CN103137629B - Flexible substrate, display device having same and manufacturing method thereof - Google Patents

Abstract

The invention discloses a flexible substrate, a display device with the flexible substrate and a manufacturing method of the display device. The flexible substrate comprises a first polymer layer and a second polymer layer. The first polymer layer comprises at least one of polyamic acid, polyimide, epoxy compound and photoresist material, and is formed on a glass carrier. The second polymer layer is formed on the first polymer layer, and the second polymer layer comprises at least one of polyimide and a transparent polymer film.

Description

Flexible substrate, display device having same and manufacturing method thereof

technical field

The present invention relates to a flexible substrate and a display device having the flexible substrate, and in particular to a flexible substrate capable of adjusting the adhesive force between the flexible substrate and a glass carrier, a display device having the same and its manufacture method.

Background technique

Traditional display devices often choose glass substrates as materials. However, glass substrates are fragile and not flexible. Therefore, a display device made of a glass substrate has poor tolerance to external stress, and cannot be used in the development of a flexible display device. In contrast, the flexible substrate has flexibility, better strength and toughness, and is lighter and thinner than the glass substrate. In the market, display devices made of flexible substrates instead of glass substrates are gradually becoming a trend.

Since the rigidity and mechanical strength of the flexible substrate itself is not as good as that of the glass substrate, when making a flexible substrate, it is often necessary to use a hard substrate or a glass substrate as a carrier as a supporting structure in the manufacturing process of the flexible substrate. After the substrate is formed, the flexible substrate is separated from the glass carrier, so that the flexible substrate can be removed and utilized, and the glass carrier can be recycled. Therefore, the adhesion between the flexible substrate and the glass carrier affects the manufacturing quality and productivity of the flexible substrate, as well as the ease of recycling the glass carrier.

If the adhesion between the flexible substrate and the glass carrier is too strong, it will not only be difficult to remove the desired flexible substrate smoothly, but also the soft substrate remaining on the glass carrier will also affect the recycling of the rigid substrate . If the adhesion between the flexible and hard substrate and the glass carrier is too weak, the flexible substrate may fall off during the manufacturing process, resulting in failure of the flexible substrate.

Contents of the invention

The object of the present invention is to provide a flexible substrate and a display device having the flexible substrate. The special first polymer layer is used to adjust the adhesive force between the flexible substrate and the glass carrier to improve the manufacturing quality and yield of the flexible substrate.

According to a first aspect of the present invention, a flexible substrate is provided, including a first polymer layer and a second polymer layer. The first polymer layer includes at least one of polyamic acid (PAA), polyimide, epoxy compound and photoresist material, and the first polymer layer is formed on a glass carrier. The second polymer layer is formed on the first polymer layer, and the second polymer layer includes at least one of polyimide and transparent polymer film.

According to a second aspect of the present invention, a display device is provided, including a first substrate, a second substrate, a display medium layer and a driving circuit. The first substrate includes a first polymer layer and a second polymer layer. The first polymer layer includes at least one of polyamic acid, polyimide, epoxy compound and photoresist material, and the first polymer layer is formed on a glass carrier. The second polymer layer is formed on the first polymer layer, and the second polymer layer includes at least one of polyimide and transparent polymer film. The second substrate is opposite to the first substrate. The display medium layer is arranged between the first substrate and the second substrate. The driving circuit is arranged between the first substrate and the second substrate, and is used for driving the display medium layer.

According to a third aspect of the present invention, a method of manufacturing a display device is proposed. The method includes the following steps. providing a first substrate, including forming a first polymer layer on a glass carrier, the first polymer layer comprising at least one of polyamic acid, polyimide, epoxy compound and photoresist material, and The adhesion between the first polymer layer and the glass carrier can be adjusted. A second polymer layer is formed on the first polymer layer, and the second polymer layer includes at least one of a polyimide and a transparent polymer film. The first substrate is peeled off from the glass carrier. A second substrate is provided. A display medium layer is formed between the first substrate and the second substrate. A driving circuit is formed between the first substrate and the second substrate to drive the display medium layer.

