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CN103097569B - Vacuum film forming device - Google Patents

Vacuum film forming device Download PDF

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Publication number
CN103097569B
CN103097569B CN201180042876.7A CN201180042876A CN103097569B CN 103097569 B CN103097569 B CN 103097569B CN 201180042876 A CN201180042876 A CN 201180042876A CN 103097569 B CN103097569 B CN 103097569B
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vacuum
substrate
film
base material
door
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CN103097569A (en
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天久勇人
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Shinmaywa Industries Ltd
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Shinmaywa Industries Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A vacuum film forming apparatus (100) according to the present invention is a film forming apparatus for forming a film on a plurality of substrates (20) in a vacuum state, and includes: a plurality of substrate supports (23) for supporting the substrate; a substrate unit (2) for supporting and transporting a plurality of substrate supports (23); and a vacuum chamber (1) having a carrying-in port (10) for carrying in and out the substrate unit (2) and a carrying-in port door (11) for opening and closing the carrying-in port (10) and forming a vacuum state. The substrate unit (2) supports a plurality of substrate supports (23) so as to be arranged in series in the conveying direction to the vacuum tank (1); the carrying-in port (10) is formed in accordance with the size of the base unit (2). With this, the vacuum film forming apparatus (100) can reduce the time required for moisture to be discharged and suppress the time required for the film forming process.

Description

真空成膜装置Vacuum film forming device

技术领域 technical field

本发明涉及在真空状态下使多个基材成膜的真空成膜装置。 The present invention relates to a vacuum film forming apparatus for forming films on a plurality of substrates in a vacuum state.

背景技术 Background technique

近年来,应用薄膜制造各种制品。作为应用薄膜的制品,例如举出使用于汽车用灯的反射器的例子。在真空成膜装置所具备的真空槽内保持基材,并且使蒸发源等的成膜单元工作以在基材上形成薄膜,以此可以制造该反射器。更具体的是,反射器是在该基材上层叠反射光的反射膜、和用于保护该反射膜的保护膜而制成的。像这样在由金属材料(例如铝)构成的反射膜上层叠保护膜,以此可以抑制反射膜随着时间的劣化。 In recent years, various articles have been manufactured using thin films. Examples of products to which the film is applied include reflectors used in automobile lamps. The reflector can be produced by holding the substrate in a vacuum chamber provided in a vacuum film forming apparatus and operating a film forming unit such as an evaporation source to form a thin film on the substrate. More specifically, the reflector is formed by laminating a reflective film for reflecting light and a protective film for protecting the reflective film on the substrate. In this way, by laminating a protective film on a reflective film made of a metal material (for example, aluminum), deterioration over time of the reflective film can be suppressed.

作为像这样利用于反射器的制造的真空成膜装置,公开了在真空槽的门的内表面侧具备成膜单元及基材保持件,并且形成为该门关闭时该成膜单元及基材保持件配置在真空槽的内侧空间内的结构的真空成膜装置(例如专利文献1、2)。 As a vacuum film-forming apparatus used in the manufacture of reflectors in this way, it is disclosed that a film-forming unit and a substrate holder are provided on the inner surface side of the door of a vacuum chamber, and that the film-forming unit and the substrate are formed when the door is closed. A vacuum film-forming apparatus having a structure in which a holder is arranged in a space inside a vacuum chamber (for example, Patent Documents 1 and 2).

例如,专利文献1、2中公开的真空成膜装置形成为在一个真空槽上设置左右对称的门,在该门上安装基材保持件等的结构,并且在关闭一方的门而对设置于该门上的基材实施成膜处理的期间,在另一方的门上可以执行基材的拆装等。 For example, the vacuum film-forming apparatuses disclosed in Patent Documents 1 and 2 have a structure in which a left-right symmetrical door is provided on one vacuum chamber, and a base material holder and the like are mounted on the door. While the film-forming process is being performed on the base material on this door, the base material can be attached and detached on the other door.

现有技术文献: Prior art literature:

专利文献1:国际公开第2009/084408号册; Patent Document 1: International Publication No. 2009/084408;

专利文献2:日本特许第4246570号公报。 Patent Document 2: Japanese Patent No. 4246570.

发明内容 Contents of the invention

发明要解决的问题: Problems to be solved by the invention:

但是,上述的现有技术中存在成膜处理所需的时间长的问题。 However, in the above-mentioned prior art, there is a problem that the time required for the film formation process is long.

更具体的是,专利文献1、2的真空成膜装置形成为在关闭一方的门(第一门)而对设置于该门上的基材实施成膜处理的期间(批量处理时间的数分钟期间),另一方的门(第二门)处于暴露在真空槽外部的空气(外部空气)中的状态。 More specifically, the vacuum film-forming apparatuses of Patent Documents 1 and 2 are formed so that one door (the first door) is closed and the substrate placed on the door is subjected to film-forming processing (several minutes of batch processing time). period), the other door (second door) is exposed to the air outside the vacuum tank (outside air).

在这里,运行真空成膜装置,例如进行如上所述的反射器的制造时,门的形成真空槽内壁的一部分的一侧的面(真空槽内壁侧面),即设置有基材的一侧的面被成膜物质所覆盖。该门的真空槽内壁侧面被成膜物质所覆盖时变成非常容易吸附水分的状态,并且与该面暴露在外部空气中的时间相对应地水分吸附量增大。像这样门的真空槽内壁侧面吸附水分时,水分的排出需要时间,并且批量处理时间长。 Here, when the vacuum film forming apparatus is operated, for example, when manufacturing the above-mentioned reflector, the surface of the side of the door forming a part of the inner wall of the vacuum chamber (the side of the inner wall of the vacuum chamber), that is, the side on which the substrate is provided The surface is covered by film-forming substances. When the side surface of the inner wall of the vacuum chamber of the door is covered with a film-forming substance, moisture is very easily adsorbed, and the amount of moisture adsorption increases according to the time the surface is exposed to the outside air. When moisture is adsorbed on the side of the inner wall of the vacuum tank of such a door, it takes time to discharge the moisture, and the batch processing takes a long time.

因此,为了抑制水分的吸附量,需要减小被成膜物质所覆盖的门的真空槽内壁侧面暴露在外部空气中的时间。 Therefore, in order to suppress the amount of moisture adsorption, it is necessary to reduce the time during which the inner wall side of the vacuum chamber of the door covered with the film-forming substance is exposed to the outside air.

但是,在专利文献1、2的真空成膜装置中,在关闭第一门进行成膜处理的期间,第二门暴露在外部空气中并且吸附水分。而且,完成对设置于第一门上的基材的成膜处理时,打开该门并执行已成膜的基材的拆装等,同时关闭第二门,执行设置于该门上的基材的成膜处理。此时,第二门已吸附较多的水分,因此使成膜处理时间更进一步加长。 However, in the vacuum film-forming apparatuses of Patent Documents 1 and 2, while the first door is closed and the film-forming process is performed, the second door is exposed to outside air and absorbs moisture. And, when the film-forming process on the base material installed on the first door is completed, the door is opened to carry out detachment of the film-formed base material, etc., and at the same time, the second door is closed to perform the processing of the base material set on the door. film-forming treatment. At this time, the second gate has absorbed more water, so the film-forming treatment time is further prolonged.

又,门的表面积依赖于基材的治具尺寸、以及配置于门上的基材数量等,而表面积越大,水分的吸附量越增大。 Also, the surface area of the door depends on the jig size of the substrate and the number of substrates placed on the door, and the larger the surface area, the greater the moisture adsorption.

