CN102737954A - Method and device for reducing electronic component manufacturing tool bodies - Google Patents
Method and device for reducing electronic component manufacturing tool bodies Download PDFInfo
- Publication number
- CN102737954A CN102737954A CN2011100856155A CN201110085615A CN102737954A CN 102737954 A CN102737954 A CN 102737954A CN 2011100856155 A CN2011100856155 A CN 2011100856155A CN 201110085615 A CN201110085615 A CN 201110085615A CN 102737954 A CN102737954 A CN 102737954A
- Authority
- CN
- China
- Prior art keywords
- floor space
- electronic component
- fabrication tool
- loading chamber
- vacuum loading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
At least one aspect of the invention provides a method. The method comprises the steps of positioning a vacuum load chamber of electronic component manufacturing tools, so that the vacuum load chamber occupies a first floor area; and positioning a host power source in a second floor area, wherein most of the second floor area is located in the first floor area, so that the coverage area of the electronic component manufacturing tools is minimized. Additionally, or alternatively, a host controller can be placed so that the coverage area occupied by the host controller basically overlaps with the coverage area of the vacuum load chamber. In addition, pluralities of other aspects of the invention are further provided.
Description
Technical field
The present invention relates to a kind of electronic component fabrication tool body, especially a kind of method and apparatus that is used to reduce electronic component fabrication tool body.
Background technology
Be that a kind of method is provided at least one aspect of the present invention, it comprises the vacuum loading chamber of positioning electronic components fabrication tool, uses to make the vacuum loading chamber occupy first floor space; Be positioned at the main frame power source in second floor space, wherein the major part of second floor space is arranged in first floor space, uses the overlay area of having reduced the electronic component fabrication tool.In addition, perhaps selectively, console controller can place make its occupied overlay area basically with the covering area overlapping of vacuum loading chamber.Other a plurality of aspects of the present invention are provided in addition.
Summary of the invention
To the problems referred to above, the present invention provides a kind of method and apparatus that is used to reduce electronic component fabrication tool body.
Be that a kind of method is provided at least one aspect of the present invention, it comprises the vacuum loading chamber of positioning electronic components fabrication tool, uses to make the vacuum loading chamber occupy first floor space; Be positioned at the main frame power source in second floor space, wherein the major part of second floor space is arranged in first floor space, uses the overlay area of having reduced the electronic component fabrication tool.In addition, perhaps selectively, console controller can place make its occupied overlay area basically with the covering area overlapping of vacuum loading chamber.Other a plurality of aspects of the present invention are provided in addition.
Embodiment
Be that a kind of method is provided at least one aspect of the present invention, it comprises the vacuum loading chamber of positioning electronic components fabrication tool, uses to make the vacuum loading chamber occupy first floor space; Be positioned at the main frame power source in second floor space, wherein the major part of second floor space is arranged in first floor space, uses the overlay area of having reduced the electronic component fabrication tool.In addition, perhaps selectively, console controller can place make its occupied overlay area basically with the covering area overlapping of vacuum loading chamber.Other a plurality of aspects of the present invention are provided in addition.
A kind of method that is used to reduce electronic component fabrication tool overlay area comprises: the vacuum loading chamber of positioning electronic components fabrication tool, use making the vacuum loading chamber occupy first floor space; And the main frame power source is positioned at second floor space, wherein the major part of second floor space is arranged in first floor space, uses the overlay area of reducing the electronic component fabrication tool; Wherein be positioned at the main frame power source in second floor space, wherein the major part of second floor space is arranged in first floor space, comprises being positioned at the main frame power source in second floor space; Wherein whole second floor space is arranged in first floor space; Wherein the major part of the 3rd floor space is arranged in first floor space, uses the overlay area of reducing the electronic component fabrication tool, and wherein is positioned at console controller in the 3rd floor space; Wherein the major part of the 3rd floor space is arranged in first floor space; Comprise being positioned at console controller in the 3rd floor space that wherein whole the 3rd floor space is arranged in first floor space, wherein the major part of second floor space is arranged in first floor space; Use the overlay area of having reduced the electronic component fabrication tool; Wherein be positioned at console controller in second floor space, wherein the major part of second floor space is arranged in first floor space, comprises being positioned at console controller in second floor space; Wherein whole second floor space is arranged in first floor space; Comprise also being positioned at the main frame power source in the 3rd floor space that wherein whole the 3rd floor space is arranged in first floor space, a kind of method that reduces the required container sum of shipping electronic component fabrication tool; Comprise: put into a container to the vacuum loading chamber of electronic component fabrication tool and main frame power source, so that the covering area overlapping of vacuum loading chamber and main frame power source; And the said container of shipping; Also comprise and put into said container to the console controller of electronic component fabrication tool; A kind of method that reduces the required container sum of shipping electronic component fabrication tool; Comprise: put into a container to the vacuum loading chamber of electronic component fabrication tool and console controller, so that the covering area overlapping of vacuum loading chamber and console controller; And the said container of shipping, a kind of equipment that is used to reduce the overlay area of electronic component fabrication tool comprises: a vacuum loading chamber support; One of one electronic component fabrication tool vacuum loading chamber, this vacuum loading chamber is connected with this vacuum loading chamber support, uses making the vacuum loading chamber occupy first floor space; An and main frame power source; Be connected on the support of vacuum loading chamber, use making the main frame power source occupy second floor space, wherein the major part of second floor space is arranged in first floor space; Use the overlay area of having reduced the electronic component fabrication tool; Also comprise the console controller that is connected on the support of vacuum loading chamber, use making console controller occupy the 3rd floor space, wherein the major part of the 3rd floor space is arranged in first floor space; Use the overlay area of having reduced the electronic component fabrication tool; Wherein whole the 3rd floor space is arranged in first floor space, and a kind of equipment that is used to reduce the overlay area of electronic component fabrication tool comprises: a vacuum loading chamber support; One of one electronic component fabrication tool vacuum loading chamber, this vacuum loading chamber is connected with this vacuum loading chamber support, uses making the vacuum loading chamber occupy first floor space; And a console controller, be connected on the support of vacuum loading chamber, use making console controller occupy second floor space; Wherein the major part of second floor space is arranged in first floor space, uses the overlay area of having reduced the electronic component fabrication tool, and wherein whole second floor space is arranged in first floor space; Main frame power source on the support of vacuum loading chamber uses making the main frame power source occupy the 3rd floor space, and wherein the major part of the 3rd floor space is arranged in first floor space; Use the overlay area of having reduced the electronic component fabrication tool, a kind of equipment that is used to reduce electronic component fabrication tool overlay area comprises: an electronic component fabrication tool; Have the main frame that occupies first overlay area, and a main frame power source, second overlay area occupied; Wherein second overlay area basically with first covering area overlapping, a kind of equipment that is used to reduce electronic component fabrication tool overlay area comprises: an electronic component fabrication tool; Has the main frame that occupies first overlay area; And a console controller, occupy second overlay area, wherein second overlay area basically with first covering area overlapping.
