus.Therefore, some ring cover can more can be used for and some sample processing device combinations than miscellaneous part.

In certain embodiments,, can strengthen the conformal performance of this sample processing device so if sample processing device of the present invention comprises the annular processes ring, this annular processes annular become comprise core with utilize contact adhesive to be attached to the composite structure of the lid of this core.Sample processing device 150 shown in Fig. 1 to 6 is instances of a this composite structure.Shown in Fig. 1 and 5, in certain embodiments, sample processing device 150 can comprise body 153, and lid 182 and 186 utilizes bonding agent (for example contact adhesive) 184 and 188 (difference) to be attached to this body 153.Under the situation of the circular arrangement of being arranged at process chamber (for example thermal chamber 152) to form (as shown in figs. 1 and 6) by composite structure for example shown in Figure 5; Thermal chamber 152 and cover 182 and 186 and can limit the annular processes ring of fitting shape at least in part, this annular processes ring are suitable for being pushed against at sample processing device 150 shape of the heat transfer surface 132 of the below of fitting when transmitting surface 132 (heat transfer surface 132 for example is shaped).In this type embodiment, some that can utilize the annular processes ring is out of shape and realized this conformal performance, keeps thermal chamber or the fluid integrity (promptly can not cause leakage) of any other fluid passage or chamber in the sample processing device 150 simultaneously.

Body 153 and be used in the sealed sample treating apparatus 150 the different lid 182 and 186 of any fluidic structures (for example thermal chamber 152) and can process by any suitable material.The instance of suitable material can comprise for example polymeric material (for example polypropylene, polyester, polycarbonate, tygon etc.), metal (for example metal forming) etc.Lid can but needn't necessarily be arranged to the roughly flat sheet component of for example metal forming, polymeric material, layered composite etc.In certain embodiments, selection be used for body 153 and cover 182 and/or 186 material can present favorable waterproof property.

In certain embodiments, lid at least one in 182 and 186 can be configured to by the material that the electromagnetic energy of wavelength is selected in transmission basically.For example, in certain embodiments, one in the lid 182 and 186 or the two can be optically transparent.As other instance, in certain embodiments, lid one in 182 and 186 or the two can be configured to by the material of being convenient to the interior fluorescence of thermal chamber 152 or color change are carried out vision or machine monitoring.

In certain embodiments, at least one in the lid 182 and 186 can comprise metal level, for example metal forming.If the metal forming of being set to, cover so 182 or 186 can comprise the inside of facing fluid structure lip-deep passivation layer, to prevent contacting between specimen material and the metal.Such passivation layer can also be used as bonded structure, and it can be used for the for example hot melt adhesion of polymkeric substance.As the alternative form of independent passivation layer, any adhesive phase that is used for lid is attached to body 153 also can be used as passivation layer, to prevent contacting between any metal in specimen material and the lid.

In certain embodiments, a lid 182 or 186 can be processed by polymer film (for example polypropylene), can comprise metal level (for example the metal foil layer of aluminium etc.) and install another lid 186 or 182 on 150 the opposite side.For example; In such embodiment; Lid 182 can with the electromagnetic radiation of selecting wavelength (for example visible spectrum, ultraviolet spectrum etc.) be transmitted in the process chamber (for example thermal chamber 152) and/or from this process chamber transmission go out, can be convenient to utilize that heat structure as herein described/surface passes thermal energy transfer in process chamber and/or from process chamber and cover 186 metal level.

Lid 182 and 186 can be incorporated into body 153 through any suitable technique, the combination of for example melting adhered, bonding agent, melting adhered and bonding agent etc.If adopt melting adhered, cover so and this lid attached surface can comprise for example polypropylene or the bonding material of some other melting, melting adhered to promote.In certain embodiments, lid 182 and 186 can combine with contact adhesive.Contact adhesive can be provided as the form of pressure sensitive adhesive layer, in certain embodiments, this pressure sensitive adhesive layer can be arranged to cover and the apparent surface of body 153 between the continuous whole layer.Some maybe be suitable the instance of attachment techniques, bonding agent etc. possibly be recorded in the United States Patent(USP) No. 6 that name for example is called ENHANCED SAMPLE PROCESSING DEVICES SYSTEMS AND METHODS; 734; 401 people such as () Bedingham and name are called the United States Patent(USP) No. 7 of SAMPLE PROCESSING DEVICES; 026,168 (people such as Bedingham).

Contact adhesive can present viscoelasticity, in certain embodiments, this viscoelasticity can so that cover in 182 and/or 186 one or more with respect to lid 182 and/or 186 attached following body 153 do some and move.Said moving possibly be because the distortion of annular processes ring causes, and for example to conform to the shape transfer surface, more describes in detail like following institute.This relatively moves also possibly be owing to different coefficient of thermal expansion between lid 182,186 and the body 153 causes.No matter the cause that relatively moves between the body in lid of the present invention and the sample processing device how; In certain embodiments; Even if there is distortion, the viscoelasticity of contact adhesive also can allow other characteristic of fluid of process chamber (for example thermal chamber 152) and fluidic structures to keep their fluid integrity (being that they can not leak).

As described herein; Comprise that utilization is attached to the sample processing device that lid on the body forms the annular processes ring of composite structure through the viscoelasticity contact adhesive and can presents conformal performance according to applied force, so that the annular processes ring fits in the shape transfer surface.Perhaps; Can be with the conformal performance of annular processes ring in the sample processing device that the present invention is used in combination through for example process chamber being arranged to be arranged in the annular processes ring and realized with (for example circular), most of zone is occupied by the cavity in the body 153 in this annular processes ring.For example, as shown in Figure 1, thermal chamber 152 can be formed by the cavity in the body 153 self, and these cavities are attached to the one or more sealings in the lid 182 and 186 on the body 153.

Fig. 6 is the close-up plan view of the part on one of sample processing device 150 of the present invention main surface.The part of device 150 shown in Figure 6 comprises the part with outer rim 185 and inner edge 187 of annular processes ring.Thermal chamber 152 can be set in the annular processes ring, and as described herein, can form the cavity that extends through body 153, is combined to limit the volume of thermal chamber 152 in lid 182 and 186 and said cavity.In order to improve conformal performance or the flexibility that is processed the annular processes ring that chamber 152 occupies, the cavity of thermal chamber 152 can occupy the body 153 that is positioned at the annular processes ring volume 50% or more.

In certain embodiments, interior hold-down ring (for example covering 160 inwall 162) can contact sample processing device 150 along the inner edge of annular processes ring 187 or between the inside part of inner edge 187 and thermal chamber 152.In addition, in certain embodiments, external compression ring (for example covering 160 outer wall 164) can contact sample processing device 150 between partly along the outer rim of annular processes ring 185 or in the outermost of outer rim 185 and thermal chamber 152.

Can provide with the combination that is positioned at the cavity of annular processes ring through the annular processes ring that utilizes the viscoelasticity contact adhesive to form composite structure with the conformal performance of annular processes ring in the sample processing device that the present invention is used in combination.Such combination can provide than the good conformal performance of the arbitrary method of independent employing.

In the embodiment shown in Fig. 1 to 6, sample processing device 150 and ring cover 160 are shown as circular symmetry separately.For example, ring cover 160 is depicted as the ring-type anchor ring with symcenter 161, and said inner edge 163 is interior radially edge 163, and said outer rim 165 is an outer radial edge 165.Yet, as stated, be to be understood that ring cover 160 can take multiple other suitable shapes.Similarly, sample processing device 150 can be taked multiple other suitable shapes, and like this,

center

151 and 161 can not be the center of symmetry, and to cover 160 inner edge 163 can not be to locate with respect to center 161 " radially " with outer rim 165.The structure of sample processing device 150 shown in Fig. 1 to 6 and ring cover 160 is merely and illustrates.

