CN102916110B - A kind of packaging technology of white light LEDs - Google Patents
A kind of packaging technology of white light LEDs Download PDFInfo
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- CN102916110B CN102916110B CN201210334557.XA CN201210334557A CN102916110B CN 102916110 B CN102916110 B CN 102916110B CN 201210334557 A CN201210334557 A CN 201210334557A CN 102916110 B CN102916110 B CN 102916110B
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- 238000012536 packaging technology Methods 0.000 title claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 89
- 239000000463 material Substances 0.000 claims abstract description 63
- 238000003756 stirring Methods 0.000 claims abstract description 43
- 238000002156 mixing Methods 0.000 claims abstract description 17
- 230000002085 persistent effect Effects 0.000 claims description 29
- 239000000843 powder Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 5
- 229920000260 silastic Polymers 0.000 claims description 5
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 claims 2
- 238000009792 diffusion process Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 14
- 230000015572 biosynthetic process Effects 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 238000000576 coating method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 3
- 238000004513 sizing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
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- 230000000740 bleeding effect Effects 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- 239000004945 silicone rubber Substances 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
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Abstract
The invention belongs to technical field of semiconductor device, particularly relate to the packaging technology of a kind of white light LEDs, comprise the following steps: mixing, fluorescent material, diffusant and glue are mixed in proportion, hand operated mixing 5 20 minutes, then uses board stirring evacuation, obtains fluorescent glue；Point glue, is coated in fluorescent glue on the inwall of cup with rack equably with point gum machine；Baking, is coated with after the cup with rack of fluorescent glue is toasted taking out, prepares white light LEDs.Relative to prior art, the present invention is by fluorescent glue point glue when being loaded with on the inwall of cup with rack of blue chip, and fluorescent material can stably sink, and is evenly distributed in around blue chip, avoid fluorescent material to pile up at the ingress edge of cup with rack, prevent the formation of the hot spot of the blue ultrawhite circle Huang in center；And fluorescent glue with the addition of diffusant, while fluorescent glue sinks, the first half of cup with rack can form diffusion layer, allows fluorescent material reach the effect of mixed light, reaches to eliminate the purpose of yellow circle.
Description
Technical field
The invention belongs to technical field of semiconductor device, particularly relate to a kind of white light LEDs that can remove yellow circle
Packaging technology.
Background branch art
Common white light is to coat YAG fluorescent powder on blue chip, utilizes this fluorescence of Blue-LED lamp
Material is to produce the gold-tinted complementary with blue light, more complementary gold-tinted and blue light is mixed, and just can draw meat
White light needed for Yan, thus prepare white light LEDs.
When blue-ray LED excitated fluorescent powder, the coating process of fluorescent material directly affects light-out effect.If it is glimmering
Light powder spreads unreasonable, then the finished product prepared arises that the phenomenon that a circle blue circle of a yellow circle is white, causes
Photochromic uneven.The coating process of the fluorescent material that prior art is used is to use median particle diameter to be about 15um
Fluorescent material mixes with glue, bubble of bleeding after hand operated mixing, pours into cup with rack in 15 minutes, and at the beginning of carrying out
Roasting and long roasting.
This technique before the baking of product in placement process and baking process, fluorescent material distribution shape in glue
State can change, and causes the skewness of fluorescent material.Owing to cup with rack is bell mouth shape, fluorescent material sinks
After can not be totally absorbed in around blue chip, the ingress edge of cup with rack also have fluorescent material pile up,
And the blue light on cup with rack limit is relatively free of the blue light at cup with rack center by force, when formed product is lighted,
The hot spot that the blue ultrawhite circle in the center that will be formed is yellow, i.e. forms Huang circle, causes halation uneven, thus limit
LED popularizing at lighting field.
In view of this, the packaging technology of a kind of white light LEDs of necessary offer, this technique enables to fluorescence
Powder uniform settlement on blue chip, and on the limit of cup with rack the deposition of not fluorescent material, thus make
Produce and there is no the uniform white light LEDs of hot spot, halation, to promote LED popularizing at lighting field.
