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CN102843158A - Audio receiving chip and portable device comprising the same - Google Patents

Audio receiving chip and portable device comprising the same Download PDF

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Publication number
CN102843158A
CN102843158A CN2012102978715A CN201210297871A CN102843158A CN 102843158 A CN102843158 A CN 102843158A CN 2012102978715 A CN2012102978715 A CN 2012102978715A CN 201210297871 A CN201210297871 A CN 201210297871A CN 102843158 A CN102843158 A CN 102843158A
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CN
China
Prior art keywords
signal
digital
audio
receiving chip
frequency receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012102978715A
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Chinese (zh)
Inventor
杨培
李旭芳
李振
蒋耀丽
王蕊
齐燕
王建庭
戴山小
李丛
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KT MICRO Inc
Beijing KT Micro Ltd
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KT MICRO Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KT MICRO Inc filed Critical KT MICRO Inc
Priority to CN2012102978715A priority Critical patent/CN102843158A/en
Publication of CN102843158A publication Critical patent/CN102843158A/en
Pending legal-status Critical Current

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Abstract

The invention relates to an audio receiving chip and a portable device comprising the audio receiving chip. The audio receiving chip comprises a frequency conversion module, a demodulation module and an audio processing module, wherein the frequency conversion module is used to receive radio-frequency signals and channel-selection signals as input, based on the channel-selection signals, the frequency conversion module generates local oscillation signals, and the local oscillation signals is used to downconvert the radio-frequency signals to intermediate frequency signals. The demodulation module is used to carry out analog-to-digital conversion processing and demodulation processing to the intermediate frequency signals to obtain digital baseband signals. The audio processing module is used to carry out de-emphasis processing, dynamic range expansion and digital-to-analog conversion processing to the digital baseband signals to obtain analog audio signals. The frequency conversion module, the demodulation module and the audio processing module are integrated in a single integrated circuit. By means of the audio receiving chip and the portable device comprising the audio receiving chip, cost of audio receiving equipment is lowered.

