CN102816534A - Structure adhesive for metal adhesion, and preparation method thereof - Google Patents
Structure adhesive for metal adhesion, and preparation method thereof Download PDFInfo
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- CN102816534A CN102816534A CN2012102870838A CN201210287083A CN102816534A CN 102816534 A CN102816534 A CN 102816534A CN 2012102870838 A CN2012102870838 A CN 2012102870838A CN 201210287083 A CN201210287083 A CN 201210287083A CN 102816534 A CN102816534 A CN 102816534A
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- component
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- structure glue
- sizing agent
- Prior art date
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- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 title abstract description 11
- 229910052751 metal Inorganic materials 0.000 title abstract description 11
- 239000002184 metal Substances 0.000 title abstract description 11
- 239000000853 adhesive Substances 0.000 title abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000007822 coupling agent Substances 0.000 claims abstract description 12
- 239000000178 monomer Substances 0.000 claims abstract description 12
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 12
- 239000003999 initiator Substances 0.000 claims abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 6
- -1 acrylic ester Chemical class 0.000 claims description 32
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 238000004513 sizing Methods 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 13
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinyl group Chemical group C1(O)=CC(O)=CC=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 10
- 229910002012 Aerosil® Inorganic materials 0.000 claims description 8
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 8
- 229920013649 Paracril Polymers 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 8
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical group CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 5
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 claims description 5
- PPSTVZDCGHLXFU-UHFFFAOYSA-N C(C=C)(=O)OCCC.[O] Chemical compound C(C=C)(=O)OCCC.[O] PPSTVZDCGHLXFU-UHFFFAOYSA-N 0.000 claims description 4
- CMEWLCATCRTSGF-UHFFFAOYSA-N N,N-dimethyl-4-nitrosoaniline Chemical compound CN(C)C1=CC=C(N=O)C=C1 CMEWLCATCRTSGF-UHFFFAOYSA-N 0.000 claims description 4
- MNOILHPDHOHILI-UHFFFAOYSA-N Tetramethylthiourea Chemical compound CN(C)C(=S)N(C)C MNOILHPDHOHILI-UHFFFAOYSA-N 0.000 claims description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- YQHLDYVWEZKEOX-UHFFFAOYSA-N cumene hydroperoxide Chemical compound OOC(C)(C)C1=CC=CC=C1 YQHLDYVWEZKEOX-UHFFFAOYSA-N 0.000 claims description 4
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- DSCFFEYYQKSRSV-UHFFFAOYSA-N 1L-O1-methyl-muco-inositol Natural products COC1C(O)C(O)C(O)C(O)C1O DSCFFEYYQKSRSV-UHFFFAOYSA-N 0.000 claims description 3
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 3
- MFWFDRBPQDXFRC-LNTINUHCSA-N (z)-4-hydroxypent-3-en-2-one;vanadium Chemical compound [V].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O MFWFDRBPQDXFRC-LNTINUHCSA-N 0.000 claims description 2
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 claims description 2
- MMEDJBFVJUFIDD-UHFFFAOYSA-N 2-[2-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1CC(O)=O MMEDJBFVJUFIDD-UHFFFAOYSA-N 0.000 claims description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N 2-butenoic acid Chemical compound CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 claims description 2
- QXIQCNFSNJEMOD-UHFFFAOYSA-N 3-hydroxybutan-2-yl prop-2-enoate Chemical compound CC(O)C(C)OC(=O)C=C QXIQCNFSNJEMOD-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 2
- CGKQZIULZRXRRJ-UHFFFAOYSA-N Butylone Chemical compound CCC(NC)C(=O)C1=CC=C2OCOC2=C1 CGKQZIULZRXRRJ-UHFFFAOYSA-N 0.000 claims description 2
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000004258 Ethoxyquin Substances 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 claims description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N aminothiocarboxamide Natural products NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 125000004386 diacrylate group Chemical group 0.000 claims description 2