Ring cover 160 is at parts for opening in 150 minutes with sample processing device shown in Fig. 1 to 4 and as stated.Yet, should be appreciated that in certain embodiments, ring cover 160 can with sample processing device 150 together, sample processing device 150 can be arranged on the substrate 110 together with ring cover 160.

As stated, in certain embodiments, lid 160 and/or substrate 110 can comprise one or more

magnetic parts

170 and 172, and this

magnetic part

170 and 172 is an electromagnets, can be excited when needed, for example to replace passive magnetic part snap-in force is provided.In such embodiment, can in sample processing device 150 rotary courses, supply power to electromagnet.

Though obviously do not illustrate among Fig. 1 to 3, in certain embodiments, substrate 110 can be constructed such that heat structure 130 is exposed on the top first surface 112 and bottom second surface 114 of substrate 110.(for example expose separately or also expose) through heat structure 130 is exposed on the top surface 112 of substrate 110 in lower surface 114, can the transmission surface 132 of heat structure 130 and covering 160 and substrate 110 between sample processing device 150 between the direct heat path is provided.

Alternative be or in addition be; When heat structure 130 was the electromagnetic energy heating of being sent by the electromagnetic energy source on the lower surface 114 that electromagnetic energy is directed to substrate 110, it possibly be favourable making heat structure 130 be exposed on the lower surface 114 of substrate 110.

(being merely for example) system 100 comprises electromagnetic energy source 190; This electromagnetic energy source 190 is configured to heat energy is delivered to heat structure 130; The electromagnetic energy that wherein sends through source 190 is directed on the lower surface 114 of substrate 110, and is directed on the part on the lower surface that is exposed to substrate 110 114 of heat structure 130.The instance of the electromagnetic energy source that some are suitable can include, but is not limited to laser instrument, wideband electromagnetic energy source (for example, white light) etc.

Though being depicted as, system 100 comprises electromagnetic energy source 190, in certain embodiments, and can be through can any appropriate energy source that heat energy is delivered to heat structure 130 being controlled the temperature of heat structure 130.The instance of the possible appropriate energy source that is used in combination with the present invention can also comprise for example Peltier's element, electric resistance heater etc. except electromagnetic energy source.

Like what be used in combination with the present invention, term " electromagnetic energy " (and variant) refers to can not have physics is delivered to desired location or material contiguously from the source electromagnetic energy (not considering wavelength/frequency).The limiting examples of electromagnetic energy can include, but is not limited to laser energy, radio frequency (RF), microwave radiation, luminous energy (comprising that ultraviolet arrives infrared spectrum) etc.In certain embodiments, electromagnetic energy can be limited to and falls into the energy of ultraviolet in the infrared radiation spectrum (comprising visible spectrum).

Under the situation that heat structure 130 heats through remote energy source (promptly not sending the energy source of heat energy through direct contact to heat structure 130), heat structure 130 can be configured to absorption of electromagnetic energy and convert the electromagnetic energy that absorbs into heat energy.Therefore, the material that is used for heat structure 130 can have enough heat conductivities, and can absorb the electromagnetic energy that is produced by electromagnet source 190 with enough speed.In addition, also possibly it is desirable to, the material that is used for heat structure 130 has enough thermal capacity, to form the thermal capacitance effect.The instance of the material that some are suitable includes, but is not limited to: aluminium, copper, gold etc.If heat structure 130 is not configured to the material of enough speed absorption of electromagnetic energy by self, so in certain embodiments, heat structure 130 can comprise the material that improves energy absorption.For example, heat structure 130 can be coated with the electromagnetic energy absorption material, for example carbon black, polypyrrole, printing ink etc.

Except being that heat structure 130 is selected the suitable material, it can also comprise towards the groove of electromagnetic energy source 190 or other surface structures, is exposed to the surface area of the electromagnetic energy that is sent in source 190 with increase.The surface area that increases the electromagnetic energy that is exposed to source 190 of heat structure 130 can improve heat structure 130 endergonic speed.The surface area that is used for the increase of heat structure 130 can also increase efficiency of electromagnetic energy absorption.

In certain embodiments, heat structure 130 can be isolated with the remainder relatively hot of substrate 110, makes only limited (if any) thermal energy in the heat structure 130 be passed to the remainder of substrate 110.Can be for example through with only be absorbed with thermal relief can material (the for example polymkeric substance etc.) supporting structure of making substrate 110 realize that heat isolates.Some suitable materials that are used for the supporting structure of substrate 110 comprise for example glass-filled plastics (for example, polyether ester ketone (polyetheresterketone)), silicones, pottery etc.

Though substrate 110 comprises basically the heat structure 130 of form of annular rings continuously, alternative is that heat structure 130 can be set to a series of discontinuous thermal elements, and is for example circular, square, is positioned under the thermal chamber 152 on the sample processing device 150.Yet a possible advantage of (for example continuous loop) heat structure 130 is that the temperature of heat structure 130 can keep balance in heating process continuously.If the group of the thermal chamber 152 in the sample processing device 150 is arranged such that they directly contact with the transmission surface 132 of heat structure 130, exist so and improve the chamber to the inhomogeneity possibility of room temperature for all thermal chambers 152 on being positioned at Continuous Heat structure 130.

Though illustrated substrate 110 comprises only heat structure 130; But should be appreciated that said substrate can comprise thermal energy transfer to the selected thermal chamber that is arranged in the sample processing device 150 on the heat structure 152 or pass out the required any amount of heat structure 130 of heat energy from this selected thermal chamber 152.In addition, in certain embodiments, under the situation that is provided with a more than heat structure 130, different heat structures 130 can be independently of one another, and making does not have a large amount of heat energy to be transmitted between different independent thermal structures 130.An instance that is provided with the alternative form of independent thermal structures 130 can be the form of donut.

Other characteristics of the system 100 of Fig. 1 to 6 are being described shown in Figure 11 and 12 and hereinafter.

Fig. 7 and 8 shows according to another annular pressing system 200 of the present invention, wherein roughly the same numeral parts roughly the same.System 200 is total above and following referring to figs. 1 through 6 and the system 100 of Figure 11 and 12 components identical and the characteristic described.Therefore, with Fig. 1 to 6 and Figure 11 and 12 illustrated embodiments in element and the corresponding element of characteristic and characteristic provide with the identical Reference numerals of 200 series.For characteristic and the element (and alternative form of these characteristics and element) of more completely describing Fig. 7 and 8 illustrated embodiments, with reference to the description that combines Fig. 1 to 6 and Figure 11 and 12 to carry out of preceding text or hereinafter.

System 200 comprises substrate 210, and this substrate can rotate around rotation 211.Substrate 210 can also be to be attached to the drive system (not shown) with preceding text frame of reference 100 said similar modes or any suitable alternative layouts.

Shown in Fig. 7 and 8, system 200 also can comprise the sample processing device 250 and ring cover 260 that can be used in combination with substrate 210.Substrate 210 shown in Fig. 7 and 8 is similar with the substrate 110 of system 100, and comprises heat structure 230, and this heat structure 230 can comprise the heat transfer surface 232 on the top surface 212 that is exposed to substrate 210.

