CN102825051A - Device for preventing liquid from splashing back - Google Patents
Device for preventing liquid from splashing back Download PDFInfo
- Publication number
- CN102825051A CN102825051A CN2012102832041A CN201210283204A CN102825051A CN 102825051 A CN102825051 A CN 102825051A CN 2012102832041 A CN2012102832041 A CN 2012102832041A CN 201210283204 A CN201210283204 A CN 201210283204A CN 102825051 A CN102825051 A CN 102825051A
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- CN
- China
- Prior art keywords
- liquid
- sidewall
- chuck
- returning
- prevent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 59
- 229920006264 polyurethane film Polymers 0.000 claims description 10
- -1 polypropylene Polymers 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000011086 glassine Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 31
- 238000004140 cleaning Methods 0.000 description 16
- 239000007921 spray Substances 0.000 description 9
- 239000012530 fluid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a device for preventing liquid from splashing back. The device comprises a chuck for placing an object, a rotating shaft and a side wall, wherein the rotating shaft is fixedly connected with the chuck and is used for driving the chuck to rotate; the side wall is annularly arranged around the chuck; liquid on the object is spin-dried by rotation of the chuck; the side wall is used for preventing the liquid thrown away from the object against splashing out of the side wall; an organic film is arranged on the inner side of the side wall; and the anti-deformation ability of the liquid is increased by the organic film, so that the liquid from the object is prevented against splashing back to the object via the side wall, and secondary pollution to the object is avoided.
Description
Technical field
The present invention relates to prevent that liquid from returning spatters the device technique field, relate in particular to a kind of preventing that liquid from returning and spattering device of semiconductor wafer cleaning that be used for.
Background technology
Along with the integrated circuit characteristic size enters into the deep-submicron stage, wafer cleans to clean from initial simple slot type and has developed into the higher monolithic cleaning of precision.In the single-chip cleaning process, utilize rotation at a high speed can the liquid on the wafer be dried, make wafer dry.
Shown in Figure 1 is the structural representation of wafer cleaning device in the prior art.As shown in Figure 1, when wafer 1 cleans, at first need wafer 1 be placed on the chuck 2; Carry out low speed rotation through control electric rotating machine 9 driven rotary axles 6 then, rotating shaft 6 drives chuck 2 and carries out low speed rotation, and rotary speed is that per second 400 changes; At last through control spray arm motor 8; Liquid spray arm 5 and semiconductor wafer 1 to be cleaned are placed with the distance of certain altitude; Be generally 70mm; When the ejection of cleaning fluid or ultra-pure water was arranged in the liquid spray arm 5, spray arm motor 8 drove liquid spray arm 5 and swings on wafer 1 surface, makes cleaning fluid or ultra-pure water evenly cover the surface of entire wafer 1.
After wafer 1 cleans up, improve the rotating speed of electric rotating machine 9, make the rotating speed of chuck 2 bring up to per second 1900 commentaries on classics, utilize the high speed rotation of electric rotating machine 9 to dry the liquid on the wafer 1, make wafer 1 drying.In the processing chamber of cleaning equipment, around around the chuck 2 sidewall 3 being set, make the liquid bump of throwing away from wafer 1 bump against sidewall 3 backs along sidewall 3 toward dirty, prevent outside liquid splash to the sidewall 3, pollute other assembly of cleaning equipment.As shown in Figure 1, when chuck 2 carries out high speed when rotating, liquid can be to leave wafer 1 at a high speed, and after liquid was run into sidewall 3, drop 12 can stretch, bounce-back, caused a part of drop 12 to be understood back and splashed on the wafer 1, caused the secondary pollution of wafer 1.
Summary of the invention
The technical problem that (one) will solve
The present invention provides a kind of and prevents that liquid from returning and spatter device, bumps against the sidewall wafer secondary pollution problem that wafer causes that rebounds back in order to solve in the wafer cleaning process liquid bump of throwing away from wafer because of rotation at a high speed.
(2) technical scheme
The present invention provides a kind of and prevents that liquid from returning and spatter device; Comprise the chuck that is used to place object, be fixedly connected with said chuck and be used to rotate the rotating shaft of said chuck and be located on the sidewall around the said chuck; The rotation of said chuck is used to dry the liquid on the said object; Outside liquid splash to the said sidewall that said sidewall is used to prevent throw away from said object, wherein, the inboard of said sidewall is provided with one deck and is used to prevent that liquid from returning the organic film that spatters.
Aforesaidly prevent that liquid from returning and spatter device that preferably, the inboard of said sidewall is stained with the said organic film of one deck.
Aforesaidly prevent that liquid from returning and spatter device that preferably, the inboard of said sidewall is coated with the said organic film of one deck.
Aforesaidly prevent that liquid from returning and spatter device that preferably, the inboard of said sidewall scribbles the said organic film of one deck.