像这样,在专利文献1、2公开的真空成膜装置中,由于是在门上配置基材等的结构,因此批量处理时间的数分钟期间一方的门暴露在外部空气中,水分吸附量增大。又,为了有效地配置基材,门的表面积增大,结果是水分吸附量增大。 In this way, in the vacuum film forming apparatuses disclosed in Patent Documents 1 and 2, since the base material and the like are arranged on the door, one door is exposed to the outside air during the several minutes of the batch processing time, and the amount of moisture adsorption increases. Big. In addition, in order to efficiently arrange the base material, the surface area of the door is increased, and as a result, the moisture adsorption amount is increased.

因此,在专利文献1、2公开的真空成膜装置中,需要将吸附的水分排出的时间,从而成膜处理所需的时间加长。 Therefore, in the vacuum film-forming apparatuses disclosed in Patent Documents 1 and 2, it takes time to discharge the adsorbed moisture, and the time required for the film-forming process becomes longer.

本发明是鉴于上述问题点而形成的,其目的在于提供减少水分的排出所需时间以能够抑制成膜处理所需时间的真空成膜装置。 The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a vacuum film-forming apparatus capable of reducing the time required for water discharge so that the time required for film-forming processing can be suppressed.

解决问题的手段: Means to solve the problem:

根据本发明的真空成膜装置是为了解决上述问题而在真空状态下对多个基材成膜的真空成膜装置,具备:用于支持所述基材的多个支持部;支持并搬运所述多个支持部的搬运单元;和具有用于搬入及搬出所述搬运单元的开口部以及用于开闭该开口部的门部,且用于形成真空状态的真空槽;所述搬运单元支持所述多个支持部以使所述多个支持部在向所述真空槽的搬运方向上直列地配置;所述开口部根据所述搬运单元的尺寸而形成。 The vacuum film forming apparatus according to the present invention is a vacuum film forming apparatus that forms films on a plurality of substrates in a vacuum state in order to solve the above-mentioned problems, and includes: a plurality of supporting parts for supporting the substrates; A conveying unit of the plurality of supporting parts; and a vacuum tank having an opening for loading and unloading the conveying unit and a door for opening and closing the opening, and for forming a vacuum state; the conveying unit supports The plurality of support parts are arranged in a row in a conveyance direction to the vacuum tank, and the opening part is formed according to the size of the conveyance unit.

在这里,基材是指成为成膜对象的构件,例如举出以特定的形状成型的成型体等的例子。 Here, the base material refers to a member to be formed into a film, for example, a molded body molded in a specific shape is given as an example.

根据上述结构,由于真空槽具备开口部及门部,因此通过该开口部,支持支持部的搬运单元可以向该真空槽搬入,或者可以从真空槽搬出。 According to the above configuration, since the vacuum chamber includes the opening and the door, the conveyance unit supporting the support part can be carried into or out of the vacuum chamber through the opening.

又,搬运单元在搬运方向上直列地配置并支持多个支持部,因此该搬运单元的尺寸取决于所支持的各支持部的尺寸。即,将搬运单元与搬运方向垂直地切割时的截面积与一个支持部的尺寸相对应。 Also, since the transport unit is arranged in series in the transport direction to support a plurality of support units, the size of the transport unit depends on the size of each support unit to be supported. That is, the cross-sectional area when the conveyance unit is cut perpendicular to the conveyance direction corresponds to the size of one support portion.

在这里,开口部的开口尺寸是根据搬运单元的尺寸而形成的。即,开口部的开口尺寸是能够使支持于搬运单元的一个支持部从真空槽进出的尺寸,更具体的是,成为将搬运单元与搬运方向垂直地切割时的截面积。 Here, the opening size of the opening is formed according to the size of the conveyance unit. That is, the opening size of the opening is such that one supporting portion supported by the conveyance unit can enter and exit from the vacuum chamber, and more specifically, it is a cross-sectional area when the conveyance unit is cut perpendicular to the conveyance direction.

又,用于开闭该开口部的门部的尺寸也与开口部的开口尺寸一起尽可能减小。即,尽可能减小门部的表面积。 In addition, the size of the door for opening and closing the opening is also reduced as much as possible together with the opening size of the opening. That is, the surface area of the door portion is reduced as much as possible.

但是,门部的真空槽内壁侧面由在基材成膜处理时所产生的成膜物质覆盖,从而处于非常容易吸附水分的状态。 However, the side surface of the inner wall of the vacuum chamber at the door is covered with film-forming substances generated during the film-forming process of the base material, and thus is in a state where it is very easy to absorb moisture.

根据本发明的真空成膜装置中,门部的真空槽内壁侧面暴露于外部空气中的时间仅仅是搬运单元进出真空槽的期间。即,如专利文献1、2中公开的真空成膜装置那样,不在成膜处理时间的期间变成门部(门)暴露在外部空气中的状态,而能够降低水分吸附量。 In the vacuum film forming apparatus according to the present invention, the time during which the inner wall of the vacuum chamber at the door is exposed to the outside air is only during the period when the transport unit enters and exits the vacuum chamber. That is, like the vacuum film forming apparatuses disclosed in Patent Documents 1 and 2, the amount of moisture adsorption can be reduced without leaving the door portion (door) exposed to the outside air during the film forming process time.

此外,如上所述尽可能减小门部的表面积,因此可以降低门部吸附的水分量。 In addition, the surface area of the door portion is reduced as much as possible as described above, so the amount of moisture absorbed by the door portion can be reduced.

像这样,根据本发明的真空成膜装置中,可以抑制门部吸附的水分量。 In this manner, in the vacuum film forming apparatus of the present invention, the amount of water absorbed by the door portion can be suppressed.

因此,根据本发明的真空成膜装置发挥减少水分排出所需的时间而抑制成膜处理所花费的时间的效果。 Therefore, the vacuum film-forming apparatus according to the present invention exhibits the effect of reducing the time required for water discharge and suppressing the time required for film-forming processing.

又,根据本发明的真空成膜装置在上述结构中,所述搬运单元也可以形成为具备加热蒸发成膜材料,用于在支持于所述支持部的基材上形成膜的一个以上的蒸发源;所述支持部及所述蒸发源在所述搬运方向上直列地配置,且在该支持部之间配设该蒸发源的结构。 In addition, in the vacuum film forming apparatus according to the present invention, in the above configuration, the transfer unit may be formed to include one or more vaporizers for forming a film by heating and evaporating the film forming material on the base material supported by the support portion. A source; a structure in which the support parts and the evaporation source are arranged in series in the conveyance direction, and the evaporation source is arranged between the support parts.

根据上述结构,由于多个支持部在搬运方向上直列地配置,因此对于搬运单元可以在搬运方向上直列地配置支持部。又,在支持部之间具备蒸发源,因此在形成真空状态的真空槽内,通过蒸发方法可以在由夹着蒸发源的支持部所支持的基材上成膜。 According to the above configuration, since the plurality of support parts are arranged in series in the conveyance direction, the support parts can be arranged in series in the conveyance direction with respect to the conveyance unit. Moreover, since the evaporation source is provided between the supporting parts, a film can be formed on the substrate supported by the supporting parts sandwiching the evaporation source by the evaporation method in the vacuum chamber formed in a vacuum state.

又,根据本发明的真空成膜装置在上述结构中,所述支持部也可以形成为旋转自如地支持基材的结构。 In addition, according to the vacuum film forming apparatus of the present invention, in the above configuration, the support unit may be configured to rotatably support the substrate.