For another example shown in Fig. 7 and 8, one or more input wells and/or other chambers (sometimes being called " non-heat " chamber or " non-heat " process chamber) 254 that sample processing device 250 can comprise thermal chamber 252 and for example be configured to be communicated with thermal chamber 252 fluids via one or more passage 258, valve etc. or their combination.In addition, input well 254 can be set between the center 251 of sample processing device 250 and in the thermal chamber 252 at least one.In addition, similar with above-mentioned lid 160, ring cover 260 can be configured to allow to touch the part that comprises input well 254 of sample processing device 250, makes to be configured to adjacent with sample processing device 250 or can to touch input well 254 when connecting when covering 260.

As other instance; Sample processing device 250 can comprise various characteristics and element; For example the name PCT patent that is called METHODS FOR NUCLEIC ACID AMPLIFICATION is announced No.WO2008/134470 people such as () Parthasarathy and is called ENHANCED SAMPLE PROCESSING DEVICES, characteristic and the element described in the U.S. Patent Publication No.2008/0152546 of SYSTEMS AND METHODS people such as () Bedingham.

Similar with said system 100; Ring cover 260 and substrate 210 can compress the sample processing device 250 (for instance) between them; With sample processing device 250 is fixing and/or remain on the substrate 210, also strengthen heat structure 230 and the thermal coupling between the sample processing device 250 on the substrate 210 with outside around rotation 211 rotations.Therefore, rotation 211 can limit the z axle of system 200.

In addition; Only by way of example and similar with system 100; Property compressing structure as an example, the system 200 shown in Fig. 7 and 8 comprises magnetic part 270 that is positioned on (but perhaps being connected in mode of operation at least) lid 260 and the magnetic part 272 that is positioned at the correspondence on (but perhaps being connected in mode of operation at least) substrate 210.

Shown in Fig. 7 and 8, ring cover 260 can also comprise center 261, inner edge 263 and outer rim 265, and when lid 260 was connected in substrate 210, center 261 can be aimed at rotation 211, and inner edge 263 limits opening 266 at least in part.For another example shown in Fig. 7 and 8, the inner edge 263 of ring cover 260 for example can be configured to be configured to sample processing device 250 when adjacent to be positioned at respect to the center 261 of ring cover 260 when ring cover 260 inboard (for example radially inner side) of thermal chamber 252.In addition, the inner edge 263 of ring cover 260 can be configured to be positioned at the radial outside of input well 254.In addition, the outer rim 265 of ring cover 260 can be configured to be positioned at the outside (for example radial outside) outside of input well 254 (and be positioned at) of thermal chamber 252.

Similar with system 100, inner edge 263 can be positioned to the center of ring cover 260 261 at a distance of first apart from d ₁' (for example first radial distance or " first radius "), and outer rim 265 can be positioned to the center of ring cover 260 261 at a distance of second distance d ₂' (for example second radial distance or " second radius ").First apart from d ₁' and second distance d ₂' (and with the relevant area of these distances) can have with preceding text and be directed against system's 100 said similar relations.

Similar with ring cover 160, ring cover 260 can comprise inwall 262 (for example " inner peripheral wall " or " interior radial wall "; In certain embodiments, it can be used as interior hold-down ring, is described below).As shown in the figure, inwall 262 can comprise or limit inner edge 263, and inwall 262 can be set at the inboard (for example radially inner side) of thermal chamber 252.

Shown in Fig. 7 and 8, inwall 262 can comprise magnetic part 270 for another example, and a part that makes magnetic part 270 form inwall 262 perhaps is connected in inwall 262.For example, in certain embodiments, magnetic part 270 can be embedded into (for example molded) in inwall 262.In addition, also similar with ring cover 160, ring cover 260 can also comprise upper wall 267, and this upper wall 267 can be arranged to cover the part of sample processing device 250, for example comprises the part of thermal chamber 252.In certain embodiments, lid at least a portion of 260 can be optically transparent, and this at least a portion for example be one in inwall 262 and the upper wall 267 or the two.

Yet different with ring cover 160 is that ring cover 260 does not comprise outer wall, therefore for system 200 the external compression ring is not provided.Exactly, in system 200, the external compression ring can be provided by sample processing device 250.

Shown in Fig. 7 and 8; Sample processing device 250 comprises outer wall 255 (perhaps " outer circle wall " or " outer radial wall "); This outer wall 255 can be used as the external compression ring, to be used at least a portion of sample processing device 250 is pressed on the heat transfer surface 232 of substrate 210.That is to say that different with the sample processing device of system 100 150 is, Fig. 7 and 8 sample processing device 250 comprise higher or thicker outer wall 255, and this outer wall 255 extends upward and the upper wall 267 of contact ring female cap 260 basically vertically.Therefore, in certain embodiments, outer wall 255 can for example cooperate with upper wall 267 as the external compression ring, make cover 260 upper wall 267 can to press down (for example along or the z axle that is arranged essentially parallel to system 200 at first direction D ₁' on) to sample processing device 250, comprise the outer wall 255 of sample processing device 250.In certain embodiments, the outer wall 255 of sample processing device 250 can be arranged on the outside (for example radial outside) of thermal chamber 252.

In addition, shown in Fig. 7 and 8, the outer wall 255 of sample processing device 250 can also be used at least in part thermal chamber 252 being isolated with surrounding environment and/or with other parts of sample processing device 250.

In addition, (be merely for example) shown in Fig. 7 and 8, in certain embodiments, the body 253 of sample processing device 250 and/or outer wall 255 can comprise and be suitable for the part 257 that cooperates with substrate 210.For example, shown in Fig. 7 and 8, at least a portion that the size of the part 257 of sample processing device 250 is suitable for admitting substrate 210.Cooperation such between sample processing device 250 and the substrate 210 for example can strengthen the connection between sample processing device 250 and the substrate 210, and can help the location of sample processing device 250 with respect to substrate 210.

As shown in Figure 7, one or more thermal chambers 252 can be arranged in the anchor ring at the center 251 of sample processing device 250, and this anchor ring also can be called " annular processes ring " sometimes.In this type embodiment, ring cover 260 can be suitable for covering and/or isolating the part that comprises annular processes ring or thermal chamber 252 of sample processing device 250.For example, ring cover 260 can be provided with inwall 262 and upper wall 267, to cover and/or to isolate the part that comprises thermal chamber 252 of sample processing device 250.

In certain embodiments; Sample processing device 250 can comprise the recess (for example annular recess) 256 that is formed on (for example in the top surface of sample processing device 250) in the body 253, and the size of this recess 256 is suitable for admitting at least a portion of ring cover 260.For example, shown in Fig. 7 and 8, when ring cover 260 was arranged on the sample processing device 250 or is connected in sample processing device 250, inwall 262 can be arranged in (comprising magnetic part 270) recess 256 of sample processing device 250.

In addition, shown in Fig. 7 and 8, one in the

magnetic part

270 and 272 or the two can for example be arranged in the anchor ring around rotation 211.And in certain embodiments, at least one in the

magnetic part

270 and 272 can comprise around the equally distributed basically magnetic force of this anchor ring.

In certain embodiments, lid 260 anchor ring that comprises magnetic part 270 or part can comprise inner edge (for example radially edge) 273 and outer rim (for example outer radial edge) 275.Shown in Fig. 7 and 8, lid 260 and/or magnetic part 270 can be constructed such that inner edge 273 and outer rim 275 all can be positioned at inboard (for example radially inner side) with respect to thermal chamber 252.