Aforesaidly prevent that liquid from returning and spatter device that preferably, said organic film is a permeable porous film, water insoluble and have a corrosion resistance.
Aforesaidly prevent that liquid from returning and spatter device that preferably, said organic film is a polyurethane film, said polyurethane film has loose structure, and the aperture in said hole is 0.2-10 μ m.
Aforesaidly prevent that liquid from returning and spatter device that preferably, said chuck and sidewall are anticorrosive material.
Aforesaidly prevent that liquid from returning and spatter device that preferably, the material of said chuck and sidewall is polypropylene, glassine paper or polyethylene.
(3) beneficial effect
Provided by the present inventionly prevent that liquid from returning and spatter device through at interior side bonds one deck organic film of sidewall; Non-deformability when increasing the liquid knockout sidewall; Spatter to object thereby prevent to return by sidewall, overcome secondary pollution object from the liquid that object is thrown away.
Description of drawings
Fig. 1 is the structural representation of wafer cleaning device in the prior art;
Fig. 2 prevents that in the embodiment of the invention liquid from returning the structural representation that spatters device;
Among the figure, 1: wafer; 2: chuck; 3: sidewall; 4: organic film; 5: the liquid spray arm; 6: rotating shaft; 7: discharging tube; 8: the spray arm motor; 9: electric rotating machine; 10: control module; 11: operating terminal; 12: drop.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment, specific embodiments of the invention describes in further detail.Following examples are used to explain the present invention, but are not used for limiting scope of the present invention.
Shown in Figure 2 is to prevent that liquid from returning the structural representation that spatters device in the embodiment of the invention.As shown in Figure 2; Preventing that liquid from returning and spatter device and comprise the chuck 2 that is used to place object, be fixedly connected the rotating shaft 6 that is used for rotary chuck 2 with chuck 2 and be located on the sidewall 3 around the chuck 2 in the embodiment of the invention; And one deck organic film 4 is set in the inboard of sidewall 3, can preferably plate or be coated with through gluing, plate in the inboard of sidewall 3 or being coated with one deck organic film 4 in the present embodiment; Make the inboard of organic film 4 and sidewall 3 fit more, prolong the life cycle of organic film 4.
Wherein, the object in the present embodiment is a wafer 1, because the cleaning fluid of clean wafers 1 is a chemical cleaning solution; So it is preferred organic film 4 is a permeable porous film, water insoluble and have corrosion resistance, for example a polyurethane film; Polyurethane film has solvent resistance, can be by the Chemical cleaning corrosion, wherein; Polyurethane film also has fine porous structure, and its aperture is 0.2-10 μ m, can only see through the water vapour molecule that particulate is about 0.4nm; And to any drop 12, can't pass through because of its particle diameter is excessive, so polyurethane film has good gas permeability and water proofing property; And the resilience of polyurethane film is poor, can increase the non-deformability of the drop 12 that strikes sidewall 3 inwalls, prevents that liquid from returning to spatter.Certainly; Those skilled in the art are easy to expect; As long as organic film 4 has corrosion resistance, resilience is poor; And have fine porous structure and just can be used for preventing that liquid from returning and spattering in the device of the embodiment of the invention, and being not limited to polyurethane film, it is all in protection scope of the present invention.
Prevent in the embodiment of the invention that liquid from returning the assembly that spatters device and can utilize the assembly in the wafer cleaning device in the prior art; Only need one deck organic film 4 be set on sidewall 3, not need independent production, practice thrift great amount of cost; Organic film 4 is very clean simultaneously, can not bring pollution to equipment.
Wherein, the bottom of sidewall 3 can also have chassis 13, is used to collect the liquid of throwing away from wafer 1, on the chassis 13 discharging tube 7 can also be set, and is used to discharge the liquid of collecting on the chassis 13, prevents that liquid from gathering on chassis 13, so that use continuously.
Because the cleaning fluid of clean wafers 1 is a chemical cleaning solution, has certain corrosivity, so preferred chuck 2, sidewall 3, chassis 13 and discharging tube 7 are anticorrosive material in the present embodiment, like polypropylene, glassine paper or polyethylene.
Preventing that liquid from returning and spatter device and one deck organic film is set in the embodiment of the invention through inboard at sidewall; Non-deformability when increasing liquid knockout to the sidewall inwall; When the inner surface bump of liquid and sidewall, most of energy all are converted into heat, can not produce bounce-back, splash; Spatter to wafer thereby prevent to return by sidewall, overcome secondary pollution wafer from the liquid that wafer is thrown away.
When practical application; Preferably, control module 10 controls electric rotating machine 9 and spray arm motor 8 through being set; Can and send to the duty that control module 10 is controlled electric rotating machine 9 and spray arm motor 8 through operating terminal 11 input control orders; Wherein, operating terminal 11 is input units such as touch-screen or keyboard, makes whole control process more accurate.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from know-why of the present invention; Can also make some improvement and replacement, these improvement and replacement also should be regarded as protection scope of the present invention.
