CN102651506A - Conductive gel with curved wires - Google Patents

Abstract

The invention relates to a conductive colloid with bent conducting wires, which is applied to various testing and electrical connection devices, such as a testing seat of an integrated circuit element, a wafer probe card, an electrical connection interface of a circuit board and the like, and is used as an electrical contact medium between an object to be tested and a testing system or between objects to be connected, the conductive colloid is mainly characterized in that a plurality of bent conducting wires are distributed in an elastic colloid body, the plurality of bent conducting wires extend from the upper surface to the lower surface of the elastic colloid body, the upper ends and the lower ends of the conducting wires are close to the same vertical line, and the design of the bent conducting wires reduces the required pressing force during various pressing tests and electrical connections, can effectively reduce the component force of the conducting wires in the horizontal direction and reduce the phenomenon of generating the side sliding phenomenon at the bottom ends of the conducting wires, further improves the stability of the testing and the side sliding connection, and increases the effective working stroke, the conductive colloid is favorable for being applied to various testing and electric connection devices.

Description

Conductive gel with curved wires

technical field

The invention relates to a wire-type conductive colloid, especially a device for various testing and electrical connections, such as test sockets for integrated circuit components, wafer probe cards, and electrical connection interfaces between circuit boards, etc. The wire-type electrical connection part in the utility model can reduce the required downward force, and provide the conductive colloid with curved wires that can reduce the side-slipping function of the wires under pressure.

Background technique

Wire-type conductive film is a kind of test socket that can be applied to integrated circuit components, wafer probe cards, and circuit board-to-circuit board electrical connection interfaces, etc., as an electrical connection between the object under test and the test system or between the objects to be connected. medium of sexual contact. The structure of the known wire-type conductive film is mainly to spread a plurality of vertical or inclined straight-line wires (such as: gold-plated copper wires) in an elastic colloid body as conductors, and make the plurality of straight-line wires extending from the upper surface of the elastic colloid to the lower surface.

When the wire-type conductive film is used, it is used in an integrated circuit component testing system as an example. The wire-type conductive film is installed in the detection base on the test carrier, and the wire-type conductive film is used as the object to be tested ( That is, the interface of signal transmission between the integrated circuit component to be tested) and the test carrier board of the testing equipment, and provides the buffer elasticity when the integrated circuit component to be tested is pressed down through the bending of the elastic colloid and some wires under pressure.

When the object to be tested is inspected, the operator moves the object to be tested into the detection base, and applies pressure to the object to be tested, so that each input and output terminal of the object to be tested (such as: pin, Lead pads or solder balls) are pressed against the upper end of the wires in the wire-type conductive film, and then the wires are electrically contacted with the corresponding contact pads on the test carrier board to connect the detection system, and then the detection system performs functions on the integrated circuit components to be tested Test operations to determine whether the function of the test object is correct.

At present, when the existing wire-type conductive film is applied to the test operation of the integrated circuit element 4, as shown in Figure 15, the wires 60 in the conductive film 6 are arranged in an oblique shape. When the integrated circuit element 4 to be tested is pressed against the wire On the type conductive film 6, the inclined straight wire 60 conducts force downward and contacts the corresponding contact pad 50 on the test carrier board 5. At this time, because part of the wire 60 is applied to the downward force and bends, And because the upper and lower ends of the wire 60 are not located on the same vertical line, while being pressed, a lateral force in the horizontal direction is generated on the lower end of the wire 60, so that the lower end of the wire 60 slides sideways on the upper surface of the test carrier board 5, Also therefore if the vertical downward force is insufficient, it is easy to cause poor electrical contact between the wire 60 and the contact pad 50 of the test carrier 5, making it difficult for the wire-type conductive film to be connected correctly with the test system, affecting the test stability of the integrated circuit element.

In order to solve the side-slip phenomenon at the lower end of the aforementioned pressed wire 60, technically, it can be improved by reducing the angle of inclination of the wire 60. However, the angle of inclination of the wire 60 is increased, and the wire 60 is pressed down to contact the test carrier board 5. The strength of the contact pad 50 on the surface will also be significantly improved relatively, especially when the wires 60 in the conductive film 6 are vertically arranged, because the vertically arranged wires 60 are not easy to be bent under pressure, so in order to achieve the purpose of pressing down the integrated circuit element to be tested Pressing the appropriate compression stroke of the conductive film 6 often requires a lower force than the existing test equipment and its peripheral devices can provide. Therefore, simply changing the inclination angle of the conductive film 6 leads 60 can not correct the conductive film 6. 60 to provide a good solution to the sideslip phenomenon caused by pressure.

