CN102737820A - I-shaped inductance framework - Google Patents
I-shaped inductance framework Download PDFInfo
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- CN102737820A CN102737820A CN2012101863042A CN201210186304A CN102737820A CN 102737820 A CN102737820 A CN 102737820A CN 2012101863042 A CN2012101863042 A CN 2012101863042A CN 201210186304 A CN201210186304 A CN 201210186304A CN 102737820 A CN102737820 A CN 102737820A
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- ferrite
- skeleton
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- insulator foot
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Abstract
The invention discloses an I-shaped inductance framework which comprises a framework and conductive pins, wherein the framework consists of a ferrite framework and an insulation base; and the conductive pins are not in direct contact with the ferrite framework. According to the I-shaped inductance framework, an inductance value and a withstand voltage value can be effectively increased; colored metal resources can be saved; and the production cost is reduced.
Description
Technical field
The present invention relates to a kind of skeleton that is applied to inductance, transformer, be specifically related to a kind of I shape inductance framework.
Background technology
At present, the I shape inductance framework is processed into by the bobbin cylinder skeleton and the conduction stitch of end plate are formed up and down by core material.Manufacture method generally adopts nickel zinc, MgZn ferrite materials processing to become ferrite I font skeleton, is planted in the aperture that the I shape end plate reserves with two or above conduction stitch again, and the some resin glue solidifies.The identical shaped I shape inductance value size of the identical number of turn is directly proportional with the magnetic permeability of iron core; The ferrite of high magnetic permeability such as manganese-zinc ferrite initial permeability are between 1800-2500; The ferrite of low magnetic permeability such as nickel zinc, MgZn ferrite initial permeability are between 10-600; And the resistivity of high magnetic conductivity ferrite is lower more than 1000 times than the ferritic resistivity of low magnetic permeability, just highly leads the withstand voltage very low of material, can not apply to city's electrical domain.The Electronics Engineer should adopt the high magnetic conductivity ferrite material, but can puncture the conduction stitch as input/output terminal because of withstand voltage mistake is low, and have to adopt the higher nickel zinc of resistivity, MgZn ferrite material manufacture I shape skeleton.Therefore the low magnetic permeability characteristic of the I shape skeleton number of turn that when the design inductance, will increase coil remedies, too much waste a large amount of copper cash, also increased the volume and the manufacturing cost of inductance.
Summary of the invention
Technical problem to be solved by this invention provides a kind of I shape inductance framework, effectively improves inductance value and withstand voltage, practices thrift nonferrous metal resource, reduces production costs.
The technical scheme that technical solution problem of the present invention is adopted is: a kind of I shape inductance framework, comprise skeleton and conduction stitch, and said skeleton is made up of ferrite skeleton and insulator foot, and said conduction stitch does not directly contact with the ferrite skeleton.
As a kind of preferred, the ferrite magnetic conductance μ of said ferrite skeleton is 1000-7000.Withstand voltage between the said conduction stitch greater than 2500V.
As a kind of preferred, said ferrite skeleton is a T-shape, and said insulator foot top is provided with groove, and said conduction stitch is arranged at the bottom of insulator foot; The bottom of the ferrite skeleton of said T-shape is connected with the set groove coupling in insulator foot top.
As a kind of preferred, said insulator foot is the bakelite insulator foot of being processed by phenolic resin material.
Preferred as further, the epoxy resin glue bond is adopted with set being connected of groove of insulator foot top in the bottom of the ferrite skeleton of said T-shape.
The present invention at first select for use initial permeability be 1000-7000 manganese-zinc ferrite powder through the moulding press compacting, become the ferrite skeleton of T-shape with nitrogen protection pushed bat kiln high temperature sintering; Select the phenolic resins bakelite powder then for use, under certain mould temperature,, and insert the conduction stitch through mold pressing injection mo(u)lding bakelite insulator foot.The ferrite skeleton of T-shape is connected through assembling with the bakelite insulator foot; Insert in the set groove in bakelite insulator foot top the bottom of the ferrite skeleton of T-shape; Joint is put into the baking oven baking with point gum machine point epoxy resin glue bond, makes it to become one.The qualified back of cooling back censorship height lead high withstand voltage inductance framework.
The invention has the beneficial effects as follows: adopt high-conductive manganese-zinc ferrite material manufacture T-shape ferrite skeleton; With phenolic resin material compacting bakelite insulator foot, the conduction stitch is plugged in the bakelite insulator foot, and the groove that bakelite insulator foot top is provided with can be led ferrite T-shape skeleton with height and matched; The epoxide-resin glue adhering and solidifying is adopted in the cooperation place; The conduction stitch does not contact withstand voltage low height and leads iron core, and the inductance value of I shape skeleton is enlarged markedly, and improves resistance to pressure; Practice thrift nonferrous metal resource, reduced production cost.
Description of drawings
Fig. 1 is one embodiment of the present invention structure cross-sectional schematic.
