CN102956758B - Method for manufacturing LED packaging structure - Google Patents

Abstract

A method for manufacturing an LED packaging structure, comprising the steps of: providing a substrate, the substrate includes a through hole; forming a conductive plate group made of ductile material on the substrate, and the conductive plate group covers the through hole and is fixed to the substrate; providing a mold Punching the part of the conductive plate group above the through hole of the substrate into the through hole to form a groove; fixing the LED chip in the groove, and electrically connecting the LED chip to the conductive plate group; and packaging the LED chip. In the manufacturing method of the LED packaging structure, by first forming the substrate with through holes, and then stamping the ductile conductive plate group, the manufacturing process of the LED bearing seat can be greatly simplified, because the manufacturing method of the entire LED packaging structure does not need Design complex molds, so manpower, material resources and time can be greatly reduced.

Description

Manufacturing method of LED packaging structure

technical field

The invention designs a method for manufacturing a semiconductor structure, in particular a method for manufacturing an LED packaging structure.

Background technique

Since its development, LED has been considered as the best light source for the new generation of green energy-saving lighting due to its advantages of energy saving, power saving, high efficiency, fast response time, long life cycle time, mercury-free, and environmental protection benefits. The bearing seat of the LED packaging structure generally includes a substrate and a metal substrate disposed on the substrate. The manufacturing method of the bearing seat is generally to first form a patterned metal substrate, and then form a substrate on the metal substrate by injection molding. In the above-mentioned manufacturing method of the bearing seat, the mold used for injection molding the base plate is usually relatively complicated, which leads to the consumption of a lot of manpower, material resources and time in the whole manufacturing method.

Contents of the invention

In view of this, it is necessary to provide a simple method for manufacturing an LED packaging structure.

A method for manufacturing an LED packaging structure, comprising the steps of: providing a substrate, the substrate includes a through hole; forming a conductive plate group made of ductile material on the substrate, and the conductive plate group covers the through hole and is fixed to the substrate; providing a mold Punching the part of the conductive plate group above the through hole of the substrate into the through hole to form a groove; fixing the LED chip in the groove, and electrically connecting the LED chip to the conductive plate group; and packaging the LED chip.

In the manufacturing method of the LED packaging structure, by first forming the substrate with through holes, and then stamping the ductile conductive plate group, the manufacturing process of the LED bearing seat can be greatly simplified, because the manufacturing method of the entire LED packaging structure does not need Design complex molds, so manpower, material resources and time can be greatly reduced.

Description of drawings

Fig. 1 is the first step of the LED manufacturing method of the present invention.

Fig. 2 is the second step of the LED manufacturing method of the present invention.

3-5 are the third step of the LED manufacturing method of the present invention.

Fig. 6 is the fourth step of the LED manufacturing method of the present invention.

Fig. 7 is an LED made by the present invention.

Description of main component symbols

10 Substrate 100 Bearing seat 11 through hole 20 Conductive plate group 200 led twenty one first conductive plate 210, 410 groove twenty two second conductive plate twenty three to open 30 mold 40 reflection layer group 41 first reflective layer 42 second reflective layer 50 chip 51 wire 52 Package

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings.

See also Fig. 1-6, have shown the manufacture method of LED 200 of the present invention, and it mainly comprises following each steps:

Step 1: As shown in FIG. 1 , a substrate 10 is provided. The substrate 10 is made of ceramics, plastics or other insulating materials, and a through hole 11 is formed in the middle by means of slotting or etching, and a through hole 11 runs through the substrate 10. The substrate 10 is formed into left and right parts on both sides of the through hole 11 . The substrate 10 has a smooth first surface and a smooth second surface opposite to the first surface. The through hole 11 is in the shape of an isosceles trapezoid, and its upper base is longer than the lower base, that is, the aperture formed by the through hole 11 on the first surface of the substrate 10 is larger than the aperture formed on the second surface of the substrate 10 .