In order to have a better understanding of the above-mentioned and other aspects of the present invention, the preferred embodiments are specifically cited below, together with the accompanying drawings, and described in detail as follows:

Description of drawings

1A to 1G are the manufacturing flow chart of the flexible substrate according to the first embodiment of the present invention;

2A to 2D are the manufacturing flow chart of the flexible substrate according to the second embodiment of the present invention;

3A to 3C are the manufacturing flow chart of the flexible substrate according to the third embodiment of the present invention;

4A to 4E are the manufacturing flow chart of the flexible substrate according to the fourth embodiment of the present invention;

5A to 5D are the manufacturing flow chart of the flexible substrate according to the fifth embodiment of the present invention;

6A to 6D are the manufacturing flow chart of the flexible substrate according to the sixth embodiment of the present invention;

7A to 7D are the manufacturing flow chart of the flexible substrate according to the seventh embodiment of the present invention;

8 is a schematic diagram of an organic light emitting diode display device according to an embodiment of the present invention;

9 is a schematic diagram of a liquid crystal display device according to an embodiment of the present invention;

FIG. 10 is a schematic diagram of an electronic paper display device according to an embodiment of the present invention.

Description of main component symbols

8~12: Display device

10, 20, 30, 40, 50, 60, 70: flexible substrate

80, 90, 110: drive circuit

100, 200, 300, 400, 400’, 500, 600, 700: glass carrier

120, 120', 120'a, 420, 420a, 520, 520a, 620, 620a, 720, 720a: the third polymer layer

140, 140a, 240, 340, 340a, 440, 440a, 540, 540a, 640, 640a: first polymer layer

160, 160a, 260, 360, 360a, 460, 460a, 560, 560a, 660, 660a, 760, 760a: second polymer layer

260, 560, 760: the second polymer material

262, 562, 762: glue material

800, 810, 900, 910, 1000, 1010: Substrate

820, 830, 920, 930, 1020, 1030: conductive layer

850, 950, 1050: display medium layer

262, 562, 762, 262a, 562a, 762a: glue material

264, 564, 764, 264a, 564a, 764a: the second polymer material

742, 744, 742a, 744a: cushioning material

740, 740a: buffer layer

Ⅰ, Ⅱ: Area

M: Photomask

S1, S2, T1, T2, V1, V2: cutting position

X-X: Tangent

detailed description

first embodiment

FIG. 1A-FIG. 1G are flowcharts showing the manufacturing process of the flexible substrate 10 according to the first embodiment of the present application. Referring to FIG. 1A , a glass carrier 100 is provided. Coating a third polymer material (not shown) on the glass carrier 100 by brush coating or spin coating, and then heating at a temperature of 110° C. to 120° C. to form a third polymer layer 120 on the glass on the carrier board 100. The third polymer layer 120 is, for example, a composite material with at least one of polysiloxane, polyamic acid (Polyamic acid), polytetrafluoroethylene and polyimide, the material of the third polymer layer 120 and the glass substrate The adhesive force of 100 is poor, so that a release surface is formed between the third polymer layer 120 and the glass carrier 100 . Referring to FIG. 1B , using a photomask M, a patterning process of exposure and development is performed on the third polymer layer 120 . The patterned third polymer layer 120' is shown in FIG. 1C.

Please refer to FIG. 1D, by brush coating or spin coating, coat the first polymer material (not shown) on the patterned third polymer layer 120' and part of the glass carrier 100, and then 80 ° C to 450 ° C to form the first polymer layer 140 on the patterned third polymer layer 120 ′ and part of the glass carrier 100 . Next, as shown in FIG. 1E , coat a second polymer material (not shown) on the first polymer layer 140 by brush coating or spin coating, and then heat at a temperature of 150° C. to 450° C. to form the second polymer layer 160 . The second polymer layer 160 includes at least one of polyimide, polymer film, or other transparent plastic materials.

In this embodiment, the first polymer material includes, for example, polyimide (PI) polymer materials such as polyamic acid (PolyacrylicAcid, PAA), epoxy (epoxy) compounds, and organic photoresist materials. At least one polymer material. The preparation method of the first polymer material is to dissolve polyamic acid and a specific proportion of epoxy compound in N-methyl 2-tetrahydropyrrolidone (N-Methyl-2-Pyrrolidone, NMP), dimethyl formamide (Dimethylformamide, DMF), dimethylacetamide (Dimethylacetamide, DMAC) or tetrahydrofuran (Tetrahydrofuran, THF) solvent. The epoxy compound is, for example, an epoxy resin, and the specific addition ratio of the epoxy compound is, for example, 0.1%-10% by weight of the epoxy compound to 99.9%-90% by weight of the polyamic acid. After being heated and baked at a temperature of 80°C to 450°C, the epoxy compound of the first polymer material undergoes a ring-opening reaction and grafts with the amic acid (AmicAcid) group of the polyamic acid to form an epoxy compound and polyamide acid cross-linked structure.

