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CN103235363A - Array waveguide grating demodulation integration micro system - Google Patents

Array waveguide grating demodulation integration micro system Download PDF

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CN103235363A
CN103235363A CN2013101386461A CN201310138646A CN103235363A CN 103235363 A CN103235363 A CN 103235363A CN 2013101386461 A CN2013101386461 A CN 2013101386461A CN 201310138646 A CN201310138646 A CN 201310138646A CN 103235363 A CN103235363 A CN 103235363A
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waveguide
grating
array
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waveguide grating
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李鸿强
董夏叶
白曜亭
李洋
刘宇
周文骞
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Tiangong University
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Tianjin Polytechnic University
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Abstract

本发明公开了一种阵列波导光栅解调集成微系统,包括C波段片上LED光源,2×2光波导耦合器,光纤布拉格光栅阵列,1×8阵列波导光栅,光电探测器阵列,该系统利用电子束曝光和反应耦合等离子工艺,在SOI晶片上制作耦合器和阵列波导光栅,将InP材料制作的LED光源发出的光通过光栅耦合至耦合器波导1,再经耦合器波导2进入光纤布拉格光栅阵列,光纤布拉格光栅阵列反射光再经耦合器波导3进入阵列波导光栅,阵列波导光栅输出波导的光也是通过光栅耦合至其上方的InGaAs光电探测器阵列。本发明公开的阵列波导光栅解调集成微系统具有结构紧凑、器件一体化、成本较低、解调精度高、速度快、提高光路稳定性和可靠性等优点。

The invention discloses an arrayed waveguide grating demodulation integrated microsystem, which includes a C-band on-chip LED light source, a 2×2 optical waveguide coupler, a fiber Bragg grating array, a 1×8 arrayed waveguide grating, and a photodetector array. Electron beam exposure and reaction coupled plasma process, fabricate coupler and arrayed waveguide grating on SOI wafer, couple the light emitted by LED light source made of InP material to coupler waveguide 1 through grating, and then enter fiber Bragg grating through coupler waveguide 2 The light reflected by the fiber Bragg grating array enters the arrayed waveguide grating through the coupler waveguide 3, and the light output from the arrayed waveguide grating is also coupled to the InGaAs photodetector array above it through the grating. The arrayed waveguide grating demodulation integrated microsystem disclosed by the invention has the advantages of compact structure, device integration, low cost, high demodulation precision, high speed, improved optical path stability and reliability, and the like.

Description

一种阵列波导光栅解调集成微系统An Arrayed Waveguide Grating Demodulation Integrated Microsystem

技术领域technical field

本发明涉及阵列波导光栅解调微系统异构集成研究,属于光电子集成领域。The invention relates to the research on the heterogeneous integration of arrayed waveguide grating demodulation microsystems, and belongs to the field of optoelectronic integration.

背景技术Background technique

国外对光纤布拉格光栅传感技术的研究较早,在发达国家已基本上实现了光纤布拉格光栅传感器的商业化、工程化。目前国外应用光纤布拉格光栅传感器最多的领域是桥梁的安全监测,同时光纤布拉格光栅传感技术的应用也逐步延伸到了电力、石油、石化等各个工业领域。国内在70年代末开始光纤布拉格光栅传感器的研究,目前已有上百家单位在这一领域开展研究工作。光纤布拉格光栅传感器在我国部分行业已得到应用,可以用来测量应变、温度、压力以及一切可以转换为应变或温度的物理量。The research on fiber Bragg grating sensing technology abroad is earlier, and the commercialization and engineering of fiber Bragg grating sensors have been basically realized in developed countries. At present, the most widely used field of fiber Bragg grating sensors in foreign countries is the safety monitoring of bridges. At the same time, the application of fiber Bragg grating sensing technology has gradually extended to various industrial fields such as electric power, petroleum, and petrochemical. Domestic research on fiber Bragg grating sensors began in the late 1970s. At present, hundreds of units have carried out research work in this field. Fiber Bragg grating sensors have been applied in some industries in my country, and can be used to measure strain, temperature, pressure and all physical quantities that can be converted into strain or temperature.