根据上述结构,由于支持部旋转自如地支持基材,因此成膜处理时使基材旋转,从而在整个基材上能够均匀地实施成膜处理。 According to the above configuration, since the supporting portion rotatably supports the substrate, the substrate can be rotated during the film forming process, and the film forming process can be uniformly performed on the entire substrate.

又,根据本发明的真空成膜装置在上述结构中,也可以具备装载所述搬运单元,并且在水平面上在与所述搬运方向不同的方向上能移动该搬运单元的移动台。 Furthermore, in the vacuum film forming apparatus according to the present invention, in the above configuration, the transport unit may be mounted and a moving table capable of moving the transport unit in a direction different from the transport direction on a horizontal plane may be provided.

根据上述结构,由于具备移动台,因此可以通过该移动台将搬运单元移动至另一个地点,同时将新的搬运单元移动至真空槽的前面,而向真空槽搬运。即,可以有效地进行向真空槽搬入的搬运单元的切换。 According to the above configuration, since the moving table is provided, the transport unit can be moved to another location by the moving table, and at the same time, a new transport unit can be moved to the front of the vacuum chamber to be conveyed to the vacuum chamber. That is, it is possible to efficiently switch the conveyance unit loaded into the vacuum tank.

又,根据本发明的真空成膜装置在上述结构中,所述门部也可以形成为相对于所述开口部左右移动,从而开闭该开口部的结构。 In addition, in the vacuum film forming apparatus according to the present invention, in the above configuration, the door may be configured to move left and right relative to the opening to open and close the opening.

又,根据本发明的真空成膜装置在上述结构中,所述门部也可以形成为一边的侧部通过铰链与所述真空槽接合,并且以该铰链为轴画出弧形地开闭所述开口部的结构。 In addition, according to the vacuum film forming apparatus of the present invention, in the above structure, the door may be formed such that one side part is connected to the vacuum chamber through a hinge, and the door can be opened and closed in an arc with the hinge as an axis. Describe the structure of the opening.

发明效果: Invention effect:

本发明如以上所述地那样构成,从而发挥减少水分排出所需的时间而能够抑制成膜处理花费的时间的效果。 The present invention is constituted as described above, and it is possible to reduce the time required for water discharge to suppress the time required for the film formation process.

附图说明 Description of drawings

图1是示出根据本实施形态的真空成膜装置的概略结构的一个示例的俯视图; FIG. 1 is a plan view showing an example of a schematic structure of a vacuum film forming apparatus according to the present embodiment;

图2是根据本实施形态的真空成膜装置中与真空排气处理相关的结构的一个示例的框图; FIG. 2 is a block diagram of an example of a structure related to vacuum exhaust processing in a vacuum film forming apparatus according to the present embodiment;

图3是根据本实施形态的真空成膜装置中与真空排气处理相关的结构的一个示例的框图; 3 is a block diagram of an example of a structure related to vacuum exhaust processing in the vacuum film forming apparatus according to the present embodiment;

图4是示意性地示出根据本实施形态的变形例的基材单元中基材的配置的一个示例的图; 4 is a diagram schematically showing an example of an arrangement of substrates in a substrate unit according to a modified example of the present embodiment;

图5是示意性地示出根据本实施形态的变形例的基材单元中基材的配置的一个示例的图。 FIG. 5 is a diagram schematically showing an example of an arrangement of substrates in a substrate unit according to a modified example of the present embodiment.

具体实施方式 detailed description

以下,参照附图说明本发明的优选的实施形态。另外,以下在所有附图中对于相同或者相对应的构成构件标以相同的参考符号并省略其说明。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In addition, in all the drawings below, the same reference numerals are assigned to the same or corresponding constituent members, and description thereof will be omitted.

(真空成膜装置的结构) (Structure of Vacuum Film Formation Equipment)

首先,参照图1说明根据本实施形态的真空成膜装置100的结构。图1是示出根据本实施形态的真空成膜装置100的概略结构的一个示例的俯视图。 First, the configuration of a vacuum film forming apparatus 100 according to the present embodiment will be described with reference to FIG. 1 . FIG. 1 is a plan view showing an example of a schematic configuration of a vacuum film forming apparatus 100 according to the present embodiment.

在本实施形态中,举例说明使用作为基材20的构成前照灯的反射器的树脂成型体,并且在真空中,在该基材20的表面上依次进行由铝的蒸发膜构成的反射膜、和由合成树脂构成的保护膜的成膜的批量式成膜装置。 In this embodiment, a resin molded body constituting a reflector of a headlamp is used as an example as the base material 20, and a reflective film composed of an evaporated film of aluminum is sequentially formed on the surface of the base material 20 in a vacuum. , and a batch-type film-forming device that forms a protective film made of synthetic resin.

如图1所示,真空成膜装置100是具备真空槽1、基材单元(搬运单元)2、排气单元4、共通基座5以及搬运基座6而构成的结构。 As shown in FIG. 1 , a vacuum film forming apparatus 100 has a structure including a vacuum chamber 1 , a substrate unit (transport unit) 2 , an exhaust unit 4 , a common base 5 , and a transfer base 6 .

真空槽1是用于在其内部形成比周围的压力低的状态(真空)的气密容器,并且本实施形态中形成为大致立方体。但是,真空槽1的形状并不限于这样的立方体,只要是能够形成希望的真空状态的形状即可。又,真空槽1具有能够使基材单元2进出的搬入口(开口部)10、及用于执行该搬入口10的开闭的搬入口门(门部)11。在本实施形态中,搬入口门11设置为拉门,相对于搬入口10左右滑动以此能够进行开闭。又,关闭搬入口门11时,在搬入口10和搬入口门11的接触部上安装有密封构件(不图示)以确保密闭性。 The vacuum chamber 1 is an airtight container for forming a lower pressure state (vacuum) than its surroundings, and is formed in a substantially cubic shape in the present embodiment. However, the shape of the vacuum chamber 1 is not limited to such a cube, as long as it can form a desired vacuum state. Furthermore, the vacuum chamber 1 has an inlet (opening) 10 through which the substrate unit 2 can be taken in and out, and an inlet door (door) 11 for opening and closing the inlet 10 . In this embodiment, the entrance door 11 is provided as a sliding door, and can be opened and closed by sliding left and right with respect to the entrance 10 . In addition, when the import door 11 is closed, a sealing member (not shown) is attached to the contact portion between the import port 10 and the import door 11 to ensure airtightness.

另外,尽管搬入口门11为拉门,但是并不限于此,也可以是搬入口门11的一边的侧部通过铰链与真空槽1接合,并且能够将该铰链为轴画出弧形地开闭的铰链门。 In addition, although the entrance door 11 is a sliding door, it is not limited thereto, and one side of the entrance door 11 may be joined to the vacuum tank 1 by a hinge, and the hinge may be used as an axis to draw an arc to open. Closed hinged door.

在本实施形态中,在真空槽1中设置有搬入口10的一侧称为正面,与其相对的面称为背面,与正面连接的左右的面分别称为左侧面、右侧面,以及将上部的面称为上表面。 In this embodiment, the side on which the inlet 10 is provided in the vacuum tank 1 is called the front, the side opposite to it is called the back, and the left and right sides connected to the front are called the left side and the right side, respectively, and The upper surface is referred to as an upper surface.

此外,真空槽1如图1所示在其外观形状的左侧面上具备等离子体放电电极12。该等离子体放电电极12是在通过等离子体聚合对配置在真空槽1内的基材20进行成膜时,用于使等离子体放电的电极。 Moreover, the vacuum chamber 1 is equipped with the plasma discharge electrode 12 on the left side surface of the external shape as shown in FIG. The plasma discharge electrode 12 is an electrode for discharging plasma when forming a film on the substrate 20 arranged in the vacuum chamber 1 by plasma polymerization.