And in certain embodiments, the anchor ring of magnetic part 270 can be positioned at the outside (for example radial outside) of the part that comprises input well 254 of one or more input wells 254 or sample processing device 250 (or part of body 253).In addition, in certain embodiments, input well 254 (or part that comprises or limit input well 254 of sample processing device 250) and/or recess 256 can provide and cover the 260 reliable location with respect to sample processing device 250.

Therefore; In certain embodiments; Magnetic part 270 can be limited in covering in certain zone of 260; In this zone, magnetic part 270 is positioned at the outside (for example radial outside) of input well 254 (or the formation thing in other convexities, chamber, recess or the body 253) and the inboard (for example radially inner side) of thermal chamber 252.In this class formation, magnetic part 270 can be considered to be constructed such that the open area maximization that can be touched or can be used in other functions by other devices of sample processing device 250.In addition, in this type embodiment, magnetic part 270 can not be configured to interrupt or disturb the processing of the sample that is arranged in thermal chamber 252.And similar with system 100,

magnetic part

270 and 272 is " amalgamation " relative to each other, is positioned required orientation will cover 260 with respect in sample processing device 250 and the substrate 210 at least one.

Similar with preceding text with reference to figure 1 and 5 described lids 182 and 186; Sample processing device 250 can comprise and covers 282; This lid 282 is arranged to cover on the part of sample processing device 250, with the input well 254 that limits sample processing device 250 at least in part or other passages, chamber, recess etc.

Fig. 9 and 10 shows according to another annular pressing system 300 of the present invention, wherein roughly the same numeral parts roughly the same.System 300 is with above and have a plurality of components identical and a characteristic below with reference to the system of the system 100 of Fig. 1 to 6 and Figure 11 and 12 or Fig. 7 and 8 200 is said.Therefore, with Fig. 1 to 6 and Figure 11 and 12 or Fig. 7 and 8 illustrated embodiments in element and the corresponding element of characteristic and characteristic provide with the identical Reference numerals of 300 series.Combine Fig. 1 to 6 and Figure 11 and 12 and the description carried out of Fig. 7 and 8 with reference to preceding text or hereinafter, with the more completely characteristic and the element (and substitute of these characteristics and element) of key diagram 9 and 10 illustrated embodiments.

System 300 comprise cover 360, sample processing device 350 and substrate 310.System 300 is substantially the same with the system 200 of Fig. 7 and 8, and difference is that system 300 comprises and covers 360 that this lid 360 does not comprise upper wall or outer wall, but only comprises inwall 362.Inwall 362 comprises one or more magnetic parts 370, and this magnetic part 370 is suitable for attracting the one or more magnetic parts 372 in the substrate 310.Therefore, the size of at least a portion of lid 360 can be confirmed as and make in its recess that is received within sample processing device 350 356.

In the embodiment shown in Fig. 9 and 10, lid 360 comprises the simple anchor ring with magnetic part 370.As shown in Figure 9, lid 360 can comprise inner edge 363 and outer rim 365, and this inner edge 363 defines the opening 366 that covers in 360.In addition, magnetic part 370 is depicted as and is arranged in (see figure 10) in the anchor ring that also comprises inner edge 373 and outer rim 375.In the embodiment shown in Fig. 9 and 10, the inner edge 363 of lid 360 separates less distance with the inner edge 373 of magnetic part 370, and the outer rim 365 of lid 360 separates less distance with the outer rim 375 of magnetic part 370.In other words, in certain embodiments, the inner edge 363 of lid 360 can be positioned to adjacent with the inner edge 373 of magnetic part 370, and in certain embodiments, the outer rim 365 of lid 360 can be positioned to adjacent with the outer rim 375 of magnetic part 370.In addition, the outer rim 375 of the inner edge 373 of the outer rim 365 of the inner edge 363 of lid 360, lid 360, magnetic part 370 and magnetic part 370 can for example be positioned at the inboard (for example radially inner side) of thermal chamber 352 with respect to the center 361 of lid 360 or with respect to rotation 311.Other characteristics of inner edge and outer rim 363,373,365 and 375 and element (for example with respect to thermal chamber 352) and alternative form thereof are found in the embodiment of above Fig. 1 to 6 and the embodiment of Fig. 7 and 8.

Shown in Fig. 9 and 10, lid 360 needn't be constructed to isolate with one or more thermal chambers in the sample processing device 350 352 and surrounding environment or with other parts of sample processing device 350 (for example physically or heat insulation ground).Be configured to sample processing device 350 is compressed, keeps and/or be deformed on the substrate 310 but cover 360, exactly on the heat transfer surface 332 of substrate 310.

Similar with preceding text with reference to figure 1 and 5 described lids 182 and 186; Sample processing device 350 can comprise and covers 382; This lid 382 is positioned at the top of the part of sample processing device 350, with one or more input wells 354 of limiting sample processing device 350 at least in part or other passages, chamber, recess etc.In addition; In certain embodiments; Sample processing device 350 can also comprise lid 182 and the 186 similar extra lid (not shown) with Fig. 1 and 5; It is positioned to cover at least a portion that is formed with thermal chamber 352 of sample processing device 350, to limit at least in part and/or to isolate thermal chamber 352.

Get back to above-mentioned system 100, Figure 11 is the cross section and perspective along the line 11-11 intercepting of Fig. 1 of a part of substrate 110 and the heat structure 130 of the system 100 shown in Fig. 1 to 6.Shown in figure 11, substrate 110 can comprise main body 116, and heat structure 130 is attached on this main body 116.Though not shown among Figure 11, in certain embodiments, main body 116 can attach to the axle that is used for making substrate 110 rotations regularly.Attached regularly referring to, in the operating period of system 100, when sample processing device 150 compressed between lid 160 and substrate 110, main body 116 did not move with respect to axle usually.

Shown in figure 11, in certain embodiments, heat structure 130 can be the structure of the roughly U-shaped of transition table face 132 belows.Such shape can realize a plurality of functions.For example, U-shaped heat structure 130 can increase electromagnetic energy and incide the surface area on it, thereby can increase amount and the speed of energy delivery to heat structure 130.In addition, the U-shaped heat structure can be provided for the lower thermal mass of heat structure 130.

As described herein, an optical signature of system of the present invention is floating of heat structure 130 or suspends attachedly, makes heat structure 130 and lid 160 bias voltage flexibly toward each other.For example; In certain embodiments; Heat structure 130 can be connected in substrate 110 through one or more elastic components, and wherein one or more elastic components provide and the opposite biasing force of power that is applied by compressing structure (for example in the

magnetic part

170 and 172 one or more).In certain embodiments, heat structure 130 can respond substrate 110 and cover between 160 snap-in force and with respect to 116 motions of the main body of substrate 110.For example, the motion of heat structure 130 can be restricted to the z direction of principal axis, and this z direction of principal axis can be aimed at (for example parallel) (for example along first direction D with rotation 111 ₁).

Through the improved conformal performance with the surface of sample processing device 150 is provided, the resilient connection of heat structure 130 possibly be favourable.That heat structure 130 unsteady attached can help to compensate is for example uneven, the surface of variation in thickness etc.When sample processing device 150 between lid 160 and heat structure 130 when compressing, the resilient connection of heat structure 130 can also improve cover 160 and heat structure 130 between the uniformity coefficient of snap-in force of generation.

