CN102799076B - A kind of exposure method for non-planar substrates and exposure device - Google Patents

Abstract

The invention discloses an exposure method for a non-planar substrate, which comprises: providing a non-planar substrate; covering at least a part of the non-planar substrate in the non-planar substrate with a photosensitive resist; exposing the photoresist to at least a portion of the non-planar material. The invention also discloses an exposure device for non-planar substrates. The exposure method and exposure device for non-planar substrates of the present invention can be adapted to large-size non-planar substrates by covering the surface of each part of the non-planar substrate with photosensitive resist and then using a stereoscopic exposure method for exposure.

Description

An exposure method and exposure device for non-planar substrates

technical field

The invention relates to the technical field of graphic exposure, in particular to an exposure method and an exposure device for non-planar substrates.

Background technique

For making circuit patterns on the surface of non-planar substrates, the prior art generally adopts laser surface modification technology and electroplating technology to realize. Laser surface modification technology is currently widely used because it greatly improves the hardness and wear resistance of the substrate surface, and can control costs. Due to the mature technology, the electroplating process is widely used at present.

However, due to the small laser beam in the laser surface modification technology, the treatment surface is small, so it is not suitable for large-sized non-planar substrates; the electroplating tank used in the electroplating process is designed according to the non-planar substrates that need to be electroplated. If the size of the planar substrate is too large, the size of the electroplating tank must be increased accordingly, resulting in a decrease in control accuracy during the electroplating process. Therefore, the electroplating process is not suitable for large-sized non-planar substrates.

Contents of the invention

The technical problem mainly solved by the present invention is to provide an exposure method and an exposure device for non-planar substrates, which can be adapted to large-sized non-planar substrates.

In order to solve the above technical problems, the present invention provides an exposure method for non-planar substrates, which includes: providing a non-planar substrate; covering at least a part of the non-planar substrate in the non-planar substrate with a photoresist; using a three-dimensional The exposure method exposes at least a portion of the photoresist that is non-planar in the non-planar substrate.

Wherein, the step of exposing at least a part of the non-planar photoresist in the non-planar substrate using a stereoscopic exposure method is specifically: a light source is arranged opposite to each part of the non-planar substrate in the non-planar substrate, so that the plurality of light sources The non-planar substrate is three-dimensionally distributed; a graphic transfer tool is set between each light source and each part of the non-planar substrate; the graphic transfer tool is irradiated by the light source, and the light transmitted from the graphic transfer tool makes the photosensitive resist A reaction occurs that transfers the graphic on the graphic transfer tool to the non-planar substrate.

Wherein, the step of covering at least a part of the non-planar part of the non-planar substrate with the photoresist comprises: immersing the non-planar substrate in the photoresist and taking it out, so that the photoresist covers the non-planar part of the non-planar substrate at least partly.

Wherein, the photosensitive resist is a resin type photosensitive material.

Wherein, the non-planar substrate is a metamaterial non-planar substrate.

In order to solve the above-mentioned technical problems, the present invention also provides an exposure device, which includes: a carrying part for carrying a non-planar substrate, at least a part of the non-planar substrate in the non-planar substrate is covered with a photosensitive resist; at least one light source , arranged relative to the bearing part; the pattern transfer tool is arranged in the optical path between the light source and the non-planar substrate; wherein, at least one light source and the pattern transfer tool use a stereoscopic exposure method to at least a part of the non-planar substrate in the non-planar substrate The photoresist is exposed.

Wherein, the device includes: a solution tank, used to hold the photosensitive resist; an operating mechanism, used to immerse the non-planar substrate in the photosensitive resist and take it out, so that at least a part of the non-planar surface of the non-planar substrate is covered with photosensitive resist. resist, and then place the non-planar substrate into the carrier.

Wherein, there are multiple light sources, and the multiple light sources are three-dimensionally distributed relative to the bearing part, so that each non-planar part of the non-planar base material is relatively provided with a light source.

Wherein, the photosensitive resist is a resin type photosensitive material.

Wherein, the non-planar substrate is a metamaterial non-planar substrate.

The exposure method and exposure device for non-planar substrates of the present invention cover at least a part of the non-planar substrate with a photosensitive resist, and then use a stereoscopic exposure method to expose the photosensitive resist, and the illumination range is large enough , light intensity and light time are easy to control, and are suitable for exposure treatment of large-size non-planar substrates.

Description of drawings

Fig. 1 is a flowchart of an embodiment of the exposure method of the present invention;

Fig. 2 is the specific flowchart of the exposure method shown in Fig. 1;

FIG. 3 is a schematic top view of an embodiment of the exposure device of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

Please refer to FIG. 1 . FIG. 1 is a flow chart of an embodiment of the exposure method of the present invention. The exposure method includes the following steps:

Step S10: providing a non-planar substrate.