Description

The audio frequency receiving chip, has the portable equipment of audio frequency receiving chip
Technical field
The present invention relates to microelectronic, relate in particular to a kind of audio frequency receiving chip, have the portable equipment of audio frequency receiving chip.
Background technology
The audio reception device that radiofrequency signal is converted into audio signal is widely used in each field, for example: WLAN, RF tag, global positioning system, wireless broadcast system, mobile phone, cordless telephone etc.
As shown in Figure 1; Structural representation for a kind of audio reception device in the prior art; Can comprise reception antenna 11, amplifier 12, converter unit 13, analog demodulator 14 and player 15; Reception antenna 11 receives analog radio-frequency signal, and amplifier 12 amplifies this analog radio-frequency signal, and the analog radio-frequency signal after converter unit 13 will amplify is down-converted to fixing intermediate frequency; 14 pairs of intermediate-freuqncy signals of analog demodulator are carried out demodulation and are obtained simulated audio signal, and player 15 is converted into sound with simulated audio signal.This audio reception device adopts discrete component to realize, makes that like this cost of equipment is higher.
Summary of the invention
The present invention provides a kind of audio frequency receiving chip, has the portable equipment of audio frequency receiving chip, to the problem that exists in the prior art, in order to realize reducing the cost of audio reception device.
The present invention provides a kind of audio frequency receiving chip, comprising:
Frequency-variable module is used for received RF signal and channel selecting signal as input, according to said channel selecting signal, generates local oscillated signal, adopts said local oscillated signal, and said radiofrequency signal is down-converted to intermediate-freuqncy signal;
Demodulation module is used for said intermediate-freuqncy signal is carried out analog-to-digital conversion process and demodulation process, obtains digital baseband signal;
Audio processing modules is used for to said digital baseband signal postemphasis processing, dynamic range expansion and digital-to-analogue conversion and handles, and obtains simulated audio signal;
Said frequency-variable module, said demodulation module and said audio processing modules are integrated in the single integrated circuit.
The present invention also provides a kind of portable equipment with audio frequency receiving chip, comprising:
The channel option interface;
The audio frequency receiving chip;
The audio signal output interface;
Wherein, said audio frequency receiving chip comprises arbitrary module of aforementioned audio frequency receiving chip.
The present invention has adopted integrated circuit to realize voiceband facility, has reduced the cost of audio reception device.In addition, adopt the dynamic range expansion technology, improved the quality of audio signal.
Description of drawings
Fig. 1 is the structural representation of a kind of audio reception device in the prior art;
Fig. 2 is the structural representation of audio frequency receiving chip embodiment of the present invention;
Fig. 3 A is first kind of structural representation of frequency-variable module among the audio frequency receiving chip embodiment of the present invention;
Fig. 3 B is second kind of structural representation of frequency-variable module among the audio frequency receiving chip embodiment of the present invention;
Fig. 4 A is first kind of structural representation of demodulation module among the audio frequency receiving chip embodiment of the present invention;
Fig. 4 B is second kind of structural representation of demodulation module among the audio frequency receiving chip embodiment of the present invention;
Fig. 5 A is first kind of structural representation of audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention;
Fig. 5 B is second kind of structural representation of audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention;
Fig. 5 C is the third structural representation of audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention;
Fig. 5 D is the 4th kind of structural representation of audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention;
Fig. 5 E is the 5th kind of structural representation of audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention;
Fig. 5 F is the 6th kind of structural representation of audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention;
Fig. 6 has the structural representation of the portable equipment embodiment of audio frequency receiving chip for the present invention.
Embodiment
Below in conjunction with Figure of description and embodiment the present invention is done further description.
As shown in Figure 2; Structural representation for audio frequency receiving chip embodiment of the present invention; This audio frequency receiving chip can comprise frequency-variable module 21, demodulation module 22 and audio processing modules 23, and demodulation module 22 is connected with frequency-variable module 21, and audio processing modules 23 is connected with demodulation module 22.Frequency-variable module 21, demodulation module 22 and audio processing modules 23 are integrated in the single integrated circuit.This integrated circuit can adopt complementary metal oxide semiconductors (CMOS), and (Complementary Metal Oxide Semiconductor is called for short: CMOS) technology, BiCMOS technology or any other technology wanting to adopt or the combination manufacturing of technology.