Many different mechanisms can be used for flexibly connecting heat structure 130.An exemplary mechanisms shown in Figure 11 and 12 is being the form of sheet spring 140, and this sheet spring 140 is attached on the main body 116 and heat structure 130 of substrate 110.Ring 142 and spring arm 144 in shown sheet spring 140 comprises, this spring arm 144 limits and extends to outer shroud 146 at otch 145 at least in part.As shown in the figure, interior ring 142 can be connected in main body 116, and outer shroud 146 can be connected in flange 136 on the heat structure 130 (also can referring to Fig. 3).Can realize the attached of spring 140 through any suitable connection technique, for example machanical fastener, bonding agent, scolder, solder brazing, welding etc.

The power that produces of adjustment sheet spring 140 in the following manner: the length that changes the otch 145 that limits spring arm 144 at least in part; Change the radial width of spring arm 144; Change the thickness of spring arm 144 (for example along the z direction of principal axis); Selection is used for the material of spring 140 etc.; Perhaps their combination.

In certain embodiments, the physics in the border (for example circle) that the inner edge on the transmission surface 132 of heat structure 130 between main body 116 that the

substrate

110 and 160 power that are pushed toward each other of covering can cause substrate 110 and the lid 160 limits is contacted.In other words, the magnetic attracting force among the embodiment shown in Fig. 1 to 6 and Figure 11 and 12 can be drawn lid 160 and be affixed by the main body 116 of substrate 110 over to one's side.Therefore, act on being clamped in of sample processing device 150 cover 160 and the power on the part between the surface 132 transmitted can pass through sheet spring 140 (or other elastic components, if use) and apply.In other words, can control through the for example elastic component of sheet spring 140 control of holding force.

In order to obtain the described result of earlier paragraphs, in certain embodiments, the holding force that between the main body 116 of lid 160 and substrate 110, produces can push hard to the biasing force that covers 160 greater than the transmission surface 132 that is used for heat structure 130.Therefore, lid 160 can be pulled to main body 116 and contact, and elastic component (for example the sheet spring 40) can be controlled at cover 160 and transmission surperficial 132 between impose on the power of sample processing device 150.

In certain embodiments, as shown in the figure, heat insulating element 138 (also can referring to Fig. 3) can be between the flange 136 of the outer shroud 146 of sheet spring 140 and substrate 110.Heat insulating element 138 can have multiple function.For example, heat insulating element 138 can reduce the thermal energy transfer between the flange 136 of outer shroud 146 and heat structure 130 of spring 140.Another possible function of heat insulating element 138 can be for spring 140 provides preload, and the top surface 112 used power that make heat structure 130 be biased to substrate 110 are selected level or on selected level.Thicker heat insulating element 138 can be increased preload by expectation usually, and thin heat insulating element 138 can be reduced preload by expectation usually.The instance that is used for some possible suitable materials of heat insulating element can comprise the material that the thermal conductivity ratio metal is low, for example polymkeric substance, pottery, elastic body etc.

Though sheet spring 140 is for can be used in an instance of the elastic component that flexibly connects heat structure 130, the sheet spring 140 shown in many other elastic components can be used for substituting perhaps can be shown in also spendable member outside the sheet spring 140.The instance of the elastic component that some other possibilities are suitable can comprise for example leaf spring, elastomer element, pneumatic type structure (for example piston, bladders etc.) etc. or their combination.

Though the main body 116 of sheet spring 140 and substrate 110 is depicted as independent parts, alternative form also is possible, wherein with the function of single global facility realization body 116 and spring 140.

Figure 13 shows according to another annular pressing system 400 of the present invention, wherein roughly the same numeral parts roughly the same.System 400 has similar elements and the characteristic that a plurality of and above Fig. 1 to 6 of combination illustrated embodiment is described.Therefore, with Fig. 1 to 6 illustrated embodiment in element and the corresponding element of characteristic and characteristic provide with the identical Reference numerals of 400 series.In order more completely to describe characteristic embodiment illustrated in fig. 13 and element (and alternative form of these characteristics and element), quote preceding text or hereinafter referring to figs. 1 through 6 descriptions done.

Shown in figure 13, system 400 comprises sample processing device 450, and this sample processing device 450 keeps being pressed between the heat structure 430 and lid 460 of substrate 410.

In the embodiment shown in fig. 13; The transmission surface 432 of heat structure 430 can be a profiled surface; Has the bossing (wherein inner edge 431 is near rotation 411, and heat structure 430 details like this paper around said rotation 411 rotations) between inner edge 431 and outer rim 433.At sample processing device 450 with before lid 460 contact, transmit surface 432 bossing can than heat structure 430 in the part at inner edge 431 and outer rim 433 places more near covering 460.In certain embodiments, shown in figure 13, when on radial cross-section, seeing, transmit surface 432 and can have convex curvature.Protruding transmission surface 432 can circular curve or for example any other curved profile of ellipse etc. limit.

Figure 14 and 15 illustrates alternative shape transfer surface, and it can the heat structure of annular ring be used in combination with for example being set to.Such modification shown in Figure 14 comprises heat structure 530 (with cross-sectional illustration so that its profile to be shown).Heat structure 530 comprises the shape transfer surface 532 with inner edge 531 and outer rim 533.Inner edge 531 is positioned adjacent to rotation, and heat structure 530 rotates around said rotation, details like this paper.Also show plane 501 (in Figure 14, seeing its edge), these plane 501 crosscut rotations.

In an illustrated embodiment, the outer rim 533 on plane 501 extend through shape transfer surface 532.With inner edge 431 and outer rim 433 be positioned at the transmission surface 432 of the Figure 13 on the same level different be that the inner edge 531 that transmits surface 532 can be positioned at and reference plane 501 skew (o) distance, and is shown in figure 14.In certain embodiments, as shown in the figure, the inner edge 531 that transmits surface 532 can be than outer rim 533 more near the lid (not shown).

Bossing as described herein, that shape transfer surface 532 can comprise between inner edge 531 and the outer rim 533.The height (h) of bossing with respect to plane 501 has been shown among Figure 14, and wherein this height (h) can represent to transmit the maximum height of the bossing on surface 532.

Shape transfer surface

432 and 532 shown in Figure 12 and 13 comprises bossing; The maximum height of this bossing is between inner edge that transmits the surface and outer rim; Yet the maximum height of bossing can replace and be positioned at an edge that transmits the surface, for example inner edge place.Such embodiment has been shown among Figure 15, has wherein shown the cut-open view of the part of heat structure 630.Heat structure 630 comprises the shape transfer surface 632 with inner edge 631 and outer rim 633, as above details.In certain embodiments, transmit surface 632 and can comprise bossing, this bossing has the height (h) above the reference plane 601 of the outer rim 633 on extend through transmission surface 632.

Yet different with the transmission surface of Figure 12 and 13 is that the maximum height (h) of transmitting the bossing on surface 632 is positioned at inner edge 631 places.From maximum height (h) beginning, transmit surface 632 with convex curve towards outer rim 633 downwarpings.In such embodiment, inner edge 631 is positioned at from the skew of reference plane 601 (o) distance and equals height (h).

Transmitting surface 432,532 maybe be by exaggerative among Figure 12-14 from the amount of plane surface skew.Highly (h) transmits the function of the inner edge on surface to the radial distance of outer rim.In certain embodiments, the radial width of transmitting the surface can be 4 centimetres or littler, in certain embodiments, is 2 centimetres or littler, and in certain embodiments, is 1 centimetre or littler.In this type embodiment, highly (h) can be in lower limit greater than in zero the scope, and this lower limit is for example 0.02 millimeter (mm) or bigger, and in certain embodiments, is 0.05 millimeter or bigger.In the upper end of scope, in certain embodiments, highly (h) can be 1 millimeter or littler, in certain embodiments, is 0.5mm or littler, and in certain embodiments, is 0.25 millimeter or littler.