In this embodiment, the cross-linked structure of the epoxy compound and the polyamic acid in the first polymer layer 140 can react with the second polymer layer 160 to tightly combine. And, the more the cross-linked structure of the epoxy compound and the polyamic acid is, the better the adhesion between the first polymer layer 140 and the glass carrier 100 and the adhesion between the first polymer layer 140 and the second polymer layer 160 are. stronger, and the degree of chemical resistance (bridging) of the first polymer layer 140 is also higher. For example, the adhesion between the first polymer layer 140 with 0.1%-10% by weight of epoxy compound and the glass substrate 100 is 0B-4B in the adhesion test specification (ASTM-D3359). . For example, in the adhesion test specification (ASTM-D3359), when the adhesion level of the second substrate in the test area attached to the first substrate is 0B, it means that there are more than 65% of the second substrate in the test area. The substrate will flake off, ie grade 0B has only weak adhesion, not no adhesion at all. When the adhesion level of the second substrate attached to the first substrate in the test area is 4B, it means that less than 5% of the second substrate in the test area will be peeled off, which means that the adhesion is relatively strong. When the adhesion rating is 5B, it means that the second substrate in the test area will not peel off at all. Therefore, the percentage by weight of the epoxy compound in the first polymer layer 140 can be adjusted according to the requirement of the adhesion force in the manufacturing process, so that the grade of the epoxy compound in the adhesion test specification (ASTM-D3359) is 0B to 4B, Depending on the requirements of the manufacturing process, the first polymer layer 140 with an adhesion level of OB can also be used.

Please refer to FIG. 1F, the second polymer layer 160, the first polymer layer 140 and the patterned third polymer layer 120' are cut by means of laser, wheel cutter or punching to form the second polymer layer 160a , the first polymer layer 140a and the patterned third polymer layer 120'a. It should be noted that the cutting position S1 and the cutting position S2 substantially correspond to the boundary of the patterned third polymer layer 120, and the surface area of the patterned third polymer layer 120'a after cutting is smaller than that of the patterned third polymer layer 120'a. The surface area of the three polymer layers 120'. Next, as shown in FIG. 1G , the flexible substrate 10 is formed by releasing between the third polymer layer 120 and the glass carrier 100 . The flexible substrate 10 in this embodiment includes a three-layer structure of the second polymer layer 160a, the first polymer layer 140a and the patterned third polymer layer 120'a.

In this embodiment, the adhesion between the first polymer layer 140 and the glass carrier 100 and the chemical resistance of the first polymer layer 140 can be adjusted by changing the weight ratio of the polyamic acid and the epoxy compound. Since the first polymer layer 140 is disposed between the material of the second polymer layer 160 and the glass carrier 100, and the adhesion between the first polymer layer 140 and the glass carrier 100 can be adjusted, the second polymer layer The selectivity of 160 materials has been improved. That is to say, whether the material of the second polymer layer 160 has poor adhesion to the glass carrier 100, the material of the second polymer layer 160 has too strong adhesion to the glass carrier 100, or the second The material of the polymer layer 160 can corrode or destroy the material of the third polymer layer 120 can be selected, the selection rate of the material of the second polymer layer 160 is as high as 90%, that is, the optional second polymer layer 160 There are many types of materials.

second embodiment

2A to 2D are flowcharts illustrating the manufacturing process of the flexible substrate 20 according to the second embodiment of the present application. Referring to FIG. 2A , a glass carrier 200 is provided. A patterned third polymer layer 220 is formed on the glass carrier 200 . The material of the patterned third polymer layer 220 has poor adhesion to the glass carrier 200 , so that a release surface is formed between the patterned third polymer layer 220 and the glass carrier 200 . The first polymer layer 240 is formed on the patterned third polymer layer 220 and part of the glass carrier 200 . The materials and formation methods of the first polymer layer 240 and the patterned third polymer layer 220 may be the same as those of the first embodiment, and will not be repeated here.

Next, as shown in FIG. 2B , a second polymer layer 260 is formed on the first polymer layer 240 . The second polymer layer 260 includes an adhesive material 262 and a second polymer material 264 . The second polymer material 264 can be pasted on the first polymer layer 240 through the adhesive material 262 in a transfer printing manner. Since the characteristics of the adhesive material 262 are less required, the selectivity can be improved. In one embodiment, the adhesive material 262 is resistant to high temperature, so as to improve the high temperature resistance of subsequent component manufacturing processes. The second polymer material 264 includes at least one of polyimide (PI), polymer film and other transparent plastic materials.

