CN103166271B - The uninterrupted power supply of modular - Google Patents
The uninterrupted power supply of modular Download PDFInfo
- Publication number
- CN103166271B CN103166271B CN201110424024.6A CN201110424024A CN103166271B CN 103166271 B CN103166271 B CN 103166271B CN 201110424024 A CN201110424024 A CN 201110424024A CN 103166271 B CN103166271 B CN 103166271B
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- wiring board
- die group
- template die
- line template
- inductance
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- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 230000005855 radiation Effects 0.000 claims abstract description 17
- 239000003990 capacitor Substances 0.000 claims description 15
- 238000012423 maintenance Methods 0.000 abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The invention discloses a kind of uninterrupted power supply of modular, be made up of a casing, first line template die group, heat radiation module and the second wiring board module is provided with in described casing, described first line template die group is installed on sheaf space on described box house, described first line template die group is provided with power semiconductor, described heat radiation module fixing is connected to below described first line template die group, and described second wiring board module is installed on described bottom half space.The inductance of not rapid wear, electric capacity and heat radiation module are separated setting with the power semiconductor of rapid wear by the uninterrupted power supply of modular of the present invention, when breaking down at circuit, only need change the inefficacy wiring board of the first line template die group being placed in sheaf space on described box house, alleviate the weight of maintenance extension wire plate, be convenient for changing inefficacy wiring board, accelerate maintenance response speed, avoid causing the wasting of resources when inefficacy wiring board is scrapped simultaneously.
Description
Technical field
The present invention relates to uninterrupted power supply technical field, especially relate to a kind of uninterrupted power supply of modular.
Background technology
Uninterrupted power supply (UPS) is widely used in the field that bank, finance, communication etc. need to provide stabilized power supply, and the fine or not direct relation of its performance the safety of a large amount of significant data.The uninterrupted power supply of modular is hot-swappable with it, can change online, the characteristic of easy-maintaining and obtain applying more and more widely.And whether the arrangement position of the inner each device of the power model of the uninterrupted power supply of modular and the replacing of consumable accessory facilitate, inspection speed speed, repair quality etc. have direct relation.
The uninterrupted power supply of existing modular is all adopt the quality such as radiator, inductance and electric capacity large rapid wear device and power semiconductor are not mixed and install in the circuit board again substantially.When safeguarding at the scene, on the inefficacy wiring board disassembled, but often occur comprising the large unspoiled devices of quality such as radiator, inductance and electric capacity, such extension wire plate is due to the large device of the quality such as subsidiary radiator, inductance and electric capacity, and causing attendant needs to carry quite heavy weight extension wire plate; And when inefficacy wiring board cannot be repaired completely, the devices such as the radiator on it, inductance, electric capacity are also together scrapped with this inefficacy wiring board, cause the great wasting of resources.
As shown in Figure 1, be the common circuit in a kind of in prior art two conversion uninterrupted power supplys of modular.It comprises mains-supplied Port IP/L, IP/N, powered battery positive and negative extreme BAT+, BAT-, silicon controlled rectifier SCRQ1, SCRQ2, SCRQ3, SCRQ4, comprise a boost booster circuit of inductance L 1, triode Q8, diode D1, bus capacitor C1, comprise the 2nd boost booster circuit of inductance L 2, triode Q5, diode D2, bus capacitor C2, comprise triode Q7, Q6, inductance L 3, the half-bridge circuit of electric capacity C3 and output port of power source OP/L, OP/N.Mains-supplied Port IP/L is electrically connected by silicon controlled rectifier SCRQ4 and inductance L 1, be electrically connected by silicon controlled rectifier SCRQ1 and inductance L 2 simultaneously, mains-supplied Port IP/N and triode Q8 one end are electrically connected, be electrically connected with triode Q5 one end simultaneously, powered battery positive terminal BAT+ is electrically connected by silicon controlled rectifier SCRQ3 and inductance L 1, powered battery negative pole end BAT-is electrically connected by silicon controlled rectifier SCRQ2 and inductance L 1, triode Q7 one end is electrically connected between diode D1 and bus capacitor C1, triode Q6 one end is electrically connected between diode D2 and bus capacitor C2, the triode Q7 other end and the triode Q6 other end are electrically connected, inductance L 3 one end is electrically connected between triode Q7 and triode Q6, inductance L 3 other end is electrically connected output port of power source OP/L, be electrically connected output port of power source OP/N by electric capacity C3 simultaneously.
During mains-supplied, civil power passes through mains-supplied Port IP/L, IP/N after silicon controlled rectifier SCRQ4, SCRQ1 rectification, then is boosted be respectively bus capacitor C1 by inductance L 1, L2, triode Q8, Q5, diode D1, D2, and C2 provides energy; During powered battery, battery passes through powered battery positive and negative extreme BAT+, BAT-through silicon controlled rectifier SCRQ2, SCRQ3, then is boosted be respectively bus capacitor C1 by inductance L 1, L2, triode Q8, Q5, diode D1, D2, and C2 provides energy.Bus capacitor C1, C2 by triode Q7, Q6, inductance L 3, electric capacity C3 form half-bridge circuit by the sine wave of external controller through pulse-width modulation (PWM) output rated voltage.