- BEFDCLMNVWHSGT-UHFFFAOYSA-N ethenylcyclopentane Chemical compound C=CC1CCCC1 BEFDCLMNVWHSGT-UHFFFAOYSA-N 0.000 claims description 2
- 235000019285 ethoxyquin Nutrition 0.000 claims description 2
- DECIPOUIJURFOJ-UHFFFAOYSA-N ethoxyquin Chemical compound N1C(C)(C)C=C(C)C2=CC(OCC)=CC=C21 DECIPOUIJURFOJ-UHFFFAOYSA-N 0.000 claims description 2
- 229940093500 ethoxyquin Drugs 0.000 claims description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- GYVGXEWAOAAJEU-UHFFFAOYSA-N n,n,4-trimethylaniline Chemical compound CN(C)C1=CC=C(C)C=C1 GYVGXEWAOAAJEU-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- BDJXVNRFAQSMAA-UHFFFAOYSA-N quinhydrone Chemical compound OC1=CC=C(O)C=C1.O=C1C=CC(=O)C=C1 BDJXVNRFAQSMAA-UHFFFAOYSA-N 0.000 claims description 2
- 229940052881 quinhydrone Drugs 0.000 claims description 2
- 235000010199 sorbic acid Nutrition 0.000 claims description 2
- 229940075582 sorbic acid Drugs 0.000 claims description 2
- 239000004334 sorbic acid Substances 0.000 claims description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052804 chromium Inorganic materials 0.000 abstract description 5
- 239000011651 chromium Substances 0.000 abstract description 5
- 229910052759 nickel Inorganic materials 0.000 abstract description 5
- 229910052725 zinc Inorganic materials 0.000 abstract description 5
- 239000011701 zinc Substances 0.000 abstract description 5
- 238000003860 storage Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 2
- 239000003381 stabilizer Substances 0.000 abstract 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 238000005303 weighing Methods 0.000 description 4
- NQSLZEHVGKWKAY-UHFFFAOYSA-N 6-methylheptyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C(C)=C NQSLZEHVGKWKAY-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a two-component acrylate structure adhesive and a preparation method thereof. The adhesive is prepared by matching a component A and a component B according to a mass part ratio of 1:1, wherein the component A comprises, by mass, 40-80 parts of an acrylate monomer, 10-40 parts of a toughening resin, 0.2-10 parts of an initiator, 0.01-1 part of a stabilizer, 0.2-5 parts of a coupling agent, and 0.2-10 parts of a thixotropic agent, and the component B comprises, by mass, 40-80 parts of an acrylate monomer, 10-40 parts of a toughening resin, 0.2-10 parts of an accelerator, 0.01-1 part of a stabilizer, 0.2-5 parts of a coupling agent, and 0.2-10 parts of a thixotropic agent. The adhesive of the present invention is rapidly cured at a room temperature, provides good adhesion effects for zinc, nickel, chromium and other metals, and has characteristics of room temperature storage, stable performance, and long storage period.
Description
Technical field
The present invention relates to a kind of two-component acrylicester structural adhesive, be specifically related to two-component acrylicester structural adhesive of metal stickings such as a kind of metal that is applicable to, particularly zinc, nickel, chromium and preparation method thereof.。
Background technology
Adopt sizing agent to metallic substance carry out bondingly being superior to traditional welding in some aspects, technology such as rivet, be spirally connected, especially the defect mending to metalwork has more unique effect with maintenance.Bondingly can not look like welding and change, can not look like riveted joint yet, be spirally connected and cause stress concentration and intensity reduction because of the boring hitch because of heat causes structural distortion and metallographic structure.Will obtain satisfied metal sticking effect as long as the choosing gummed is fitted, joint is reasonable, technology is proper.
Represent s-generation acrylate adhesive to have plurality of advantages such as quick solidifying, intensity height, good toughness, flexibility be strong as the typical case of esters of acrylic acid sizing agent.But be applicable to metal sticking on the market, the two-component acrylicester structural adhesive that is specially adapted to metal stickings such as zinc, nickel, chromium is of less types.For this reason, develop this series products and show necessary especially.