目前光纤布拉格光栅解调系统体积较大、价格昂贵等限制了光纤布拉格光栅传感技术的推广应用。阵列波导光栅解调方法是一种极具潜力的新型光纤布拉格光栅解调方法,具有精度高、解调速度快等特点。本发明对阵列波导光栅解调系统的光源、光波导耦合器、阵列波导光栅、光电探测器进行异构集成。异构集成后的阵列波导光栅解调集成微系统具有结构紧凑、器件一体化、集成度较高、成本较低,提高光路的稳定性和可靠性等优点。本发明必将对光纤布拉格光栅传感解调领域的发展起到重要推动作用,同时对于未来全硅光电子集成芯片的研究也具有重要意义。阵列波导光栅解调集成微系统可以被广泛应用于桥梁、建筑物、健康监测、石油工业等领域,甚至于将阵列波导光栅解调集成微系统植入到服装中,完成人体生理参数的实时测量,这对于人体感染性、肿瘤、心脏等疾病的及时诊断和治疗也具有重要的意义和应用价值,进一步拓展光纤布拉格光栅传感技术在面向健康、生命科学和航空航天上的应用。At present, the fiber Bragg grating demodulation system is large in size and expensive, which limits the popularization and application of fiber Bragg grating sensing technology. The arrayed waveguide grating demodulation method is a new type of fiber Bragg grating demodulation method with great potential, which has the characteristics of high precision and fast demodulation speed. The invention performs heterogeneous integration on the light source, the optical waveguide coupler, the array waveguide grating and the photodetector of the arrayed waveguide grating demodulation system. The arrayed waveguide grating demodulation integrated microsystem after heterogeneous integration has the advantages of compact structure, device integration, high integration, low cost, and improved stability and reliability of the optical path. The invention will surely play an important role in promoting the development of the fiber Bragg grating sensing and demodulation field, and meanwhile has great significance for the research of future all-silicon optoelectronic integrated chips. The arrayed waveguide grating demodulation integrated microsystem can be widely used in bridges, buildings, health monitoring, petroleum industry and other fields, and even the arrayed waveguide grating demodulation integrated microsystem is implanted into clothing to complete the real-time measurement of human physiological parameters , which is also of great significance and application value for the timely diagnosis and treatment of human infectious diseases, tumors, heart and other diseases, and further expands the application of fiber Bragg grating sensing technology in health, life sciences and aerospace.

发明内容Contents of the invention

本发明的目的在于解决光纤布拉格光栅解调系统体积较大、价格昂贵等问题,提供一种结构紧凑、解调精度高、解调速度快、成本较低的阵列波导光栅解调集成微系统。The purpose of the present invention is to solve the problems of large volume and high price of the fiber Bragg grating demodulation system, and provide an arrayed waveguide grating demodulation integrated microsystem with compact structure, high demodulation accuracy, fast demodulation speed and low cost.

本发明通过以下技术方案实现:The present invention is realized through the following technical solutions:

(1)C波段片上LED光源的基本结构为在InP衬底上连续生长4层,依次为n-InP缓冲层、InGaAsP有源层、p-InP限制层和p-InGaAsP顶层。C波段片上LED光源发光中心波长为1550nm,在正偏电压为0.8V时,发光功率为2mW,波长带宽为100nm。(1) The basic structure of the C-band on-chip LED light source is to continuously grow four layers on the InP substrate, followed by the n-InP buffer layer, the InGaAsP active layer, the p-InP confinement layer and the p-InGaAsP top layer. The central wavelength of the C-band on-chip LED light source is 1550nm. When the forward bias voltage is 0.8V, the luminous power is 2mW and the wavelength bandwidth is 100nm.

(2)采用光栅耦合器将C波段LED光源发出的光耦合至2×2光波导耦合器波导1,在SOI晶片上刻蚀光栅,确定波导层刻蚀深度、光栅周期和占空比,在光栅耦合反方向加分布式布拉格反射镜以提高耦合效率,光栅耦合方向末端通过锥形波导与2×2光波导耦合器波导1相连。(2) Use the grating coupler to couple the light emitted by the C-band LED light source to the waveguide 1 of the 2×2 optical waveguide coupler, etch the grating on the SOI wafer to determine the etching depth, grating period and duty cycle of the waveguide layer. A distributed Bragg reflector is added to the opposite direction of the grating coupling to improve the coupling efficiency, and the end of the grating coupling direction is connected to the waveguide 1 of the 2×2 optical waveguide coupler through a tapered waveguide.

(3)在SO1晶片上制作工作在1550nm中心波长的2×2光波导耦合器,通过波导1接收光栅衍射的光,通过波导2将光引入光纤布拉格光栅阵列,再通过波导2、3将光纤布拉格光栅阵列反射回来的光引入1×8阵列波导光栅。2×2光波导耦合器附加损耗不大于0.5dB,不均匀性不大于0.1dB,尺寸不大于6×100μm2,分光比接近50∶50,使得1×8阵列波导光栅接收尽可能多的光。(3) Fabricate a 2×2 optical waveguide coupler with a center wavelength of 1550nm on the SO1 chip, receive the light diffracted by the grating through the waveguide 1, introduce the light into the fiber Bragg grating array through the waveguide 2, and then pass the optical fiber through the waveguides 2 and 3 The light reflected by the Bragg grating array is introduced into the 1×8 arrayed waveguide grating. The additional loss of the 2×2 optical waveguide coupler is not more than 0.5dB, the non-uniformity is not more than 0.1dB, the size is not more than 6×100μm 2 , and the splitting ratio is close to 50:50, so that the 1×8 arrayed waveguide grating can receive as much light as possible .