Get back to Figure 13,, can improve the thermal coupling efficient between heat structure 430 and the sample processing device 450 through the shape transfer that combines with lid 460 of the present invention and compressing structure surface is provided.In certain embodiments, shape transfer surface 432 cooperates with the power that is applied by lid 460 can make sample processing device 450 distortion, makes it conform to the shape of transmitting surface 432.This distortion of sample processing device 450 can be used for promoting contact; Even the surperficial or transmission surperficial 432 towards transmitting surface 432 of sample processing device 450 self comprises irregular part, otherwise this irregular part possibly hinder uniform contact under the situation that does not have distortion.

Comprise that at sample processing device 450 lid 460 can comprise optical window 468 among the embodiment of process chamber (seeing the thermal chamber 152 on the sample processing device 150 of Fig. 1 for example), this optical window 468 allows electromagnetic energies to see through and covers at least a portion of 460.Such electromagnetic energy can be used for for example monitoring process chamber, inquires after process chamber, the material in the heat treatment chamber, mobile example treating apparatus 450, excite material in the process chamber etc." optical window " refers to and covers 460 transmission and have the selected part of the electromagnetic energy of selected wavelength.This transmission can be passed transmission material (or " optical clear " material) or pass and is formed on the cavity covered in 460 (seeing the lid 160,260 and 360 among Fig. 1 to 4,7,8 and 9,10 for example).

For the distortion that further promotes sample processing device 450 with fit across stride across sample processing device 450 towards the part of transmitting surface 432.In certain embodiments, all basically snap-in force transmission between lid 460 and heat structure 430 can pass through to cover 460 interior hold-

down ring

462 and 464 generations of external compression ring.

In order further to improve 450 pairs of applyings of transmitting surface 432 of sample processing device; In certain embodiments; Interior hold-down ring 462 can comprise edge treated part 469 with external compression ring 464, makes the subtle change of size of different parts (lid, sample processing device, heat structure etc.) to compensate through edge treated part 469 at least in part.An instance of suitable edge treated part can be a rounded feature, and it promotes sample processing device 450 to contact with point between hold-down ring 462 and 464.Other possible instances of edge treated part that maybe be suitable can comprise the triangular structure 469c shown in the cantilever member 469b shown in the elastic washer 469a shown in Figure 16 A, Figure 16 B for example and Figure 16 C.

In another modification; Be to be understood that; Though illustrated system comprises the elastic component that heat structure is connected in substrate, also can use alternative layouts, wherein in hold-down ring 462 flexibly be connected in through one or more elastic components with external compression ring 464 and cover 460.The hold-down ring of flexibly installing on the lid 460 462 and 464 can also be used in system 400 for surface for example injustice, variation in thickness etc. some compensation being provided.When sample processing device 450 between lid 460 and heat structure 430 when compressing, hold-down ring 462 and/or 464 resilient connection can also improve cover 460 and heat structure 430 between the uniformity coefficient of snap-in force of generation.

As described herein; In certain embodiments; The part that contacts with transmission surface 432 (or other shape transfer surfaces) of sample processing device 450 can present some conformal performance, and during compressing, this conformal performance makes sample processing device 450 can conform to the shape of transmitting surface 432.This conformal performance can be limited to sample processing device and transmit the part that surface 432 contacts.Sample processing devices that some of right shape part of the shaping heat transfer surface that is suitable for fitting maybe be suitable be can comprise, the U.S. Patent Publication No.2007/0009391 that name for example is called COMPLIANT MICROFLUIDIC SAMPLE PROCESSING DISKS people such as () Bedingham and the U.S. Patent Publication No.2008/0050276 that is called MODULAR SAMPLE PROCESSING APPARATUS KITS AND MODULES people such as () Bedingham are recorded in.

One embodiment of the present of invention comprise the system that is used to handle sample processing device; Said system comprises: substrate; But it is connected in drive system with mode of operation, and wherein this drive system makes substrate rotate around rotation, and wherein said rotation limits the z axle; Heat structure, but it is connected in substrate with mode of operation, and wherein heat structure comprises the transmission that the exposes surface near the substrate first surface; At least one first magnetic part, but it is connected in substrate with mode of operation; Sample processing device, it comprises at least one thermal chamber; Ring cover; It is suitable for towards transmitting the surface; This ring cover has center, inner edge and outer rim; This sample processing device is suitable for being arranged between substrate and the ring cover, and the inner edge of ring cover is formed at when sample processing device is adjacent with ring cover to be provided with the inboard that is centered close at least one thermal chamber with respect to ring cover; And at least one second magnetic part; But it is connected in ring cover with mode of operation; This at least one second magnetic part is configured and attracts at least one first magnetic part; On the first direction of z axle, ring cover being applied power, thereby impel at least a portion of sample processing device to contact with the transmission surface of substrate.

An alternative embodiment of the invention comprises the system that is used to handle sample processing device; Said system comprises: substrate; But it is connected in drive system with mode of operation, and wherein this drive system makes substrate rotate around rotation, and wherein said rotation limits the z axle; Heat structure, but it is connected in substrate with mode of operation, and wherein heat structure comprises the transmission that the exposes surface near the substrate first surface; First anchor ring of magnetic part, but it is connected in substrate with mode of operation; Sample processing device, it comprises at least one thermal chamber; Ring cover, it is suitable for towards transmitting the surface, and this ring cover has inner edge and outer rim, and inner edge is positioned at the inboard of at least one thermal chamber, and sample processing device is suitable for being arranged between substrate and the ring cover; And second anchor ring of magnetic part; But it is connected in ring cover with mode of operation; Second anchor ring of magnetic part is constructed to attract first anchor ring of magnetic part; On the first direction of z axle, ring cover being applied power, thereby impel at least a portion of sample processing device to contact with the transmission surface of substrate.

An alternative embodiment of the invention comprises the method that is used to handle sample processing device, and said method comprises: substrate is provided, but this substrate is connected in drive system with mode of operation; Heat structure is provided, but this heat structure is connected in substrate with mode of operation, wherein heat structure comprises the transmission that the exposes surface near the substrate first surface; The sampling treating apparatus, this sample processing device comprises at least one thermal chamber; Ring cover is provided, and this ring cover is towards transmitting the surface, and ring cover has inner edge and outer rim; But be connected at least one first magnetic part of substrate and be connected at least one second magnetic part of ring cover with mode of operation but provide with mode of operation; With sample processing device between substrate and ring cover; Make the inner edge of ring cover be positioned at the inboard of at least one thermal chamber; And make at least one first magnetic part attract at least one second magnetic part; On the first direction of z axle, ring cover being applied power, thereby impel at least a portion of sample processing device to contact with the transmission surface of substrate; And substrate is rotated around rotation, wherein said rotation limits the z axle.

In any of the foregoing description, sample processing device can also comprise at least one non-thermal chamber, and when sample processing device is adjacent with ring cover when being provided with, this at least one non-thermal chamber is positioned at the inboard of ring cover inner edge.

In any of the foregoing description, edge radially in the inner edge of ring cover can comprise, and interior radially edge can be positioned at the radially inner side of at least one thermal chamber.