Referring to FIGS. 2C to 2D , the second polymer layer 260 , the first polymer layer 240 and the patterned third polymer layer 220 are cut by means of laser, wheel cutter or punching. The cutting position N1 and the cutting position N2 substantially correspond to the boundary of the patterned third polymer layer 220, and the surface area of the patterned third polymer layer 220a after cutting is smaller than the surface area of the patterned third polymer layer 220 before cutting . Next, release the mold between the patterned third polymer layer 220 and the glass carrier 200 to form the flexible substrate 20 . As shown in FIG. 2D , the flexible substrate 20 includes a three-layer structure of a second polymer layer 260 a , a first polymer layer 240 a and a patterned third polymer layer 220 a , and the flexible substrate 20 is resistant to chemical and high temperature.

third embodiment

3A to 3C illustrate the manufacturing flow chart of the flexible substrate 30 according to the third embodiment of the present invention. The materials of the glass carrier 300 , the first polymer layer 340 and the second polymer layer 360 in this embodiment are the same as those of the glass carrier 100 , the first polymer layer 140 and the second polymer layer 160 in the first embodiment. The same, and will not be repeated here. As shown in FIG. 3A , a glass carrier 300 is provided, and a first polymer material (not shown) is coated on the glass carrier 300 by brush coating or spin coating, and then at a temperature of 80° C. to 450° C. Heating is performed to form the first polymer layer 340 on the glass carrier 300 .

Next, as shown in FIG. 3B, a second polymer material (not shown) is coated on the first polymer layer 340 by brush coating or spin coating, and then heated at a temperature of 150° C. to 450° C. , to form the second polymer layer 360 . Finally, release the mold between the first polymer layer 340 and the glass carrier 300 to form the flexible substrate 30 as shown in FIG. 3C . The flexible substrate 30 in this embodiment includes a double layer structure of the second polymer layer 360 and the first polymer layer 340 .

By changing the weight ratio of polyamic acid and epoxy compound in the material of the first polymer layer 340, the adhesion between the first polymer layer 340 and the glass carrier 300 and the chemical resistance of the first polymer layer 340 can be adjusted. . In this embodiment, an epoxy compound with a weight percentage of 0.1% to 10% can also be selected as the material composition of the first polymer layer 340 according to the requirements of the manufacturing process, so that the first polymer layer 340 and the glass carrier 300 The adhesion level between them is 0B to 4B (adhesion test specification ASTM-D3359), and the first polymer layer 340 with an adhesion level of 0B can also be used.

Preferably, an epoxy compound with a weight percentage of 0.1%-6% can be added to form the first polymer layer 340. At this time, the adhesion between the first polymer layer 340 and the glass carrier 300 is 1B-2B . In the manufacturing process of the thin film transistor substrate and the liquid crystal display device, when the adhesion between the first polymer layer 340 and the glass carrier 300 is 1B, the first polymer layer 340 can be prevented from detaching from the glass carrier 300 during the manufacturing process. When the adhesion between the first polymer layer 340 and the glass carrier 300 is 2B, after the manufacturing process in FIG. .

Since the adhesion between the first polymer layer 340 and the glass carrier 300 can be adjusted, the material of the second polymer layer 360 with poor adhesion to the glass carrier 300 and the material with too strong adhesion to the glass carrier 300 The material of the second polymer layer 360 can produce an appropriate adhesion force with the glass carrier plate 300 through the first polymer layer 340, improve the selectivity of the material of the second polymer layer 360, effectively reduce the production cost and Speed up development.

Fourth embodiment

4A-4E are flowcharts illustrating the manufacturing process of the flexible substrate 40 according to the fourth embodiment of the present application. As shown in FIG. 4A , a glass carrier 400 is provided, a second region II of the glass carrier 400 is shielded with a photomask M, and the first region I not shielded by the photomask M is irradiated with ultraviolet light. The wavelength range is, for example, short-wavelength ultraviolet light of 172-258 nanometers (nm). Please refer to FIG. 4B , after the ultraviolet light is irradiated, the hydrogen bond of the first region I of the glass carrier 400' is reduced. At this time, the wet degree of the first region I of the glass carrier 400' is higher than that of the second region II.