In addition, the wire-type conductive film is applied to the wafer probe card and the electrical connection interface between the circuit board and the circuit board, etc., and it also has the same disadvantage as the above-mentioned side-slip phenomenon caused by the pressure of the wire.

Contents of the invention

The technical problem to be solved by the present invention is to provide a conductive colloid with a curved wire, which can improve the problem that the existing wire-type conductive film is used in various testing and electrical connection devices, and the wire is easily slipped under pressure.

In order to solve the above-mentioned technical problems, the technical solution proposed by the present invention is to provide a conductive colloid with curved wires, which includes: an elastic colloid body and a plurality of wires dispersed in the elastic colloid body, the plurality of wires form a curved shape and extend from the upper surface of the elastic colloid body to the lower surface, and the upper and lower ends of the wire are close to the same vertical line.

In the conductive colloid with curved wires, all the wires are bent in the same direction.

In the conductive colloid with curved wires, the conductive colloid has a first axis and a second axis perpendicular to the first axis, and most wires arranged in the elastic colloid body are based on the first axis and the second axis. The second axis is distributed in rows and columns, and the conductors in any column along the first axis are bent in the same direction, and the conductors in any two adjacent columns are bent in opposite directions.

In the conductive colloid with curved wires, the conductive colloid has a first axis and a second axis perpendicular to the first axis, and most wires arranged in the elastic colloid body are based on the first axis and the second axis. The second axis is distributed in rows and columns, and forms a set of wires in the first group consisting of several adjacent rows of wires in the same bending direction, and is adjacent to another group of wires in the second group consisting of several adjacent rows of wires. The wires are arranged sequentially in a manner opposite to the bending direction of the wires of the first group.

In the conductive colloid with curved wires, the curved form of the wires is curved.

In the conductive colloid with curved wires, the curved form of the wires is a two-stage bent shape.

The beneficial effects that can be achieved by the present invention are: a plurality of wires scattered in the elastic colloid body are used to form a curved shape, and the upper and lower ends of each wire are close to the same vertical line, so that it can be used in various tests and electrical tests. In the permanent connection device, when the input and output terminals of the object to be tested (or the object to be connected) are pressed down on the curved wire of the conductive colloid, the curved wire can be directly deformed to absorb the downward force and reduce the horizontal component force, so It can reduce the side-slip phenomenon of the bottom end of the wire, improve the stability of testing and connection, and increase the effective working stroke range of the wire in the vertical direction, which is beneficial for the conductive colloid to be used in various testing and electrical connection devices.

Description of drawings

FIG. 1 is a schematic perspective view of a first preferred embodiment of the conductive colloid of the present invention.

FIG. 2 is a schematic perspective view of a second preferred embodiment of the conductive colloid of the present invention.

FIG. 3 is a schematic side sectional view of a second preferred embodiment of the conductive colloid shown in FIG. 2 .

FIG. 4 is a schematic perspective view of a third preferred embodiment of the conductive colloid of the present invention.

FIG. 5 is a perspective view of a fourth preferred embodiment of the conductive colloid of the present invention.

FIG. 6 is a schematic side sectional view of a fourth preferred embodiment of the conductive colloid shown in FIG. 5 .

Fig. 7 is a reference diagram of the use state when the first preferred embodiment of the conductive colloid shown in Fig. 1 is applied to the detection of integrated circuit components in the form of Ball Grid Array (BGA).

Fig. 8 is a reference view (1) of the use state of the conductive colloid of the present invention installed in a strip shape on a carrier board.

Fig. 9 is a reference view (2) of the use state of the conductive colloid of the present invention installed in a strip shape on a carrier board.

Fig. 10 is a reference view (3) of the use state of the conductive colloid of the present invention installed on a carrier board in the form of strips.

Fig. 11 is a reference view of the use state of the conductive colloid of the present invention installed in block form on a carrier board.

