CN102724858B - A kind of interpolation frame and shielding backboard thereof - Google Patents

Abstract

The embodiment of the invention discloses a shielding backplane. The shielding backplane (1) is provided with a plurality of cooling holes, and the cooling holes are waveguide holes (2) with waveguide characteristics. In the shielding backplane provided by the embodiment of the present invention, heat dissipation holes are provided on the shielding backplane so that it has a heat dissipation function to meet its heat dissipation requirements; the heat dissipation hole is a waveguide hole with waveguide characteristics, and according to the shielding attenuation characteristics , so that the backplane installed on the subframe forms a shielding body with shielding effect, which has prevented the interference of electromagnetic signals between electronic devices. The embodiments of the present invention design a special shielding backplane without the need for shielding accessories, and can also have the dual effects of heat dissipation and shielding. Therefore, on the premise of ensuring heat dissipation and preventing electromagnetic signal interference between devices, it solves the problems of the existing technology. hole, no shielding defect. The embodiment of the invention also discloses a subframe with the above-mentioned shielding backplane.

Description

A subframe and its shielding backplane

technical field

The invention relates to the technical field of shielding backplanes, in particular to a subframe and its shielding backplane.

Background technique

The subframe refers to the frame structure used to install and fix the backplane and single board. Among them, the single board refers to the combination of the circuit board and the mounting parts; the backplane refers to the connection of the single boards and provides physical channels for signal transmission between the single boards, and is usually installed in the subrack.

In order to prevent the interference of electromagnetic signals between electronic devices, generally the subracks need to be shielded. At present, the backplane is usually seamlessly overlapped with the conductive cloth and the subframe to form a shield or realize partitioned shielding within the subframe.

In the prior art, generally, the backplane and the subframe are used to form a shielding body for shielding. However, with the rapid development of the communication industry and the increasing demand for information services, the power consumption of the current equipment is increasing. Due to the heat dissipation requirements, it is necessary to open large holes on the backplane to dissipate heat. However, opening holes on the backplane Heat dissipation destroys the shield formed by the original backplane and subframe.

Therefore, how to solve the heat dissipation and shielding problems at the same time has become an important technical problem to be solved urgently by those skilled in the art.

Contents of the invention

Embodiments of the present invention provide a shielding backplane to simultaneously solve the problems of heat dissipation and shielding.

To achieve the above object, the present invention provides the following technical solutions:

A shielding backplane, the shielding backplane is provided with several cooling holes, and the cooling holes are waveguide holes with waveguide characteristics.

An embodiment of the present invention also provides a subframe, including a subframe body and a backplane disposed on the subframe body, and the backplane is the shielding backplane described in any one of the above items.

It can be seen from the above technical solutions that the shielded backplane provided by the embodiment of the present invention has a heat dissipation function by opening a heat dissipation hole on the shielded backplane to meet its heat dissipation requirements; the heat dissipation hole is a waveguide with waveguide characteristics According to the shielding attenuation characteristics of the waveguide hole, the backplane installed on the subrack forms a shielding body with shielding effect, which prevents the interference of electromagnetic signals between electronic devices. In the embodiment of the present invention, by designing a special shielding backplane, there is no need to install shielding accessories on the outside of the subframe, and it can also have the dual effects of heat dissipation and shielding. Therefore, on the premise of ensuring heat dissipation and preventing electromagnetic signal interference between devices, the problem is solved There is a defect in technology that occupies a large space.

Since the subframe provided by the embodiment of the present invention has the above-mentioned shielding backplane, it has all the technical effects of the above-mentioned shielding backplane, which will not be repeated here.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is a schematic cross-sectional structure diagram of a waveguide hole provided by an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a waveguide hole provided by an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a shielding backplane provided by an embodiment of the present invention;

Fig. 4 is a schematic structural diagram of a shielded backplane with a circular waveguide hole provided by an embodiment of the present invention;

5 is a schematic structural diagram of a shielded backplane with square waveguide holes provided by an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a shielding backplane with a hexagonal waveguide hole provided by an embodiment of the present invention;

Fig. 7 is a schematic structural diagram of the arrangement of circular waveguide holes provided by an embodiment of the present invention;

Fig. 8 is a schematic structural diagram of a square waveguide hole provided by an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of the arrangement of hexagonal waveguide holes provided by an embodiment of the present invention;

Fig. 10 is a schematic structural diagram of an arrangement of circular waveguide holes provided by another embodiment of the present invention;

Fig. 11 is a schematic structural diagram of an arrangement of circular waveguide holes provided by another embodiment of the present invention;

Fig. 12 is a schematic structural diagram of an arrangement of circular waveguide holes provided by another embodiment of the present invention.

detailed description

The embodiment of the invention discloses a shielding backplane to solve the problems of heat dissipation and shielding at the same time.