Next, as shown in FIG. 4C , a first polymer layer 440 is formed on the glass carrier 400 ′, and a second polymer layer 460 is formed on the first polymer layer 440 . The materials and formation methods of the first polymer layer 440 and the second polymer layer 460 are the same as those of the first and second embodiments, and will not be repeated here. Please refer to FIG. 4D next. FIG. 4D is a cross-sectional view of the structure shown in FIG. 4C cut along the line X-X. As shown in FIG. 4D , the second polymer layer 460 and the first polymer layer 440 are cut by means of laser, wheel cutter or punching, and the cutting position T1 and the cutting position T2 are substantially located between the second polymer layer 460 and the first polymer layer 460. A polymer layer 440 corresponds to the range of the second region II of the glass carrier 400 ′, and corresponds to the boundary of the first region I and the second region II of the glass carrier 400 ′.

In this embodiment, since the degree of wetness of the first region I of the glass carrier 400' is higher than that of the second region II, the adhesion of the first polymer layer 440 to the first region I is greater than that of the first polymer layer 440. Adhesion of layer 440 to the second region II. Therefore, the first polymer layer 440a can be released from the glass carrier 400' from the cutting position T1 and the cutting position T2 to form a flexible substrate 40 as shown in FIG. 4E. The flexible substrate 40 includes the first polymer layer 440a. And the double-layer structure of the second polymer layer 460a. The surface area of the flexible substrate 40 is substantially smaller than the surface area of the second region II of the glass carrier 400'.

fifth embodiment

5A to 5D are flowcharts illustrating the manufacturing process of the flexible substrate 50 according to the fifth embodiment of the present application. As shown in FIG. 5A , there is provided a glass carrier 500 irradiated with ultraviolet light, for example, short-wavelength ultraviolet light in a wavelength range of 172-258 nanometers (nm). The hydrogen bond of the first region I of the glass carrier plate 500 irradiated by ultraviolet light is reduced, so that the wet degree of the first region I after ultraviolet light irradiation is higher than that of the second region II not irradiated by ultraviolet light. Next, the third polymer layer 520 is sequentially formed on the glass carrier 500 , and the first polymer layer 540 is formed on the third polymer layer 520 . The third polymer layer 520 is, for example, a surface-treated release material, such as polysiloxane material, polyamic acid, fluorine-based polymer material (such as polytetrafluoroethylene), or polyimide.

Please refer to FIG. 5B-FIG. 5C, a second polymer layer 560 is provided. The second polymer layer 560 includes an adhesive material 562 and a second polymer material 564. The second polymer layer 560 is formed on the first polymer layer by transfer printing. on the polymer layer 540 . The formation methods of the first polymer layer 540 and the second polymer material 564 are the same as those of the first polymer layer 440 and the second polymer layer 460 corresponding to the fourth embodiment, and will not be repeated here. The materials of the first polymer layer 540 and the second polymer material 564 are the same as those of the first polymer layer 240 and the second polymer layer 260 corresponding to the second embodiment, and will not be repeated here.

Please then refer to FIG. 5C, the second polymer layer 560 and the first polymer layer 540 are cut by means of laser, wheel cutter or punching, etc., and the cutting position P1 and the cutting position P2 are substantially located between the second polymer layer 560 and the first polymer layer. A polymer layer 540 corresponds to the range of the second region II of the glass carrier 500 , and corresponds to the boundary of the first region I and the second region II of the glass carrier 500 .

In this embodiment, since the degree of wetness of the first region I of the glass carrier 500 is higher than that of the second region II, the adhesion between the third polymer layer 520 and the first region I is greater than that of the third polymer layer. 520 Adhesion to the second zone II. Therefore, the third polymer layer 520 can be released from the glass carrier 500 from the cutting position P1 and the cutting position P2 to form a flexible substrate 50 as shown in FIG. The three-layer structure of the first polymer layer 540a and the second polymer layer 560a. The surface area of the flexible substrate 50 is substantially smaller than the surface area of the second region II of the glass carrier 500 .

Sixth embodiment

6A-6D are flowcharts illustrating the manufacturing process of the flexible substrate 60 according to the sixth embodiment of the present application. As shown in FIG. 6A , a patterned third polymer layer 620 is formed on the glass carrier 600 . Referring to FIG. 6B , a first polymer layer 640 is formed on the patterned third polymer layer 620 and part of the glass carrier 600 . As shown in FIG. 6C, a second polymer layer 660 is formed on the first polymer layer 640, and the second polymer layer 660 and the first polymer layer 640 are cut. The cutting position V1 and the cutting position V2 substantially correspond to The boundary of the third polymer layer 620 is patterned, and the surface areas of the cut first polymer layer 640 a and the second polymer layer 660 a are smaller than the surface area of the patterned third polymer layer 620 .