Summary of the invention
It is an object of the invention to: for the deficiencies in the prior art, and provide the encapsulation work of a kind of white light LEDs
Skill, this technique enables to fluorescent material uniform settlement to blue chip, and on the limit of cup with rack not
There is the deposition of fluorescent material, thus produce and there is no the uniform white light LEDs of hot spot, halation, to promote LED to exist
Popularizing of lighting field.
In order to achieve the above object, the present invention adopts the following technical scheme that
The packaging technology of a kind of white light LEDs, comprises the following steps:
The first step, mixing, by fluorescent material, diffusant and glue according to (100-150): (3-8): (1000-3000)
Weight ratio mixing, hand operated mixing 5-20 minute, then use board stirring and evacuation, make fluorescent material equal
Even it is distributed in glue, obtains fluorescent glue；
Second step, puts glue, and the fluorescent glue first step configured with point gum machine is coated in equably and is loaded with blue core
On the inwall of the cup with rack of sheet；
3rd step, baking, it is coated with after the cup with rack of fluorescent glue is toasted taking out, prepares white light LEDs.
Wherein, in the first step, the consumption of diffusant selects to be because the most both to play mixed light, disappearing
The effect of hot spot, can will be preferably minimized the impact of light efficiency again.
As a kind of improvement of the packaging technology of white light LEDs of the present invention, described fluorescent material is Y3Al5O12∶Ce3+、
YAG∶Tb+With at least one in YAG.
As a kind of improvement of the packaging technology of white light LEDs of the present invention, the median particle diameter of described fluorescent material is
8-12um.The particle diameter of fluorescent material is too big, glue can be caused support cannot to live fluorescent material, by mixed fluorescent material
Glue pour into support before fluorescent material occur as soon as precipitation, cause batch material fluorescent material content to differ, impact collection
Moderate.And the least luminous efficiency that can affect finished product of particle diameter.
As a kind of improvement of the packaging technology of white light LEDs of the present invention, described diffusant is polymethylacrylic acid
At least one in methyl ester, polystyrene and organosilicon light spread powder.These several diffusants are in higher temperature
Lower non yellowing does not decomposes, and has higher refractive index, preferably organosilicon light spread powder.
The a kind of of packaging technology as white light LEDs of the present invention improves, and board stirring described in the first step is divided into three
Section, the speed of the first stirring section is 500-700rmp, and vacuum is 0-1kPa, and the stirring persistent period is 1-3
Minute；Second stirring section speed be 1000-1500rmp, vacuum is 1-3kPa, stirring the persistent period be
3-5 minute；The speed of the 3rd stirring section is 600-900rmp, and vacuum is 0.5-2kPa, stirs the persistent period
For 4-7 minute.Board stirs than hand operated mixing, and fluorescent material can be made more uniformly to be dispersed in glue.
As a kind of improvement of the packaging technology of white light LEDs of the present invention, the baking described in the 3rd step is divided into three sections,
The baking temperature of the first baking section is 40-80 DEG C, and the persistent period of baking is 0.5-2 hour；Second baking section
Baking temperature be 60-100 DEG C, the persistent period of baking is 0.5-2 hour, the 3rd baking section baking temperature
For 120-180 DEG C, the persistent period of baking is 1.5-4 hour, so that the sedimentation effect of fluorescent material reaches
Good.
As a kind of improvement of the packaging technology of white light LEDs of the present invention, the viscosity of described glue is 2000-6000
cps.The viscosity of glue need to select with the particle diameter of fluorescent material and operation equipment collocation.If viscosity is the highest, equipment is grasped
Making instability, batch material glue amount differs, and affects concentration degree；Viscosity is the lowest, it is impossible to support lives fluorescent material,
Before the glue of mixed fluorescent material is poured into support, fluorescent material occurs as soon as precipitation, causes batch material fluorescent material to contain
Amount differs, and affects concentration degree.
