CN102840488A - LED lights with cooling function - Google Patents
LED lights with cooling function Download PDFInfo
- Publication number
- CN102840488A CN102840488A CN2012103352747A CN201210335274A CN102840488A CN 102840488 A CN102840488 A CN 102840488A CN 2012103352747 A CN2012103352747 A CN 2012103352747A CN 201210335274 A CN201210335274 A CN 201210335274A CN 102840488 A CN102840488 A CN 102840488A
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- Prior art keywords
- led lamp
- substrate
- cnt
- sinking function
- function according
- Prior art date
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- 238000001816 cooling Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 25
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 5
- 239000002041 carbon nanotube Substances 0.000 abstract 3
- 229910021393 carbon nanotube Inorganic materials 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 206010023126 Jaundice Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention discloses an LED lamp with a heat dissipation function, which comprises a hollow shell (1), a cover body (2) arranged at the top of the shell (1) and a substrate (3) encapsulated in the shell (1), wherein a plurality of LED lamp bodies (4) are embedded on the substrate (3), and the LED lamp bodies (4) are positioned in the hollow position of the shell (1); and a carbon nanotube (5) and a heat dissipation device (6) are sequentially arranged from the bottom of the substrate (3) to the bottom of the shell (1), and the carbon nanotube (5) and the heat dissipation device (6) form a double heat dissipation structure. The invention adopts a double heat dissipation structure formed by combining the carbon nano-tube and the heat dissipation device, so that heat generated by the LED lamp body can be quickly convected and exchanged with external air, and the air flow circulation is not obstructed, thereby realizing the maximization of the heat dissipation area and achieving the effect of good heat dissipation performance.
Description
Technical field
The present invention relates to a kind of decorating lighting lamp, especially a kind ofly be used for bar, nightclub, coffee shop, dance hall, camp, the LED lamp with heat sinking function in place such as family, belong to lighting technical field.
Background technology
Light emitting diode (Light Emitting Diode is hereinafter to be referred as LED) is the luminous semi-conductor electricity sub-element of a kind of ability, and it can directly be converted into light to electricity.The main body of LED is a semi-conductive wafer, and this semiconductor wafer is made up of two parts, and a part is a P-type semiconductor; Occupied an leading position by the hole in the inside, another part is a N-type semiconductor, and the inside mainly is an electronics; Two kinds of semiconductors couple together, and form a P-N knot; Add specific compound at P-N knot place, can send the light of particular color, glow, gallium phosphide diode green light, silicon carbide diode jaundice light like the gallium arsenide phosphide diode.
Along with popularizing of scientific and technological progress and environmental protection concept, the LED lighting engineering more and more receives widely and paying attention to, and is developed rapidly.Because LED is far superior to the traditional lighting product on the aspect of principle of luminosity, energy-saving and environmental protection; Add incandescent lamp and electronic energy-saving lamp in people's daily use still in occupation of very high ratio; In order to cut the waste, LED illumination manufacturer must develop the LED illuminating product that meets people's use habit and come to replace gradually traditional incandescent lamp and electronic energy-saving lamp.Be the life-span of the too high LED of the influence lamp of node heat that prevents the LED lamp; Generally all be provided with heat abstractor, but at present the heat abstractor that adopts of on the market LED lamp is generally single formula and structure substrate bonded, and this heat abstractor is formed by copper or aluminium alloy manufacturing; Its weight is big, material cost is high, thermal resistance is high; Cause radiating effect undesirable, especially for high-powered LED lamp, the heat abstractor of existing LED lamp has been difficult to satisfy the demands.Therefore, developing the good LED lamp of a kind of heat dispersion, is the problem that the present invention need solve.
Summary of the invention
To the objective of the invention is in order addressing the deficiencies of the prior art, the LED lamp with heat sinking function that a kind of simple in structure, radiating effect is good, the heat sink material cost is low to be provided.
The object of the invention can reach through taking following technical scheme:
Have the LED lamp of heat sinking function, its design feature is: comprise hollow housing, be arranged on the cover body of case top and be encapsulated in the substrate in the housing, assembly has several LED lamp bodies on said substrate, and said LED lamp body is positioned at the hollow position of housing; Be provided with CNT and heat abstractor successively from said base plate bottom to said housing bottom, said CNT and heat abstractor constitute combination heat dissipation structure.