The embodiment of the invention also discloses a subframe with the above-mentioned shielding backplane.

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Please refer to Figure 1-Figure 3, Figure 1 is a schematic cross-sectional structure diagram of the waveguide hole provided by the embodiment of the present invention; Figure 2 is a schematic structural diagram of the waveguide hole provided by the embodiment of the present invention, and Figure 3 is the shielding provided by the embodiment of the present invention Schematic diagram of the backplane structure.

The shielded backplane provided by the embodiment of the present invention is a backplane with a shielding function. The so-called backplane refers to a backplane used for connecting boards and providing physical channels for signal transmission between boards, and is usually installed in a subrack. A plurality of cooling holes are opened on the shielding backplane 1 to achieve the purpose of heat dissipation of the shielding backplane. In this embodiment, the number of heat dissipation holes is not limited, and may be arbitrary, and the shape and size of the heat dissipation holes are not limited, and the size and size of the heat dissipation holes can be designed according to actual heat dissipation conditions. The key point of the embodiment of the present invention is that the heat dissipation hole is a waveguide hole 2 with waveguide characteristics.

In the shielding backplane provided by the embodiment of the present invention, heat dissipation holes are provided on the shielding backplane 1 to make it have a heat dissipation function and meet its heat dissipation requirements; the heat dissipation holes are waveguide holes 2 with waveguide characteristics, according to the shielding of The attenuation feature makes the backplane installed on the subrack form a shielding body with shielding effect, which has prevented the interference of electromagnetic signals between electronic devices. In the embodiment of the present invention, by designing a special shielding backplane, there is no need to install shielding accessories on the outside of the subframe, and it can also have the dual effects of heat dissipation and shielding. Therefore, on the premise of ensuring heat dissipation and preventing electromagnetic signal interference between devices, the problem is solved There is a defect in technology that occupies a large space.

In a specific embodiment of the present invention, the connection properties of the surface layer, the bottom layer and the inner wall of the waveguide hole 2 are all GND (Ground, representing the ground or 0 line) properties. The cut-off frequency of circular waveguide (that is, the cross section of the waveguide hole is circular) is fc=6.9×109/dHz. According to the theory of electromagnetic field, as long as the working frequency is much smaller than the cut-off frequency fc of the waveguide, the magnetic field shielding effectiveness of the circular waveguide is S=32t /ddB, where d is the diameter of the waveguide hole, and t is the length of the waveguide hole.

The cut-off frequency fc=5.9*109/dHz of the rectangular waveguide (that is, the cross section of the waveguide hole is square), correspondingly, the shielding effect of the rectangular waveguide S=27.2t/ddB, where d is the side length of the waveguide hole, and t is the waveguide The length of the hole.

The shielding effect formulas of the two types of waveguides are only mentioned above. Those skilled in the art can understand that waveguides of other shapes also have shielding effects, and the corresponding shielding effects can be calculated according to the corresponding formulas in the prior art. For other types of waveguides The shielding effect formulas are no longer listed one by one. In the embodiment of the present invention, the cut-off frequencies of the openings of different shapes and the calculation formula of the screen effect can be used to select the openings of different shapes and the sizes of the openings to meet the requirements of different shielding effectiveness.

As shown in Figure 2, the surface layer GND21 of the waveguide hole 2 is connected to the surface layer GND plane of the shielding backplane, the bottom layer GND23 of the waveguide hole 2 is connected to the bottom layer GND plane of the shielding backplane, and the inner wall GND22 of the waveguide hole 2 is respectively connected to the waveguide hole The surface layer GND21 of 2 is connected to the bottom layer GND23 of the waveguide hole 2 to ensure the continuity of the overall GND.

That is, in this embodiment, the implementation method of the PCB metallized waveguide hole with waveguide shielding characteristics:

a) The connection properties of the surface layer and the bottom layer of the cooling hole are set to GND;

b) The inner wall of the heat dissipation hole is metallized copper plating (that is, the inner wall of the heat dissipation hole has a metallized copper plating layer) and the connection property is also set to GND;

c) The GND on the surface layer, the bottom layer and the inner wall of the hole is connected to the GND plane of the surface layer and the bottom layer of the backplane to ensure the continuity of the overall GND, thereby forming a waveguide hole 2 with shielding effect.

Please refer to Figures 4-6, Figure 4 is a schematic structural diagram of a shielded backplane with a circular waveguide hole provided by an embodiment of the present invention; Figure 5 is a schematic structural diagram of a shielded backplane with a square waveguide hole provided by an embodiment of the present invention ; FIG. 6 is a schematic structural diagram of a shielded backplane with a hexagonal waveguide hole provided by an embodiment of the present invention.

