CN103165680B - A kind of substrate for display and display unit - Google Patents
A kind of substrate for display and display unit Download PDFInfo
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- CN103165680B CN103165680B CN201310072120.8A CN201310072120A CN103165680B CN 103165680 B CN103165680 B CN 103165680B CN 201310072120 A CN201310072120 A CN 201310072120A CN 103165680 B CN103165680 B CN 103165680B
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- 239000000758 substrate Substances 0.000 title claims abstract description 67
- 238000002161 passivation Methods 0.000 claims abstract description 33
- 238000002834 transmittance Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 104
- 238000000034 method Methods 0.000 description 49
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 37
- 239000007789 gas Substances 0.000 description 32
- 229910052581 Si3N4 Inorganic materials 0.000 description 27
- 230000015572 biosynthetic process Effects 0.000 description 27
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 27
- 239000010409 thin film Substances 0.000 description 24
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 22
- 229910000077 silane Inorganic materials 0.000 description 22
- 229910021529 ammonia Inorganic materials 0.000 description 14
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 6
- 229910004205 SiNX Inorganic materials 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 229910052729 chemical element Inorganic materials 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133502—Antiglare, refractive index matching layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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Abstract
本发明提供了一种显示用基板及显示装置,涉及显示技术领域,解决了现有的透明薄膜透过率低的问题。一种显示用基板,包括:基板以及设置在所述基板上的多个像素结构;所述像素结构分为透光区和非透光区,且所述像素结构中位于所述透光区的部分包括多个透明薄膜,所述多个透明薄膜中至少三个相邻的透明薄膜的折射率依排列顺序依次变化;所述基板上依次设置有栅绝缘层、钝化层和像素电极,所述多个透明薄膜中至少三个相邻的透明薄膜的折射率依排列顺序依次变化具体为:所述栅绝缘层、钝化层和像素电极的折射率依次变化。本发明适用于显示装置的制造领域。
The invention provides a substrate for display and a display device, relates to the field of display technology, and solves the problem of low transmittance of the existing transparent film. A display substrate, comprising: a substrate and a plurality of pixel structures arranged on the substrate; the pixel structure is divided into a light-transmitting area and a non-light-transmitting area, and the pixel structure located in the light-transmitting area Part includes a plurality of transparent films, the refractive index of at least three adjacent transparent films in the plurality of transparent films changes sequentially in sequence; a gate insulating layer, a passivation layer and a pixel electrode are sequentially arranged on the substrate, so The refractive indices of at least three adjacent transparent films among the plurality of transparent films are sequentially changed according to the arrangement sequence, specifically: the refractive indices of the gate insulating layer, the passivation layer and the pixel electrode are sequentially changed. The invention is applicable to the field of manufacturing display devices.
Description
技术领域 technical field
本发明涉及显示技术领域,尤其涉及一种透明薄膜及其制作方法、显示用基板及显示装置。 The invention relates to the field of display technology, in particular to a transparent thin film and a manufacturing method thereof, a display substrate and a display device.
背景技术 Background technique
显示器作为显示工具,在人们的日常生活中扮演着越来越重要的角色。且随着技术的不断更新,人们对显示器的要求也越来越高。例如人们要求其具有高亮度、宽视角、高分辨率等。 As a display tool, monitors are playing an increasingly important role in people's daily lives. And with the continuous update of technology, people have higher and higher requirements for displays. For example, people require it to have high brightness, wide viewing angle, high resolution and so on.
其中,现有技术中,一种提高显示器亮度的方法为提高光的利用效率。现有的显示器,包括阵列基板,如图1、图2所示,所述阵列基板包括基板1以及设置在所述基板1上的栅线2、数据线4以及公共电极线6,其中,栅线2和数据线4围成的区域称为像素区,在像素区设置有薄膜晶体管3等器件,像素区除薄膜晶体管3等器件之外的区域为显示区。如图2所示,光线穿过显示区要依次经过基板1以及设置在基板1上面的栅绝缘层7、钝化层8和像素电极层5。而要想提高光的利用效率就要提高基板、栅绝缘层、钝化层以及像素电极层等的透过率,以减小光的损失。 Wherein, in the prior art, a method for increasing the brightness of a display is to increase light utilization efficiency. The existing display includes an array substrate, as shown in Fig. 1 and Fig. 2, the array substrate includes a substrate 1 and gate lines 2, data lines 4 and common electrode lines 6 arranged on the substrate 1, wherein the gate The area enclosed by the line 2 and the data line 4 is called a pixel area, in which thin film transistors 3 and other devices are arranged, and the area of the pixel area except the thin film transistors 3 and other devices is a display area. As shown in FIG. 2 , light passing through the display area passes through the substrate 1 and the gate insulating layer 7 , passivation layer 8 and pixel electrode layer 5 arranged on the substrate 1 in sequence. In order to improve the utilization efficiency of light, the transmittance of the substrate, gate insulating layer, passivation layer, and pixel electrode layer must be increased to reduce light loss.
发明内容 Contents of the invention
本发明的实施例提供一种透明薄膜及其制作方法、显示用基板及显示装置,所述透明薄膜包括至少三个子层,且所述至少三个子层的折射率依排列顺序依次变化,使得所述透明薄膜的透过率更高。 Embodiments of the present invention provide a transparent thin film and its manufacturing method, a display substrate, and a display device. The transparent thin film includes at least three sublayers, and the refractive indices of the at least three sublayers change sequentially in sequence, so that all The transmittance of the transparent film is higher.
为达到上述目的,本发明的实施例采用如下技术方案: In order to achieve the above object, embodiments of the present invention adopt the following technical solutions:
本发明实施例提供了一种透明薄膜,包括层叠的至少三个子层,所述至少三个子层的折射率各不相同,且位于最底层和最顶层之间的任一个子层的折射率介于与其相邻的两个子层的折射率之间。 An embodiment of the present invention provides a transparent film, including at least three sublayers stacked, the refractive indices of the at least three sublayers are different, and the refractive index of any sublayer located between the bottommost layer and the topmost layer is between between the refractive indices of the two adjacent sublayers.