As a kind of improvement of the packaging technology of white light LEDs of the present invention, described glue is liquid silastic, ring
At least one in epoxy resins glue or silicones, preferably dual composition addition type are heated vulcanized liquid silicone rubber,
This silicone rubber transparency is good, soft, good springiness, thermo oxidative stability are good, electrical insulation capability is excellent, resistance to
Ozone damp, waterproof, antirust, cold-resistant, resistance to and weather resistance are remarkable, even if under the long condition of high temperature
Also will not xanthochromia.
As a kind of improvement of the packaging technology of white light LEDs of the present invention, when second step point gum machine carries out glue,
The point glue speed of X-direction and the some glue speed of Y-direction are 200-300mm/s, and the some glue speed of Z-direction is
9-150mm/s, does not the most produce the phenomenon drawing glue while of to ensure speed of production.
Relative to prior art, the present invention is by optimizing fluorescent material and the proportion of glue in fluorescent glue, when by glimmering
Optical cement point glue is when being loaded with on the inwall of cup with rack of blue chip, and fluorescent material can stably sink, all
It is distributed in around blue chip, it is to avoid fluorescent material is piled up at the ingress edge of cup with rack, prevents center evenly
The formation of the hot spot that blue ultrawhite circle is yellow；And fluorescent glue with the addition of diffusant so that fluorescent material can be reasonable
Ground distribution, and while fluorescent glue sinks, the first half of cup with rack can form diffusion layer, this layer
Effect be the effect allowing fluorescent material reach mixed light, thus reach to eliminate the purpose of yellow circle, do not have to produce
The uniform white light LEDs of hot spot, halation, promotes LED popularizing at lighting field.
Accompanying drawing explanation
Fig. 1 is the encapsulating structure schematic diagram of white light LEDs of the present invention.
Detailed description of the invention
Below in conjunction with Figure of description and embodiment, the present invention is further illustrated.
The encapsulating structure of the white light LEDs that the present invention provides includes that blue chip 1, cup with rack 2, glass are saturating
Mirror 3 and substrate 4, blue chip 1 is placed in the bottom of cup with rack 2, glass lens 3 and substrate 4 by viscous
Closing to connect and form closed cavity, cup with rack 2 is placed in this closed cavity, and the electrode tip of blue chip 1 is even
Being connected to contact conductor 11, this contact conductor 11 is electrically connected with substrate 4, and the inwall of cup with rack 2 is coated with
Having fluorescence coating 21 and diffusion layer 22, wherein, diffusion layer 22 is positioned at the top of the inwall of cup with rack 2, and
Fluorescence coating 21 is then positioned at the bottom of the inwall of cup with rack 2.
Embodiment 1
The present embodiment provide a kind of encapsulating structure for realizing above-mentioned white light LEDs packaging technology, including with
Lower step:
The first step, mixing, by fluorescent material YAG (yttrium-aluminium-garnet, median particle diameter is 10 μm), diffusant
The mixture (mass ratio of the two is 3: 1) of polymethyl methacrylate and polystyrene and glue silicones
(viscosity is 3000cps) mixes according to the weight ratio of 100: 3: 1000, hand operated mixing 10 minutes, then
Using board stirring evacuation, wherein, board stirring is divided into three sections, and the speed of the first stirring section is 500rmp,
Vacuum is 0, and the stirring persistent period is 3 minutes；The speed of the second stirring section is 1000rmp, and vacuum is
1kPa, the stirring persistent period is 5 minutes；The speed of the 3rd stirring section is 600rmp, and vacuum is 0.5kPa,
The stirring persistent period is 7 minutes, makes fluorescent material YAG be evenly distributed in glue liquid silastic, obtains glimmering
Optical cement；
Second step, puts glue, and the fluorescent glue first step configured with point gum machine is coated in equably and is loaded with blue core
On the inwall of the cup with rack 2 of sheet, fluorescent glue is made to flow down along the inwall of cup with rack 2, thus at support
The inwall of cup 2 be partially formed one layer of diffusion layer 22, around blue chip 1, then form fluorescence
Layer 21, wherein, the some glue speed of X-direction and the some glue speed of Y-direction are 200mm/s, Z-direction
Point glue speed is 10mm/s；
3rd step, baking, it is coated with after the cup with rack of fluorescent glue is toasted taking out, prepares white light LEDs.