Fig. 12 is a reference diagram of the use state when the conductive colloid of the present invention is mounted on the carrier board in the form of a block and applied to the detection of integrated circuit components in the form of Ball Grid Array (BGA).

Fig. 13 is a reference diagram of the use state of the conductive colloid of the present invention mounted on a carrier board in the form of a strip and applied to a wafer probe card.

Fig. 14 is a reference diagram of the use state of the conductive colloid of the present invention installed on the carrier board in the form of a strip, and applied between circuit boards as an electrical connector.

Fig. 15 is a schematic plan view of a ball grid array (BGA) form integrated circuit element pressed down and contacted by applying the existing wire-type conductive film to the test carrier.

Description of component symbols

1...conductive colloid 10...elastic colloid body

11...wires 2...integrated circuit components

20...I/O terminal 3...Test carrier board

30...contact pads 4...integrated circuit components

5...Test carrier board 50...Contact pad

6...conductive conductive film 60...wire

7...carrier board 8...wafer

8A...Detection circuit board 9...Circuit board

Detailed ways

In the following, the technical means adopted by the present invention to achieve the intended purpose of the invention will be further described in conjunction with the accompanying drawings and preferred embodiments of the present invention.

The conductive colloid with curved wires of the present invention can be applied to various testing and electrical connection devices, such as test sockets for integrated circuit components, wafer probe cards, and electrical connection interfaces between circuit boards and the like. As shown in Figures 1 to 6, it discloses various preferred embodiments of the conductive colloid with curved wires of the present invention. It can be seen from the figures that the conductive colloid 1 includes an elastic colloid body 10 and is dispersed on the The majority of wires 11 in the elastic colloid body 10 extend from the upper surface of the elastic colloid body 10 to the lower surface. The predetermined area of the elastic colloid body 10, such as the conductive colloid 1, is predetermined to provide input and output terminals (such as pins, pins, etc.) lead pads, solder balls or contacts, etc.), the wires 11 are formed in a curved shape, as shown in FIGS. shape, or two-stage bending shape (such as k shape), etc., and the upper and lower ends of each lead 11 are close to the same vertical line (referring to the up and down direction).

Each of the preferred embodiments shown in Figures 1 to 6, wherein the upper surface of the defined conductive colloid 1 has a first axis and a second axis perpendicular to the first axis, these are arranged on the elastic glue The distribution form of the wires 11 in the body 10 is based on the first axis and the second axis in the form of rows and columns, and the wires 11 in any column along the first axis are bent in the same direction, and two adjacent columns The bending directions of the conducting wires 11 can be the same or opposite, or the conducting wires 11 in the first group consisting of several adjacent columns of conducting wires 11 have the same bending direction, and the other group of adjacent conducting wires 11 consisting of several adjacent columns of conducting wires 11 have the same bending direction. The conductive wires 11 of the second group are arranged in sequence in a direction opposite to the bending direction of the conductive wires 11 of the first group, and so on.

As shown in Figure 7, the conductive colloid 1 of the present invention can be a sheet-shaped body with an area sufficient to provide contact with all the input and output terminals of the object to be measured or the object to be connected, or as shown in Figure 8, Figure 9 and Figure 10, the conductive The colloid 1 can be a strip with an area sufficient to provide the object to be tested (or the object to be connected) in a row or series of input-output terminal contacts; and as shown in FIGS. The position of the full area of the elastic colloid body 10, as shown in Figure 10, the conductive colloid 1 is scattered in the area where the input and output terminals of the conductive colloid 1 are predetermined to provide the object under test (or the object to be connected) to contact; or as shown in Figure 10 11 and 12, the conductive colloid 1 can also be designed as a small block with an area sufficient to provide contact with one or several input and output terminals of the object under test (or object to be connected).

As shown in FIG. 7 , when the conductive colloid 1 is a plate-shaped body with an area sufficient to provide contact with all the input and output terminals of the integrated circuit element to be tested, the conductive colloid 1 can be directly installed on the bottom of the test base for use.