排气单元4是用于对真空槽1的内部进行真空排气的单元,其具备辅助真空泵(罗茨泵(rootspump)31及油旋转泵32)和高真空泵(油扩散泵33及冷阱(cooltrap)34)而构成。又,为了控制这些各种泵和真空槽1之间的空气的流通,而具备主阀13、粗抽(roughingvacuum)阀14、前级管道阀(forelinevalve)15、排气阀(ventvalve)16以及闸阀(gatevalve)17。另外,在图1中,因考虑到纸面的大小有限,未图示闸阀17及冷阱34。下面详述关于与真空排气处理相关的真空槽1、该排气单元4以及包含图1中设置于真空槽1的上表面的主阀13的其他阀的说明。 The exhaust unit 4 is a unit for vacuum exhausting the inside of the vacuum chamber 1, and includes an auxiliary vacuum pump (Roots pump (roots pump) 31 and oil rotary pump 32) and a high vacuum pump (oil diffusion pump 33 and cold trap ( cooltrap) 34). In addition, in order to control the flow of air between these various pumps and the vacuum tank 1, a main valve 13, a roughing vacuum valve 14, a foreline valve 15, a vent valve 16, and Gate valve (gate valve) 17. In addition, in FIG. 1 , the gate valve 17 and the cold trap 34 are not shown in the figure due to the limited size of the page. The description of the vacuum chamber 1 related to the vacuum exhaust process, the exhaust unit 4 and other valves including the main valve 13 provided on the upper surface of the vacuum chamber 1 in FIG. 1 will be described in detail below.

另外,上述的真空槽1及排气单元4一起支持于共通基座5。 In addition, the above-mentioned vacuum chamber 1 and exhaust unit 4 are supported together by a common base 5 .

基材单元2是通过基材支持体(支持部)23保持基材20的部件,并且装载在设置于搬运基座6上的移动台25上,从而能够与该移动台25一起移动,或者能够在设置于移动台25上的轨道(第二轨道52)上移动。 The substrate unit 2 is a member that holds the substrate 20 by a substrate support (support portion) 23, and is loaded on a moving table 25 provided on the transfer base 6 so as to be able to move together with the moving table 25, or to be able to It moves on a rail (second rail 52 ) provided on the moving table 25 .

即,在搬运基座6的表面上,在与向基材单元2的真空槽1的搬运方向垂直的方向(换入方向)上设置有第一轨道51。而且,通过由第一轨道51引导使移动台25移动,可以使装载在移动台25上的基材单元2向换入方向,即相对于搬入口10左右移动。 That is, on the surface of the transfer base 6 , the first rail 51 is provided in a direction perpendicular to the transfer direction (replacement direction) to the vacuum chamber 1 of the base material unit 2 . Furthermore, by moving the moving table 25 guided by the first rails 51 , the base material unit 2 mounted on the moving table 25 can be moved to the direction of replacement, that is, to the left and right with respect to the loading port 10 .

此外,在移动台25上沿着搬运方向(搬入方向或者搬出方向)设置有第二轨道52。又,在真空槽1的内部也设置有轨道以与该第二轨道52连接,基材单元2通过在该第二轨道52和真空槽1内的轨道(真空槽轨道53)上移动,可以从真空槽1进出。 In addition, a second rail 52 is provided on the moving table 25 along the conveyance direction (carry-in direction or carry-out direction). Also, a track is provided inside the vacuum tank 1 to be connected to the second track 52, and the substrate unit 2 can move from the second track 52 to the track (vacuum tank track 53) in the vacuum tank 1. Vacuum tank 1 goes in and out.

另外,在本实施形态中,移动台25形成为在与搬运方向垂直的方向上移动的结构,但是移动方向并不限于此,只要在与搬运方向不同的方向上移动以使装载在移动台25上的不同基材单元2能分别交替地向真空槽1搬入及搬出即可。 In addition, in this embodiment, the mobile platform 25 is formed to move in a direction perpendicular to the conveyance direction, but the moving direction is not limited to this, as long as it moves in a direction different from the conveyance direction so that the load on the mobile platform 25 Different substrate units 2 above can be carried in and out of the vacuum chamber 1 alternately.

如上所述,可移动的基材单元2如图1所示具备保持基材20的基材支持体(支持部)23、配置在基材支持体23之间的蒸发源21、支持基材支持体23及蒸发源21的支持基座24。 As described above, the movable substrate unit 2 includes, as shown in FIG. The body 23 and the support base 24 of the evaporation source 21.

基材支持体23具有从支持基座24向垂直方向、向上延伸的杆形的轴部,在该轴部上可以安装基材20。在本实施形态中,如图1所示,形成为用一个基材支持体23能够固定两个基材20的结构。又,基材单元2配置在真空槽1内的适当位置时,电力供给至不图示的驱动马达,可以以基材支持体23的轴部为中心使基材20旋转(自转)。 The substrate support 23 has a rod-shaped shaft portion extending vertically and upwardly from the support base 24 , and the substrate 20 can be attached to the shaft portion. In the present embodiment, as shown in FIG. 1 , two substrates 20 can be fixed with one substrate support 23 . Moreover, when the substrate unit 2 is arranged at an appropriate position in the vacuum chamber 1 , power is supplied to a drive motor not shown, and the substrate 20 can be rotated around the shaft of the substrate support 23 (autorotation).

蒸发源21在真空中加热蒸发成膜材料(蒸发材料),从而使其附着在基材20上。蒸发源21由从支持基座24向垂直方向、向上延伸的两个蒸发用电阻加热电极28、和在该垂直方向上以一定间隔桥接在蒸发用电阻加热电极28之间的、用于蒸发蒸发材料的细丝(filament)27构成。在本实施形态中,作为蒸发材料,尽管使用铝或者其合金,但是并不限于此。 The evaporation source 21 heats and evaporates a film-forming material (evaporation material) in a vacuum so that it adheres to the substrate 20 . The evaporation source 21 is composed of two evaporation resistance heating electrodes 28 extending upward from the support base 24 in the vertical direction, and a bridge for evaporation between the evaporation resistance heating electrodes 28 at a certain interval in the vertical direction. Filaments 27 of material are formed. In this embodiment, although aluminum or its alloy is used as an evaporation material, it is not limited to this.

支持基座24可以支持并固定基材支持体23及蒸发源21,并且可以由设置于移动台25上的第二轨道52及设置于真空槽1内的真空槽轨道53引导而移动。即,在支持基座24的侧部设置有与第二轨道52及真空槽轨道53的宽度相对应的多个车轮,并且可以通过该车轮在第二轨道52及真空槽轨道53上移动。借助于此,基材单元2可以在搬运方向上从真空槽1进出。 The support base 24 can support and fix the substrate support 23 and the evaporation source 21 , and can move guided by the second rail 52 provided on the moving table 25 and the vacuum tank rail 53 provided in the vacuum tank 1 . That is, a plurality of wheels corresponding to the widths of the second rail 52 and the vacuum tank rail 53 are provided on the side of the support base 24 , and the wheels can move on the second rail 52 and the vacuum tank rail 53 . With this, the substrate unit 2 can enter and exit from the vacuum chamber 1 in the conveyance direction.