(4)在SOI晶片上制作工作在1550nm中心波长的1×8阵列波导光栅,其结构为马鞍型,插入损耗不大于25.5dB,串扰不大于3.2dB,尺寸不大于270μm×390μm。在1×8阵列波导光栅输入平板波导前端接一段锥形多模波导,在锥形多模干涉耦合器之前和阵列波导光栅输出平板波导之后各插入一段锥形预展宽波导,得到光谱平坦化的1×8阵列波导光栅,可获得具有低色度色散的平坦化光谱,降低阵列波导光栅的输出光谱串扰。(4) Fabricate a 1×8 arrayed waveguide grating working at a center wavelength of 1550nm on an SOI wafer, with a saddle-shaped structure, insertion loss not greater than 25.5dB, crosstalk not greater than 3.2dB, and size not greater than 270μm×390μm. A tapered multimode waveguide is connected to the front end of the 1×8 arrayed waveguide grating input slab waveguide, and a section of tapered pre-stretched waveguide is inserted before the tapered multimode interference coupler and after the arrayed waveguide grating output slab waveguide to obtain spectral flattening. 1×8 arrayed waveguide grating, which can obtain a flattened spectrum with low chromatic dispersion, and reduce the output spectral crosstalk of the arrayed waveguide grating.

(5)采用光栅耦合器将SOI波导内传播的光垂直衍射至其上方的光电探测器阵列。光电探测器以InGaAs/InP为材料,在InP衬底上连续生长3层,依次为:n-InP缓冲层、i-InGaAs本征吸收层、p-InP盖层。光电探测器尺寸不大于460×460×170μm3,在5V偏压下的暗电流小于0.5nA,灵敏度约为3nW,光敏面积为40μm,在1.1μm-1.65μm波段响应度超过0.9A/W;(5) The grating coupler is used to vertically diffract the light propagating in the SOI waveguide to the photodetector array above it. The photodetector is made of InGaAs/InP, and three layers are continuously grown on the InP substrate, which are: n-InP buffer layer, i-InGaAs intrinsic absorption layer, and p-InP capping layer. The size of the photodetector is not larger than 460×460×170μm 3 , the dark current under 5V bias is less than 0.5nA, the sensitivity is about 3nW, the photosensitive area is 40μm, and the responsivity in the 1.1μm-1.65μm band exceeds 0.9A/W;

在上述步骤(1)中,建立发光中心波长为1550nm的InP基片上LED光源模型,利用Silvaco仿真软件对LED结构进行模拟仿真,求解LED光谱曲线。In the above step (1), an LED light source model on an InP substrate with a luminous center wavelength of 1550nm is established, and Silvaco simulation software is used to simulate the LED structure and solve the LED spectral curve.

在上述步骤(2)中,建立光栅耦合器模型,基于FDTD算法对光栅耦合器进行模拟仿真,计算其耦合效率。在光源垂直照射的情况下,光栅耦合效率不低于40%。In the above step (2), the grating coupler model is established, and the grating coupler is simulated based on the FDTD algorithm to calculate its coupling efficiency. In the case of vertical illumination of the light source, the coupling efficiency of the grating is not lower than 40%.

在上述步骤(3)中,建立2×2光波导耦合器数学模型,确定其基本参数,在保证传输效率的前提下实现与1×8阵列波导光栅的互连。应用光束传播法(BPM)对2×2光波导耦合器进行仿真、优化设计,以减小其附加损耗,改善其偏振特性和不均匀性,使得所设计的2×2光波导耦合器附加损耗小于0.5dB,不均匀性小于0.1dB,尺寸不大于6×100μm2。导出2×2光波导耦合器版图,确定SOI晶片参数,利用电子束曝光和反应耦合等离子工艺,进行光刻板的制作。In the above step (3), the mathematical model of the 2×2 optical waveguide coupler is established, its basic parameters are determined, and the interconnection with the 1×8 arrayed waveguide grating is realized on the premise of ensuring the transmission efficiency. The beam propagation method (BPM) is used to simulate and optimize the design of the 2×2 optical waveguide coupler to reduce its additional loss, improve its polarization characteristics and inhomogeneity, and make the additional loss of the designed 2×2 optical waveguide coupler Less than 0.5dB, non-uniformity less than 0.1dB, size not larger than 6×100μm 2 . The layout of the 2×2 optical waveguide coupler is derived, the parameters of the SOI wafer are determined, and the photolithography plate is made by electron beam exposure and reactive coupled plasma technology.