Wherein, frequency-variable module 21 is used for received RF signal and channel selecting signal as input, according to channel selecting signal, generates local oscillated signal, adopts local oscillated signal, and radiofrequency signal is down-converted to intermediate-freuqncy signal; The frequency of this intermediate-freuqncy signal is fixed, and can be 10.9MHz or 445KHz.Demodulation module 22 is used for intermediate-freuqncy signal is carried out analog-to-digital conversion process and demodulation process, obtains digital baseband signal; Audio processing modules 23 is used for to digital baseband signal postemphasis processing, dynamic range expansion and digital-to-analogue conversion to be handled, and obtains simulated audio signal.
Shown in Fig. 3 A, be first kind of structural representation of frequency-variable module among the audio frequency receiving chip embodiment of the present invention, frequency-variable module 21 can comprise frequency synthesizer 211 and converter unit 212.Wherein, frequency synthesizer 211 is used for according to channel selecting signal, generates a local oscillated signal; Converter unit 212 is used for received RF signal, adopts local oscillated signal, and radiofrequency signal is down-converted to intermediate-freuqncy signal.Frequency synthesizer 211 can (Direct Digital Synthesizer be called for short: DDS) for the Direct Digital frequency synthesizer.
Shown in Fig. 3 B; Second kind of structural representation for frequency-variable module among the audio frequency receiving chip embodiment of the present invention; On the basis of structural representation shown in Fig. 3 A, frequency-variable module 21 can also comprise phase generator 213, is connected between frequency synthesizer 211 and the converter unit 212.Phase generator 213 is used for the local oscillated signal that stems from frequency synthesizer 211 is carried out phase-shift processing, obtains the quadrature local oscillated signal, and the quadrature local oscillated signal is sent to converter unit 212; Converter unit 212 is used to adopt the quadrature local oscillated signal, and radiofrequency signal is down-converted to intermediate-freuqncy signal.At this moment, intermediate-freuqncy signal comprises I road signal and Q road signal.
Shown in Fig. 4 A; First kind of structural representation for demodulation module among the audio frequency receiving chip embodiment of the present invention; Demodulation module 22 can comprise analog to digital converter 221 and digital demodulator 222, and analog to digital converter 221 is connected with frequency-variable module 21: digital demodulator 222 is connected with analog to digital converter 221.Wherein, analog to digital converter 221 is used for converting intermediate-freuqncy signal into digital medium-frequency signal; Digital demodulator 222 is used for digital medium-frequency signal is carried out demodulation process, obtains digital baseband signal.
Shown in Fig. 4 B; Second kind of structural representation for demodulation module among the audio frequency receiving chip embodiment of the present invention; Demodulation module 22 can comprise analog demodulator 223 and analog to digital converter 221, and analog demodulator 223 is connected with frequency-variable module 21, and analog to digital converter 221 is connected with analog demodulator 223.Analog demodulator 223 is used for intermediate-freuqncy signal is carried out demodulation process, obtains analog baseband signal; Analog to digital converter 223 is used for analog baseband signal is carried out analog-to-digital conversion, obtains digital baseband signal.
Shown in Fig. 5 A; First kind of structural representation for audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention; This audio processing modules 23 can comprise digital deemphasis unit 231, digital dynamic range expanding element 232 and digital to analog converter 233; Digital dynamic range expansion module 232 is connected with digital deemphasis unit 232, and digital to analog converter 233 is connected with digital dynamic range expanding element 232.Wherein, digital deemphasis unit 231 is used for the digital baseband signal processing of postemphasising; Digital dynamic range expanding element 232 is used for the digital baseband signal that postemphasises after handling is carried out dynamic range expansion; Digital to analog converter 233 is used for the digital baseband signal after the expansion is carried out digital-to-analogue conversion, obtains simulated audio signal.
Shown in Fig. 5 B; Second kind of structural representation for audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention; Be that with the difference of structural representation shown in Fig. 5 A digital deemphasis unit 231 is connected between digital dynamic range expanding element 232 and the digital to analog converter 233.Wherein, digital dynamic range expanding element 232 is used for digital baseband signal is carried out dynamic range expansion; Digital deemphasis unit 231 is used for the digital baseband signal processing of postemphasising after the expansion; Digital to analog converter 233 is used for the digital baseband signal that postemphasises after handling is carried out digital-to-analogue conversion, obtains simulated audio signal.