Step 2: As shown in FIG. 2 , set a conductive plate set 20 with a smooth surface on the substrate 10 , and fix the conductive plate set 20 on the first surface of the substrate 10 by using solder or hot melt adhesive. Since both the substrate 10 and the conductive plate group 20 have smooth surfaces, they can be firmly combined. The conductive plate group 20 covers the through hole 11 and is fixed with the substrate 10 at the left and right parts of the through hole 11 . The conductive plate set 20 is made of conductive material with good ductility. In this embodiment, the conductive plate set 20 is made of copper foil. The conductive plate group 20 can be stretched to a certain extent under the action of external tension without breaking. The conductive plate set 20 leaves an opening 23 on the right side of the substrate 10 . The opening 23 divides the conductive plate group 20 into a first conductive plate 21 and a second conductive plate 22 left and right. The first conductive plate 21 and the second conductive plate 22 serve as two electrodes of the bearing seat 100 . Wherein, the opening 23 is further to the right than the through hole 11 , so that the first conductive plate 21 completely covers the through hole 11 .

Step 3: As shown in FIG. 3 , provide a mold 30 whose shape and structure are roughly the same as the through hole 11 . The mold 30 is in the shape of an isosceles trapezoid, and its upper base length is longer than the lower base length. The isosceles trapezoidal shape of the mold 30 is similar to the isosceles trapezoidal shape of the through hole 11 . The length of the lower base of the mold 30 is slightly smaller than the length of the lower base of the through hole 11 , its two base angles are equal to the two base angles of the through hole 11 , and its height is greater than the depth of the through hole 11 . As shown in Figure 4, the central axis of the mold 30 is aligned with the center of the through hole 11, and the temperature is about 100-150°C in a hot pressing method, that is, from the first surface of the substrate 10 to the second surface. Direction pressure presses the part of the first conductive plate 21 covering the upper end of the through hole 11 into the through hole 11, so that the first conductive plate 21 is recessed toward the through hole 11 and close to the boundary of the through hole 11 to form an isosceles trapezoid shape. As shown in FIG. 5 , except for the parts fixed on both sides of the through hole 11 on the first surface of the substrate 10 , the middle part of the first conductive plate 21 is pressed into the through hole 11 by the mold 30 . The part of the first conductive plate 21 that originally covered the through hole 11 becomes thinner and longer, forming a groove 210 that is bent in three sections. The through hole 11 is filled to be flush with the second surface of the substrate 10 . Since the first conductive plate 21 adheres to the inner wall of the through hole 11 through deformation, its adhering part must conform to the contour of the through hole 11 , that is, the two are firmly attached. After the first conductive plate 21 is formed, the mold 30 is moved upwards. Since there is no adhesion between the first conductive plate 21 and the mold 30 , when the mold 30 is removed, the conductive plate 21 still remains bent in three sections to fill the through hole 11 , thereby forming a groove 210 similar in shape to the through hole 11 . After the mold 30 is removed, the bearing seat 100 is basically formed. A first conductive plate 21 and a second conductive plate 22 are installed on the substrate 10 , and the two are separated by an opening 23 to form two electrodes insulated from each other. The first conductive plate 21 forms a trapezoidal groove 210 to provide space for accommodating the LED chip 50 .

Step 4: As shown in FIG. 6 , a reflective layer 40 is formed on the surface of the conductive plate set 20 . The reflective layer 40 is fixed on the conductive plate group 20 by electroplating with a material with high reflectivity. In this embodiment, the material of the reflective layer 40 is preferably metallic silver. The reflective layer 40 includes a first reflective layer 41 and a second reflective layer 42 separated by the opening 23 . The first reflective layer 41 covers the surface of the first conductive plate 21 , including the part fixed on the first surface of the substrate 10 and the part inside the groove 210 . The first reflective layer 41 forms a groove 410 corresponding to the groove 210 . The second reflective layer 42 covers the surface of the second conductive plate 22 . By forming the reflective layer 40 on the surface of the conductive plate set 20 , the bearing seat 100 is shaped. Compared with the traditional bearing seat 100 formed by injection molding on a patterned metal substrate, the method provided by the present invention has the advantages of simple operation, fast molding speed, and less equipment.