The object of the invention can also reach through following technical scheme:
A kind of embodiment of the present invention is: said housing can be the structure that adopts pottery or aluminium to process.
A kind of embodiment of the present invention is: said cover body can be transparence and the structure that the LED lamp body is encapsulated.
A kind of embodiment of the present invention is: the top of said LED lamp body can be provided with fluorophor, and said fluorophor is positioned at cover body.
A kind of embodiment of the present invention is: said CNT bottom can be coated with one deck aluminium.
A kind of embodiment of the present invention is: can adopt scolding tin to be connected between said CNT and the substrate, the scolding tin temperature is 150～250 ℃.
A kind of embodiment of the present invention is: said CNT can have the structure of several apertures for hollow and inner.
A kind of embodiment of the present invention is: said heat abstractor can be connected on the substrate through the hollow position of CNT.
A kind of embodiment of the present invention is: said heat abstractor can be the sun flower-like structure of being made up of some fin, and said every fin is provided with at least 2 through holes.
A kind of embodiment of the present invention is: said through hole can be circular hole, square hole or blinds fenestra.
The present invention has following outstanding beneficial effect:
1, CNT of the present invention is hollow and inner has the structure of several apertures, and density is less, heat radiation easily, and thermal resistance is less than the heat abstractor that traditional copper or aluminium alloy are processed, and the weight of CNT is light, cost is lower, is fit to be widely used.
2, the present invention adopts the double radiation structure that CNT and heat abstractor combine; Make heat that the LED lamp body produces can be rapidly and extraneous air carry out convection current and heat exchange; Airflow is not interrupted, thereby realizes the maximization of area of dissipation, and reaches the good effect of heat dispersion.
Description of drawings
Fig. 1 is the sectional structure sketch map of the specific embodiment of the invention 1;
Fig. 2 is the plan structure sketch map of the specific embodiment of the invention 1;
Fig. 3 is the structure for amplifying sketch map of the specific embodiment of the invention 1 heat abstractor;
Fig. 4 is the sectional structure sketch map of the specific embodiment of the invention 2.
Wherein, 1-housing, 2-cover body, 3-substrate, 4-LED lamp body, 5-CNT, 6-heat abstractor, 7-fluorophor.
The specific embodiment
Specific embodiment 1:
Fig. 1-Fig. 3 has constituted specific embodiment 1 of the present invention.
With reference to Fig. 1-Fig. 3, present embodiment comprises housing 1, cover body 2, substrate 3, LED lamp body 4, CNT 5 and heat abstractor 6, and said CNT 5 constitutes double radiation structure with heat abstractor 6.
In the present embodiment, the hollow structure of said housing 1 for adopting pottery to process.Said cover body 2 is a transparence and with the structure of LED lamp body encapsulation, it is arranged on housing 1 top.Said substrate 3 is encapsulated in the housing 1.Said LED lamp body 4 has 3, and its hollow position and assembly that is positioned at housing 1 is on substrate 3.Said CNT 5 bottoms are coated with one deck aluminium.Adopt scolding tin to be connected between said CNT 5 and the substrate 3, the scolding tin temperature is 150 ℃.Said CNT 5 is that hollow and inside have the structure of several apertures.Said heat abstractor 6 is connected on the substrate 3 through the hollow position of CNT 5.Said heat abstractor 6 is the sun flower-like structure of being made up of some fin 6-1, and every fin is provided with 2 through hole 6-2.Said through hole 6-2 is a circular hole.Said CNT 5 is arranged on substrate 3 bottoms to the position of housing 1 bottom with the double radiation structure that heat abstractor 6 is formed.
The operation principle of present embodiment:
When the 4 energising work of LED lamp body, its heat conducts to substrate 3, is transmitted on the heat abstractor 6 through CNT 5 through substrate 3 again; When air passes through the fin 6-1 of heat abstractor 6; Under the effect of through hole 6-2, conduct to air through the mode of free convection, heat is taken away.The double radiation structure that CNT 5 and heat abstractor 6 combine; Make heat that LED lamp body 4 produces can be rapidly and extraneous air carry out convection current and heat exchange; Airflow is not interrupted, thereby realizes the maximization of area of dissipation, and reaches the good effect of heat dispersion.