Claims (1)
1. method that is used to reduce electronic component fabrication tool overlay area comprises: the vacuum loading chamber of positioning electronic components fabrication tool, use making the vacuum loading chamber occupy first floor space; And the main frame power source is positioned at second floor space, wherein the major part of second floor space is arranged in first floor space, uses the overlay area of reducing the electronic component fabrication tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100856155A CN102737954A (en) | 2011-04-07 | 2011-04-07 | Method and device for reducing electronic component manufacturing tool bodies |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100856155A CN102737954A (en) | 2011-04-07 | 2011-04-07 | Method and device for reducing electronic component manufacturing tool bodies |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102737954A true CN102737954A (en) | 2012-10-17 |
Family
ID=46993229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100856155A Pending CN102737954A (en) | 2011-04-07 | 2011-04-07 | Method and device for reducing electronic component manufacturing tool bodies |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102737954A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201430130Y (en) * | 2009-06-12 | 2010-03-24 | 北儒精密股份有限公司 | Vacuum device with transmission function for low-temperature process |
| US20100086381A1 (en) * | 2005-02-04 | 2010-04-08 | Advanced Display Process Engineering Co., Ltd. | Vacuum processing apparatus |
| CN201540879U (en) * | 2009-08-25 | 2010-08-04 | 东莞宏威数码机械有限公司 | Lifting position adjusting device |
-
2011
- 2011-04-07 CN CN2011100856155A patent/CN102737954A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100086381A1 (en) * | 2005-02-04 | 2010-04-08 | Advanced Display Process Engineering Co., Ltd. | Vacuum processing apparatus |
| CN201430130Y (en) * | 2009-06-12 | 2010-03-24 | 北儒精密股份有限公司 | Vacuum device with transmission function for low-temperature process |
| CN201540879U (en) * | 2009-08-25 | 2010-08-04 | 东莞宏威数码机械有限公司 | Lifting position adjusting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CL2012003378A1 (en) | Seat module for an industrial machine that includes a base a body and a cabin module, the seat module comprises a seat, a control panel mounted on the seat one or more monitors connected to the control panel, a plurality of controls positioned on the control panel and a controller connected to the control panel; a cabin module unit for an industrial machine. | |
| WO2011014614A3 (en) | Medical cart | |
| WO2011097569A3 (en) | Patient/invalid handling support | |
| IN2015DN00986A (en) | ||
| WO2015111070A3 (en) | Five-axis machining apparatus | |
| WO2011057827A3 (en) | Load device for generating surface loads on plate-shaped test bodies | |
| WO2009001497A1 (en) | Laser processing apparatus | |
| WO2012134175A3 (en) | Conductive substrate and touchscreen having same | |
| EP2549206A3 (en) | Plate-based adsorption chiller subassembly | |
| TW200728177A (en) | Apparatus for loading and unloading workpiece | |
| GB0611979D0 (en) | Coordinate positioning machine | |
| SG170655A1 (en) | Press method and press tool | |
| MY160071A (en) | Apparatus for Mounting Semiconductor Chips | |
| PH12014502415B1 (en) | System for loading and unloading during port operations, comprising a crane, and a base located in the body of the crane that supports and stacks hatchway covers | |
| NO20063595L (en) | Procedure and equipment for moving a group of objects | |
| CN102737954A (en) | Method and device for reducing electronic component manufacturing tool bodies | |
| CN102896622A (en) | Tray for test machine | |
| EP2535586A3 (en) | Machine including compressor controlling apparatus and method | |
| CN105628068A (en) | Fixture preventing measurement deviation and manufacturing method thereof | |
| GB2519723A (en) | Apparatus for lifting shelves | |
| GB2476476B (en) | Charged particle beam system | |
| EP2554741A3 (en) | Bed for ironing device | |
| CN103286709A (en) | Bonding jig | |
| CN209337688U (en) | Scroll plate flexible processing unit automatic stacking mechanism | |
| CN204603193U (en) | Printed circuit board (PCB) contraposition riveted bogey |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121017 |