(真空成膜装置中与真空排气处理相关的结构) (Structure related to vacuum exhaust processing in vacuum film forming equipment)

根据本实施形态的真空成膜装置100形成为在真空状态的真空槽1内,在基材20上进行铝膜、保护膜等成膜的结构。因此,根据本实施形态的真空成膜装置100形成为在真空槽1内配置有基材20时,执行真空排气处理以使该真空槽1内部达到真空的结构。以下,参照图2、图3说明与该真空排气处理相关的结构。图2、图3是根据本实施形态的真空成膜装置100中与真空排气处理相关的结构的一个示例的框图。 The vacuum film forming apparatus 100 according to the present embodiment is configured to form an aluminum film, a protective film, and the like on a substrate 20 in a vacuum chamber 1 in a vacuum state. Therefore, the vacuum film forming apparatus 100 according to the present embodiment is configured to perform a vacuum exhaust process to vacuum the inside of the vacuum chamber 1 when the substrate 20 is placed in the vacuum chamber 1 . Hereinafter, the configuration related to this vacuum exhaust process will be described with reference to FIGS. 2 and 3 . FIG. 2 and FIG. 3 are block diagrams showing an example of the configuration related to the vacuum exhaust process in the vacuum film forming apparatus 100 according to the present embodiment.

如图2及图3所示,排气单元4形成为具备辅助真空泵(罗茨泵31及油旋转泵32)和高真空泵(油扩散泵33及冷阱34)的结构。又,为了控制这些各种泵和真空槽1之间的空气的流通,具备主阀13、粗抽阀14、前级管道阀15、排气阀16以及闸阀17。 As shown in FIGS. 2 and 3 , the exhaust unit 4 is configured to include an auxiliary vacuum pump (Roots pump 31 and oil rotary pump 32 ) and a high vacuum pump (oil diffusion pump 33 and cold trap 34 ). In addition, in order to control the flow of air between these various pumps and the vacuum chamber 1 , a main valve 13 , a rough valve 14 , a foreline valve 15 , an exhaust valve 16 , and a gate valve 17 are provided.

更具体的是,主阀13设置于形成在真空槽1和油扩散泵33的排气口之间的排气通路中,并且控制该排气通路的开闭。粗抽阀14在执行粗抽排气时控制真空槽1和辅助真空泵(罗茨泵31及油旋转泵32)之间的配管的开闭。又,前级管道阀15控制油扩散泵33和辅助真空泵(尤其是罗茨泵31)之间的配管的开闭。排气阀16控制连通真空槽1和外部空气而设置的配管的开闭。闸阀17控制真空槽1和冷阱34之间的配管的开闭。 More specifically, the main valve 13 is provided in an exhaust passage formed between the vacuum tank 1 and the exhaust port of the oil diffusion pump 33 , and controls the opening and closing of the exhaust passage. The rough valve 14 controls the opening and closing of piping between the vacuum chamber 1 and the auxiliary vacuum pump (the Roots pump 31 and the oil rotary pump 32 ) when performing rough pumping and exhausting. In addition, the foreline valve 15 controls the opening and closing of piping between the oil diffusion pump 33 and the auxiliary vacuum pump (especially the Roots pump 31 ). The exhaust valve 16 controls the opening and closing of piping provided to communicate the vacuum chamber 1 and the outside air. The gate valve 17 controls opening and closing of piping between the vacuum chamber 1 and the cold trap 34 .

根据本实施形态的真空成膜装置100形成为为了将真空槽1内部由大气压排气至真空,而分为粗抽排气和高真空排气以阶段性地进行排气的结构。 The vacuum film forming apparatus 100 according to the present embodiment is configured to evacuate the inside of the vacuum chamber 1 from atmospheric pressure to a vacuum by dividing it into rough evacuation and high vacuum evacuation, and evacuating in stages.

首先,通过连续运行油旋转泵32及罗茨泵31的辅助真空泵,直至从大气压达到高真空泵的工作压力为止进行排气。另外,油旋转泵32是形成为转子旋转一次的期间将被油密封的空间排空的结构的真空泵。又,罗茨泵31安装在真空槽1和油旋转泵32之间,也发挥加压泵(boosterpump)的功能。 First, the oil rotary pump 32 and the auxiliary vacuum pump of the Roots pump 31 are continuously operated until the atmospheric pressure reaches the operating pressure of the high vacuum pump. In addition, the oil rotary pump 32 is a vacuum pump configured to evacuate an oil-sealed space during one rotation of the rotor. Moreover, the Roots pump 31 is installed between the vacuum tank 1 and the oil rotary pump 32, and also functions as a booster pump.

在该粗抽排气的阶段,主阀13、前级管道阀15、排气阀16以及闸阀17被关闭,仅粗抽阀14处于打开状态。而且,通过油旋转泵32和罗茨泵31进行排气(粗抽排气),直至真空槽1内部从大气压达到高真空泵的工作压力为止。 In the stage of rough pumping and exhausting, the main valve 13 , the foreline valve 15 , the exhaust valve 16 and the gate valve 17 are closed, and only the roughing valve 14 is opened. Then, the oil rotary pump 32 and the Roots pump 31 perform exhaust (rough exhaust) until the inside of the vacuum tank 1 reaches the operating pressure of the high vacuum pump from the atmospheric pressure.

真空槽1内部达到高真空泵的工作压力时,如图3所示打开状态的粗抽阀14被关闭,取而代之,打开主阀13、前级管道阀15以及闸阀17。借助于此,真空槽1和油扩散泵33连通,并且油扩散泵33和辅助真空泵(罗茨泵31及油旋转泵32)连通。此外,真空槽1和冷阱34连通。 When the inside of the vacuum tank 1 reaches the working pressure of the high vacuum pump, the rough valve 14 in the opened state as shown in FIG. Thereby, the vacuum tank 1 communicates with the oil diffusion pump 33 , and the oil diffusion pump 33 communicates with the auxiliary vacuum pump (the Roots pump 31 and the oil rotary pump 32 ). In addition, the vacuum chamber 1 communicates with the cold trap 34 .

而且,连续运行油扩散泵33、辅助真空泵(罗茨泵31及油旋转泵32)以及冷阱34,以此真空排气至达到规定的真空域。另外,油扩散泵33加热油以形成蒸汽,并且从狭窄的间隙喷射该蒸汽,通过油分子一起带走气体分子以工作。又,冷阱34捕集存在于真空槽1内的水蒸汽。 Furthermore, the oil diffusion pump 33 , the auxiliary vacuum pump (the Roots pump 31 and the oil rotary pump 32 ), and the cold trap 34 are continuously operated to vacuum exhaust until a predetermined vacuum region is reached. In addition, the oil diffusion pump 33 heats the oil to form steam, and sprays the steam from a narrow gap, taking gas molecules together with the oil molecules to work. Also, the cold trap 34 traps water vapor present in the vacuum chamber 1 .

真空槽1内部达到规定的真空度时,进行对基材20的成膜处理。在根据本实施形态的真空成膜装置100中,为了在基材20上形成反射膜而采用真空蒸发方法。即,使用配置在基材支持体23之间的蒸发源21在固定于基材支持体23的基材20上形成反射膜。另外,此时基材20在真空槽1内以基材支持体23的轴部为中心自转,借助于此在基材20的表面均匀地形成反射膜。 When the inside of the vacuum chamber 1 reaches a predetermined degree of vacuum, the film formation process on the substrate 20 is performed. In the vacuum film forming apparatus 100 according to the present embodiment, a vacuum evaporation method is used to form a reflective film on the substrate 20 . That is, a reflective film is formed on the substrate 20 fixed to the substrate supports 23 using the evaporation source 21 disposed between the substrate supports 23 . In addition, at this time, the substrate 20 is rotated around the axis of the substrate support 23 in the vacuum chamber 1 , whereby a reflective film is uniformly formed on the surface of the substrate 20 .