可选的,形成所述透明薄膜的材料为氮化硅。 Optionally, the material forming the transparent film is silicon nitride.
本发明实施例提供了一种透明薄膜的制作方法,包括: The embodiment of the present invention provides a method for manufacturing a transparent film, including:
设置初始工艺条件,形成所述透明薄膜的初始子层; Setting initial process conditions to form an initial sublayer of the transparent film;
按照每一个工艺条件的变化对所述透明薄膜折射率大小的影响,调节所述至少一个工艺条件,形成以所述初始子层为基准、折射率依排列顺序依次变化的至少两个后续子层。 According to the influence of the change of each process condition on the refractive index of the transparent film, adjust the at least one process condition to form at least two subsequent sublayers whose refractive index changes sequentially based on the initial sublayer. .
可选的,所述设置初始工艺条件包括:设置初始的生成温度、生成压力、功率以及气体流量。 Optionally, setting the initial process conditions includes: setting initial generation temperature, generation pressure, power and gas flow.
可选的,所述按照每一个工艺条件的变化对所述透明薄膜折射率大小的影响,调节所述至少一个工艺条件,形成以所述初始子层为基准、折射率依排列顺序依次变化的至少两个后续子层包括: Optionally, according to the influence of each process condition change on the refractive index of the transparent film, the at least one process condition is adjusted to form a transparent film whose refractive index changes sequentially based on the initial sub-layer. At least two subsequent sublayers include:
采用升高生成温度、降低生成压力以及降低功率中至少一种调节方式,形成第二子层; Forming the second sub-layer by at least one adjustment mode of increasing the forming temperature, reducing the forming pressure and reducing the power;
一次或多次采用升高生成温度、降低生成压力以及降低功率中至少一种调节方式,形成一个或多个后续子层; Forming one or more subsequent sub-layers by one or more adjustment methods of increasing the forming temperature, reducing the forming pressure and reducing the power;
或者, or,
采用降低生成温度、升高生成压力以及升高功率中至少一种调节方式,形成第二子层; Forming the second sub-layer by using at least one adjustment method among reducing the formation temperature, increasing the formation pressure, and increasing the power;
一次或多次采用降低生成温度、升高生成压力以及升高功率中至少一种调节方式,形成一个或多个后续子层。 One or more subsequent sub-layers are formed by adopting at least one adjustment method among lowering the forming temperature, increasing the forming pressure and increasing the power one or more times.
可选的,所述按照每一个工艺条件的变化对所述透明薄膜折射率大小的影响,调节所述至少一个工艺条件,形成以所述初始子层为基准、折射率依排列顺序依次变化的至少两个后续子层包括: Optionally, according to the influence of each process condition change on the refractive index of the transparent film, the at least one process condition is adjusted to form a transparent film whose refractive index changes sequentially based on the initial sub-layer. At least two subsequent sublayers include:
采用升高生成温度、降低生成压力、降低功率以及降低硅烷相对于氨气的气体流量中至少一种调节方式,形成第二子层; Forming the second sub-layer by at least one of increasing the formation temperature, reducing the formation pressure, reducing the power, and reducing the gas flow rate of silane relative to ammonia;
一次或多次采用升高生成温度、降低生成压力、降低功率以及降低硅烷相对于氨气的气体流量中至少一种调节方式,形成一个或多个后续子层; forming one or more subsequent sublayers one or more times by at least one of increasing the formation temperature, reducing the formation pressure, reducing the power, and reducing the gas flow of silane relative to ammonia;
或者, or,
采用降低生成温度、升高生成压力、升高功率以及升高硅烷相对于氨气的气体流量中至少一种调节方式,形成第二子层; Forming the second sub-layer by at least one of reducing the formation temperature, increasing the formation pressure, increasing the power, and increasing the gas flow rate of silane relative to ammonia;
一次或多次采用降低生成温度、升高生成压力、升高功率以及升高硅烷相对于氨气的气体流量中至少一种调节方式,形成一个或多个后续子层。 The one or more subsequent sublayers are formed one or more times by adjusting at least one of lowering the formation temperature, increasing the formation pressure, increasing the power, and increasing the gas flow of silane relative to ammonia.
本发明实施例提供了一种显示用基板,包括:基板以及设置在所述基板上的多个像素结构;所述像素结构分为透光区和非透光区,且所述像素结构中位于所述透光区的部分包括多个的透明薄膜,其中,所述至少一个透明薄膜为本发明实施例提供的任一所述的薄膜。 An embodiment of the present invention provides a substrate for display, including: a substrate and a plurality of pixel structures arranged on the substrate; the pixel structure is divided into a light-transmitting area and a non-light-transmitting area, and the The part of the light-transmitting region includes a plurality of transparent films, wherein the at least one transparent film is any one of the films provided in the embodiments of the present invention.
可选的,所述显示用基板为阵列基板,每一像素结构中的一个所述透明薄膜为栅绝缘层的部分,或为钝化层的部分。 Optionally, the display substrate is an array substrate, and one of the transparent thin films in each pixel structure is a part of a gate insulating layer, or a part of a passivation layer.
本发明提供了一种显示用基板,包括:基板以及设置在所述基板上的多个像素结构;所述像素结构分为透光区和非透光区,且所述像素结构中位于所述透光区的部分包括多个透明薄膜,且所述多个透明薄膜中至少三个相邻的透明薄膜的折射率依排列顺序依次变化。 The present invention provides a substrate for display, comprising: a substrate and a plurality of pixel structures arranged on the substrate; the pixel structure is divided into a light-transmitting area and a non-light-transmitting area, and the The part of the light-transmitting area includes a plurality of transparent films, and the refractive indices of at least three adjacent transparent films in the plurality of transparent films change sequentially in sequence.
