CN102899608B - Film coating method - Google Patents
Film coating method Download PDFInfo
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- CN102899608B CN102899608B CN201110210471.1A CN201110210471A CN102899608B CN 102899608 B CN102899608 B CN 102899608B CN 201110210471 A CN201110210471 A CN 201110210471A CN 102899608 B CN102899608 B CN 102899608B
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- substrate
- shadow mask
- mask unit
- plated film
- area
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000007888 film coating Substances 0.000 title abstract description 9
- 238000009501 film coating Methods 0.000 title abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 claims description 45
- 238000006073 displacement reaction Methods 0.000 claims description 30
- 238000000059 patterning Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 14
- 230000008020 evaporation Effects 0.000 claims description 5
- 238000001704 evaporation Methods 0.000 claims description 5
- 238000005401 electroluminescence Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a film coating method. The film coating method comprises the following steps: providing a substrate and a film coating source opposite to the substrate; arranging a shadow mask unit between the substrate and the film coating source and corresponding to the first zone of the substrate, wherein the shadow mask unit has an opened pattern, and the area of the shadow mask unit is less than the area of the substrate; carrying out a first coat making technology through treating the shadow mask unit as a mask and utilizing the film coating source to form a first patterned coat on the opened pattern exposed first zone; moving the shadow mask unit relative to the substrate to make the moved shadow mask unit correspond to the second zone of the substrate; and carrying out a second coat making technology through treating the shadow mask unit as the mask and utilizing the film coating source to form a second patterned coat on the opened pattern exposed second zone.
Description
Technical field
The present invention relates to the formation method of rete, and particularly relate to the method for carrying out plated film on large-sized substrate.
Background technology
Organic Light Emitting Diode (Organic Light Emittine Diode; OLED) there is the characteristic that structure simply, does not need the excellences such as additional backlight, resolving power are high, the performance of pixel individual color is good, the reaction times is shorter, generally apply at present in the Manufacturing Techniques of the true color of flat-panel screens.
The making method of organic light-emitting diode display element be utilize mask (Shadow Mask) and pixel technique of counterpoint by luminous organic material evaporation on glass substrate to form the organic luminous layer of a patterning, wherein mask is made up of a metallic film and a framework be connected with the surrounding zone of metallic film.
In recent years, along with the manufacturing technology of glass substrate is showing improvement or progress day by day, the size of glass substrate increases day by day, therefore, needs to use larger-size mask.But, the size increase of mask can derive some problems, such as: frame size increase can cause weight increase and be easily out of shape, therefore, storing, carrying, with manufacture craft in can increase many difficulty to the operation of personnel and board design, so that cost of manufacture improves; The size of metallic film is subject to the restriction of supplier, therefore not easily obtains large-sized metallic film; And increase along with the size of metallic film, the facility in order to processing metal film also need to coordinate and amplify, so that cost of manufacture significantly improves.
Summary of the invention
For solving the problem, one embodiment of the invention provides a kind of method of plated film, comprise: provide a substrate and a coating source relative with substrate, there is provided a shadow mask unit between substrate and coating source and correspond to a first area of substrate, wherein shadow mask unit has a patterns of openings; With shadow mask unit for mask, coating source is utilized to carry out a first filming manufacture craft, so that the first area exposed in patterns of openings to form one first patterning plated film; Make relative displacement between shadow mask unit and substrate, to make the shadow mask unit after displacement correspond to a second area of substrate, second area and first area partly overlap or separated from one another; And with shadow mask unit for mask, utilize coating source to carry out one second plated film manufacture craft, so that the second area exposed in patterns of openings to form one second patterning plated film.
Accompanying drawing explanation
Figure 1A to Fig. 1 D is the top view of the plated film manufacture craft of one embodiment of the invention;
Fig. 2 A to Fig. 2 D is respectively the sectional view of Figure 1A to Fig. 1 D along I-I ' line segment;
Fig. 3 A is the top view of the plated film manufacture craft of another embodiment of the present invention;
Fig. 3 B is the sectional view of Fig. 3 A along I-I ' line segment;
Fig. 4 is the top view of the plated film manufacture craft of further embodiment of this invention;
Fig. 5 is the top view of the plated film manufacture craft of one embodiment of the invention;
Fig. 6 A to Fig. 6 C is the top view of the plated film manufacture craft of one embodiment of the invention;
Fig. 7 A to Fig. 7 C is respectively the sectional view of Fig. 6 A to Fig. 6 C along I-I ' line segment;
Fig. 8 is the top view of the plated film manufacture craft of another embodiment of the present invention.