But existing modularized design is placed on same wiring board power semiconductor, inductance, electric capacity and radiator.As shown in Figure 1, silicon controlled rectifier SCRQ1, SCRQ2, SCRQ3, SCRQ4, triode Q5, Q8, diode D1, D2 and the first radiator (not shown) and inductance L 1, L2 are designed on first line plate A; Triode Q7, Q6 and the second radiator (not shown) and inductance L 3, bus capacitor C1, C2, electric capacity C3 are designed on the second wiring board B simultaneously.Thus, after sale or maintenance department prepare change inefficacy wiring board time, because the weight of first line plate A and the second wiring board B and cost are all quite high, if keep in repair bad, cause scrapping of first line plate A or the second wiring board B, also can cause on first line plate A or the second wiring board B that some do not damage the waste of device as inductance, electric capacity and radiator simultaneously.
Summary of the invention
The defect that the present invention be directed to the existence of above-mentioned background technology provides a kind of weight alleviating maintenance extension wire plate, be convenient for changing inefficacy wiring board, accelerate maintenance response speed, avoid the uninterrupted power supply of the modular causing the wasting of resources when inefficacy wiring board is scrapped simultaneously.
For achieving the above object, the invention discloses a kind of uninterrupted power supply of modular, be made up of a casing, first line template die group, heat radiation module and the second wiring board module is provided with in described casing, described first line template die group is installed on sheaf space on described box house, described first line template die group is provided with power semiconductor, and described heat radiation module fixing is connected to below described first line template die group, and described second wiring board module is installed on described bottom half space.
Further, described first line template die group comprises first line plate, the second wiring board and tertiary circuit plate, and described first line plate, the second wiring board and tertiary circuit plate are respectively arranged with power semiconductor.
Further, described heat radiation module comprises stator and fin, and described stator is fixed on described casing, and described fin is fastened in described stator upper end, and the power semiconductor in described first line template die group is fixed on described fin.
Further, described second wiring board module is provided with inductance or electric capacity.
In sum, the inductance of not rapid wear, electric capacity and heat radiation module are separated setting with the power semiconductor of rapid wear by the uninterrupted power supply of modular of the present invention, when breaking down at circuit, only need change the inefficacy wiring board of the first line template die group being placed in sheaf space on described box house, alleviate the weight of maintenance extension wire plate, be convenient for changing inefficacy wiring board, accelerate maintenance response speed, avoid causing the wasting of resources when inefficacy wiring board is scrapped simultaneously.
Accompanying drawing explanation
Fig. 1 is circuit and the circuit board structure schematic diagram of two conversion uninterrupted power supplys of existing modular.
Fig. 2 is circuit and the circuit board structure schematic diagram of the uninterrupted power supply of modular of the present invention.
Fig. 3 is the cross section structure schematic diagram of the concrete layout of the present invention shown in Fig. 2.
Embodiment
For feature of the present invention, technological means and the specific purposes reached, function can be understood further, below in conjunction with accompanying drawing and embodiment, the present invention is described in further detail.
Refer to Fig. 2 and Fig. 3, the uninterrupted power supply of modular of the present invention is made up of a casing 10, described casing 10 internal circuit comprises mains-supplied Port IP/L, IP/N, the positive and negative extreme BAT+ of powered battery, BAT-, silicon controlled rectifier SCRQ1, SCRQ2, SCRQ3, SCRQ4, comprise inductance L 1, triode Q8, diode D1, the one boost booster circuit of bus capacitor C1, comprise inductance L 2, triode Q5, diode D2, the 2nd boost booster circuit of bus capacitor C2, comprise triode Q7, Q6, inductance L 3, the half-bridge circuit of electric capacity C3 and output port of power source OP/L, OP/N.Mains-supplied Port IP/L is electrically connected by silicon controlled rectifier SCRQ4 and inductance L 1, be electrically connected by silicon controlled rectifier SCRQ1 and inductance L 2 simultaneously, mains-supplied Port IP/N and triode Q8 one end are electrically connected, be electrically connected with triode Q5 one end simultaneously, powered battery positive terminal BAT+ is electrically connected by silicon controlled rectifier SCRQ3 and inductance L 1, powered battery negative pole end BAT-is electrically connected by silicon controlled rectifier SCRQ2 and inductance L 1, triode Q7 one end is electrically connected between diode D1 and bus capacitor C1, triode Q6 one end is electrically connected between diode D2 and bus capacitor C2, the triode Q7 other end and the triode Q6 other end are electrically connected, inductance L 3 one end is electrically connected between triode Q7 and triode Q6, inductance L 3 other end is electrically connected output port of power source OP/L, be electrically connected output port of power source OP/N by electric capacity C3 simultaneously.