本发明提供了一种显示装置,包括本发明实施例提供的任一所述的显示用基板。 The present invention provides a display device, including any one of the display substrates provided in the embodiments of the present invention.
本发明实施例提供的一种透明薄膜及其制作方法、显示用基板及显示装置,相对包括两个子层的现有透明薄膜,所述透明薄膜包括至少三个子层,所述至少三个子层的折射率各不相同,且所述至少三个子层的折射率依排列顺序依次变化,即位于最底层和最顶层之间的任一个子层的折射率介于与其相邻的两个子层的折射率之间,使得所述透明薄膜的透过率更高。 The embodiments of the present invention provide a transparent film and its manufacturing method, a display substrate, and a display device. Compared with the existing transparent film including two sublayers, the transparent film includes at least three sublayers, and the at least three sublayers The refractive indices are different, and the refractive indices of the at least three sublayers are changed sequentially according to the order of arrangement, that is, the refractive index of any sublayer located between the bottommost layer and the topmost layer is lower than that of the two adjacent sublayers. rate, so that the transmittance of the transparent film is higher.
附图说明 Description of drawings
图1为现有技术中的一种阵列基板局部俯视结构示意图; FIG. 1 is a schematic structural view of a partial top view of an array substrate in the prior art;
图2为图1所示阵列基板的剖视结构示意图; FIG. 2 is a schematic cross-sectional structural view of the array substrate shown in FIG. 1;
图3为本发明实施例提供的一种透明薄膜; Fig. 3 is a kind of transparent film provided by the embodiment of the present invention;
图4为本发明实施例提供的一种阵列基板的剖视结构示意图; 4 is a schematic cross-sectional structure diagram of an array substrate provided by an embodiment of the present invention;
图5为本发明实施例提供的一种制作透明薄膜的方法示意图; Fig. 5 is a schematic diagram of a method for making a transparent film provided by an embodiment of the present invention;
图6为本发明实施例提供的一种制作栅绝缘薄膜的制作方法示意图; FIG. 6 is a schematic diagram of a method for manufacturing a gate insulating film provided by an embodiment of the present invention;
附图标记: Reference signs:
1-基板;2-栅线;3-薄膜晶体管;4-数据线;5-像素电极层;6-公共电极线;7-栅绝缘层;8-钝化层;10-透明薄膜;101-第一子层;102-第二子层;103-第三子层。 1-substrate; 2-gate line; 3-thin film transistor; 4-data line; 5-pixel electrode layer; 6-common electrode line; 7-gate insulating layer; 8-passivation layer; 10-transparent film; 101- 1st sublayer; 102-second sublayer; 103-third sublayer.
具体实施方式 detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。 The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.
需要说明的是,当光从折射率为n1的介质入射至折射率为n2的介质时,其在界面处会同时发生光的反射和折射,进而形成光的损失。根据光学基本定理菲涅尔方程,其反射率R以及透过率T与介质的折射率的关系为: It should be noted that when light is incident from a medium with a refractive index of n1 to a medium with a refractive index of n2, reflection and refraction of light will occur simultaneously at the interface, thereby resulting in light loss. According to the fundamental theorem of optics, the Fresnel equation, the relationship between the reflectivity R and the transmittance T and the refractive index of the medium is:
现假设n1=2,n2=1,即光从折射率为2的介质射入折射率为1的介质中,经计算可以得出R=11.1%,T=88.9%,其中反射率和折射率为经过计算之后的近似值。 Assume now that n1=2, n2=1, that is, light enters from a medium with a refractive index of 2 into a medium with a refractive index of 1. After calculation, it can be obtained that R=11.1%, T=88.9%, where the reflectivity and refractive index are calculated approximate values.
当在折射率为n1和折射率为n2的介质之间加入折射率为n3的介质,其中,n3介于n1和n2之间。例如,n3=1.5,经计算可以得出R=5.9%,T=94.1%,即其透过率提高了5.2%。 When a medium with a refractive index n3 is added between the mediums with a refractive index n1 and a refractive index n2, wherein n3 is between n1 and n2. For example, n3=1.5, it can be calculated that R=5.9%, T=94.1%, that is, the transmittance is increased by 5.2%.
当在折射率为n1和折射率为n3的介质之间加入折射率为n4的介质,在折射率为n2和折射率为n3的介质之间加入折射率为n5的介质,其中,n4介于n1和n3之间,n5介于n2和n3之间。例如,n4=1.75,n5=1.25,经计算可以得出R=3.0%,T=97.0%,即其透过率提高了8.1%。 When a medium with a refractive index of n4 is added between a medium with a refractive index of n1 and a refractive index of n3, a medium with a refractive index of n5 is added between a medium with a refractive index of n2 and a refractive index of n3, wherein n4 is between Between n1 and n3, n5 between n2 and n3. For example, n4=1.75, n5=1.25, it can be calculated that R=3.0%, T=97.0%, that is, the transmittance is increased by 8.1%.
由此可以得出结论,当光线经过不同折射率的介质时,由于反射和折射,会有光的损失,但通过在不同折射率的介质之间加入折射率介于两个介质之间的介质,可以提高光的透过率,进而提高光的利用率。 From this, it can be concluded that when light passes through media with different refractive indices, there will be light loss due to reflection and refraction, but by adding a medium with a refractive index between the two media between media with different refractive indices , can increase the transmittance of light, and then improve the utilization rate of light.
基于上面的理论,本发明提供了一种透明薄膜,如图3所示,包括层叠的至少三个子层,所述至少三个子层的折射率各不相同,且位于最底层和最顶层之间的任一个子层的折射率介于与其相邻的两个子层的折射率之间。 Based on the above theory, the present invention provides a transparent film, as shown in Figure 3, comprising at least three sub-layers stacked, the refractive indices of the at least three sub-layers are different, and are located between the bottommost layer and the topmost layer The refractive index of any sub-layer is between the refractive indices of the two adjacent sub-layers.