Summary of the invention
The object of the present invention is to provide a kind of metal sticking that is used for, be specially adapted to two-component acrylicester structural adhesive of metal stickings such as zinc, nickel, chromium and preparation method thereof.
For realizing above-mentioned technical purpose, concrete technical scheme of the present invention is:
Propose a kind of two-component acrylicester structure glue sizing agent, said two-component acrylicester structure glue sizing agent carries out proportioning by A component and B component by mass fraction 1:1;
Described A components in mass portion number is made up of following raw material:
40 parts ~ 80 parts of acrylic ester monomers,
10 parts ~ 40 parts of toughened resins,
0.2 part ~ 10 parts of initiators,
0.01 part ~ 1 part of stablizer,
0.2 ~ 5 part of coupling agent,
0.2 ~ 10 part of thixotropic agent;
Described B components in mass portion number is made up of following raw material:
40 parts ~ 80 parts of acrylic ester monomers,
10 parts ~ 40 parts of toughened resins,
0.2 part ~ 10 parts of promotor,
0.01 part ~ 1 part of stablizer,
0.2 ~ 5 part of coupling agent,
0.2 ~ 10 part of thixotropic agent.
Said acrylic ester monomer is a TEB 3K, (methyl) Hydroxyethyl acrylate, (methyl) Propylene glycol monoacrylate, (methyl) vinylformic acid tetrahydrofuran ester; 2-benzene oxygen ethyl-methyl propenoate, (methyl) IBOA, (methyl) n-butyl acrylate, (methyl) lauryl acrylate; (methyl) tetradecyl acrylate, (methyl) Process Conditions of Cetane Acrylate, (methyl) octadecyl acrylate, (methyl) vinylformic acid; Phenylformic acid, methylene-succinic acid, Sorbic Acid, m-phthalic acid; TGM 1, ethoxyquin double A diacrylate, one or more in the 1,4 butanediol diacrylate.
Said toughened resin is an X 050, paracril, styrene-butadiene rubber(SBR), MBS resin, ABS resin, urethane resin, propenoate quasi-oligomer, one or more in the epoxy modified acrylic resin.
Said initiator is a Lucidol, isopropyl benzene hydroperoxide, tertbutyl peroxide, one or more in the cyclohexanone peroxide.
Said promotor is triethylamine, N, accelerine, N, N-dimethyl-p-toluidine, vinyl thiocarbamide, tetramethyl thiourea, cobalt naphthenate, cobalt iso-octoate, cobalt octoate, vanadium acetylacetonate, ferric acetyl acetonade, one or more in butyraldehyde-n-aniline condensation thing.
Said stablizer is a Resorcinol, quinhydrone(s), 2,6 di tert butyl 4 methyl phenol, one or more among the Na2EDTA.
Said coupling agent is γ-An Bingjisanyiyangjiguiwan (KH 550), γ-glycidyl ether oxygen propyl trimethoxy silicane (KH 560), one or more in γ-methacryloxypropyl trimethoxy silane (KH570).
Said thixotropic agent is an organobentonite, aerosil, THIXCIN, one or more in the polyethylene wax.
The present invention also proposes a kind of preparation method of described two-component acrylicester structure glue sizing agent, and said preparation method comprises:
The preparation of A component: acrylic ester monomer is mixed, add stablizer and coupling agent successively, the toughened resin adding is stirred, the initiator adding is stirred again, add thixotropic agent at last and stir, the froth in vacuum discharging gets the A component;
The preparation of B component: acrylic ester monomer is mixed, add stablizer and coupling agent successively, the toughened resin adding is stirred, stirred promotor adding again, add thixotropic agent at last and stir, the froth in vacuum discharging gets the B component.
Beneficial effect of the present invention:
1. the normal temperature fast setting is good for the adhesive effect of metals such as zinc, nickel, chromium.
2. normal temperature storage, stable performance, storage period is long.