Main element nomenclature
110 ~ substrate;
112 ~ surface;
120 ~ coating source;
130 ~ shadow mask unit;
132 ~ patterns of openings;
132a ~ opening;
134 ~ metallic film;
136 ~ framework;
142,144,144a, 146,148 ~ patterning plated film;
A1 ~ first area;
A2 ~ second area;
A3 ~ the 3rd region;
L1, L2 ~ length;
V1, V2, V3, V4, V5, V6 ~ travel direction;
W1, W2 ~ width.
Embodiment
Making and the use-pattern of the embodiment of the present invention will be described in detail below.So it should be noted, the invention provides many inventive concepts for application, it can multiple specific pattern be implemented.In literary composition illustrate discuss specific embodiment be only manufacture with use explanation of the present invention, be not used to limit the scope of the invention.In addition, label or the sign of repetition may be used in different embodiments.These repeat only clearly to describe the present invention in order to simple, do not represent between discussed different embodiment and/or structure and have any association.Moreover, when address one first material layer to be positioned on one second material layer or on time, comprise the first material layer directly contacted or to be separated with one or more other materials layer situation with the second material layer.In the accompanying drawings, the shape of embodiment or thickness can expand, to simplify or conveniently to indicate.
Figure 1A to Fig. 1 D illustrates the top view of the plated film manufacture craft of one embodiment of the invention.Fig. 2 A to Fig. 2 D illustrates the sectional view of Figure 1A to Fig. 1 D along I-I ' line segment respectively.
Referring to Figure 1A and Fig. 2 A, there is provided a substrate 110 and a coating source 120 relative with substrate 110, wherein coating source 120 is such as an evaporation source, and it is suitable for evaporation electroluminescence material on substrate, such as Organic Light Emitting Diode (OLED) material.Substrate 110 is such as a glass substrate.Between substrate 110 and coating source 120, provide a shadow mask unit 130, and shadow mask unit 130 corresponds to a first area A1 of substrate 110.In one embodiment, shadow mask unit 130 is configured on the A1 of first area.
Specifically, shadow mask unit 130 has a patterns of openings 132 and exposes part first area A1.In one embodiment, patterns of openings 132 has multiple opening 132a.In one embodiment, the area of shadow mask unit 130 is less than the area of substrate 110, and that is, the size of shadow mask unit 130 is less than the size of substrate 110 (such as length and/or width).In one embodiment, shadow mask unit 130 comprises metallic film 134 and the framework 136 that has patterns of openings 132, and framework 136 contacts with the surrounding zone of metallic film 134 with support metal film 134.
Then, with shadow mask unit 130 for mask, coating source 120 is utilized to carry out a plated film manufacture craft (such as evaporation manufacture craft), with formation one patterning plated film 142 (as shown in Figure 1B and Fig. 2 B) on the first area A1 exposed in patterns of openings 132.
Then, referring to Figure 1B and Fig. 2 B, make relative displacement between shadow mask unit 130 and substrate 110, with the second area A2 making the shadow mask unit after displacement 130 correspond to substrate 110.Specifically, in the present embodiment, relative displacement between shadow mask unit 130 and substrate 110 is made to be the mobile shadow mask unit 130 when substrate 110 position is fixing, to change the relative position of shadow mask unit 130 and substrate 110.In one embodiment, second area A2 and first area A1 does not overlap each other.
In one embodiment, shadow mask unit 130 is positioned on a surface 112 of substrate 110, and the travel direction of shadow mask unit 130 (travel direction V1 as shown in Figure 2 B) is parallel to the either direction on surface 112.In addition, when mobile shadow mask unit 130, coating source 120 can be moved in the lump, align shadow mask unit 130 to make coating source 120.