其中,所述透明薄膜可以是显示装置中阵列基板上的栅绝缘层或钝化层。且需要说明的是,现有技术中,显示装置领域的各层结构大多是通过气相沉积法沉积形成的,例如钝化层、栅绝缘层等可以是通过PECVD(PlasmaEnhancedChemicalVaporDeposition,等离子体气相沉积)形成。等离子体气相沉积是一种借助微波或射频等使含有薄膜组成原子的气体电离,在局部形成等离子体,而等离子体化学活性很强,很容易发生反应,进而在基片上沉积出所期望的薄膜。本发明实施例中,“薄膜”是指利用沉积等方法制作出的一层薄膜。若在整个制作过程当中该“薄膜”无需构图工艺,则该“薄膜”还可以称为“层”,例如栅绝缘层;若在整个制作过程当中该“薄膜”还需构图工艺,则在构图工艺前称为“薄膜”,构图工艺后称为“层”。经过构图工艺后的“层”中包含至少一个薄膜“图案”。例如钝化层是通过沉积形成一层薄膜,再经过构图工艺在所述薄膜上形成过孔等。 Wherein, the transparent thin film may be a gate insulating layer or a passivation layer on an array substrate in a display device. And it should be noted that in the prior art, most of the layer structures in the field of display devices are deposited by vapor deposition, for example, passivation layers, gate insulating layers, etc. can be formed by PECVD (PlasmaEnhancedChemicalVaporDeposition, plasma vapor deposition) . Plasma vapor deposition is a kind of ionization of the gas containing the constituent atoms of the film by means of microwave or radio frequency to form plasma locally, and the plasma is highly chemically active and easy to react, and then deposits the desired film on the substrate. In the embodiments of the present invention, "thin film" refers to a layer of thin film produced by methods such as deposition. If the "thin film" does not require a patterning process during the entire manufacturing process, the "thin film" can also be called a "layer", such as a gate insulating layer; It is called "film" before the process, and it is called "layer" after the patterning process. The "layer" after the patterning process contains at least one film "pattern". For example, the passivation layer is deposited to form a thin film, and then a via hole is formed on the thin film through a patterning process.
现有技术中,栅绝缘层通过PECVD沉积,且形成栅绝缘层的材料优选采用SiNx(氮化硅),当然也可以是其他材料,例如还可以是SiO2(二氧化硅)等。本发明实施例仅以栅绝缘层为氮化硅为例进行详细说明。栅绝缘薄膜在沉积的过程中是通过分别将硅烷和氨气电离,形成等离子体,通过反应形成氮化硅在基板上形成栅绝缘薄膜。栅绝缘薄膜在沉积前期,沉积射频功率较大,沉积的速率较快,这样可以提高产能,但沉积的SiNx结构松散,且Si/N比相对较高,形成的栅绝缘薄膜的折射率较大。沉积后期,为了使得有源层上的源极和漏极导通信号不受干扰,会降低沉积速率,沉积的SiNx结构致密,且Si/N比相对较低,形成的栅绝缘薄膜的折射率较小。即所述栅绝缘层是包括了折射率不同的两个子层。 In the prior art, the gate insulating layer is deposited by PECVD, and the material forming the gate insulating layer is preferably SiNx (silicon nitride), and of course other materials, such as SiO 2 (silicon dioxide), can also be used. The embodiment of the present invention is described in detail only by taking silicon nitride as an example for the gate insulating layer. During the deposition process of the gate insulating film, silane and ammonia gas are respectively ionized to form plasma, and silicon nitride is formed by reaction to form a gate insulating film on the substrate. In the early stage of gate insulating film deposition, the deposition radio frequency power is higher and the deposition rate is faster, which can increase productivity, but the deposited SiNx structure is loose, and the Si/N ratio is relatively high, and the refractive index of the formed gate insulating film is relatively large. . In the later stage of deposition, in order to ensure that the source and drain conduction signals on the active layer are not disturbed, the deposition rate will be reduced. The deposited SiNx has a dense structure and a relatively low Si/N ratio. The refractive index of the formed gate insulating film smaller. That is, the gate insulating layer includes two sublayers with different refractive indices.
本发明提供的薄膜,可以为所述栅绝缘薄膜,且相对于包括两层子层的现有栅绝缘薄膜,包括至少三个子层的栅绝缘薄膜的透过率提高,进而提高光的利用率,应用于显示面板,可以提高显示面板的亮度。如图3所示,以栅绝缘层10包括三个子层为例,所述三个子层分别为第一子层101、第二子层102和第三子层103。其中,第二子层102的透过率介于第一子层101和第三子层103的透过率之间。这样通过在第一子层和第三子层之间设置第二子层,提高了栅绝缘层的透过率,应用于显示面板,可以提高显示面板的亮度。 The film provided by the present invention may be the gate insulating film, and compared with the existing gate insulating film comprising two sublayers, the transmittance of the gate insulating film comprising at least three sublayers is improved, thereby improving the utilization rate of light , applied to the display panel, can improve the brightness of the display panel. As shown in FIG. 3 , the gate insulating layer 10 includes three sublayers as an example, and the three sublayers are respectively a first sublayer 101 , a second sublayer 102 and a third sublayer 103 . Wherein, the transmittance of the second sub-layer 102 is between those of the first sub-layer 101 and the third sub-layer 103 . In this way, by disposing the second sublayer between the first sublayer and the third sublayer, the transmittance of the gate insulating layer is improved, and when applied to a display panel, the brightness of the display panel can be improved.