Embodiment
For making the object of the invention, technical scheme and advantage clearer, below in conjunction with specific embodiment, to further explain of the present invention.
Embodiment 1
| The component title | The A component | The B component |
| The methylacrylic acid tetrahydrofuran ester | 32 | 28 |
| 2-benzene oxygen ethyl-methyl propenoate | 12 | 14 |
| Methylacrylic acid | 4 | 4 |
| Toxilic acid | 4 | 4 |
| Isooctyl methacrylate | 8 | 10 |
| Paracril | 20 | 18 |
| The MBS resin | 15 | 17 |
| KH570 | 1 | 1 |
| Resorcinol | 0.05 | 0.05 |
| 2,6 di tert butyl 4 methyl phenol | 0.05 | 0.05 |
| N, accelerine | 0.8 | |
| Cobalt iso-octoate | 0.2 | |
| Isopropyl benzene hydroperoxide | 2.2 | |
| Aerosil | 2 | 2 |
Preparation technology:
A component preparation: accurately take by weighing methylacrylic acid tetrahydrofuran ester, 2-phenoxy ethyl-methyl propenoate, methylacrylic acid, toxilic acid and Isooctyl methacrylate, mix; Adding KH570, Resorcinol and 2,6 di tert butyl 4 methyl phenol mixes; Then paracril and MBS resin are added successively, it is dissolved fully; Add isopropyl benzene hydroperoxide and aerosil again, and stir; Last froth in vacuum, discharging promptly gets the A component.
B component preparation: accurately take by weighing after methylacrylic acid tetrahydrofuran ester, 2-benzene oxygen ethyl-methyl propenoate, methylacrylic acid, toxilic acid and Isooctyl methacrylate mix; Add KH570, Resorcinol and 2,6 di tert butyl 4 methyl phenol and mix, then paracril and MBS resin are added successively; It is dissolved fully; With N, accelerine and cobalt iso-octoate and aerosil add, and stir again.Last froth in vacuum, discharging promptly gets the B component.
Embodiment 2
| The component title | The A component | The B component |
| TEB 3K | 27 | 25 |
| Rocryl 400 | 15 | 17 |
| Methylacrylic acid | 6 | 6 |
| TGM 1 | 4 | 4 |
| N-BMA | 8 | 7 |
| Paracril | 19 | 18 |
| ABS resin | 14 | 16 |
| KH570 | 1 | 1 |
| Para benzoquinone | 0.05 | 0.05 |
| 2,6 di tert butyl 4 methyl phenol | 0.05 | 0.05 |
| Tetramethyl thiourea | 1.5 | |
| Cobalt naphthenate | 0.6 | |
| The Lucidol tert-butyl ester | 1.9 | |
| Aerosil | 3.5 | 3.5 |
Preparation technology:
A component preparation: accurately take by weighing TEB 3K, Rocryl 400, methylacrylic acid, TGM 1, n-BMA and mix; Add KH570, para benzoquinone and 2,6 di tert butyl 4 methyl phenol are mixed; Then paracril and ABS resin are added successively, it is dissolved fully; Add tertbutyl peroxide and aerosil again, and stir; Last froth in vacuum, discharging promptly gets the A component.
B component preparation: accurately take by weighing TEB 3K, Rocryl 400, methylacrylic acid, TGM 1, n-BMA and mix; Add KH570, para benzoquinone and 2,6 di tert butyl 4 methyl phenol are mixed; Then paracril and ABS resin are added successively, it is dissolved fully; Add cobalt naphthenate, tetramethyl thiourea and aerosil again, and stir; Last froth in vacuum, discharging promptly gets the B component.
According to GB/T 7124-2008 test shearing resistance,, see table 1 according to GB/T 7122-1996 test stripping strength.