When the conductive colloid 1 is enough to provide one row or several rows of strips (as shown in Fig. 8, Fig. 9 and Fig. 10), or the conductive colloid 1 is enough to provide one or several small strips of I/O terminal contacts. block (as shown in Figure 11 and Figure 12), the conductive colloid 1 is further installed in a plurality of forms on a carrier plate 7 to form an electrical connector, as shown in Figure 12, is to reveal the combination of the conductive colloid 1 The carrier board 7 constitutes an electrical connector that can be contacted by all the input and output terminals of the integrated circuit element 4 to be tested, and is then mounted on the testing seat by the electrical connector. In addition, the conductive colloid of the present invention combined with the carrier board can also be used as a wafer probe card, or an electrical connection interface between circuit boards and the like.

Taking the application of the present invention to the detection operation of integrated circuit components as an example of the medium for electrical contact between the integrated circuit component and the test carrier of the test system, as shown in Figure 7, when the integrated circuit component 2 to be tested is displaced in the detection base , the integrated circuit element 2 is pressed down on the conductive colloid 1, wherein each input-output terminal 20 (such as a pin, lead pad or solder ball) at the bottom of the integrated circuit element 2 is in contact with the upper end of the corresponding wire 11 , and then contact the corresponding contact pad 30 on the lower test carrier board 3 through the lower end of the wire 11, wherein the elastic colloid body 10 is used to provide the cushioning elasticity of the integrated circuit element 2 when it is pressed down, and the curved wire 11 is easy to be compressed. The design that makes the middle section easier to be compressed and bent makes the integrated circuit element 2 can directly force the wire 11 to bend, reducing the amount of pressure required for testing, and reducing the force component in the horizontal direction applied to the lower end of the wire 11, so It can effectively control the sideslip phenomenon of the bottom end of the wire 11 on the test carrier board 3 that it contacts, and make these wires 11 have sufficient vertical downward force to contact the corresponding contact pad 30 on the test carrier board 3 to ensure integration Each input and output terminal of the circuit element 2, such as solder balls, pins or lead pads, is correctly connected to the test system to achieve a stable test effect.

As shown in FIG. 13, it is disclosed that the conductive colloid 1 of the present invention is installed on the carrier board 7 and applied in the wafer probe card as a test medium for the electrical connection between the wafer 8 and the probe circuit board 8A; and as shown in FIG. 14, It is disclosed that the conductive gel 1 of the present invention is installed on the carrier board 7 and applied between the circuit boards 9 as an electrical connection interface. In the above-mentioned various types of pressure tests and electrical connections, it can also effectively reduce the horizontal force component of the wires and reduce the sideslip phenomenon at the bottom of the wires, improving the stability of the test and connection.

The above descriptions are only preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this professional technology Personnel, without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make some changes or modifications to equivalent embodiments with equivalent changes, but all the content that does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solutions of the present invention.

Claims (6)

1. A conductive colloid with curved wires, comprising: an elastic colloid body and a plurality of wires dispersed in the elastic colloid body, it is characterized in that the plurality of wires form a curved shape and are formed from the elastic colloid body upper surface Extending to the lower surface, the upper and lower ends of the wire are close to the same vertical line. 2. The conductive colloid with curved wires according to claim 1, wherein all the wires are bent in the same direction. 3. The conductive colloid with curved wire according to claim 1, wherein the conductive colloid has a first axis and a second axis perpendicular to the first axis, and is arranged in the elastic colloid body. Most of the wires are distributed in rows and columns according to the first axis and the second axis, and the wires in any row along the first axis are bent in the same direction, and the wires in any two adjacent rows are bent in opposite directions. 4. The conductive colloid with curved wire according to claim 1, wherein the conductive colloid has a first axis and a second axis perpendicular to the first axis, and is arranged in the elastic colloid body. Most of the wires are distributed in rows and columns according to the first axis and the second axis, and form a group of wires consisting of several adjacent columns. The wires in the first group have the same bending direction, and are adjacent to another group of adjacent columns. The wires in the second group constituted by the wires are arranged sequentially in a manner opposite to the bending direction of the wires in the first group. 5. The conductive colloid with curved wires according to any one of claims 1 to 4, characterized in that, the curved form of the wires is curved. 6 . The conductive colloid with curved wires according to any one of claims 1 to 4 , wherein the wires are bent in a two-stage bent shape. 7 .

Images