In this embodiment, the waveguide hole 2 can be a round hole as shown in FIG. 4, a square hole as shown in FIG. 5, and a regular hexagonal hole as shown in FIG. Rectangular hole or shaped hole. That is, the shape of the waveguide hole disclosed in this embodiment may be any polygonal hole, arc-shaped hole or other irregular shaped hole, and the embodiment of the present invention does not limit the shape of the waveguide hole.

Please refer to Figure 7-Figure 12, Figure 7 is a schematic structural diagram of the circular waveguide hole arrangement provided by the embodiment of the present invention; Figure 8 is a schematic structural diagram of the square waveguide hole provided by the embodiment of the present invention; Figure 9 is an embodiment of the present invention The structure schematic diagram of the hexagonal waveguide hole arrangement provided; Figure 10 is the structural diagram of the circular waveguide hole arrangement provided by another embodiment of the present invention; Figure 11 is the circular waveguide hole arrangement provided by another embodiment of the present invention Schematic diagram of the structure of the method; FIG. 12 is a schematic diagram of the structure of the arrangement of circular waveguide holes provided by another embodiment of the present invention.

In this embodiment, there are multiple waveguide holes 2, and the multiple waveguide holes 2 have the same structure, and the square array or rectangular array disclosed along Fig. 4, Fig. 5 and Fig. 6 can also be the trapezoidal array shown in Fig. 10, The triangular array shown in FIG. 11 , the rhombus array shown in FIGS. 7-9 , the circular array or the special-shaped array shown in FIG. 12 are arranged. That is, the plurality of waveguide holes 2 disclosed in the embodiment of the present invention can be arranged in an array or in an irregular arrangement, where the array can be arbitrary, and multiple array arrangements can also be set on one shielding backplane 1 , which is not limited in the embodiment of the present invention.

In another embodiment of the present invention, there are multiple waveguide holes 2 with different structures, that is, waveguide holes 2 of two or more shapes can be arranged on the same shielding backplane 1, such as on the same Two or more types of round holes, square holes, rectangular holes, regular hexagonal holes, rounded square holes, rounded rectangular holes and special-shaped holes are arranged on the shielding backplane 1 .

In yet another embodiment of the present invention, multiple waveguide holes have the same shape and different sizes, that is, waveguide holes 2 of the same shape can be arranged on the same shielding backplane 1, such as circular waveguide holes, but the diameter of the circular waveguide holes can be different.

In this embodiment, the thickness of the shielding backplane is a thickness that can be achieved by a PCB (Printed Circuit Board, printed circuit board) production process, for example, the thickness is 0.5 mm-50 mm.

The subframe provided by the embodiments of the present invention includes a subframe body and a backplane disposed on the subframe body, wherein the backplane is the shielding backplane disclosed in the above embodiments. Because the subframe provided by the embodiment of the present invention adopts the shielding backplane disclosed in the above embodiments, it has all the technical effects of the shielding backplane described above. Please refer to the above description, which will not be repeated here.

Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other.

The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (8)

1. a shielding backboard, it is characterized in that, described shielding backboard is used for connecting single board, between veneer, signal transmission provides physical channel, described shielding backboard (1) offers some louvres, and described louvre is the waveguide aperture (2) with guide properties;

The connection attribute of the top layer of described waveguide aperture (2), bottom and inwall is GND attribute;

The top layer GND (21) of described waveguide aperture (2) is connected in the top layer GND plane of described shielding backboard;

The bottom GND (23) of described waveguide aperture (2) is connected in the bottom GND plane of described shielding backboard;

The inwall GND (22) of described waveguide aperture (2) is connected with the bottom GND (23) of described waveguide aperture (2) with the top layer GND (21) of described waveguide aperture (2) respectively.

2. shield backboard as claimed in claim 1, it is characterized in that, the inwall of described waveguide aperture (2) has metallization copper plate.

3. shield backboard as claimed in claim 1 or 2, it is characterized in that, described waveguide aperture (2) is circular hole, square hole, regular hexagon hole, rounded square hole, fillet slot or irregularly-shaped hole.

4. shield backboard as claimed in claim 1 or 2, it is characterized in that, described waveguide aperture (2) is for multiple, multiple described waveguide aperture (2) structure is identical, and arranges along the mode of quadrate array, rectangular array, trapezoidal array, triangular array, rhombus array, circular array or special-shaped array.

5. shield backboard as claimed in claim 1 or 2, it is characterized in that, described waveguide aperture (2) is for multiple, and multiple described waveguide aperture (2) structure is different.

6. shield backboard as claimed in claim 5, it is characterized in that, multiple described waveguide aperture (2) shape is different, or shape is identical and size different.

7. shield backboard as claimed in claim 1 or 2, it is characterized in that, the thickness of described shielding backboard (1) is 0.5mm-50mm.

8. an interpolation frame, comprise interpolation frame body and be arranged at the backboard on described interpolation frame body, it is characterized in that, described backboard is the shielding backboard as described in any one of claim 1-7.