反射膜形成后,在该反射膜上形成保护膜。在该保护膜的形成工序中,通过等离子体聚合法在基材20的表面形成树脂膜。此时,基材20也在真空槽1内自转而在基材20的表面均匀地形成保护膜(树脂膜)。 After the reflective film is formed, a protective film is formed on the reflective film. In the step of forming the protective film, a resin film is formed on the surface of the substrate 20 by a plasma polymerization method. At this time, the substrate 20 is also rotated in the vacuum chamber 1 to uniformly form a protective film (resin film) on the surface of the substrate 20 .

像这样,完成对基材20的规定的成膜处理时,主阀13、前级管道阀15以及闸阀17被关闭,而排气阀16被打开。借助于此,真空槽1内的压力能够返回到大气压。 In this manner, when the predetermined film formation process on the substrate 20 is completed, the main valve 13 , the back-line valve 15 , and the gate valve 17 are closed, and the exhaust valve 16 is opened. With this, the pressure in the vacuum chamber 1 can be returned to atmospheric pressure.

之后,打开搬入口门11,从真空槽1搬出完成处理的基材单元2,取而代之搬入另外准备的基材单元2。像这样,通过搬入口门11的开闭,进行基材单元2的更换。 Afterwards, the carrying-in door 11 is opened, and the processed substrate unit 2 is carried out from the vacuum chamber 1, and a separately prepared substrate unit 2 is carried in instead. In this way, the base material unit 2 is replaced by opening and closing the carry-in door 11 .

(基材单元的搬入及搬出处理) (Loading and unloading processing of base unit)

接着,再次参照图1说明关于上述基材单元2的与搬入及搬出处理相关的结构。 Next, the structure related to the carrying-in and carrying-out process of the above-mentioned base material unit 2 will be described with reference to FIG. 1 again.

在基材单元2上,沿着向真空槽1的搬运方向,分别直列地配置有两个夹着蒸发源21的基材支持体23。该基材单元2形成为如上所述装载在设置于移动台25上的第二轨道52上,并且由该第二轨道52引导而能够向真空槽1进出的结构。借助于此,作业人员可以向真空槽1搬入基材单元2,或者搬出容纳于真空槽1内的基材单元2。 On the substrate unit 2 , two substrate supports 23 are arranged in series to sandwich the evaporation source 21 along the conveyance direction to the vacuum chamber 1 . The substrate unit 2 is mounted on the second rail 52 provided on the movable table 25 as described above, and is guided by the second rail 52 so as to be able to enter and exit the vacuum chamber 1 . With this, the operator can carry the substrate unit 2 into the vacuum chamber 1 or carry out the substrate unit 2 accommodated in the vacuum chamber 1 .

又,移动台25装载在设置于搬运基座6上的第一轨道51上。该第一轨道51设置为在与第二轨道52在水平面上大致垂直的方向上延伸。因此,移动台25能够在与搬运方向大致垂直的方向(换入方向)上在搬运基座6的表面上移动。 Moreover, the moving table 25 is mounted on the first rail 51 provided on the conveyance base 6 . The first rail 51 is provided to extend in a direction substantially perpendicular to the second rail 52 on the horizontal plane. Therefore, the moving table 25 can move on the surface of the conveyance base 6 in a direction substantially perpendicular to the conveyance direction (replacement direction).

在这里,本实施形态中,在搬运基座6的表面上设置有移动台25,并且在移动台25上分别装载有两个基材单元2。因此,在两个基材单元2中,使一方向换入方向滑动以到达对应于搬入口10的位置。而且,之后,可以沿着搬运方向向真空槽1内搬入该经滑动的基材单元2。 Here, in this embodiment, the moving table 25 is provided on the surface of the transfer base 6, and two base material units 2 are mounted on the moving table 25, respectively. Therefore, in the two base material units 2 , one direction is slid in the insertion direction so as to reach a position corresponding to the loading port 10 . Then, the slid substrate unit 2 can be carried into the vacuum chamber 1 along the conveyance direction.

此外,将成膜处理后的基材单元2从真空槽1移动至移动台25上的规定位置,并且用搬运基座6使移动台25向换入方向滑动,从而这次是使未成膜处理的基材单元2位于对应于搬入口10的位置。 In addition, the substrate unit 2 after the film formation process is moved from the vacuum chamber 1 to a predetermined position on the moving table 25, and the moving table 25 is slid in the direction of replacement by the transfer base 6, so that this time the film-forming process is not processed. The substrate unit 2 is located at a position corresponding to the import port 10 .

通过形成这样的结构,可以在对一方的基材单元2实施成膜处理的过程中,从另一方的成膜处理后的基材单元2上拆卸基材20,并且换成未成膜处理的新的基材20。 By forming such a structure, it is possible to detach the base material 20 from the other base material unit 2 after the film formation process and replace it with a new one that has not been subjected to the film formation process while the film formation process is being performed on one base material unit 2 . The substrate 20.

在这里,在基材单元2中,两个基材支持体23沿着对于真空槽1的搬运方向,夹着蒸发源21分别配置。即,按照基材支持体23、蒸发源21、基材支持体23的顺序在搬运方向上直列地配置。 Here, in the substrate unit 2 , two substrate supports 23 are respectively arranged with the evaporation source 21 therebetween along the conveyance direction with respect to the vacuum chamber 1 . That is, the substrate support 23 , the evaporation source 21 , and the substrate support 23 are arranged in series in the conveyance direction in this order.

因此,俯视基材单元2时,搬运方向为较长方向且与搬运方向垂直的方向的基材单元2的宽度与基材支持体23所具有的尺寸相对应。 Therefore, when the substrate unit 2 is viewed from above, the width of the substrate unit 2 in which the conveyance direction is the longer direction and perpendicular to the conveyance direction corresponds to the size of the substrate support 23 .

因此,搬入口10的开口宽度(开口尺寸)只要与基材单元2的基材支持体23的尺寸宽度相对应即可,例如,如上所述的专利文献1、2,不需要使真空槽1的与基材单元2相对的一侧的整个面开口。 Therefore, the opening width (opening size) of the loading port 10 only needs to correspond to the dimension width of the base material support body 23 of the base material unit 2. The entire surface of the side opposite to the base unit 2 is open.

因此,堵塞该搬入口10的搬入口门11的表面积也与将真空槽1的与基材单元2相对的一侧的整个面开口并作为搬入口10的结构相比减小。 Therefore, the surface area of the inlet door 11 that blocks the inlet 10 is also smaller than that of a configuration in which the entire surface of the vacuum chamber 1 facing the substrate unit 2 is opened as the inlet 10 .

即,在根据本实施形态的真空成膜装置100中,可以减小搬入口门11的表面积,从而可以降低搬入口门11的背面(真空槽内壁侧面)吸附水分的量。 That is, in the vacuum film forming apparatus 100 according to this embodiment, the surface area of the entrance door 11 can be reduced, thereby reducing the amount of moisture adsorbed on the back surface (the inner wall side of the vacuum chamber) of the entrance door 11 .