Shown in Fig. 5 C; The third structural representation for audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention; Audio processing modules 23 can comprise digital deemphasis unit 231, digital to analog converter 233 and simulation dynamic range expander 234; Digital to analog converter 233 is connected with digital deemphasis unit 231, and simulation dynamic range expander 234 is connected with digital to analog converter 233.Wherein, the digital deemphasis unit is used for the digital baseband signal processing of postemphasising; Digital to analog converter 233 is used for the digital baseband signal that postemphasises after handling is carried out digital-to-analogue conversion, obtains analog baseband signal; Simulation dynamic range expander 234 is used for analog baseband signal is carried out dynamic range expansion, obtains simulated audio signal.
Shown in Fig. 5 D; The 4th kind of structural representation for audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention; Audio processing modules 23 can comprise digital dynamic range expander 232, digital to analog converter 233 and simulation de-emphasis unit 235; Digital to analog converter 233 is connected with digital dynamic range expander 232, and simulation de-emphasis unit 235 is connected with digital to analog converter 233.Wherein, Digital dynamic range expander 232 is used for digital baseband signal is carried out dynamic range expansion; Digital to analog converter 233 is used for the digital baseband signal after the expansion is carried out digital-to-analogue conversion; Obtain analog baseband signal, simulation de-emphasis unit 235 is used for the analog baseband signal processing of postemphasising is obtained simulated audio signal.
Shown in Fig. 5 E; The 5th kind of structural representation for audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention; Audio processing modules 23 can comprise digital to analog converter 233, simulation de-emphasis unit 235 and simulation dynamic range expander 234; Simulation de-emphasis unit 235 is connected with digital to analog converter 233, and simulation dynamic range expander 234 is connected with simulation de-emphasis unit 235.Wherein, digital to analog converter 233 is used for digital baseband signal is carried out digital-to-analogue conversion, obtains analog baseband signal; Simulation de-emphasis unit 235 is used for the analog baseband signal processing of postemphasising; Simulation dynamic range expander 234 is used for the analog baseband signal that postemphasises after handling is carried out dynamic range expansion, obtains simulated audio signal.
Shown in Fig. 5 F; The 6th kind of structural representation for audio frequency receiving chip embodiment sound intermediate frequency processing module of the present invention; Be that with the difference of structural representation shown in Fig. 5 E simulation de-emphasis unit 235 is connected between digital to analog converter 233 and the simulation dynamic range expander 234.Wherein, digital to analog converter 233 is used for digital baseband signal is carried out digital-to-analogue conversion, obtains analog baseband signal; Simulation dynamic range expander 234 is used for analog baseband signal is carried out dynamic range expansion; Simulation de-emphasis unit 235 is used for the analog baseband signal processing of postemphasising after the expansion is obtained simulated audio signal.
Referring to Fig. 2, the audio frequency receiving chip can also comprise power amplifier 24 on the basis that comprises frequency-variable module 21, demodulation module 22 and audio processing modules 23 again, is connected with audio processing modules 23, is used for simulated audio signal is carried out power amplification.The gain of power amplifier 24 can be that fix or adjustable.Power amplifier 24 together is integrated in the single integrated circuit with frequency-variable module 21, demodulation module 22 and audio processing modules 23.
Present embodiment has adopted integrated circuit to realize voiceband facility, has reduced the cost of voiceband facility.In addition, adopt the dynamic range expansion technology, improved the quality of audio signal.
As shown in Figure 6, the structural representation for the present invention has the portable equipment embodiment of audio frequency receiving chip can comprise channel option interface 61, audio frequency receiving chip 62, audio signal output interface 63.Channel option interface 61 is connected with audio frequency receiving chip 62, and audio signal output interface 63 is connected with audio frequency receiving chip 62.
Wherein, audio frequency receiving chip 62 can comprise arbitrary module among the aforementioned audio frequency receiving chip embodiment, repeats no more at this.
Again referring to Fig. 6; Present embodiment can also comprise reception antenna 11 and audio player 64; Reception antenna 11 is connected with audio frequency receiving chip 62, and audio player 64 is connected with audio signal output interface 63, audio player 64 specifically can for audio amplifier, earphone etc. can back sound information equipment.
What should explain at last is: above embodiment is only unrestricted in order to technical scheme of the present invention to be described; Although the present invention is specified with reference to preferred embodiment; Those of ordinary skill in the art is to be understood that; Can make amendment or be equal to replacement technical scheme of the present invention, and not break away from the spirit and the scope of technical scheme of the present invention.