In any of the foregoing description, the outer rim of ring cover can comprise outer radial edge.

In any of the foregoing description, at least a portion of sample processing device can comprise at least one thermal chamber.

In any of the foregoing description, sample processing device can comprise recess, and ring cover can comprise that size is suitable for being accepted in the part in the recess of sample processing device.

In any of the foregoing description, at least one thermal chamber can be set in the endless belt of rotation.

In any of the foregoing description, at least one thermal chamber can be set in the annular processes ring, and at least a portion of sample processing device can comprise the annular processes ring.

In any of the foregoing description, the outer rim of ring cover can be positioned in the inboard of at least one thermal chamber.

In any of the foregoing description, the outer rim of ring cover can be positioned in the outside of at least one thermal chamber.

In any of the foregoing description, ring cover can comprise wall, and said wall is suitable for being arranged at least one thermal chamber.In certain embodiments, said wall can be optically transparent.

In any of the foregoing description, at least a portion of ring cover can be optically transparent.

In any of the foregoing description, at least one in ring cover and the sample processing device can comprise outer wall, and this outer wall is positioned at the outside of at least one thermal chamber, isolates at least one thermal chamber with heat.

In any of the foregoing description, inner edge can be to be positioned to center with ring cover at a distance of the interior radially edge of first radial distance, and outer rim can be to be configured to and the center of the ring cover outer radial edge at a distance of second radial distance.

In any of the foregoing description, first radial distance can for second radial distance at least about 50%.

In any of the foregoing description, ring cover can comprise opening, and this opening is provided for providing touching sample processing device.

In any of the foregoing description, the outer rim of ring cover can be positioned to center with ring cover at a distance of first radius, and first radius can limit first area.In this type embodiment, the area of opening can be at least 30% of first area.

In any of the foregoing description; Sample processing device can comprise be suitable for at least one thermal chamber at least one input well of being communicated with of at least one fluid, and at least one input well can also be set between the center of sample processing device and at least one thermal chamber at least one.

In any of the foregoing description, when sample processing device is adjacent with ring cover when being provided with, ring cover can be suitable for allowing at least one touch at least one input well.

In any of the foregoing description, ring cover can comprise opening, and this opening is provided for can providing when being provided with at least one touch at least one input well in that sample processing device is adjacent with ring cover.

In any of the foregoing description, ring cover can comprise when sample processing device is adjacent with ring cover and covers at least one the part at least one thermal chamber when being provided with.

In any of the foregoing description, ring cover can form with sample processing device.

In any of the foregoing description, at least one at least one first magnetic part and at least one second magnetic part can comprise ferrimagnet.

In any of the foregoing description, at least one second magnetic part can comprise inner edge and outer rim, and inner edge and outer rim all can be positioned at the inboard of at least one thermal chamber.

In any of the foregoing description, ring cover can comprise inner and outer wall, and this inwall comprises at least one second magnetic part, and when sample processing device is adjacent with ring cover when being provided with, this outer wall is positioned at the outside of at least one thermal chamber.

In any of the foregoing description, at least one first magnetic part and at least one relative to each other amalgamation of second magnetic part make ring cover and substrate can be suitable for the relative to each other orientation setting to be scheduled to.

In any of the foregoing description, at least one at least one first magnetic part and at least one second magnetic part can be the anchor ring form that is provided with around rotation.

In any of the foregoing description, at least one at least one first magnetic part and at least one second magnetic part can comprise around the equally distributed basically magnetic force of anchor ring.

In any of the foregoing description, at least one second magnetic part can be arranged to around the form of the anchor ring of rotation, and this anchor ring can comprise outer rim.In this type embodiment, it is adjacent with the outer rim of anchor ring that the outer rim of ring cover can be positioned to.

In any of the foregoing description; At least one second magnetic part can be arranged to around the form of the anchor ring of rotation; This anchor ring can comprise outer rim, and for example when sample processing device is adjacent with ring cover when being provided with, this outer rim can be positioned in the inboard of at least one thermal chamber.

In any of the foregoing description, second anchor ring of magnetic part can comprise inner edge and outer rim, and inner edge and outer rim all can be positioned at the inboard of at least one thermal chamber.

In any of the foregoing description, ring cover can comprise inner and outer wall, and this inwall comprises second anchor ring of magnetic part, and when sample processing device is adjacent with ring cover when being provided with, this outer wall is positioned at the outside of at least one thermal chamber.

In any of the foregoing description, the relative to each other amalgamation of second anchor ring of first anchor ring of magnetic part and magnetic part makes ring cover and substrate be suitable for predetermined orientation setting.

In any of the foregoing description, at least one in first anchor ring of magnetic part and second anchor ring of magnetic part can comprise around the equally distributed basically magnetic force of anchor ring.

In any of the foregoing description, second anchor ring of magnetic part can comprise outer rim, and the outer rim of ring cover can be positioned to adjacent with the outer rim of second anchor ring of magnetic part.

In any of the foregoing description, second anchor ring of magnetic part can comprise outer rim, and when sample processing device is adjacent with ring cover when being provided with, this outer rim can be positioned in the inboard of at least one thermal chamber.

In any of the foregoing description; The inner edge of ring cover can limit opening; And any among the said method embodiment can also comprise at least a portion of touching sample processing device via the opening in the ring cover, wherein said at least a portion of touching sample processing device can comprise physically touch, touch optically with calorifics at least a in touching.

Though various embodiment of the present invention only shown in the drawings by way of example should be appreciated that without departing from the scope of the invention, can adopt and describe in the literary composition and the multiple combination of illustrated embodiment.For example, some embodiment of system of the present invention can comprise substrate from an embodiment, from the sample processing device of another embodiment with from the lid of another embodiment.

In addition, describing above and only appear by way of example at the embodiment shown in the accompanying drawing, is not the restriction that is intended to as to notion of the present invention and principle.Like this, those of ordinary skill in the art should be appreciated that under the situation that does not break away from the spirit and scope of the present invention and can carry out various changes to each element and structure thereof and arrangement.

All references quoted among this paper and patent openly expressly in full way of reference incorporate the disclosure into.

Various characteristic of the present invention and aspect provide in following claims.

Claims

1. system that is used to handle sample processing device, said system comprises:

Substrate, but said substrate is connected in drive system with mode of operation, and wherein said drive system makes said substrate rotate around rotation, and wherein said rotation limits the z axle;

Heat structure, but said heat structure is connected in said substrate with mode of operation, and wherein said heat structure comprises the transmission surface that the first surface of contiguous said substrate exposes;

At least one first magnetic part, but said at least one first magnetic part is connected in said substrate with mode of operation;

Sample processing device, said sample processing device comprises at least one thermal chamber;

Ring cover; Said ring cover is suitable for towards said transmission surface; Said ring cover has center, inner edge and outer rim; Said sample processing device is suitable for being arranged between said substrate and the said ring cover, and the inner edge of said ring cover is formed at when said sample processing device is adjacent with said ring cover to be provided with the inboard that is centered close to said at least one thermal chamber with respect to said ring cover; And

At least one second magnetic part; But said at least one second magnetic part is connected in said ring cover with mode of operation; Said at least one second magnetic part is configured for and attracts said at least one first magnetic part on the first direction of said z axle, said ring cover being applied power, thereby impels at least a portion of said sample processing device to contact with the transmission surface of said substrate.