Wherein, the surface of the non-planar substrate is not planar, for example, the non-planar substrate is hemispherical or cone-shaped. In this embodiment, the non-planar substrate is a metamaterial non-planar substrate. Metamaterials refer to artificial composite structures or composite materials with extraordinary physical properties that natural materials do not have. Through the orderly design of the structure on the key physical scale of the material, the limitation of some apparent natural laws can be broken through, so as to obtain the supernormal material function beyond the ordinary nature inherent in nature. The properties and functions of metamaterials are mainly derived from their internal structure rather than the materials from which they are composed.

Step S20: Covering at least a part of the non-planar substrate in the non-planar substrate with a photoresist.

Wherein, step S20 further includes immersing the non-planar substrate in the photoresist and taking it out, so that the photoresist covers at least a part of the non-planar part of the non-planar substrate. Of course, those skilled in the art can easily use other methods to cover at least a part of the non-planar substrate with the photoresist, such as showering, spraying and the like.

Photoresist is a polymer compound that can change the resist ability after being exposed to light. And it is an acidic corrosion solution (mainly including hydrochloric acid, sodium hypochlorite or ferric chloride and other components). In this embodiment, the photoresist is a resin-type photosensitive material. The time for immersing the non-planar substrate into the photosensitive resist can be set according to actual needs.

Step S30: exposing at least a part of the non-planar photoresist in the non-planar substrate using a stereo exposure method.

Wherein, through the stereoscopic exposure method, after the photosensitive resist covering at least a part of the non-planar part of the non-planar substrate is exposed to light and reacts, the remaining photosensitive resist forms a predetermined pattern. Compared with the prior art, the three-dimensional exposure method only coats a single surface of a non-planar substrate with a photosensitive resist for exposure, and covers multiple surfaces of a non-planar substrate with a photosensitive resist for three-dimensional exposure.

Next, the stereoscopic exposure method will be described in detail. Please refer to FIG. 2 together. FIG. 2 is a specific flowchart of the exposure method shown in FIG. 1 . In the exposure method, step S30 is specifically divided into the following steps:

Step S31 : setting a light source opposite to each non-planar part of the non-planar substrate, so that a plurality of light sources are distributed three-dimensionally relative to the non-planar substrate.

Among them, since the non-plane of the non-planar substrate is three-dimensionally distributed relative to the plane, in order to make all the non-plane of the non-planar substrate within the irradiation range of the light source, each part of the non-plane in the non-planar substrate is relatively Set up a light source. In order to save the number of light sources and improve the lighting efficiency, one light source can be arranged in each of the four directions of the non-planar substrate, front, back, left, and right.

Step S32: setting a graphic transfer tool between each light source and each non-planar portion of the non-planar substrate.

Wherein, the graphic transfer tool may be a graphic carrier such as a film or a steel mesh. In this embodiment, the graphic transfer tool is attached to each part of the non-planar substrate to obtain different graphics.

Step S33: irradiating the pattern transfer tool with a light source, and the light transmitted from the pattern transfer tool causes the photosensitive resist to react, so that the pattern on the pattern transfer tool is transferred to the non-planar substrate.

Wherein, each light source irradiates the corresponding pattern transfer tool, and after the part of the photosensitive resist exposed to light reacts, the part not exposed to light under the protection of the pattern transfer tool forms a predetermined pattern.

Due to the large illumination area of the light source, it is possible to illuminate large non-planar substrates. Moreover, the light intensity and light time are also easier to control, the operation is relatively simple, and the cost is low.

Please refer to FIG. 3 . FIG. 3 is a schematic top view of an embodiment of the exposure device of the present invention. For clarity, the non-planar substrate 111 is also shown in the figure. The exposure device includes a bearing part 110 , at least one light source 120 and a pattern transfer tool (not shown).

The carrying part 110 is used for carrying the non-planar substrate 111 . At least a portion of the non-planar substrate 111 is covered with photoresist. Specifically, the exposure device includes a solution tank 130 and an operating mechanism 140 . The solution tank 130 is used to contain photoresist. The operating mechanism 140 can be a device with a clamping function such as a robot arm. The operating mechanism 140 is used to immerse the non-planar substrate 111 in the photosensitive resist and take it out, so that at least a part of the non-planar surface of the non-planar substrate 111 is covered. There is a photoresist, and then the non-planar substrate 111 is put into the carrying part 110 .

At least one light source 120 is disposed opposite to the bearing part 110 . In this embodiment, there are multiple light sources 120, for example four, and the multiple light sources 120 are three-dimensionally distributed relative to the bearing part 110, so that each non-planar part of the non-planar substrate 111 is relatively provided with a light source 120, that is, multiple The light sources 120 are also three-dimensionally distributed relative to the non-planar substrate 111 .