In this embodiment, the materials and forming methods of the first polymer layer 640 and the second polymer layer 660 are the same as those in the first embodiment, and will not be repeated here. It is worth noting that the patterned third polymer layer 620 in this embodiment is, for example, a surface-treated release material, such as polysiloxane material, polyamic acid (Polyamic acid), fluorine-based polymer material (such as polytetrafluoroethylene) Vinyl) or polyimide and other materials. Polysiloxane materials are polymers derived from silicon-oxygen bonds as the backbone. The common feature of polysiloxane materials and fluorine-based polymer materials is that the materials are extremely inert, so the surface properties are not easy to stick. The adhesion between the patterned third polymer layer 620 and the first polymer layer 640a is poor, thus forming a release surface between the patterned third polymer layer 620 and the first polymer layer 640a. Next, the third polymer layer 620 and the first polymer layer 640a are patterned to form a flexible substrate 60 as shown in FIG. 6D. The flexible substrate 60 includes a first polymer layer 640a and a second polymer layer 660a. .

Seventh embodiment

7A to 7D are flowcharts illustrating the manufacturing process of the flexible substrate 70 according to the seventh embodiment of the present application. As shown in FIG. 7A , a patterned third polymer layer 720 is formed on the glass carrier 700 . The patterned third polymer layer 720 is patterned to form regions A and B with different viscosities. Referring to FIG. 7B , a buffer layer 740 is formed on the patterned third polymer layer 720 . The buffer layer 740 is, for example, composed of a buffer material 742 and a buffer material 744. The buffer material 742 and the buffer material 744 are such as polyimide, general photoresist material, acrylic-based (Acrylic) material, silicon type (Silicontype) material or organic Polymer Materials.

Referring to FIGS. 7B-7C , a second polymer layer 760 is provided, and the second polymer layer 760 includes an adhesive material 762 and a second polymer material 764 . The second polymer material 764 can be pasted on the buffer layer 740 by transfer printing through the adhesive material 762 . Since the characteristics of the glue material 762 are less required, the selectivity can be improved. The buffer layer 740 can isolate the adhesive material 762 from the patterned third polymer layer 720 to avoid damage to the release ability of the patterned third polymer layer 720 .

Next, referring to FIG. 7C , the second polymer layer 760 and the buffer layer 740 are cut, and the cutting positions U1 and U2 substantially correspond to the boundary of the patterned third polymer layer 720 . Moreover, the surface areas of the cut buffer layer 740 a (shown in FIG. 7D ) and the second polymer layer 760 a (shown in FIG. 7D ) are smaller than the surface area of the patterned third polymer layer 720 .

In this embodiment, the material and forming method of the second polymer layer 760 are the same as those in the sixth embodiment, and will not be repeated here. The patterned third polymer layer 720 is, for example, a surface-treated release material, including polysiloxane, polyamic acid, fluorine-based polymer material (such as polytetrafluoroethylene) or polyimide material. Polysiloxane materials are polymers derived from silicon-oxygen bonds as the backbone. The common feature of polysiloxane materials and fluorine-based polymer materials is that the materials are extremely inert, so the surface properties are not easy to stick. The adhesion between the patterned third polymer layer 720 and the buffer layer 740a is poor, thus forming a release surface between the patterned third polymer layer 720 and the buffer layer 740a. Next, the third polymer layer 720 and the buffer layer 740a are patterned to form a flexible substrate 70 as shown in FIG. 7D . The flexible substrate 70 includes the buffer layer 740a and the second polymer layer 760a.

Apply the above embodiments to different types of display devices

The flexible substrate manufactured by the method of the above embodiments can be applied to different types of display devices, such as organic light emitting diodes (OLED), liquid crystal display devices (LCD) and electronic paper (E-Paper) display devices. As such, the aspects of these different display devices will be described below.