2. method that is used to handle sample processing device, said method comprises:

Substrate is provided, but said substrate is connected in drive system with mode of operation;

Heat structure is provided, but said heat structure is connected in said substrate with mode of operation, wherein said heat structure comprises the transmission surface that the first surface of contiguous said substrate exposes;

The sampling treating apparatus, said sample processing device comprises at least one thermal chamber;

Ring cover is provided, and said ring cover is towards said transmission surface, and said ring cover has inner edge and outer rim;

But be connected at least one first magnetic part of said substrate and be connected at least one second magnetic part of said ring cover with mode of operation but provide with mode of operation;

Said sample processing device is arranged between said substrate and the said ring cover; Make the inner edge of said ring cover be positioned at the inboard of said at least one thermal chamber; And make said at least one first magnetic part attract said at least one second magnetic part; On the first direction of z axle, said ring cover being applied power, thereby impel at least a portion of said sample processing device to contact with the transmission surface of said substrate; And

Said substrate is rotated around rotation, and wherein said rotation limits the z axle.

3. system according to claim 1 or method according to claim 2; Wherein said sample processing device also comprises at least one non-thermal chamber; When said sample processing device is adjacent with said ring cover when being provided with, said at least one non-thermal chamber is positioned at the inboard of the inner edge of said ring cover.

4. according to each described system in the claim 1 and 3 or according to each described method among the claim 2-3; Edge radially in the inner edge of wherein said ring cover comprises, and in wherein said radially the edge be positioned at the radially inner side of said at least one thermal chamber.

5. according to each described system is perhaps according to each described method among the claim 2-4 among claim 1 and the 3-4, the outer rim of wherein said ring cover comprises outer radial edge.

6. according to each described system is perhaps according to each described method among the claim 2-5 among claim 1 and the 3-5, said at least a portion of wherein said sample processing device comprises said at least one thermal chamber.

7. according to each described system among claim 1 and the 3-6 or according to each described method among the claim 2-6; Wherein said sample processing device comprises recess, and wherein said ring cover comprises that size is suitable for being received within the part in the said recess of said sample processing device.

8. according to each described system among claim 1 and the 3-7 or according to each described method among the claim 2-7, wherein said at least one thermal chamber is disposed in the endless belt of said rotation.

9. according to each described system among claim 1 and the 3-8 or according to each described method among the claim 2-8; Wherein said at least one thermal chamber is disposed in the annular processes ring, and said at least a portion of wherein said sample processing device comprises said annular processes ring.

10. according to each described system is perhaps according to each described method among the claim 2-9 among claim 1 and the 3-9, the outer rim of wherein said ring cover is positioned at the inboard of said at least one thermal chamber.

11. according to each described system is perhaps according to each described method among the claim 2-10 among claim 1 and the 3-10, the outer rim of wherein said ring cover is positioned at the outside of said at least one thermal chamber.

12. according to each described system is perhaps according to each described method among the claim 2-11 among claim 1 and the 3-11, wherein said ring cover comprises wall, said wall is suitable for being arranged on said at least one thermal chamber.

13. system according to claim 12 or method, wherein said wall are optically transparent.

14. according to each described system is perhaps according to each described method among the claim 2-13 among claim 1 and the 3-13, at least a portion of wherein said ring cover is optically transparent.

15. according to each described system among claim 1 and the 3-14 or according to each described method among the claim 2-14; In wherein said ring cover and the said sample processing device at least one comprises outer wall; Said outer wall is positioned at the outside of said at least one thermal chamber, isolates said at least one thermal chamber with heat.

16. according to each described system among claim 1 and the 3-15 or according to each described method among the claim 2-15; Wherein said inner edge is to be set to and the interior radially edge at a distance of first radial distance, the center of said ring cover, and wherein said outer rim is to be set to and the center of the said ring cover outer radial edge at a distance of second radial distance.

17. system according to claim 16 or method, wherein said first radial distance be said second radial distance at least about 50%.

18. according to each described system is perhaps according to each described method among the claim 2-17 among claim 1 and the 3-17, wherein said ring cover comprises opening, said opening is provided for providing touching said sample processing device.

19. system according to claim 18 or method; The outer rim of wherein said ring cover be set to the center of said ring cover at a distance of first radius; Wherein said first radius limits first area, and the area of wherein said opening is at least 30% of said first area.

20. according to each described system among claim 1 and the 3-19 or according to each described method among the claim 2-19; Wherein said sample processing device comprise be suitable for said at least one thermal chamber at least one input well of being communicated with of at least one fluid, and said at least one input well is set between the center of said sample processing device and in said at least one thermal chamber at least one.

21. system according to claim 20 or method, wherein said ring cover are suitable for allowing to touch in said at least one input well at least one when being provided with in that said sample processing device is adjacent with said ring cover.

22. system according to claim 20 or method, wherein said ring cover comprises opening, and said opening is provided for providing when being provided with at least one touch in said at least one input well in that said sample processing device is adjacent with said ring cover.

23. according to claim 21 or 22 described system or methods, wherein said ring cover is included in the part of at least one in said at least one thermal chamber of covering when said sample processing device is adjacent with said ring cover to be provided with.

24. according to each described system is perhaps according to each described method among the claim 2-23 among claim 1 and the 3-23, wherein said ring cover and said sample processing device form.

25. according to each described system is perhaps according to each described method among the claim 2-24 among claim 1 and the 3-24, at least one in wherein said at least one first magnetic part and said at least one second magnetic part comprises ferrimagnet.

26. according to each described system among claim 1 and the 3-25 or according to each described method among the claim 2-25; Wherein said at least one second magnetic part comprises inner edge and outer rim, and wherein said inner edge and said outer rim all are positioned at the inboard of said at least one thermal chamber.

27. according to each described system among claim 1 and the 3-26 or according to each described method among the claim 2-26; Wherein said ring cover comprises inner and outer wall; Said inwall comprises said at least one second magnetic part, and said outer wall is positioned at the outside of said at least one thermal chamber when being provided with in that said sample processing device is adjacent with said ring cover.

28. according to each described system among claim 1 and the 3-27 or according to each described method among the claim 2-27; Wherein said at least one first magnetic part and said at least one relative to each other amalgamation of second magnetic part make said ring cover and said substrate be suitable for relative to each other with predetermined orientation setting.

29. according to each described system among claim 1 and the 3-28 or according to each described method among the claim 2-28, at least one in wherein said at least one first magnetic part and said at least one second magnetic part is the form around the endless belt of said rotation setting.

30. system according to claim 29 or method, at least one in wherein said at least one first magnetic part and said at least one second magnetic part comprise around the equally distributed basically magnetic force of said endless belt.

31. according to each described system among claim 1 and the 3-30 or according to each described method among the claim 2-30; Wherein said at least one second magnetic part is arranged to around the form of the endless belt of said rotation; And wherein said endless belt comprises outer rim, and the adjacent setting of the outer rim of the outer rim of wherein said ring cover and said endless belt.

32. according to each described system among claim 1 and the 3-31 or according to each described method among the claim 2-31; Wherein said at least one second magnetic part is arranged to the form around the endless belt of said rotation; Wherein said endless belt comprises outer rim; And wherein when said sample processing device is adjacent with said ring cover when being provided with, said outer rim is positioned at the inboard of said at least one thermal chamber.

33. according to each described method among the claim 2-32, the inner edge of wherein said ring cover limits an opening, and said method also comprises at least a portion of touching said sample processing device via the said opening in the said ring cover.

34. method according to claim 33, at least a portion of wherein touching said sample processing device comprise physically touch, touch optically with calorifics at least a in touching.