钝化层与栅绝缘层相似,形成钝化层的材料也可以是氮化硅,且现有技术中钝化薄膜也是包括了两个折射率不同的子层。具体的,在钝化薄膜沉积的前期,为了保护信号线不被腐蚀,沉积的SiNx结构致密,形成的钝化薄膜的折射率较小。在钝化薄膜沉积的后期,为了便于过孔的坡角的控制,沉积的SiNx结构松散,形成的钝化薄膜的折射率较大。 The passivation layer is similar to the gate insulating layer, and the material forming the passivation layer may also be silicon nitride, and the passivation film in the prior art also includes two sublayers with different refractive indices. Specifically, in the early stage of the deposition of the passivation film, in order to protect the signal lines from being corroded, the deposited SiNx has a dense structure, and the formed passivation film has a relatively small refractive index. In the later stage of the passivation film deposition, in order to facilitate the control of the slope angle of the via hole, the deposited SiNx structure is loose, and the formed passivation film has a relatively large refractive index.
本发明提供的薄膜,可以为所述钝化薄膜,且相对于包括两层子层的现有钝化薄膜,包括至少三个子层的钝化薄膜的透过率提高,进而提高光的利用率,应用于显示面板,可以提高显示面板的亮度。 The film provided by the present invention can be the passivation film, and compared with the existing passivation film comprising two sub-layers, the transmittance of the passivation film comprising at least three sub-layers is improved, thereby improving the utilization rate of light , applied to the display panel, can improve the brightness of the display panel.
当然,本发明实施例提供的薄膜也不仅仅局限于栅绝缘薄膜和钝化薄膜,也可以是显示领域的其他薄膜或者其他领域的薄膜。例如还可以是像素电极薄膜或彩膜基板上的公共电极薄膜等,本发明实施例仅以栅绝缘薄膜和钝化薄膜为例进行详细说明。 Of course, the films provided in the embodiments of the present invention are not limited to the gate insulating film and the passivation film, and may also be other films in the display field or films in other fields. For example, it may also be a pixel electrode film or a common electrode film on a color filter substrate, etc. The embodiment of the present invention only uses a gate insulating film and a passivation film as examples for detailed description.
本发明提供了一种透明薄膜的制作方法,可用于制作本发明实施例提供的透明薄膜,如图5所示,包括: The present invention provides a method for making a transparent film, which can be used to make the transparent film provided by the embodiment of the present invention, as shown in Figure 5, including:
步骤S101、设置初始工艺条件,形成所述透明薄膜的初始子层。 Step S101 , setting initial process conditions to form an initial sub-layer of the transparent film.
其中,形成所述透明薄膜的工艺条件根据不同材料的薄膜和不同的形成方法各有不同。本发明实施例仅以PECVD形成氮化硅薄膜为例进行详细说明。具体的,对于以PECVD形成氮化硅薄膜,所述工艺条件包括:生成温度、生成压力、功率以及气体流量。则所述设置初始工艺条件包括:设置初始的生成温度、生成压力、功率以及气体流量。 Wherein, the process conditions for forming the transparent thin film are different according to the thin films of different materials and different forming methods. The embodiment of the present invention is described in detail by taking the formation of a silicon nitride film by PECVD as an example. Specifically, for forming a silicon nitride film by PECVD, the process conditions include: generation temperature, generation pressure, power and gas flow. Then, the setting of the initial process conditions includes: setting the initial generation temperature, generation pressure, power and gas flow.
其中,所述气体流量影响形成所述透明薄膜的物质的各化学元素的质量比,且生成气体的量不同,形成所述透明薄膜的物质中的各化学元素的含量也不同。且对于不同物质,其生成的气体也不同。例如沉积氮化硅是分别见硅烷和氨气电离,形成等离子体,通过反应形成氮化硅在基板上形成氮化硅薄膜。则所述生成气体即为硅烷和氨气,其中,硅烷提供硅元素,氨气提供氮元素。通过控制气体流量可以控制形成氮化硅薄膜的Si/N(硅氮比)。 Wherein, the gas flow rate affects the mass ratio of each chemical element of the material forming the transparent film, and the amount of generated gas is different, so is the content of each chemical element in the material forming the transparent film. And for different substances, the gases generated are also different. For example, to deposit silicon nitride, silane and ammonia gas are ionized to form plasma, and silicon nitride is formed by reaction to form a silicon nitride film on the substrate. Then the generated gas is silane and ammonia gas, wherein silane provides silicon element, and ammonia gas provides nitrogen element. Si/N (silicon-nitrogen ratio) for forming a silicon nitride film can be controlled by controlling the gas flow rate.
步骤S102、按照每一个工艺条件的变化对所述透明薄膜折射率大小的影响,调节所述至少一个工艺条件,形成以所述初始子层为基准、折射率依排列顺序依次变化的至少两个后续子层。 Step S102, according to the influence of the change of each process condition on the refractive index of the transparent film, adjust the at least one process condition to form at least two layers whose refractive index changes sequentially based on the initial sub-layer. subsequent sublayers.
其中,工艺条件对不同材料的薄膜的透过率大小的影响也不同,这就需要根据薄膜的具体情况进行具体分析。本发明实施例以上述工艺条件对氮化硅薄膜的折射率的大小影响为例进行说明。 Among them, the influence of process conditions on the transmittance of films of different materials is also different, which requires specific analysis according to the specific conditions of the films. The embodiments of the present invention are described by taking the influence of the above process conditions on the refractive index of the silicon nitride thin film as an example.
具体的,所述生成温度与所述氮化硅透明薄膜折射率成反比,即生成温度越高,则所述氮化硅透明薄膜的折射率越小,反之,生成温度越低,则所述氮化硅透明薄膜的折射率越大;所述生成压力与所述氮化硅透明薄膜折射率成正比,即生成压力越大,则所述氮化硅透明薄膜的折射率越大,反之,生成压力越小,则所述氮化硅透明薄膜的折射率越小;所述功率与所述氮化硅透明薄膜折射率成正比,即功率越大,则所述氮化硅透明薄膜的折射率越大,反之,功率越小,则所述氮化硅透明薄膜的折射率越小。 Specifically, the formation temperature is inversely proportional to the refractive index of the silicon nitride transparent film, that is, the higher the formation temperature, the smaller the refractive index of the silicon nitride transparent film; conversely, the lower the formation temperature, the lower the The greater the refractive index of the silicon nitride transparent film; the generation pressure is proportional to the refractive index of the silicon nitride transparent film, that is, the greater the generation pressure, the greater the refractive index of the silicon nitride transparent film, and vice versa, The smaller the generation pressure, the smaller the refractive index of the silicon nitride transparent film; the power is proportional to the refractive index of the silicon nitride transparent film, that is, the greater the power, the smaller the refractive index of the silicon nitride transparent film The larger the power, on the contrary, the smaller the power, the smaller the refractive index of the silicon nitride transparent film.