Specific embodiment 2:
With reference to Fig. 4, present embodiment comprises housing 1, cover body 2, substrate 3, LED lamp body 4, CNT 5, heat abstractor 6 and fluorophor 7, and said CNT 5 constitutes double radiation structure with heat abstractor 6.
In the present embodiment, said fluorophor 7 is arranged on LED lamp body 4 tops and is positioned at cover body 2, and LED lamp body 4 sees through the effect that fluorophor 7 produces fluorescent lamp.Adopt scolding tin to be connected between said CNT 5 and the substrate 3, the scolding tin temperature is 250 ℃.All the other connected modes are with specific embodiment 1.
Specific embodiment 3:
The main feature of present embodiment is: the structure of said housing 1 for adopting aluminium to process, and assembly has more than 4 or 4 at the LED lamp body 4 on the substrate 3, and all the other are with specific embodiment 1 or 2.
Specific embodiment 4:
The main feature of present embodiment is: said heat abstractor 6 is made up of some fin 6-1, and every fin is provided with the through hole 6-2 more than 3 or 3, and this through hole 6-2 is square hole or blinds fenestra.All the other are with specific embodiment 1 or 2.
The above; Be merely the best specific embodiment of the present invention; But protection scope of the present invention is not limited thereto; Any technical staff who is familiar with the present technique field is equal to replacement or change according to technical scheme of the present invention and inventive concept thereof in the scope that the present invention disclosed, all belong to protection scope of the present invention.
Claims (10)
1. the LED lamp that has heat sinking function; It is characterized in that: comprise hollow housing (1), be arranged on the cover body (2) at housing (1) top and be encapsulated in the substrate (3) in the housing (1); Going up assembly at said substrate (3) has several LED lamp bodies (4), and said LED lamp body (4) is positioned at the hollow position of housing (1); Be provided with CNT (5) and heat abstractor (6) from said substrate (3) bottom successively to said housing (1) bottom, said CNT (5) and heat abstractor (6) constitute double radiation structure.
2. the LED lamp with heat sinking function according to claim 1 is characterized in that: the structure of said housing (1) for adopting pottery or aluminium to process.
3. the LED lamp with heat sinking function according to claim 1 is characterized in that: said cover body (2) is for transparence and with the structure of LED lamp body encapsulation.
4. the LED lamp with heat sinking function according to claim 1 is characterized in that: the top of said LED lamp body (4) is provided with fluorophor (7), and said fluorophor (7) is positioned at cover body (2).
5. the LED lamp with heat sinking function according to claim 1 is characterized in that: said CNT (5) bottom is coated with one deck aluminium.
6. the LED lamp with heat sinking function according to claim 1 is characterized in that: adopt scolding tin to be connected between said CNT (5) and the substrate (3), the scolding tin temperature is 150～250 ℃.
7. the LED lamp with heat sinking function according to claim 1 is characterized in that: said CNT (5) is that hollow and inside have the structure of several apertures.
8. the LED lamp with heat sinking function according to claim 7 is characterized in that: said heat abstractor (6) is connected on the substrate (3) through the hollow position of CNT (5).
9. the LED lamp with heat sinking function according to claim 8 is characterized in that: the sun flower-like structure of said heat abstractor (6) for being made up of some fin (6-1), said every fin is provided with at least 2 through holes (6-2).