又,搬入口门11的背面接触到外部空气的时间仅仅是搬入及搬出基材单元2所需的时间。即,与专利文献1、2那样在实施配备在一方的门上的基材20的成膜处理的期间,另一方的门一直暴露在外部空气中的结构相比,减少搬入口门11暴露于外部空气的时间。因此,可以降低搬入口门11吸附水分的量。 In addition, the time during which the back surface of the carrying-in door 11 is exposed to outside air is only the time required for carrying in and carrying out the base material unit 2 . That is, compared with the structure in which the other door is always exposed to the outside air during the film-forming process of the base material 20 equipped on one door as in Patent Documents 1 and 2, the exposure of the entrance door 11 to the outside air is reduced. time for outside air. Therefore, the amount of moisture absorbed by the carry-in door 11 can be reduced.

又,在本实施形态中,如图1所示向真空槽1搬入及搬出基材单元2时,搬入口门11形成为相对于搬入口10向左侧移动的结构。因此,在真空槽1的左侧侧面上需要确保相当于该搬入口门11的宽度的空间,以使该搬入口门11能够移动。 Moreover, in this embodiment, when carrying in and carrying out the base material unit 2 to the vacuum tank 1 as shown in FIG. Therefore, it is necessary to secure a space corresponding to the width of the import door 11 on the left side of the vacuum chamber 1 so that the import door 11 can move.

但是,与上述例如专利文献1、2那样使真空槽1的与基材单元2相对的一侧的整个面开口的结构相比,为了移动搬入口门11而预先应确保的空间减少。 However, compared with the structure in which the entire surface of the vacuum chamber 1 facing the base unit 2 is opened as in Patent Documents 1 and 2, the space to be secured in advance for moving the import door 11 is reduced.

更具体的是,假设搬入口门11的宽度为真空槽1的宽度的约一半,则在相同的设置面积上设置根据本实施形态的真空成膜装置100、和与其相同的尺寸且具有与专利文献1、2相同的结构的门的真空成膜装置的情况下,前者是能够设置约1.5倍数量的装置。 More specifically, assuming that the width of the entrance door 11 is about half of the width of the vacuum chamber 1, the vacuum film forming apparatus 100 according to this embodiment is installed on the same installation area, and has the same dimensions as that of the patented vacuum film forming apparatus 100. In the case of the door vacuum film-forming apparatus having the same structure as Documents 1 and 2, about 1.5 times as many apparatuses can be installed in the former.

此外,如图1所示真空槽1的搬入口10形成在真空槽1的正面的左半部分的结构的情况下,使搬入口门11向正面的右侧滑动时,为了搬入口门11的移动而预先应确保的空间进一步减少。 In addition, in the case where the import port 10 of the vacuum chamber 1 is formed on the left half of the front of the vacuum chamber 1 as shown in FIG. The space that should be secured in advance for moving is further reduced.

像这样根据本实施形态的真空成膜装置100中,能够减少为了搬入口门11的移动而预先应确保的空间,因此可以提高其设置场所的自由度。又,与专利文献1、2中公开的真空成膜装置相比能够密集地配置。 Thus, in the vacuum film forming apparatus 100 according to the present embodiment, the space to be secured in advance for the movement of the carrying-in door 11 can be reduced, and thus the degree of freedom of its installation location can be increased. Moreover, compared with the vacuum film-forming apparatuses disclosed in patent documents 1 and 2, it can arrange|position densely.

又,在根据本实施形态的真空成膜装置100中,由于与搬入口门11的开闭机构相关的结构、以及与基材单元2的移动相关的结构是如上所述非常简单的机构,因此也可以使基材20的成膜处理容易实现自动化。 In addition, in the vacuum film forming apparatus 100 according to this embodiment, since the structure related to the opening and closing mechanism of the inlet door 11 and the structure related to the movement of the substrate unit 2 are very simple mechanisms as described above, It is also possible to easily automate the film-forming process of the substrate 20 .

(变形例1) (Modification 1)

以下,参照图4及图5说明根据本实施形态的真空成膜装置100的变形例。图4及图5是示意性地示出根据本实施形态的变形例的基材单元2中基材20的配置的一个示例的图。 Hereinafter, modifications of the vacuum film forming apparatus 100 according to this embodiment will be described with reference to FIGS. 4 and 5 . 4 and 5 are diagrams schematically showing an example of the arrangement of the base material 20 in the base material unit 2 according to a modified example of the present embodiment.

根据本实施形态的真空成膜装置100所具备的基材单元2形成为如图1所示具备两个基材支持体23,并且一个蒸发源21配置在这些基材支持体23之间的结构。但是,基材支持体23及蒸发源21的个数并不限于此。例如,如图4所示,也可以形成为具备三个基材支持体23和两个蒸发源21,并且三个基材支持体23在一方向(搬运方向)上配置且各个基材支持体23之间配设有蒸发源21的结构。而且,支持于基材支持体23的各基材20也可以形成为在成膜处理时以基材支持体23的轴为中心自转的结构。 The substrate unit 2 included in the vacuum film forming apparatus 100 according to this embodiment is formed to include two substrate supports 23 as shown in FIG. 1 , and one evaporation source 21 is arranged between these substrate supports 23. . However, the number of substrate supports 23 and evaporation sources 21 is not limited thereto. For example, as shown in FIG. 4 , it may also be formed to include three substrate supports 23 and two evaporation sources 21, and the three substrate supports 23 are arranged in one direction (transportation direction) and each substrate support 23 is provided with the structure of evaporation source 21. Furthermore, each base material 20 supported by the base material holder 23 may be configured to rotate around the axis of the base material holder 23 during the film formation process.

此外,如图5所示,也可以形成为对于各基材支持体23在同一平面上具备多个基材20的结构。而且,也可以形成为在每个基材支持体23上形成的该基材20群之间,即,在不同的两个基材支持体23之间分别设置有蒸发源21的结构。 In addition, as shown in FIG. 5 , a plurality of base materials 20 may be provided on the same plane for each base material support 23 . Furthermore, a structure may be adopted in which the evaporation sources 21 are respectively provided between the groups of the substrates 20 formed on each substrate support 23 , that is, between two different substrate supports 23 .

更具体的是,在各基材支持体23上,在以该中心轴为中心位于相同圆周上的位置设置有在与中心轴相同的方向上延伸的多个自转轴(图5的示例中为四个自转轴)。而且,形成为在该自转轴上分别设置有基材20的安装治具(不图示),通过该治具在各自转轴上安装基材20的结构。各基材20形成为在成膜处理时以各基材支持体23的中心轴作为旋转轴公转,同时以自转轴为中心旋转的结构。 More specifically, on each substrate support 23, a plurality of rotation axes extending in the same direction as the central axis (in the example of FIG. four rotation axes). Furthermore, a mounting jig (not shown) for the base material 20 is respectively provided on the rotation shaft, and the base material 20 is mounted on each rotation shaft by the jig. Each substrate 20 is configured to revolve around the center axis of each substrate support 23 as a rotation axis and to rotate around its spin axis during the film formation process.

像这样,在搬运方向上直列地排列基材支持体23的结构更加能够减少基材单元2的宽度(或者,与搬运方向垂直地切割的截面),其结果是能够减小搬入口10的开口尺寸以及开闭该搬入口10的搬入口门11的尺寸,在降低搬入口门11吸附的水分量的方面较好。 In this way, the structure in which the substrate supports 23 are arranged in series in the conveyance direction can further reduce the width of the substrate unit 2 (or, a cross section cut perpendicular to the conveyance direction), and as a result, the opening of the import port 10 can be reduced. The size and the size of the import door 11 that opens and closes the import port 10 are preferable in terms of reducing the amount of moisture absorbed by the import door 11 .