所述调节所述至少一个工艺条件,形成以所述初始子层为基准、折射率依排列顺序依次变化的至少两个后续子层。可以是以所述初始子层为基准,至少两个后续子层的折射率依排列顺序依次增大;也可以是以所述初始子层为基准,至少两个后续子层的折射率依排列顺序依次减小。 The adjustment of the at least one process condition is to form at least two subsequent sublayers whose refractive index changes sequentially based on the initial sublayer. It can be based on the initial sublayer, and the refractive indices of at least two subsequent sublayers increase sequentially in sequence; or based on the initial sublayer, the refractive indices of at least two subsequent sublayers can be arranged in sequence order in decreasing order.
具体的,所述按照每一个工艺条件的变化对所述透明薄膜折射率大小的影响,调节所述至少一个工艺条件,形成以所述初始子层为基准、折射率依排列顺序依次降低的至少两个后续子层包括: Specifically, according to the influence of the change of each process condition on the refractive index of the transparent film, the at least one process condition is adjusted to form at least one layer whose refractive index decreases sequentially based on the initial sub-layer. The two subsequent sublayers include:
采用升高生成温度、降低生成压力以及降低功率中至少一种调节方式,形成第二子层; Forming the second sub-layer by at least one adjustment mode of increasing the forming temperature, reducing the forming pressure and reducing the power;
一次或多次采用升高生成温度、降低生成压力以及降低功率中至少一种调节方式,形成一个或多个后续子层。 One or more subsequent sub-layers are formed by adopting at least one adjustment method among increasing the forming temperature, reducing the forming pressure and reducing the power one or more times.
或者,按照每一个工艺条件的变化对所述透明薄膜折射率大小的影响,调节所述至少一个工艺条件,形成以所述初始子层为基准、折射率依排列顺序依次增大的至少两个后续子层包括: Or, according to the influence of the change of each process condition on the refractive index of the transparent film, adjust the at least one process condition to form at least two primary sub-layers whose refractive index increases sequentially based on the order of arrangement. Subsequent sublayers include:
采用降低生成温度、升高生成压力以及升高功率中至少一种调节方式,形成第二子层; Forming the second sub-layer by using at least one adjustment method among reducing the formation temperature, increasing the formation pressure, and increasing the power;
一次或多次采用降低生成温度、升高生成压力以及升高功率中至少一种调节方式,形成一个或多个后续子层。 One or more subsequent sub-layers are formed by adopting at least one adjustment method among lowering the forming temperature, increasing the forming pressure and increasing the power one or more times.
相同的物质,控制气体流量使生成的所述透明薄膜的物质中的各化学元素的含量不同,其折射率的影响也不相。且不同的物质形成的透明薄膜中各化学元素的含量对其折射率的影响也不相同。本发明实施例中仅以氮化硅为例。通过控制生成氮化硅的硅烷和氨气的气体流量,可以得到不同的硅氨比,且所述氮化硅透明薄膜折射率与Si/N成正比。即Si/N越大,氮化硅透明薄膜的折射率越大;Si/N越小,氮化硅透明薄膜的折射率越小。 For the same substance, the gas flow rate is controlled so that the content of each chemical element in the substance of the transparent thin film is different, and the influence of the refractive index is also different. Moreover, the content of each chemical element in the transparent film formed by different substances has different effects on its refractive index. In the embodiment of the present invention, only silicon nitride is taken as an example. Different ratios of silicon to ammonia can be obtained by controlling the gas flow of silane and ammonia to generate silicon nitride, and the refractive index of the silicon nitride transparent film is directly proportional to Si/N. That is, the larger the Si/N, the larger the refractive index of the silicon nitride transparent film; the smaller the Si/N, the smaller the refractive index of the silicon nitride transparent film.
具体的,对于通过硅烷和氨气形成氮化硅透明薄膜,所述按照每一个工艺条件的变化对所述透明薄膜折射率大小的影响,调节所述至少一个工艺条件,形成以所述初始子层为基准、折射率依排列顺序依次降低的至少两个后续子层包括: Specifically, for the formation of a silicon nitride transparent film by silane and ammonia gas, according to the influence of the change of each process condition on the refractive index of the transparent film, adjust the at least one process condition to form the initial particle The at least two subsequent sub-layers whose refractive index decreases sequentially according to the layer include:
采用升高生成温度、降低生成压力、降低功率以及降低硅烷相对于氨气的气体流量中至少一种调节方式,形成第二子层; Forming the second sub-layer by at least one of increasing the formation temperature, reducing the formation pressure, reducing the power, and reducing the gas flow rate of silane relative to ammonia;
一次或多次采用升高生成温度、降低生成压力、降低功率以及降低硅烷相对于氨气的气体流量中至少一种调节方式,形成一个或多个后续子层。 One or more subsequent sub-layers are formed using at least one of increasing the formation temperature, reducing the formation pressure, reducing the power, and reducing the gas flow of silane relative to ammonia one or more times.
其中,所述降低硅烷相对于氨气的气体流量可以是降低硅烷的气体流量也可以是增大氨气的气体流量,只要降低Si/N比即可。 Wherein, the reduction of the gas flow rate of silane relative to the ammonia gas may be to reduce the gas flow rate of silane gas or to increase the gas flow rate of ammonia gas, as long as the Si/N ratio is lowered.