Afterwards, with shadow mask unit 130 for mask, coating source 120 is utilized to carry out a plated film manufacture craft, with formation one patterning plated film 144 (as shown in Fig. 1 C and Fig. 2 C) on the second area A2 exposed in patterns of openings 132.In one embodiment, patterning plated film 142 is separated from one another with patterning plated film 144.
Then, please refer to Fig. 1 C and Fig. 2 C, make relative displacement again between shadow mask unit 130 and substrate 110, with one the 3rd region A3 making the shadow mask unit after displacement again 130 correspond to substrate 110.In one embodiment, the 3rd region A3 and first area A1 and second area A2 is separated from one another.In one embodiment, the travel direction (as that shown in fig. 2 c travel direction V2) of shadow mask unit 130 is parallel to the either direction on surface 112.
Then, with shadow mask unit 130 for mask, utilize coating source 120 to carry out a plated film manufacture craft, with formation one patterning plated film 146 (as shown in Fig. 1 D and Fig. 2 D) on the 3rd region A3 exposed in patterns of openings 132.The material of patterning plated film 142,144,146 is such as electroluminescence material, as Organic Light Emitting Diode material.
Afterwards, as shown in Fig. 1 D and Fig. 2 D, optionally can repeat aforementioned manufacturing process steps (comprise and sequentially to make between shadow mask unit 130 and substrate 110 relative displacement and carry out plated film manufacture craft) one or repeatedly, to form one or more patterning plated film 148 again on substrate 110.
In one embodiment, when the length L1 of shadow mask unit 130 is not less than the length L2 of substrate 110, and the width W 1 of shadow mask unit 130 is when being less than the width W 2 of substrate 110 (as shown in Figure 1A), and the travel direction V1 of relative displacement can be made all to be parallel to the width (as shown in Figure 1 C) of substrate 110 with the travel direction V2 of relative displacement again.
Fig. 3 A illustrates the top view of the plated film manufacture craft of another embodiment of the present invention.Fig. 3 B illustrates the sectional view of Fig. 3 A along I-I ' line segment.In another embodiment, as shown in Fig. 3 A and Fig. 3 B, first area A1 and second area A2 can partly overlap, and the patterning plated film 142 formed after carrying out plated film manufacture craft can partly overlap each other with patterning plated film 144a.Afterwards, mobile shadow mask unit can be repeated and carry out plated film manufacture craft until complete the predetermined all patterning plated films be formed on substrate 110.
Fig. 4 illustrates the top view of the plated film manufacture craft of further embodiment of this invention.In another embodiment, as shown in Figure 4, when the width W 1 of shadow mask unit 130 is less than the width W 2 of substrate 110, and the length L1 of shadow mask unit 130 is when being less than the length L2 of substrate 110, shadow mask unit 130 need carry out relative displacement along the length direction of substrate 110 and width, with the plated film in regions all on completing substrate 110, therefore, the travel direction V1 of relative displacement can be not parallel to the travel direction V2 of relative displacement again, for example, the travel direction V1 of relative displacement is perpendicular to the travel direction V2 of relative displacement again.It should be noted that the position of dashed pattern representative shadow mask unit 130 when carrying out plated film manufacture craft each time of Fig. 4.
Fig. 5 illustrates the top view of the plated film manufacture craft of one embodiment of the invention.In addition, in one embodiment, as shown in Figure 5, when carrying out plated film manufacture craft, shadow mask unit 130 and substrate 110 can only partly overlap, and shadow mask unit 130 can direction V3, V4 move.It should be noted that the position of dashed pattern representative shadow mask unit 130 when carrying out plated film manufacture craft each time of Fig. 5.
From aforementioned, the film coating method of the present embodiment is by making shadow mask unit 130 and substrate 110 relative displacement reach full plate plated film, therefore, the shadow mask unit 130 (being less than the size of substrate 110) that size can be used less is used as mask, therefore can avoid existingly increasing the various problems derived because of mask size, and then increase the easness of manufacture craft and significantly reduce cost of manufacture.