[0023] the mutual bonding test of table 1 metallic substance
Above-described specific embodiment; The object of the invention, technical scheme and beneficial effect have been carried out further detailed description, and institute it should be understood that the above is merely specific embodiment of the present invention; Be not limited to the present invention; All within spirit of the present invention and principle, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a two-component acrylicester structure glue sizing agent is characterized in that, said two-component acrylicester structure glue sizing agent carries out proportioning by A component and B component by mass fraction 1:1;
Described A components in mass portion number is made up of following raw material:
40 parts ~ 80 parts of acrylic ester monomers,
10 parts ~ 40 parts of toughened resins,
0.2 part ~ 10 parts of initiators,
0.01 part ~ 1 part of stablizer,
0.2 ~ 5 part of coupling agent,
0.2 ~ 10 part of thixotropic agent;
Described B components in mass portion number is made up of following raw material:
40 parts ~ 80 parts of acrylic ester monomers,
10 parts ~ 40 parts of toughened resins,
0.2 part ~ 10 parts of promotor,
0.01 part ~ 1 part of stablizer,
0.2 ~ 5 part of coupling agent,
0.2 ~ 10 part of thixotropic agent.
2. two-component acrylicester structure glue sizing agent according to claim 1 is characterized in that said acrylic ester monomer is a TEB 3K, (methyl) Hydroxyethyl acrylate; (methyl) Propylene glycol monoacrylate, (methyl) vinylformic acid tetrahydrofuran ester, 2-benzene oxygen ethyl-methyl propenoate, (methyl) IBOA; (methyl) n-butyl acrylate, (methyl) lauryl acrylate, (methyl) tetradecyl acrylate, (methyl) Process Conditions of Cetane Acrylate; (methyl) octadecyl acrylate, (methyl) vinylformic acid, phenylformic acid, methylene-succinic acid; Sorbic Acid, m-phthalic acid, TGM 1; Ethoxyquin double A diacrylate, one or more in the 1,4 butanediol diacrylate.
3. two-component acrylicester structure glue sizing agent according to claim 2 is characterized in that said toughened resin is an X 050, paracril; styrene-butadiene rubber(SBR), MBS resin, ABS resin; urethane resin, propenoate quasi-oligomer, one or more in the epoxy modified acrylic resin.
4. two-component acrylicester structure glue sizing agent according to claim 3 is characterized in that said initiator is a Lucidol, isopropyl benzene hydroperoxide, tertbutyl peroxide, one or more in the cyclohexanone peroxide.
5. two-component acrylicester structure glue sizing agent according to claim 4 is characterized in that said promotor is triethylamine, N; Accelerine, N, N-dimethyl-p-toluidine, vinyl thiocarbamide; Tetramethyl thiourea, cobalt naphthenate, cobalt iso-octoate, cobalt octoate; Vanadium acetylacetonate, ferric acetyl acetonade, one or more in butyraldehyde-n-aniline condensation thing.
6. two-component acrylicester structure glue sizing agent according to claim 5 is characterized in that said stablizer is a Resorcinol, quinhydrone(s), 2,6 di tert butyl 4 methyl phenol, one or more among the Na2EDTA.
7. two-component acrylicester structure glue sizing agent according to claim 6; It is characterized in that; Said coupling agent is γ-An Bingjisanyiyangjiguiwan (KH 550); γ-glycidyl ether oxygen propyl trimethoxy silicane (KH 560), one or more in γ-methacryloxypropyl trimethoxy silane (KH570).
8. two-component acrylicester structure glue sizing agent according to claim 1 is characterized in that said thixotropic agent is an organobentonite, aerosil, THIXCIN, one or more in the polyethylene wax.
9. preparation method like the described two-component acrylicester structure glue of claim 1-8 sizing agent is characterized in that said preparation method comprises:
The preparation of A component: acrylic ester monomer is mixed, add stablizer and coupling agent successively, the toughened resin adding is stirred, the initiator adding is stirred again, add thixotropic agent at last and stir, the froth in vacuum discharging gets the A component;
The preparation of B component: acrylic ester monomer is mixed, add stablizer and coupling agent successively, the toughened resin adding is stirred, stirred promotor adding again, add thixotropic agent at last and stir, the froth in vacuum discharging gets the B component.
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