Please refer to FIG. 8 , which shows a schematic structural diagram of an organic light emitting diode (OLED) display device 8 according to an embodiment of the present invention. As shown in FIG. 8 , the OLED display device 8 includes an upper substrate 800 and a lower substrate 810 opposite to the upper substrate 800 . A driving circuit 80 is disposed between the upper substrate 800 and the lower substrate 810 . The driving circuit 80 includes a first conductive layer 820 disposed on the upper substrate 800 , and a second conductive layer 830 disposed on the lower substrate 810 . A display medium layer 850 is sandwiched between the first conductive layer 820 and the second conductive layer 830 . The display medium layer 850 in this embodiment includes a plurality of organic light emitting diodes. It should be noted that the upper substrate 800 or the lower substrate 810 can be made by using any of the above-mentioned embodiments.

Please refer to FIG. 9 , which shows a schematic structural diagram of a liquid crystal display device (LCD) 9 according to an embodiment of the present invention. As shown in FIG. 9 , the liquid crystal display device 9 includes an upper substrate 900 and a lower substrate 910 opposite to the upper substrate. A driving circuit 90 is disposed between the upper substrate 900 and the lower substrate 910 . The driving circuit 90 includes a first conductive layer 920 disposed on the upper substrate 900 , and a second conductive layer 930 disposed on the lower substrate 910 . A display medium layer 950 is sandwiched between the first conductive layer 920 and the second conductive layer 930 , and the display medium layer 950 in this embodiment includes a plurality of liquid crystal cells. It should be noted that the upper substrate 900 or the lower substrate 910 can be made by using any of the above-mentioned embodiments.

Please refer to FIG. 10 , which shows a schematic structural diagram of an electronic paper (E-Paper) display device 12 according to an embodiment of the present invention. As shown in FIG. 10 , the electronic paper display device 12 includes an upper substrate 1000 and a lower substrate 1010 opposite to the upper substrate. A driving circuit 110 is disposed between the upper substrate 1000 and the lower substrate 1010 . The driving circuit 110 includes a first conductive layer 1020 disposed on the upper substrate 1000 , and a second conductive layer 1030 disposed on the lower substrate 1010 . A display medium layer 1050 is interposed between the first conductive layer 1020 and the second conductive layer 1030 . In this embodiment, the display medium layer 1050 includes electronic ink of a plurality of display particles, for example. It should be noted that the upper substrate 1000 or the lower substrate 1010 can be made by using any of the above-mentioned embodiments.

In summary, the above embodiments of the present invention can improve the second polymer layer by changing the weight ratio of polyamic acid and epoxy compound in the material of the first polymer layer and adjusting the adhesion between the first polymer layer and the glass carrier. The selectivity of the material of the polymer layer. The manufacturing method of the flexible substrate according to the above-mentioned embodiments of the present invention not only provides an appropriate adhesive force between the edge of the flexible substrate and the glass carrier, so that the flexible substrate will not fall off from the glass carrier during the manufacturing process, and the flexible After the substrate is manufactured, the boundary of the flexible substrate can be defined by means of laser cutting, and the current machine can be used to easily and completely release the flexible substrate from the glass carrier, which can not only reduce production costs and speed up development , to facilitate the recycling and reuse of the carrier board, and provide a better yield and quality of the manufacturing process of the flexible substrate.

In summary, although the present invention has been disclosed in conjunction with the above preferred embodiments, they are not intended to limit the present invention. Those skilled in the art to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be defined by the appended claims.

Claims (18)

1. a flexible base plate, comprising:

First macromolecule layer, this first macromolecule layer comprises a polyamic acid (PAA), a pi, an epoxy compounds and a photo anti-corrosion agent material at least one, this first macromolecule layer is formed in a glass support plate, wherein between this first macromolecule layer and this glass support plate, there is an adhesive force, this adhesive force grade is 0B to 4B, and this adhesive force between this first macromolecule layer and this glass support plate, the part by weight adjustment of polyamides propylhomoserin is made an addition to by this epoxy compounds; And

Second macromolecule layer, be formed on this first macromolecule layer, this second macromolecule layer comprises a pi (PI).

2. flexible base plate as claimed in claim 1, wherein the part by weight of this epoxy compounds and this polyamic acid is the weight ratio of 0.1% to 10%.

3. flexible base plate as claimed in claim 1, also comprise third high molecular layer, be attached between this first macromolecule layer and this glass support plate, this third high molecular layer comprises a polysiloxanes, a polytetrafluoroethylene, this pi and this polyamic acid at least one.

4. flexible base plate as claimed in claim 3, wherein the surface area of this third high molecular layer is less than the surface area of this first macromolecule layer.