Wherein, baking is divided into three sections, and the baking temperature of the first baking section is 40 DEG C, and the persistent period of baking is 2 little
Time；The baking temperature of the second baking section is 60 DEG C, and the persistent period of baking is 2 hours, the 3rd baking section
Baking temperature is 120 DEG C, and the persistent period of baking is 4 hours.The process of baking can make diffusion layer 22 He
Fluorescence coating 21 sizing is fixing, and makes the sedimentation effect of fluorescent material reach optimal, it is to avoid fluorescent material is in cup with rack
The ingress edge of 2 is piled up, and prevents the formation of the hot spot of the blue ultrawhite circle Huang in center；And the interpolation of diffusant makes
While fluorescent glue sinks, the first half of cup with rack 2 can form diffusion layer 22, makes fluorescent material reach
The effect of mixed light, thus reach to eliminate the purpose of yellow circle.
Embodiment 2
The present embodiment provide a kind of encapsulating structure for realizing above-mentioned white light LEDs packaging technology, including with
Lower step:
The first step, mixing, by fluorescent material YAG: Tb+(median particle diameter is 8 μm), diffusant organosilicon light
Spread powder and glue dual composition addition type heat vulcanized liquid silicone rubber (viscosity is 4000cps) according to 125: 6:
The weight ratio mixing of 2000, hand operated mixing 5 minutes, then use board stirring evacuation, wherein, machine
Platform stirring is divided into three sections, and the speed of the first stirring section is 600rmp, and vacuum is 0.5kPa, when stirring continues
Between be 2 minutes；The speed of the second stirring section is 1200rmp, and vacuum is 2kPa, and the stirring persistent period is 4
Minute；The speed of the 3rd stirring section is 800rmp, and vacuum is 1kPa, and the stirring persistent period is 6 minutes,
Make fluorescent material YAG: Tb+It is evenly distributed in glue liquid silastic, obtains fluorescent glue；
Second step, puts glue, and the fluorescent glue first step configured with point gum machine is coated in equably and is loaded with blue core
On the inwall of the cup with rack 2 of sheet, fluorescent glue is made to flow down along the inwall of cup with rack 2, thus at support
The inwall of cup 2 be partially formed one layer of diffusion layer 22, around blue chip 1, then form fluorescence
Layer 21, wherein, the some glue speed of X-direction and the some glue speed of Y-direction are 250mm/s, Z-direction
Point glue speed is 50mm/s；
3rd step, baking, it is coated with after the cup with rack of fluorescent glue is toasted taking out, prepares white light LEDs.
Wherein, baking is divided into three sections, and the baking temperature of the first baking section is 60 DEG C, and the persistent period of baking is 1 little
Time；The baking temperature of the second baking section is 80 DEG C, and the persistent period of baking is 1 hour, the 3rd baking section
Baking temperature is 150 DEG C, and the persistent period of baking is 2 hours.The process of baking can make diffusion layer 22 He
Fluorescence coating 21 sizing is fixing, and makes the sedimentation effect of fluorescent material reach optimal, it is to avoid fluorescent material is in cup with rack
The ingress edge of 2 is piled up, and prevents the formation of the hot spot of the blue ultrawhite circle Huang in center；And the interpolation of diffusant makes
While fluorescent glue sinks, the first half of cup with rack 2 can form diffusion layer 22, makes fluorescent material reach
The effect of mixed light, thus reach to eliminate the purpose of yellow circle.