(变形例2) (Modification 2)

又,根据本实施形态的真空成膜装置100形成为在搬运基座6上设置有移动台25,通过在换入方向上左右移动,在一方的基材单元2进行成膜处理的期间,在另一方的基材单元2上进行基材20的拆装的结构。 In addition, the vacuum film forming apparatus 100 according to the present embodiment is formed such that the moving table 25 is provided on the transfer base 6, and by moving left and right in the switching direction, while one substrate unit 2 is performing the film forming process, The other base unit 2 is configured to attach and detach the base material 20 .

但是,并不限于该结构,也可以形成为搬运基座6为在一方向上移动的皮带输送机,将装载安装有基材20的基材单元2的移动台25在该皮带输送机上以规定间隔排列,并且依次进行成膜处理的结构。 However, it is not limited to this structure, and the transfer base 6 may be formed as a belt conveyor that moves in one direction, and the mobile table 25 on which the base material unit 2 with the base material 20 is mounted is placed on the belt conveyor at predetermined intervals. Arranged, and the film-forming process is performed sequentially.

即,通过搬运基座6将装载基材单元2的移动台25搬运到搬入口10的前面时,搬入口门11被打开,基材单元2搬入到真空槽1内。而且,对基材单元2实施成膜处理而从真空槽1搬出时,新的基材单元2搬运到搬入口10的前面,并且成膜处理后的基材单元2向搬运基座6的移动目的地移动。 That is, when the moving table 25 on which the base material unit 2 is loaded is transported to the front of the load-in port 10 by the transport base 6 , the load-in door 11 is opened, and the base material unit 2 is loaded into the vacuum chamber 1 . Furthermore, when the substrate unit 2 is subjected to the film formation process and carried out from the vacuum chamber 1, the new substrate unit 2 is conveyed to the front of the import port 10, and the substrate unit 2 after the film formation process is moved to the conveyance base 6 destination move.

像这样,也可以形成为使基材单元2以规定间隔排列于在一定方向上移动的搬运基座上,并且依次实施成膜处理的结构。 In this manner, the substrate units 2 may be arranged at predetermined intervals on a conveyance base moving in a certain direction, and the film-forming process may be sequentially performed.

从上述说明,本领域技术人员对本发明的较多的改良和其他实施形态等是清楚的。因此,上述说明应该仅作为示例解释,并且是以向本领域技术人员教导实施本发明的最优选的形态为目的提供的。在不脱离本发明的精神的范围内,可以实质性地改变其结构和/或功能的具体内容。 From the above description, many improvements, other embodiments, and the like of the present invention will be clear to those skilled in the art. Therefore, the above description should be interpreted as an example only, and is provided for the purpose of teaching the most preferable mode for carrying out the present invention to those skilled in the art. Details of structure and/or function may be substantially changed without departing from the spirit of the invention.

工业应用性: Industrial applicability:

本发明的真空成膜装置作为对汽车、家电部件装饰、光学用途的树脂以及玻璃部件等进行金属膜、保护膜等成膜的装置是有用的。 The vacuum film-forming apparatus of the present invention is useful as an apparatus for forming a metal film, a protective film, and the like on automobiles, decoration of home appliance parts, resins for optical use, glass parts, and the like.

符号说明: Symbol Description:

1真空槽; 1 vacuum tank;

2基材单元(搬运单元); 2 substrate unit (handling unit);

4排气单元; 4 exhaust unit;

5共通基座; 5 common bases;

6搬运基座; 6 handling base;

10搬入口(开口部); 10 loading port (opening);

11搬入口门(门部); 11 move the entrance door (gate);

12等离子体放电电极; 12 plasma discharge electrodes;

13主阀; 13 main valve;

14粗抽阀; 14 Rough pumping valve;

15前级管道阀; 15 foreline pipeline valve;

16排气阀; 16 exhaust valve;

17闸阀; 17 gate valve;

20基材; 20 substrates;

21蒸发源; 21 evaporation source;

23基材支持体(支持部); 23 substrate support body (support part);

24支持基座; 24 support bases;

25移动台; 25 mobile stations;

27细丝; 27 filaments;

28蒸发用电阻加热电极; 28 resistance heating electrodes for evaporation;

31罗茨泵; 31 roots pump;

32油旋转泵; 32 oil rotary pump;

33油扩散泵; 33 oil diffusion pump;

34冷阱; 34 cold traps;

51第一轨道; 51 first track;

52第二轨道; 52 second track;

53真空槽轨道; 53 vacuum groove track;

100真空成膜装置。 100 vacuum film forming device.

Claims (5)

1. a vacuum film formation apparatus, is the vacuum film formation apparatus under vacuum conditions to multiple base material film forming, possesses:
For supporting multiple support sectors of described base material;
Heating evaporation filmogen, for forming the more than one evaporation source of film on the base material being supported in described support sector;
Possesses the handling unit of the evaporation source of more than the plurality of support sector and one, described handling unit carries the base material supported by this support sector, and described handling unit is so that the plurality of support sector and described evaporation source are supporting the plurality of support sector and described evaporation source to the form configuring and arranging between this support sector this evaporation source in upright arrangement on the carrying direction of described vacuum tank;With
There is the peristome for moving into and take out of described handling unit and the door portion for this peristome of opening and closing, and for forming the vacuum tank of vacuum state;
Described peristome is formed according to the size of described handling unit。
2. vacuum film formation apparatus according to claim 1, it is characterised in that described support sector rotatably supports base material。
3. vacuum film formation apparatus according to claim 1, it is characterised in that possess the described handling unit of loading, and mobile of this handling unit can be moved in the horizontal plane on the direction different from described carrying direction。
4. vacuum film formation apparatus according to claim 1, it is characterised in that described door portion moves left and right relative to described peristome, thus this peristome of opening and closing。
5. vacuum film formation apparatus according to claim 1, it is characterised in that the sidepiece that described door portion is formed as is engaged with described vacuum tank by hinge, and draw peristome described in arc ground opening and closing with this hinge for axle。
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04174327A (en) * 1989-12-26 1992-06-22 Hitachi Ltd Infrared rays temperature image measuring method and device and heating device which is equipped with it, control method of heating temperature, and film-forming device
JPH05271935A (en) * 1992-03-26 1993-10-19 Shin Meiwa Ind Co Ltd Vacuum deposition device for continuous film formation
JP2004099947A (en) * 2002-09-06 2004-04-02 Shincron:Kk Thin-film-forming apparatus
CN101044260A (en) * 2004-10-22 2007-09-26 株式会社昭和真空 Thin film forming apparatus and method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3595272B2 (en) * 1993-03-15 2004-12-02 株式会社神戸製鋼所 Arc ion plating equipment
JP2004099948A (en) 2002-09-06 2004-04-02 Shincron:Kk Thin-film-forming apparatus
JP4246570B2 (en) 2003-08-26 2009-04-02 新明和工業株式会社 Vacuum deposition system
JP2006225709A (en) 2005-02-17 2006-08-31 Shin Meiwa Ind Co Ltd Vacuum processing system
US20110117289A1 (en) 2007-12-28 2011-05-19 Ulvac, Inc. Deposition Apparatus and Deposition Method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04174327A (en) * 1989-12-26 1992-06-22 Hitachi Ltd Infrared rays temperature image measuring method and device and heating device which is equipped with it, control method of heating temperature, and film-forming device
JPH05271935A (en) * 1992-03-26 1993-10-19 Shin Meiwa Ind Co Ltd Vacuum deposition device for continuous film formation
JP2004099947A (en) * 2002-09-06 2004-04-02 Shincron:Kk Thin-film-forming apparatus
CN101044260A (en) * 2004-10-22 2007-09-26 株式会社昭和真空 Thin film forming apparatus and method thereof

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