Claims (12)

1. an audio frequency receiving chip is characterized in that, comprising:
Frequency-variable module is used for received RF signal and channel selecting signal as input, according to said channel selecting signal, generates local oscillated signal, adopts said local oscillated signal, and said radiofrequency signal is down-converted to intermediate-freuqncy signal;
Demodulation module is used for said intermediate-freuqncy signal is carried out analog-to-digital conversion process and demodulation process, obtains digital baseband signal;
Audio processing modules is used for to said digital baseband signal postemphasis processing, dynamic range expansion and digital-to-analogue conversion and handles, and obtains simulated audio signal;
Said frequency-variable module, said demodulation module and said audio processing modules are integrated in the single integrated circuit.
2. audio frequency receiving chip according to claim 1 is characterized in that, said demodulation module comprises:
Analog to digital converter is used for converting said intermediate-freuqncy signal into digital medium-frequency signal;
Digital demodulator is used for said digital medium-frequency signal is carried out demodulation process, obtains digital baseband signal.
3. audio frequency receiving chip according to claim 1 is characterized in that, said demodulation module comprises:
Analog demodulator is used for said intermediate-freuqncy signal is carried out demodulation process, obtains analog baseband signal;
Analog to digital converter is used for said analog baseband signal is carried out analog-to-digital conversion, obtains digital baseband signal.
4. according to the audio frequency receiving chip of claim 1, it is characterized in that said audio processing modules comprises:
The digital deemphasis unit is used for the processing of postemphasising of said digital baseband signal;
The digital dynamic range expanding element is used for the digital baseband signal that postemphasises after handling is carried out dynamic range expansion;
Digital to analog converter is used for the digital baseband signal after the expansion is carried out digital-to-analogue conversion, obtains simulated audio signal.
5. audio frequency receiving chip according to claim 1 is characterized in that, said audio processing modules comprises:
The digital dynamic range expanding element is used for said digital baseband signal is carried out dynamic range expansion;
The digital deemphasis unit is used for the digital baseband signal processing of postemphasising after the expansion;
Digital to analog converter is used for the digital baseband signal that postemphasises after handling is carried out digital-to-analogue conversion, obtains simulated audio signal.
6. audio frequency receiving chip according to claim 1 is characterized in that, said frequency-variable module comprises:
Frequency synthesizer is used for according to channel selecting signal, generates a local oscillated signal;
Converter unit is used for received RF signal, adopts said local oscillated signal, and said radiofrequency signal is down-converted to intermediate-freuqncy signal.
7. audio frequency receiving chip according to claim 6 is characterized in that, said frequency synthesizer is the Direct Digital frequency synthesizer.
8. audio frequency receiving chip according to claim 6 is characterized in that, said frequency-variable module also comprises:
Phase generator is used for the said local oscillated signal that stems from said frequency synthesizer is carried out phase-shift processing, obtains the quadrature local oscillated signal, and said quadrature local oscillated signal is sent to said converter unit;
Said converter unit is used to adopt said quadrature local oscillated signal, and said radiofrequency signal is down-converted to intermediate-freuqncy signal.
9. audio frequency receiving chip according to claim 8 is characterized in that, the integrated circuit of said integrated circuit for adopting CMOS technology to make.
10. audio frequency receiving chip according to claim 1 is characterized in that, also comprises:
Power amplifier is used for said simulated audio signal is carried out power amplification;
Said power amplifier is integrated in the said integrated circuit.
11. audio frequency receiving chip according to claim 10 is characterized in that, the Gain Adjustable of said power amplifier.
12. the portable equipment with audio frequency receiving chip is characterized in that, comprising:
The channel option interface;
The audio frequency receiving chip;
The audio signal output interface;
Wherein, said audio frequency receiving chip comprises the arbitrary described audio frequency receiving chip of claim 1-11.
CN2012102978715A 2012-08-20 2012-08-20 Audio receiving chip and portable device comprising the same Pending CN102843158A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103546177A (en) * 2013-10-24 2014-01-29 北京锐安科技有限公司 Radio frequency receiving device and vehicle-mounted hollow monitoring equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101136647A (en) * 2006-08-31 2008-03-05 美国博通公司 Radio Frequency Integrated Circuits and Wireless Transmitter, Wireless Receiver Integrated Circuits
CN201422113Y (en) * 2009-04-17 2010-03-10 捷顶微电子(上海)有限公司 Frequency modulation radio system
CN202261245U (en) * 2011-08-25 2012-05-30 北京昆腾微电子有限公司 Integrated audio transmitter and portable device, integrated audio receiver and portable device, audio communication system
CN202713286U (en) * 2012-08-20 2013-01-30 北京昆腾微电子有限公司 Audio frequency receiving chip and portable equipment thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101136647A (en) * 2006-08-31 2008-03-05 美国博通公司 Radio Frequency Integrated Circuits and Wireless Transmitter, Wireless Receiver Integrated Circuits
CN201422113Y (en) * 2009-04-17 2010-03-10 捷顶微电子(上海)有限公司 Frequency modulation radio system
CN202261245U (en) * 2011-08-25 2012-05-30 北京昆腾微电子有限公司 Integrated audio transmitter and portable device, integrated audio receiver and portable device, audio communication system
CN202713286U (en) * 2012-08-20 2013-01-30 北京昆腾微电子有限公司 Audio frequency receiving chip and portable equipment thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103546177A (en) * 2013-10-24 2014-01-29 北京锐安科技有限公司 Radio frequency receiving device and vehicle-mounted hollow monitoring equipment

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Application publication date: 20121226