Embodiment 3
The present embodiment provide a kind of encapsulating structure for realizing above-mentioned white light LEDs packaging technology, including with
Lower step:
The first step, mixing, by fluorescent material Y3Al5O12∶Ce3+(median particle diameter is 12 μm), diffusant are organic
Silicon light spread powder and epoxide-resin glue (viscosity is 6000cps) mix according to the weight ratio of 150: 8: 3000,
Hand operated mixing 20 minutes, then uses board stirring evacuation, and wherein, board stirring is divided into three sections, the
The speed of one stirring section is 700rmp, and vacuum is 1kPa, and the stirring persistent period is 1 minute；Second stirring
The speed of section is 1500rmp, and vacuum is 3kPa, and the stirring persistent period is 3 minutes；3rd stirring section
Speed is 900rmp, and vacuum is 2kPa, and the stirring persistent period is 4 minutes, makes fluorescent material Y3Al5O12∶Ce3+
It is evenly distributed in glue liquid silastic, obtains fluorescent glue；
Second step, puts glue, and the fluorescent glue first step configured with point gum machine is coated in equably and is loaded with blue core
On the inwall of the cup with rack 2 of sheet, fluorescent glue is made to flow down along the inwall of cup with rack 2, thus at support
The inwall of cup 2 be partially formed one layer of diffusion layer 22, around blue chip 1, then form fluorescence
Layer 21, wherein, the some glue speed of X-direction and the some glue speed of Y-direction are 300mm/s, Z-direction
Point glue speed is 150mm/s；
3rd step, baking, it is coated with after the cup with rack of fluorescent glue is toasted taking out, prepares white light LEDs.
Wherein, baking is divided into three sections, and the baking temperature of the first baking section is 80 DEG C, and the persistent period of baking is 0.5
Hour；The baking temperature of the second baking section is 100 DEG C, and the persistent period of baking is 0.5 hour, the 3rd baking
The baking temperature of section is 180 DEG C, and the persistent period of baking is 1.5 hours.The process of baking can make diffusion layer
22 and fluorescence coating 21 sizing fixing, and make the sedimentation effect of fluorescent material reach optimal, it is to avoid fluorescent material is at support
The ingress edge of cup 2 is piled up, and prevents the formation of the hot spot of the blue ultrawhite circle Huang in center；And the adding of diffusant
While adding so that sinking at fluorescent glue, the first half of cup with rack 2 can form diffusion layer 22, makes fluorescence
Powder reaches the effect of mixed light, thus reaches to eliminate the purpose of yellow circle.
In a word, the present invention is by optimizing fluorescent material and the proportion of glue, stirring condition, some glue speed in fluorescent glue
Degree and baking condition etc., and by reasonably selecting glue so that when fluorescent glue point glue is being loaded with blueness
Time on the inwall of the cup with rack 2 of chip 1, fluorescent material can stably sink, and is evenly distributed in blue light core
Around sheet 1, it is to avoid fluorescent material is piled up (because if fluorescent material cannot sink at the ingress edge of cup with rack 2
Form sediment to the bottom of cup with rack 2, during through bulb or eyeglass, still have the generation of yellow circle), prevent center
The formation of the hot spot that blue ultrawhite circle is yellow；And the present invention with the addition of diffusant in fluorescent glue, and have selected
The amount ranges of one diffusant optimized so that fluorescent material can reasonably be distributed, and under fluorescent glue
While Chen, the first half of cup with rack 2 can form diffusion layer 22, and the effect of this layer is to allow fluorescent material reach
To the effect of mixed light, thus reach to eliminate the purpose of yellow circle, do not have hot spot, halation the whitest to produce
Light LED, promotes LED popularizing at lighting field.
It should be noted that the announcement of book and elaboration, technology people of the art according to the above description
Above-mentioned embodiment can also be changed and revise by member.Therefore, the invention is not limited in and be disclosed above
With the detailed description of the invention described, some equivalent modifications and change to the present invention should also be as the power in the present invention
In the protection domain that profit requires.Although additionally, this specification employs some specific terms, but these
Term merely for convenience of description, does not constitute any restriction to the present invention.
Claims (8)
1. the packaging technology of a white light LEDs, it is characterised in that comprise the following steps:
The first step, mixing, by fluorescent material, diffusant and glue according to (100-150): (3-8): the weight ratio mixing of (1000-3000), hand operated mixing 5-20 minute, then board stirring evacuation are used, make fluorescent material be evenly distributed in glue, obtain fluorescent glue；The viscosity of described glue is 2000-6000cps；
Second step, puts glue, and the fluorescent glue first step configured with point gum machine is coated on the inwall of the cup with rack being loaded with blue chip equably；
3rd step, baking, it is coated with after the cup with rack of fluorescent glue is toasted taking out, prepares white light LEDs.