Fig. 6 A to Fig. 6 C illustrates the top view of the plated film manufacture craft of one embodiment of the invention.Fig. 7 A to Fig. 7 C illustrates the sectional view of Fig. 6 A to Fig. 6 C along I-I ' line segment respectively.It should be noted that component structure, material etc. that the present embodiment uses are similar in appearance to the embodiment of aforementioned Figure 1A to Fig. 1 D, therefore, do not repeat them here structure and the material of similar components.
Referring to Fig. 6 A and Fig. 7 A, provide a substrate 110 and a coating source 120 relative with substrate 110.Between substrate 110 and coating source 120, provide a shadow mask unit 130, and shadow mask unit 130 corresponds to a first area A1 of substrate 110.
Then, with shadow mask unit 130 for mask, coating source 120 is utilized to carry out a plated film manufacture craft, with formation one patterning plated film 142 (as shown in Fig. 6 B and Fig. 7 B) on the first area A1 exposed in the patterns of openings 132 of shadow mask unit 130.
Then, referring to Fig. 6 B and Fig. 7 B, when shadow mask unit 130 position is fixing, moving substrate 110, with the second area A2 making the shadow mask unit after displacement 130 correspond to substrate 110.
In addition, in one embodiment, shadow mask unit 130 is positioned on a surface 112 of substrate 110, and the travel direction of substrate 110 (travel direction V1 as shown in Figure 7 B) is parallel to the either direction on surface 112.
Afterwards, with shadow mask unit 130 for mask, coating source 120 is utilized to carry out a plated film manufacture craft, with formation one patterning plated film 144 (as shown in Fig. 6 C and Fig. 7 C) on the second area A2 exposed in patterns of openings 132.
Afterwards, as shown in Fig. 6 C and Fig. 7 C, optionally can repeat aforementioned manufacturing process steps (comprise sequentially moving substrate 110 and carry out plated film manufacture craft) one or repeatedly, to form one or more patterning plated film 148 again on substrate 110.
Fig. 8 illustrates the top view of the plated film manufacture craft of another embodiment of the present invention.In one embodiment, as shown in Figure 8, when shadow mask unit 130 position is fixing, along any direction moving substrate 110, such as, can move along direction V5, V6, to form applicable patterning plated film on substrate 110.It should be noted that the dotted line frame illustrated in Fig. 8 is substrate 110 along the position at place after V5, V6 displacement of direction.
In sum, film coating method of the present invention is by making shadow mask unit and substrate relative displacement reach full plate plated film, therefore the shadow mask unit that size can be used less is used as mask, therefore, can avoid existingly increasing the various problems derived because of mask size, and then increase the easness of manufacture craft, and significantly reduce cost of manufacture.
Although disclose the present invention in conjunction with above preferred embodiment; but itself and be not used to limit scope of the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on the claim of enclosing.
Claims (11)
1. a method for plated film, comprising:
There is provided a substrate and a coating source relative with this substrate, provide a shadow mask unit between this substrate and this coating source and correspond to a first area of this substrate, wherein this shadow mask unit has a patterns of openings;
With this shadow mask unit for mask, this coating source is utilized to carry out a first filming manufacture craft, so that this first area exposed in this patterns of openings to form one first patterning plated film;
Make relative displacement between this shadow mask unit and this substrate, to make this shadow mask unit after displacement correspond to a second area of this substrate, this second area and this first area partly overlap or separated from one another;
With this shadow mask unit for mask, this coating source is utilized to carry out one second plated film manufacture craft, so that this second area exposed in this patterns of openings to form one second patterning plated film;
Make relative displacement again between this shadow mask unit and this substrate, to make this shadow mask unit after displacement again correspond to one the 3rd region of this substrate, the 3rd region and this first area and this second area partly overlap or separated from one another; And
With this shadow mask unit for mask, this coating source is utilized to carry out one the 3rd plated film manufacture craft, so that the 3rd region exposed in this patterns of openings to form one the 3rd patterning plated film, wherein the width of this shadow mask unit is less than the width of this substrate, and the length of this shadow mask unit is less than the length of this substrate, the direction of wherein this relative displacement is not parallel to the direction of this relative displacement again.