10. the LED lamp with heat sinking function according to claim 9 is characterized in that: said through hole (6-2) is circular hole, square hole or blinds fenestra.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103352747A CN102840488A (en) | 2012-09-11 | 2012-09-11 | LED lights with cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103352747A CN102840488A (en) | 2012-09-11 | 2012-09-11 | LED lights with cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102840488A true CN102840488A (en) | 2012-12-26 |
Family
ID=47368100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103352747A Pending CN102840488A (en) | 2012-09-11 | 2012-09-11 | LED lights with cooling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102840488A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105698014A (en) * | 2016-01-29 | 2016-06-22 | 江苏河马自动化设备有限公司 | LED lamp bank |
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| CN1614772A (en) * | 2003-11-08 | 2005-05-11 | 鸿富锦精密工业（深圳）有限公司 | Radiator and producing method thereof |
| CN1623230A (en) * | 2001-12-20 | 2005-06-01 | 英特尔公司 | Carbon nanotube thermal interface structures |
| EP1753036A2 (en) * | 2005-08-08 | 2007-02-14 | Samsung Electronics Co., Ltd. | Light emitting diode package and fabrication method thereof |
| WO2007058438A1 (en) * | 2005-11-18 | 2007-05-24 | Amosense Co., Ltd. | Electronic parts packages |
| CN101315913A (en) * | 2008-06-12 | 2008-12-03 | 上海芯光科技有限公司 | A light weight and high thermal conductivity power device package |
| US7626250B2 (en) * | 2005-06-03 | 2009-12-01 | Samsung Electro-Mechanics Co., Ltd. | High power LED package and fabrication method thereof |
| CN201521928U (en) * | 2009-11-10 | 2010-07-07 | 浙江摩根电子科技有限公司 | Radiating structure of LED module |
| CN201757295U (en) * | 2010-05-25 | 2011-03-09 | 江门市低碳照明科技有限公司 | LED lamp structure |
| CN201779477U (en) * | 2010-06-21 | 2011-03-30 | 广东聚科照明股份有限公司 | High-efficiency heat-radiating light-emitting diode (LED) lamp |
| CN201779503U (en) * | 2010-08-13 | 2011-03-30 | 美力达电子（昆山）有限公司 | Light-emitting diode lamp with better radiating effect |
| US8084778B2 (en) * | 2008-10-27 | 2011-12-27 | Samsung Led Co., Ltd. | Light emitting diode package |
| CN202310438U (en) * | 2011-11-04 | 2012-07-04 | 新高创意科技有限公司 | Heat sink positioning structure of heat dissipation module |
-
2012
- 2012-09-11 CN CN2012103352747A patent/CN102840488A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1623230A (en) * | 2001-12-20 | 2005-06-01 | 英特尔公司 | Carbon nanotube thermal interface structures |
| CN1614772A (en) * | 2003-11-08 | 2005-05-11 | 鸿富锦精密工业（深圳）有限公司 | Radiator and producing method thereof |
| US7626250B2 (en) * | 2005-06-03 | 2009-12-01 | Samsung Electro-Mechanics Co., Ltd. | High power LED package and fabrication method thereof |
| EP1753036A2 (en) * | 2005-08-08 | 2007-02-14 | Samsung Electronics Co., Ltd. | Light emitting diode package and fabrication method thereof |
| WO2007058438A1 (en) * | 2005-11-18 | 2007-05-24 | Amosense Co., Ltd. | Electronic parts packages |
| CN101315913A (en) * | 2008-06-12 | 2008-12-03 | 上海芯光科技有限公司 | A light weight and high thermal conductivity power device package |
| US8084778B2 (en) * | 2008-10-27 | 2011-12-27 | Samsung Led Co., Ltd. | Light emitting diode package |
| CN201521928U (en) * | 2009-11-10 | 2010-07-07 | 浙江摩根电子科技有限公司 | Radiating structure of LED module |
| CN201757295U (en) * | 2010-05-25 | 2011-03-09 | 江门市低碳照明科技有限公司 | LED lamp structure |
| CN201779477U (en) * | 2010-06-21 | 2011-03-30 | 广东聚科照明股份有限公司 | High-efficiency heat-radiating light-emitting diode (LED) lamp |
| CN201779503U (en) * | 2010-08-13 | 2011-03-30 | 美力达电子（昆山）有限公司 | Light-emitting diode lamp with better radiating effect |
| CN202310438U (en) * | 2011-11-04 | 2012-07-04 | 新高创意科技有限公司 | Heat sink positioning structure of heat dissipation module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105698014A (en) * | 2016-01-29 | 2016-06-22 | 江苏河马自动化设备有限公司 | LED lamp bank |
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| PB01 | Publication | ||
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121226 |