Claims (8)
1. one kind prevents that liquid from returning and spatters device; Comprise the chuck that is used to place object, be fixedly connected with said chuck and be used to rotate the rotating shaft of said chuck and be located on the sidewall around the said chuck; The rotation of said chuck is used to dry the liquid on the said object; Outside liquid splash to the said sidewall that said sidewall is used to prevent throw away from said object, it is characterized in that the inboard of said sidewall is provided with one deck and is used to prevent that liquid from returning the organic film that spatters.
2. according to claim 1ly prevent that liquid from returning and spatter device, it is characterized in that the inboard of said sidewall is stained with the said organic film of one deck.
3. according to claim 1ly prevent that liquid from returning and spatter device, it is characterized in that the inboard of said sidewall is coated with the said organic film of one deck.
4. according to claim 1ly prevent that liquid from returning and spatter device, it is characterized in that the inboard of said sidewall scribbles the said organic film of one deck.
5. according to claim 1ly prevent that liquid from returning and spatter device, it is characterized in that said organic film is a permeable porous film, water insoluble and have a corrosion resistance.
6. according to claim 5ly prevent that liquid from returning and spatter device that it is characterized in that said organic film is a polyurethane film, said polyurethane film has loose structure, the aperture in said hole is 0.2-10 μ m.
7. according to claim 1ly prevent that liquid from returning and spatter device, it is characterized in that said chuck and sidewall are anticorrosive material.
8. according to claim 7ly prevent that liquid from returning and spatter device, it is characterized in that the material of said chuck and sidewall is polypropylene, glassine paper or polyethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102832041A CN102825051A (en) | 2012-08-09 | 2012-08-09 | Device for preventing liquid from splashing back |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102832041A CN102825051A (en) | 2012-08-09 | 2012-08-09 | Device for preventing liquid from splashing back |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102825051A true CN102825051A (en) | 2012-12-19 |
Family
ID=47328486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102832041A Pending CN102825051A (en) | 2012-08-09 | 2012-08-09 | Device for preventing liquid from splashing back |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102825051A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107634004A (en) * | 2016-07-19 | 2018-01-26 | 沈阳芯源微电子设备有限公司 | It is a kind of to prevent liquid from splashing the dash mechanism to haze |
| CN110729180A (en) * | 2019-11-26 | 2020-01-24 | 上海华力集成电路制造有限公司 | Crystal edge washing process method |
| CN114171449A (en) * | 2021-12-02 | 2022-03-11 | 华海清科股份有限公司 | Wafer fixing device and wafer drying device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1399312A (en) * | 2001-07-25 | 2003-02-26 | 旺宏电子股份有限公司 | Wafer cleaning device |
| US20060102069A1 (en) * | 2004-11-17 | 2006-05-18 | Dainippon Screen Mfg. Co., Ltd. | Substrate rotation type treatment apparatus |
| CN200946965Y (en) * | 2006-06-28 | 2007-09-12 | 常州市科沛达超声工程设备有限公司 | Silicon Wafer Dryer |
| CN102339729A (en) * | 2010-07-22 | 2012-02-01 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning and drying machine |
| CN202779106U (en) * | 2012-08-09 | 2013-03-13 | 北京七星华创电子股份有限公司 | Device capable of preventing fluid from splashing back |
-
2012
- 2012-08-09 CN CN2012102832041A patent/CN102825051A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1399312A (en) * | 2001-07-25 | 2003-02-26 | 旺宏电子股份有限公司 | Wafer cleaning device |
| US20060102069A1 (en) * | 2004-11-17 | 2006-05-18 | Dainippon Screen Mfg. Co., Ltd. | Substrate rotation type treatment apparatus |
| CN200946965Y (en) * | 2006-06-28 | 2007-09-12 | 常州市科沛达超声工程设备有限公司 | Silicon Wafer Dryer |
| CN102339729A (en) * | 2010-07-22 | 2012-02-01 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning and drying machine |
| CN202779106U (en) * | 2012-08-09 | 2013-03-13 | 北京七星华创电子股份有限公司 | Device capable of preventing fluid from splashing back |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107634004A (en) * | 2016-07-19 | 2018-01-26 | 沈阳芯源微电子设备有限公司 | It is a kind of to prevent liquid from splashing the dash mechanism to haze |
| CN110729180A (en) * | 2019-11-26 | 2020-01-24 | 上海华力集成电路制造有限公司 | Crystal edge washing process method |
| CN110729180B (en) * | 2019-11-26 | 2021-10-15 | 上海华力集成电路制造有限公司 | Crystal edge washing process method |
| CN114171449A (en) * | 2021-12-02 | 2022-03-11 | 华海清科股份有限公司 | Wafer fixing device and wafer drying device |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121219 |