The light-emitting diode 200 can be fabricated by using the bearing seat 100 fabricated in the above four steps. As shown in FIG. 6 , a semiconductor crystal grain is disposed in the groove 410 of the first reflective layer 41 . The semiconductor grain is an LED light emitting chip 50 . The two electrodes of the chip 50 are connected to the first reflective layer 4121 and the second reflective layer 42 by wires 51 . An encapsulation layer 52 is formed to cover the wire 51 and the chip 50 . The encapsulation layer 52 is made of transparent material, which may be made of silicone resin or other resins, or other mixed materials. The encapsulation layer 52 may also contain phosphor (not shown) according to the needs of the chip 50 and light emission. When the first conductive plate 21 and the second conductive plate 22 are connected to opposite power sources, the chip 50 emits light to the outside, and the light is reflected by the reflective layer 40 and then passes through the encapsulation layer 52 to emit to the outside of the LED 200 . If the encapsulation layer 52 contains fluorescent powder, the light is reflected by the reflective layer 50 to excite the fluorescent powder in the encapsulation layer 52 to obtain mixed light and then radiate to the outside of the LED 200 .

Since the carrier 100 is formed by first forming a substrate with a through hole, and then stamping the ductile conductive plate group, the manufacturing process of the LED carrier can be greatly simplified, and no complex mold needs to be designed in the manufacturing method of the entire LED packaging structure. Therefore, manpower, material resources and time can be greatly reduced.

Claims (10)

1. a manufacture method for LED encapsulation structure, comprises step:

There is provided substrate, this substrate comprises through hole;

Substrate is formed the conductive plate group be made up of ductile material, and this conductive plate group covers through hole and fixes with substrate;

Mould is provided, the conductive plate group part be arranged in above substrate through-hole is stamped into described through hole and forms groove; At groove internal fixtion LED chip, and LED chip is made to be electrically connected conductive plate group; And

Packaging LED chips.

2. the manufacture method of LED encapsulation structure as claimed in claim 1, is characterized in that: this conductive plate group is attached through-hole wall face by the part that mould punching enters in this through hole.

3. the manufacture method of LED encapsulation structure as claimed in claim 2, is characterized in that: this conductive plate group covers one deck reflector.

4. the manufacture method of LED encapsulation structure as claimed in claim 3, is characterized in that: this reflector is generated by the method for electrosilvering.

5. the manufacture method of LED encapsulation structure as claimed in claim 4, is characterized in that: this through hole is an isosceles trapezoid shape, and on it, bottom side length is greater than the length of side of going to the bottom.

6. the manufacture method of LED encapsulation structure as claimed in claim 5, is characterized in that: this mold shape is an isosceles trapezoid shape similar to through hole.

7. the manufacture method of LED encapsulation structure as claimed in claim 6, is characterized in that: this conductive plate group is divided into the first conductive plate and the second conductive plate by opening, and this first conductive plate covers the opening of through hole upper end, and fixes with the substrate at through hole two ends.

8. the manufacture method of LED encapsulation structure as claimed in claim 7, is characterized in that: this mould is by after the first conductive plate punching press, and the partial variable-length that this first conductive plate covers on through hole is thinning.

9. the manufacture method of LED encapsulation structure as claimed in claim 8, is characterized in that: have the part flushed with base lower surface after this first conductive plate is stamped.

10. the manufacture method of LED encapsulation structure as claimed in claim 9, it is characterized in that: reflector covers in conductive plate group, and be divided into the first reflector and the second reflector by the same opening of segmentation conductive plate group, first reflector covers the first conductive plate, and the second reflector covers the second conductive plate.