5. flexible base plate as claimed in claim 1, also comprises colored filter or thin-film transistor, is arranged on the surface of this first macromolecule layer.

6. a display unit, comprising:

First substrate, this first substrate comprises:

First macromolecule layer, is formed in a glass support plate, and this first macromolecule layer comprises a polyamic acid, a pi, an epoxy compounds and a photo anti-corrosion agent material at least one; And

Second macromolecule layer, be formed on this first macromolecule layer, this second macromolecule layer comprises this pi;

Second substrate is relative with this first substrate and establish;

Display dielectric layer, is arranged between this first substrate and this second substrate; And

Drive circuit, is arranged between this first substrate and this second substrate, in order to drive this display dielectric layer; Wherein this second macromolecule layer comprises a glue material and one second macromolecular material, and this glue material is arranged between this second macromolecular material and this first macromolecule layer, and this glue material is in order to this first macromolecule layer and this second macromolecular material of fitting.

7. display unit as claimed in claim 6, wherein this first substrate is a flexible base plate, and this second substrate is same as this first substrate.

8. display unit as claimed in claim 6, wherein the part by weight of this epoxy compounds and this polyamic acid is the weight ratio of 0.1% to 10%.

9. display unit as claimed in claim 6, wherein have an adhesive force between this first macromolecule layer and this glass support plate, this adhesive force grade is 0B to 4B.

10. display unit as claimed in claim 6, wherein this display dielectric layer comprise an Organic Light Emitting Diode, a liquid crystal and an electric ink three one of them.

The manufacture method of 11. 1 kinds of display unit, comprising:

One first substrate is provided, comprises:

Form one first macromolecule layer in a glass support plate, this first macromolecule layer comprises a polyamic acid, a pi, an epoxy compounds and a photo anti-corrosion agent material at least one, and the adhesive force adjustable of this first macromolecule layer and this glass support plate;

Form one second macromolecule layer on this first macromolecule layer, this second macromolecule layer comprises this pi; And

This first substrate is divested from this glass support plate;

One second substrate is provided;

Form a display dielectric layer between this first substrate and this second substrate; And

Form one drive circuit between this first substrate and this second substrate, to drive this display dielectric layer.

12. methods as claimed in claim 11, wherein form the step of this first macromolecule layer in this glass support plate and comprise:

Be coated with one first macromolecular material in this glass support plate, this first macromolecular material comprises this polyamic acid, this pi, this epoxy compounds and this photo anti-corrosion agent material at least one;

With this first macromolecular material of the heating temperatures of 80 DEG C ~ 450 DEG C to form this first macromolecule layer in this glass support plate.

13. methods as claimed in claim 12, wherein form the step of this second macromolecule layer on this first macromolecule layer and comprise:

Be coated with one second macromolecular material in this glass support plate, this second macromolecular material comprises this pi;

With this second macromolecular material of the heating temperatures of 150 DEG C ~ 450 DEG C, to form this second macromolecule layer on this first macromolecule layer.

14. methods as claimed in claim 12, wherein before the step of this first macromolecular material of coating in this glass support plate, also comprise:

With this polyamic acid of this epoxy compounds of percentage by weight 0.1% and percentage by weight 10%, manufacture this first macromolecular material.

15. methods as claimed in claim 12, wherein before the step of this first macromolecule layer of formation in this glass support plate, also comprise:

Form a third high molecular layer in this glass support plate, this third high molecular layer comprises a polysiloxanes, a polytetrafluoroethylene, this pi and this polyamic acid at least one.

16. methods as claimed in claim 12, wherein formed this first macromolecule layer in this glass support plate before, also comprise:

With a region of this glass support plate of UV-irradiation, make that this of this first macromolecule layer and this glass support plate is interregional has one first adhesive force, and one of this first macromolecule layer and this glass support plate another interregional there is one second adhesive force, this first adhesive force is greater than this second adhesive force.

17. methods as claimed in claim 16, wherein the wave-length coverage of this ultraviolet light is between 172 nanometer to 258 nanometers.

18. methods as claimed in claim 11, wherein by the step that this first substrate divests from this glass support plate, comprising:

Cut this first substrate, first substrate after this cutting is divided into a first area and a second area, this first area and this glass substrate have one the 3rd adhesive force, and this second area and this glass substrate have one the 4th adhesive force, and the 3rd adhesive force is greater than the 4th adhesive force; And

This second area of this first substrate is divested from this glass support plate.