The pattern transfer tool is disposed in the optical path between the light source 120 and the non-planar substrate 111 , specifically, the pattern transfer tool is disposed between each light source 120 and each non-planar part of the non-planar substrate 111 . After the photoresist covers each part of the non-planar substrate 111, the pattern transfer tool can be attached on the photoresist, for example, the pattern transfer tool is a wet film, and can also be spaced evenly from the light source 120 and the non-planar substrate 111 Settings such as graphics transfer tool to stencil.

At least one light source 120 and the pattern transfer tool use a stereo exposure method to expose at least a part of the non-planar photosensitive resist in the non-planar substrate 111, that is, multiple light sources 120 illuminate simultaneously, and the light passing through the pattern transfer tool makes the photosensitive resist The resist reacts, and the photosensitive resist that has not been exposed to light forms a predetermined pattern. The graphics transfer tool completes the graphics transfer.

In more embodiments, there is one light source 120 and it is set relative to the bearing part 110, the bearing part 110 can be rotated, and a graphic transfer tool is attached to each part of the non-planar substrate 111, and the graphic transfer tools of each part with the same or different graphics. When the light source 120 irradiates, the carrying part 110 drives the non-planar substrate 111 and the pattern transfer tool to rotate, so that the pattern transfer tool of each part of the non-planar part of the non-planar substrate 111 can be irradiated, and the pattern on the pattern transfer tool is transferred. to non-planar substrates 111.

Through the above method, the exposure method and exposure device for non-planar substrates of the present invention cover the photosensitive resist on at least a part of the non-planar substrate in the non-planar substrate, and then use the stereoscopic exposure method to expose the photosensitive resist, The illumination range is large enough, the illumination intensity and illumination time are easy to control, it can be adapted to large-size non-planar substrates, and the operation is simplified and the cost is reduced.

The above is only the embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process conversion made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related technologies fields, all of which are equally included in the scope of patent protection of the present invention.

Claims (8)

1. for an exposure method for non-planar substrates, it is characterized in that, described method comprises:

Non-planar substrates is provided;

Cover in described non-planar substrates at least partially nonplanar with photosensitive resist agent;

Three-dimensional exposure method is used to expose photosensitive resist agent at least partially nonplanar in described non-planar substrates; Be specially: nonplanar every a part of homogeneous phase is to arranging a light source in described non-planar substrates, the relative non-planar substrates of multiple described light sources is spatially distributed; In light source and non-planar substrates described in each, between nonplanar every part, Graphic transitions instrument is set; Utilize described light source irradiation Graphic transitions instrument, from the light of described Graphic transitions instrument transmission, photosensitive resist agent is reacted, thus make Graphic transitions on described Graphic transitions instrument to non-planar substrates; The described Graphic transitions instrument of each several part has different figures, thus on non-planar substrates on obtain different figure.

2. exposure method according to claim 1, is characterized in that, described photosensitive resist agent covers nonplanar step at least partially in non-planar substrates and comprises:

Described non-planar substrates to be immersed in photosensitive resist agent and to take out, described photosensitive resist agent being covered in non-planar substrates at least partially nonplanar.

3. exposure method according to claim 2, is characterized in that, described photosensitive resist agent is resin type photoactive material.

4. exposure method according to claim 1, is characterized in that, described non-planar substrates is Meta Materials non-planar substrates.

5. for a non-planar substrates exposure device, it is characterized in that, described device comprises:

Supporting part, for carrying non-planar substrates, nonplanarly in described non-planar substrates is coated with photosensitive resist agent at least partially;

Multiple light source, relatively described supporting part is arranged, and in described non-planar substrates, nonplanar every a part of homogeneous phase is to arranging a light source, and the relative non-planar substrates of multiple described light sources is spatially distributed;

Graphic transitions instrument, is arranged among the light path between described light source and non-planar substrates;

Wherein, described at least one light source and Graphic transitions instrument use three-dimensional exposure method to expose photosensitive resist agent at least partially nonplanar in described non-planar substrates;

In light source and non-planar substrates described in each, between nonplanar every part, Graphic transitions instrument is set; Utilize described light source irradiation Graphic transitions instrument, from the light of described Graphic transitions instrument transmission, photosensitive resist agent is reacted, thus make Graphic transitions on described Graphic transitions instrument to non-planar substrates; The described Graphic transitions instrument of each several part has different figures, thus on non-planar substrates on obtain different figure.

6. exposure device according to claim 5, is characterized in that, described device comprises:

Solution tank, for containing photosensitive resist agent;

Operating mechanism, for described non-planar substrates to be immersed in photosensitive resist agent and to take out, makes nonplanarly in described non-planar substrates to be coated with photosensitive resist agent at least partially, more described non-planar substrates is inserted supporting part.

7. exposure device according to claim 5, is characterized in that, described photosensitive resist agent is resin type photoactive material.

8. exposure device according to claim 5, is characterized in that, described non-planar substrates is Meta Materials non-planar substrates.