或者,所述按照每一个工艺条件的变化对所述透明薄膜折射率大小的影响,调节所述至少一个工艺条件,形成以所述初始子层为基准、折射率依排列顺序依次增大的至少两个后续子层包括: Or, according to the influence of the change of each process condition on the refractive index of the transparent film, the at least one process condition is adjusted to form at least one layer whose refractive index increases sequentially based on the initial sub-layer. The two subsequent sublayers include:
采用降低生成温度、升高生成压力、升高功率以及升高硅烷相对于氨气的气体流量中至少一种调节方式,形成第二子层; Forming the second sub-layer by at least one of reducing the formation temperature, increasing the formation pressure, increasing the power, and increasing the gas flow rate of silane relative to ammonia;
一次或多次采用降低生成温度、升高生成压力、升高功率以及升高硅烷相对于氨气的气体流量中至少一种调节方式,形成一个或多个后续子层。 The one or more subsequent sublayers are formed one or more times by adjusting at least one of lowering the formation temperature, increasing the formation pressure, increasing the power, and increasing the gas flow of silane relative to ammonia.
其中,所述升高硅烷相对于氨气的气体流量可以是增大硅烷的气体流量也可以是减小氨气的气体流量,只要增大Si/N比即可。 Wherein, the increase of the gas flow rate of silane relative to the ammonia gas may be to increase the gas flow rate of silane gas or to decrease the gas flow rate of ammonia gas, as long as the Si/N ratio is increased.
具体的,对于基板上的栅绝缘层,由于现有工艺中两个子层从下至上的折射率依次减小,则当栅绝缘层包括多个子层时,各子层的折射率从下至上依次减小。对于基板上的钝化层,由于现有工艺中两个子层的折射率从下至上依次增大,则当钝化层包括多个子层时,各子层的折射率从下至上依次增大。所述“上”、“下”以制作子层的先后顺序为准,例如最先形成的子层为在下的子层,后面形成的子层为在上的子层。 Specifically, for the gate insulating layer on the substrate, since the refractive index of the two sub-layers decreases sequentially from bottom to top in the existing process, when the gate insulating layer includes multiple sub-layers, the refractive index of each sub-layer sequentially decreases from bottom to top decrease. For the passivation layer on the substrate, since the refractive index of the two sublayers increases sequentially from bottom to top in the prior art, when the passivation layer includes multiple sublayers, the refractive index of each sublayer increases sequentially from bottom to top. The "upper" and "lower" are based on the order in which the sub-layers are produced, for example, the sub-layer formed first is the lower sub-layer, and the sub-layer formed later is the upper sub-layer.
具体的,如图6所示,制作栅绝缘薄膜包括: Specifically, as shown in FIG. 6, making the gate insulating film includes:
步骤S201、设置初始的生成温度、生成压力、功率以及气体流量,形成所述栅绝缘薄膜的初始子层。 Step S201 , setting initial generation temperature, generation pressure, power and gas flow rate to form an initial sub-layer of the gate insulating film.
步骤S202、采用升高生成温度、降低生成压力、降低功率以及降低硅烷相对于氨气的气体流量中至少一种调节方式,形成第二子层。 Step S202 , using at least one adjustment method among increasing the generation temperature, reducing the generation pressure, reducing the power, and reducing the gas flow rate of silane relative to ammonia to form the second sublayer.
在初始工艺条件的基础上升高生成温度、降低生成压力、降低功率以及降低硅烷相对于氨气的气体流量,可以是调节其中的一种,也可以同时调节多种方式,使形成的第二子层的折射率大于第一子层的折射率。 On the basis of the initial process conditions, increasing the formation temperature, reducing the formation pressure, reducing the power, and reducing the gas flow rate of silane relative to ammonia can be adjusted in one of them, or in multiple ways at the same time, so that the formed second child The refractive index of the layer is greater than the refractive index of the first sublayer.
步骤S203、采用升高生成温度、降低生成压力、降低功率以及降低硅烷相对于氨气的气体流量中至少一种调节方式,形成第三子层。 Step S203 , using at least one adjustment method among increasing the generation temperature, reducing the generation pressure, reducing the power, and reducing the gas flow rate of silane relative to ammonia to form the third sublayer.
同样的,在步骤S202的工艺条件的基础上,升高生成温度、降低生成压力、降低功率以及降低硅烷相对于氨气的气体流量,可以至调节其中的一种,也可以同时调节多种方式,使形成的第三子层的折射率大于第二子层的折射率。 Similarly, on the basis of the process conditions in step S202, increase the generation temperature, reduce the generation pressure, reduce the power, and reduce the gas flow rate of silane relative to ammonia, one of which can be adjusted, and multiple ways can also be adjusted at the same time , so that the refractive index of the formed third sublayer is greater than the refractive index of the second sublayer.
这样以此类推,还可以形成后续子层,则形成的栅绝缘薄膜包括至少三个子层,且各子层的折射率依次增大,相对于现有的栅绝缘薄膜,其透过率更高。 By analogy, subsequent sub-layers can also be formed, and the formed gate insulating film includes at least three sub-layers, and the refractive index of each sub-layer increases sequentially. Compared with the existing gate insulating film, its transmittance is higher .
本发明实施例仅以制作栅绝缘薄膜为例进行详细说明,制作其他透明薄膜可以参照上述步骤,在这里就不作赘述。 The embodiment of the present invention is described in detail by taking the fabrication of the gate insulating film as an example, and the above-mentioned steps may be referred to for fabricating other transparent films, and details are not repeated here.
本发明提供了一种显示用基板,包括:基板以及设置在所述基板上的多个像素结构;所述像素结构分为透光区和非透光区,且所述像素结构中位于所述透光区的部分包括多个透明薄膜,其中,至少一个所述透明薄膜为本发明实施例提供的薄膜。 The present invention provides a substrate for display, comprising: a substrate and a plurality of pixel structures arranged on the substrate; the pixel structure is divided into a light-transmitting area and a non-light-transmitting area, and the The part of the light-transmitting area includes a plurality of transparent films, wherein at least one of the transparent films is the film provided by the embodiment of the present invention.