The packaging technology of white light LEDs the most according to claim 1, it is characterised in that: described fluorescent material is Y3Al5O12: Ce3+, YAG:Tb+With at least one in YAG.
The packaging technology of white light LEDs the most according to claim 2, it is characterised in that: the median particle diameter of described fluorescent material is 8-12um.
The packaging technology of white light LEDs the most according to claim 1, it is characterised in that: described diffusant is at least one in polymethyl methacrylate, polystyrene and organosilicon light spread powder.
The packaging technology of white light LEDs the most according to claim 1, it is characterised in that: board stirring described in the first step is divided into three sections, and the speed of the first stirring section is 500-700rmp, and vacuum is 0-1kPa, and the stirring persistent period is 1-3 minute；The speed of the second stirring section is 1000-1500rmp, and vacuum is 1-3kPa, and the stirring persistent period is 3-5 minute；The speed of the 3rd stirring section is 600-900rmp, and vacuum is 0.5-2kPa, and the stirring persistent period is 4-7 minute.
6. according to the packaging technology of the white light LEDs described in claim l, it is characterised in that: the baking described in the 3rd step is divided into three sections, and the baking temperature of the first baking section is 40-80 DEG C, and the persistent period of baking is 0.5-2 hour；The baking temperature of the second baking section is 60-100 DEG C, and the persistent period of baking is 0.5-2 hour, and the baking temperature of the 3rd baking section is 120-180 DEG C, and the persistent period of baking is 1.5-4 hour.
The packaging technology of white light LEDs the most according to claim 1, it is characterised in that: described glue is at least one in liquid silastic, epoxide-resin glue or silicones.
The packaging technology of white light LEDs the most according to claim 1, it is characterised in that: when second step point gum machine carries out glue, the some glue speed of X-direction and the some glue speed of Y-direction are 200-300mm/s, and the some glue speed of Z-direction is 9-150mm/s.
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| CN201210334557.XA CN102916110B (en) | 2012-09-05 | 2012-09-05 | A kind of packaging technology of white light LEDs |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104716244A (en) * | 2013-12-13 | 2015-06-17 | 鸿富锦精密工业（深圳）有限公司 | White light LED encapsulation structure |
| CN103712104B (en) * | 2013-12-18 | 2016-01-13 | 浙江阳光照明电器集团股份有限公司 | A kind of LED tube lamp |
| KR102131771B1 (en) * | 2014-02-05 | 2020-07-08 | 엘지이노텍 주식회사 | Light emitting device package and lighting apparatus including the same |
| CN104017526B (en) * | 2014-05-29 | 2016-04-27 | 绍兴光彩显示技术有限公司 | A kind of white light surface-mount digital tube fluorescent material point glue glue and using method thereof |
| CN104992636A (en) * | 2015-07-03 | 2015-10-21 | 江门吉华光电精密有限公司 | Self-emitting white light LED nixie tube and production process thereof |
| CN105938867A (en) * | 2016-06-13 | 2016-09-14 | 深圳市玲涛光电科技有限公司 | Rubber mixing process and LED lamp bead |
| CN106832939B (en) * | 2017-01-24 | 2020-06-09 | 杭州科翼科技有限公司 | An LED lamp packaging material |
| TWI708408B (en) | 2017-09-29 | 2020-10-21 | 友達光電股份有限公司 | Light source device |
| CN110165040A (en) * | 2019-06-14 | 2019-08-23 | 深圳市晶锐光电有限公司 | A kind of fluorescent glue and its packaging technology improving hot spot |
| CN112156950A (en) * | 2020-08-18 | 2021-01-01 | 广州市巨宏光电有限公司 | Process for coating fluorescent adhesive layer on surface of LED chip |
| CN114395366A (en) * | 2022-01-17 | 2022-04-26 | 广东安珂光电科技有限公司 | Method for recycling LED packaging waste glue |
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| CN101958384A (en) * | 2010-10-18 | 2011-01-26 | 东莞市勤望达光电科技有限公司 | Preparation method of white light-emitting diode and light-emitting diode thereof |
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