2. the method for plated film as claimed in claim 1, wherein makes the step of relative displacement between this shadow mask unit and this substrate comprise:
When the position of this substrate is fixed, this shadow mask unit mobile.
3. the method for plated film as claimed in claim 2, wherein makes the step of relative displacement between this shadow mask unit and this substrate also comprise:
This coating source mobile, with this shadow mask unit that aligns.
4. the method for plated film as claimed in claim 2, wherein this shadow mask unit is positioned at one of this substrate on the surface, and the travel direction of this shadow mask unit is parallel to the either direction on this surface.
5. the method for plated film as claimed in claim 1, wherein makes the step of relative displacement between this shadow mask unit and this substrate comprise:
When the position of this shadow mask unit is fixed, this substrate mobile.
6. the method for plated film as claimed in claim 5, wherein this shadow mask unit is positioned at one of this substrate on the surface, and the travel direction of this substrate is parallel to the either direction on this surface.
7. the method for plated film as claimed in claim 1, wherein this first patterning plated film and this second patterning plated film separated from one another or partly overlap each other.
8. the method for plated film as claimed in claim 1, the direction of wherein this relative displacement is perpendicular to the direction of this relative displacement again.
9. the method for plated film as claimed in claim 1, wherein this first filming manufacture craft and this second plated film manufacture craft are evaporation manufacture craft.
10. the method for plated film as claimed in claim 1, wherein the material of this first patterning plated film and this second patterning plated film comprises electroluminescence material.
The method of 11. plated films as claimed in claim 1, wherein the area of this shadow mask unit is less than the area of this substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110210471.1A CN102899608B (en) | 2011-07-26 | 2011-07-26 | Film coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110210471.1A CN102899608B (en) | 2011-07-26 | 2011-07-26 | Film coating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102899608A CN102899608A (en) | 2013-01-30 |
| CN102899608B true CN102899608B (en) | 2015-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110210471.1A Active CN102899608B (en) | 2011-07-26 | 2011-07-26 | Film coating method |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106103789A (en) * | 2014-03-12 | 2016-11-09 | 阿德文泰克全球有限公司 | Little mask laying technology for extensive deposition |
| KR102687513B1 (en) * | 2018-12-31 | 2024-07-22 | 엘지디스플레이 주식회사 | Mask and method of manufacturing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10102237A (en) * | 1996-09-25 | 1998-04-21 | Casio Comput Co Ltd | Electrode formation method |
| JP2000313951A (en) * | 1999-04-28 | 2000-11-14 | Sony Corp | Equipment and method for film deposition |
| JP2003297562A (en) * | 2002-03-29 | 2003-10-17 | Sanyo Electric Co Ltd | Vapor deposition method |
| WO2011034011A1 (en) * | 2009-09-15 | 2011-03-24 | シャープ株式会社 | Vapor deposition method and vapor deposition apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4463492B2 (en) * | 2003-04-10 | 2010-05-19 | 株式会社半導体エネルギー研究所 | Manufacturing equipment |
-
2011
- 2011-07-26 CN CN201110210471.1A patent/CN102899608B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10102237A (en) * | 1996-09-25 | 1998-04-21 | Casio Comput Co Ltd | Electrode formation method |
| JP2000313951A (en) * | 1999-04-28 | 2000-11-14 | Sony Corp | Equipment and method for film deposition |
| JP2003297562A (en) * | 2002-03-29 | 2003-10-17 | Sanyo Electric Co Ltd | Vapor deposition method |
| WO2011034011A1 (en) * | 2009-09-15 | 2011-03-24 | シャープ株式会社 | Vapor deposition method and vapor deposition apparatus |
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| CN102899608A (en) | 2013-01-30 |
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Address after: 518109 Guangdong, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 4, building 1, building Applicant after: Qunkang Technology (Shenzhen) Co., Ltd. Applicant after: Innolux Display Group Address before: 518109 Guangdong, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 4, building 1, building Applicant before: Qunkang Technology (Shenzhen) Co., Ltd. Applicant before: Chimei Optoelectronics Co., Ltd. |
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