需要说明的是,部分位于所述透光区的透明薄膜,其也可以延伸至非透光区,即所述透明薄膜位于所述基板上,覆盖透光区和非透光区。所述显示用基板可以适用于液晶显示装置,也可以适用于有机发光二极管显示装置。 It should be noted that part of the transparent film located in the light-transmitting region may also extend to the non-transmitting region, that is, the transparent film is located on the substrate and covers the light-transmitting region and the non-transmitting region. The display substrate can be applied to a liquid crystal display device, and can also be applied to an organic light emitting diode display device.
可选的,所述显示用基板为阵列基板,每一像素结构中的一个所述透明薄膜为栅绝缘层的部分,或为钝化层的部分。如图4所示,所述阵列基板上的栅绝缘层7和钝化层8均包括至少三个子层。当然,所述透明薄膜还可以是阵列基板上的像素电极层。且所述显示用基板还可以是彩膜基板,则所述透明薄膜为彩膜基板上的公共电极层等位于透光区,光线穿过会产生光损失的各薄膜。 Optionally, the display substrate is an array substrate, and one of the transparent thin films in each pixel structure is a part of a gate insulating layer, or a part of a passivation layer. As shown in FIG. 4 , both the gate insulating layer 7 and the passivation layer 8 on the array substrate include at least three sublayers. Certainly, the transparent thin film may also be a pixel electrode layer on the array substrate. In addition, the display substrate may also be a color filter substrate, and the transparent thin film is the common electrode layer on the color filter substrate located in the light-transmitting area, and the light passes through each thin film that will cause light loss.
本发明实施例提供了一种显示用基板,包括:基板以及设置在所述基板上的多个像素结构;所述像素结构分为透光区和非透光区,且所述像素结构中位于所述透光区的部分包括多个透明薄膜,且所述多个透明薄膜中至少三个相邻的透明薄膜的折射率依排列顺序依次变化。 An embodiment of the present invention provides a substrate for display, including: a substrate and a plurality of pixel structures arranged on the substrate; the pixel structure is divided into a light-transmitting area and a non-light-transmitting area, and the The part of the light-transmitting area includes a plurality of transparent films, and the refractive indices of at least three adjacent transparent films in the plurality of transparent films change sequentially in sequence.
具体的,折射率依排列顺序依次变化可以是依排列顺序依次减小也可以是依排列顺序依次增大。本发明实施例中,所述基板也可以是一种透明薄膜。则如图4所示,所述阵列基板在基板1上依次设置有栅绝缘层7、钝化层8和像素电极5,每一像素结构中所述栅绝缘层7设置在所述钝化层8和基板1之间。所述至少三个相邻的透明薄膜的折射率依排列顺序依次变化,可以是所述栅绝缘层的折射率介于所述基板的折射率和所述钝化层的折射率之间,即基板、栅绝缘层和钝化层的折射率依次变化。可提高阵列基板光的透过率,在相同光照强度的情况下,提高了显示面板的亮度。所述至少三个相邻的透明薄膜的折射率依排列顺序依次变化还可以是相邻设置的栅绝缘层、钝化层和像素电极的折射率依次变化。当然,也可以是从最低层至最顶层的各薄膜的折射率依次变化,即还可以是基板、栅绝缘层、钝化层和像素电极的折射率依次变化。 Specifically, the refractive index may be sequentially changed according to the sequence of arrangement, may be sequentially decreased according to the sequence of arrangement, or may be sequentially increased according to the sequence of arrangement. In the embodiment of the present invention, the substrate may also be a transparent film. As shown in FIG. 4, the array substrate is provided with a gate insulating layer 7, a passivation layer 8 and a pixel electrode 5 in sequence on the substrate 1, and the gate insulating layer 7 is arranged on the passivation layer in each pixel structure. 8 and substrate 1. The refractive indices of the at least three adjacent transparent films change sequentially according to the arrangement order, and the refractive index of the gate insulating layer may be between the refractive index of the substrate and the refractive index of the passivation layer, that is, The refractive indices of the substrate, the gate insulating layer and the passivation layer change sequentially. The light transmittance of the array substrate can be improved, and the brightness of the display panel can be improved under the same light intensity. The refractive index of the at least three adjacent transparent thin films changes sequentially according to the arrangement order, and the refractive index of the adjacently arranged gate insulating layer, passivation layer and pixel electrode may also change sequentially. Of course, the refractive index of each thin film may also change sequentially from the lowest layer to the topmost layer, that is, the refractive index of the substrate, gate insulating layer, passivation layer and pixel electrode may also change sequentially.
需要说明的是,部分位于所述透光区的透明薄膜,其也可以延伸至非透光区,即所述透明薄膜位于所述基板上,覆盖透光区和非透光区。所述显示用基板可以适用于液晶显示装置,也可以适用于有机发光二极管显示装置。 It should be noted that part of the transparent film located in the light-transmitting region may also extend to the non-transmitting region, that is, the transparent film is located on the substrate and covers the light-transmitting region and the non-transmitting region. The display substrate can be applied to a liquid crystal display device, and can also be applied to an organic light emitting diode display device.
本发明提供了一种显示装置,包括本发明实施例提供的所述阵列基板。所述显示装置可以为液晶显示器、电子纸、OLED(OrganicLight-EmittingDiode,有机发光二极管)显示器等显示器件以及包括这些显示器件的电视、数码相机、手机、平板电脑等任何具有显示功能的产品或者部件。 The present invention provides a display device, including the array substrate provided by the embodiment of the present invention. The display device can be a display device such as a liquid crystal display, an electronic paper, an OLED (Organic Light-Emitting Diode, organic light-emitting diode) display, and any product or component with a display function such as a TV, a digital camera, a mobile phone, a tablet computer, etc. that include these display devices .
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到的变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。 The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. All should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.
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