First line template die group 20 is provided with in described casing 10, heat radiation module 30 and the second wiring board module 40, described first line template die group 20 is installed on the upper sheaf space in described casing 10 inside, described first line template die group 20 comprises first line plate 21, second wiring board 22 and tertiary circuit plate 23, described first line plate 21 is provided with power semiconductor silicon controlled rectifier SCRQ1, SCRQ2, SCRQ3 and SCRQ4, described second wiring board 22 is provided with power semiconductor triode Q5, Q8, and diode D1, D2, described tertiary circuit plate 23 is provided with power semiconductor triode Q7 and Q6.
Described heat radiation module 30 fixing is connected to below described first line template die group 20, described heat radiation module 30 comprises metal stator 31 and fin 32, described stator 31 is fixed on described casing 10, described fin 32 is fastened in described stator 31 upper end, power semiconductor on described first line plate 21, second wiring board 22 and tertiary circuit plate 23 is fixed on described fin 32, distributes with the heat produced by power semiconductor.
Described second wiring board module 40 is installed on described casing 10 bottom space, described second wiring board module 40 comprises the 4th wiring board 41, described 4th wiring board 41 is arranged at below described heat radiation module 30, and described 4th wiring board 41 is provided with inductance L 1, L2, L3, bus capacitor C1, C2 and electric capacity C3.
The present invention is when described casing 10 internal circuit breaks down, because the inductance L 1 on heat radiation module 30 and the 4th wiring board 41, L2, L3, bus capacitor C1, C2 and electric capacity C3 are not rapid wear device, fault occurs in the power semiconductor of rapid wear in first line template die group 20, now only need change the inefficacy wiring board in first line template die group 20, simultaneously, first line template die group 20 is arranged at the upper sheaf space in described casing 10 inside, and the maintenance personal that is more convenient for observes and carries out replacement operation.
In sum, the inductance of not rapid wear, electric capacity and heat radiation module 20 are separated setting with the power semiconductor of rapid wear by the uninterrupted power supply of modular of the present invention, when breaking down at circuit, only need change the inefficacy wiring board of the first line template die group 20 being placed in the upper sheaf space in described casing 10 inside, alleviate the weight of maintenance extension wire plate, be convenient for changing inefficacy wiring board, accelerate maintenance response speed, avoid causing the wasting of resources when inefficacy wiring board is scrapped simultaneously.
The above embodiment only have expressed one embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as limitation of the scope of the invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with claims.
Claims (1)
1. the uninterrupted power supply of a modular, be made up of a casing (10), first line template die group (20) and heat radiation module (30) is provided with in described casing (10), it is characterized in that: in described casing (10), be also provided with the second wiring board module (40), described first line template die group (20) is installed on sheaf space on described casing (10) inside, described first line template die group (20) is provided with power semiconductor, described heat radiation module (30) fixing is connected to described first line template die group (20) below, described second wiring board module (40) is installed on described casing (10) bottom space, described second wiring board module (40) is provided with inductance or electric capacity,
Described first line template die group (20) comprises first line plate (21), the second wiring board (22) and tertiary circuit plate (23), and described first line plate (21), the second wiring board (22) and tertiary circuit plate (23) are respectively arranged with power semiconductor;
Described heat radiation module (30) comprises stator (31) and fin (32), described stator (31) is fixed on described casing (10), and described fin (32) is fastened in described stator (31) upper end; Power semiconductor on the first line plate (21) of described first line template die group (20), the second wiring board (22) and tertiary circuit plate (23) is fixed on described fin (32);
Described second wiring board module (40) comprises the 4th wiring board (41), described 4th wiring board (41) is arranged at described heat radiation module (30) below, and described 4th wiring board (41) is provided with inductance, bus capacitor and electric capacity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110424024.6A CN103166271B (en) | 2011-12-19 | 2011-12-19 | The uninterrupted power supply of modular |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110424024.6A CN103166271B (en) | 2011-12-19 | 2011-12-19 | The uninterrupted power supply of modular |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103166271A CN103166271A (en) | 2013-06-19 |
| CN103166271B true CN103166271B (en) | 2016-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110424024.6A Active CN103166271B (en) | 2011-12-19 | 2011-12-19 | The uninterrupted power supply of modular |
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| Country | Link |
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| CN (1) | CN103166271B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201986336U (en) * | 2011-04-19 | 2011-09-21 | 广东易事特电源股份有限公司 | An isolation device for an intelligent emergency power supply system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7113405B2 (en) * | 2004-05-27 | 2006-09-26 | Eaton Power Quality Corporation | Integrated power modules with a cooling passageway and methods for forming the same |
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2011
- 2011-12-19 CN CN201110424024.6A patent/CN103166271B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201986336U (en) * | 2011-04-19 | 2011-09-21 | 广东易事特电源股份有限公司 | An isolation device for an intelligent emergency power supply system |
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| Publication number | Publication date |
|---|---|
| CN103166271A (en) | 2013-06-19 |
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