Fig. 2 is the A-A view among Fig. 1.
Fig. 3 is the B-B view among Fig. 1.
Fig. 4 is the ferrite skeleton structure sketch map of T-shape in one embodiment of the present invention shown in Figure 1.
Below in conjunction with accompanying drawing the present invention is further specified.
Embodiment
Like accompanying drawing 1 to shown in Figure 3; A kind of I shape inductance framework comprises the bakelite insulator foot 2 of T-shape ferrite skeleton 1, phenolic resin material being provided with groove 4 on bakelite insulator foot 2 tops; The bottom is provided with conduction stitch 3; The bottom of T-shape ferrite skeleton 1 is connected with set groove 4 couplings in bakelite insulator foot 2 tops, and the epoxy resin glue bond is adopted in the junction, is connected to form adhesive layer 5.
Wherein T-shape ferrite skeleton 1 is as shown in Figure 4; The pc40 manganese-zinc ferrite powder of selecting initial permeability 2500 for use is through the moulding press compacting; Form with 1350 ℃ of high temperature sinterings of nitrogen protection pushed bat kiln, wherein Φ 1 is 13.00mm for 6.00mm H for 16.00mm h for 10.00mm Φ 2 again.Bakelite insulator foot 2 selects for use D141 phenolic resins bakelite powder through 350 ℃, 60 tons mold pressing injection mo(u)ldings of mould temperature, and inserts the zinc-plated draw point of φ 0.8 * 15mm CP.T-shape ferrite skeleton 1 is bonded through epoxide-resin glue with bakelite insulator foot 2 and is one.
Claims (6)
1. an I shape inductance framework comprises skeleton and conduction stitch (3), and it is characterized in that: said skeleton is made up of ferrite skeleton (1) and insulator foot (2), and said conduction stitch (3) does not directly contact with ferrite skeleton (1).
2. I shape inductance framework as claimed in claim 1 is characterized in that: the ferrite magnetic conductance μ of said ferrite skeleton (1) is 1000-7000.
3. I shape inductance framework as claimed in claim 1 is characterized in that: withstand voltage greater than 2500V between the said conduction stitch (3).
4. like any described I shape inductance framework of claim 1 to 3; It is characterized in that: said ferrite skeleton (1) is a T-shape; Said insulator foot (2) top is provided with groove (4), and said conduction stitch (3) is arranged at the bottom of insulator foot (2); The bottom of the ferrite skeleton (1) of said T-shape is connected with set groove (4) coupling in insulator foot (2) top.
5. a kind of I shape inductance framework as claimed in claim 4 is characterized in that: said insulator foot (2) is the bakelite insulator foot of being processed by phenolic resin material.
6. a kind of I shape inductance framework as claimed in claim 4 is characterized in that: the bottom of the ferrite skeleton (1) of said T-shape adopts epoxide-resin glue (5) bonding with set being connected of groove (4) of insulator foot (2) top.
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101863042A CN102737820A (en) | 2012-06-08 | 2012-06-08 | I-shaped inductance framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101863042A CN102737820A (en) | 2012-06-08 | 2012-06-08 | I-shaped inductance framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102737820A true CN102737820A (en) | 2012-10-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101863042A Pending CN102737820A (en) | 2012-06-08 | 2012-06-08 | I-shaped inductance framework |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102737820A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105261462A (en) * | 2015-10-30 | 2016-01-20 | 江苏靖江互感器厂有限公司 | Electromagnetic voltage transformer |
| CN105489343A (en) * | 2016-01-20 | 2016-04-13 | 海宁市飞腾电子有限公司 | Electromagnetic coil |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030116671A1 (en) * | 2001-12-21 | 2003-06-26 | Minebea Co., Ltd. | Drum type core with discrete structure |
| CN202102828U (en) * | 2011-05-31 | 2012-01-04 | 林万炯 | High-frequency transformer |
| CN202585066U (en) * | 2012-06-08 | 2012-12-05 | 海宁市杰诚电子元件厂 | I-shaped inductor framework |
-
2012
- 2012-06-08 CN CN2012101863042A patent/CN102737820A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030116671A1 (en) * | 2001-12-21 | 2003-06-26 | Minebea Co., Ltd. | Drum type core with discrete structure |
| CN202102828U (en) * | 2011-05-31 | 2012-01-04 | 林万炯 | High-frequency transformer |
| CN202585066U (en) * | 2012-06-08 | 2012-12-05 | 海宁市杰诚电子元件厂 | I-shaped inductor framework |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105261462A (en) * | 2015-10-30 | 2016-01-20 | 江苏靖江互感器厂有限公司 | Electromagnetic voltage transformer |
| CN105489343A (en) * | 2016-01-20 | 2016-04-13 | 海宁市飞腾电子有限公司 | Electromagnetic coil |
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Application publication date: 20121017 |