在上述步骤(4)中,基于光束传输法的传输理论,对1×8阵列波导光栅的结构组成、衍射级数、相邻阵列波导的长度差、平板波导的焦距和自由光谱区等参数进行设计,建立1×8阵列波导光栅数学模型,并对其进行优化设计,使其光谱分布均匀,损耗不大于3.2dB,串扰不大于25.5dB,尺寸不大于270μm×390μm。相比于同等微米级的阵列波导光栅,损耗和串扰有所减小。设计光谱平坦化的1×8阵列波导光栅,以获得具有低色度色散的平坦化光谱,降低输出光谱的串扰。导出1×8阵列波导光栅的版图,确定SOI晶片参数,利用电子束曝光和反应耦合等离子工艺,完成1×8阵列波导光栅的制作。In the above step (4), based on the transmission theory of the beam transmission method, parameters such as the structural composition, diffraction order, length difference of adjacent array waveguides, focal length and free spectral region of the 1×8 arrayed waveguide grating were analyzed. Design, establish a mathematical model of 1×8 arrayed waveguide grating, and optimize the design to make its spectral distribution uniform, the loss not greater than 3.2dB, the crosstalk not greater than 25.5dB, and the size not greater than 270μm×390μm. Loss and crosstalk are reduced compared to equivalent micron-scale arrayed waveguide gratings. A 1×8 arrayed waveguide grating for spectral flattening is designed to obtain a flattened spectrum with low chromatic dispersion and reduce the crosstalk of the output spectrum. The layout of the 1×8 arrayed waveguide grating is derived, the parameters of the SOI wafer are determined, and the fabrication of the 1×8 arrayed waveguide grating is completed by electron beam exposure and reactive coupled plasma technology.

在上述步骤(5)中,建立InP基光电探测器模型,为消除电极对光的有害吸收以及满足光耦合的相位匹配条件,分别对电极结构和本征吸收层厚度进行改进和优化,利用Silvaco仿真软件对光电探测器结构进行模拟仿真,光电探测器灵敏度约为3nW,在1.1μm-1.65μm波段响应度超过0.9A/W。In the above step (5), the InP-based photodetector model is established. In order to eliminate the harmful absorption of light by the electrode and meet the phase matching conditions of optical coupling, the electrode structure and the thickness of the intrinsic absorption layer are respectively improved and optimized. Silvaco The simulation software simulates the structure of the photodetector. The sensitivity of the photodetector is about 3nW, and the responsivity in the 1.1μm-1.65μm band exceeds 0.9A/W.

本发明的阵列波导光栅解调集成微系统效果和益处是:提供一种极具潜力的新型光纤布拉格光栅解调方法,具有结构紧凑、器件一体化、集成度较高、成本较低、提高光路的稳定性和可靠性等优点。The effect and benefits of the arrayed waveguide grating demodulation integrated microsystem of the present invention are: to provide a new type of fiber Bragg grating demodulation method with great potential, which has the advantages of compact structure, device integration, high integration, low cost, and improved optical path. advantages of stability and reliability.

附图说明Description of drawings

图1是阵列波导光栅解调集成微系统示意图;Figure 1 is a schematic diagram of an arrayed waveguide grating demodulation integrated microsystem;

图2是C波段片上LED光源结构示意图;Figure 2 is a schematic diagram of the structure of the C-band on-chip LED light source;

图3是光源与光栅耦合器连接示意图;Fig. 3 is a schematic diagram of the connection between the light source and the grating coupler;

图4是光栅耦合器结构示意图;Fig. 4 is a structural schematic diagram of a grating coupler;

图5是2×2多模干涉耦合器版图;Figure 5 is a layout of a 2×2 multimode interference coupler;

图6是2×2多模干涉耦合器光场和光功率分布图;Fig. 6 is a 2 * 2 multimode interference coupler optical field and optical power distribution diagram;

图7是2×2多模干涉耦合器实物图;Figure 7 is a physical diagram of a 2×2 multimode interference coupler;

图8是马鞍型1×8阵列波导光栅版图;Figure 8 is the saddle-shaped 1×8 arrayed waveguide grating layout;

图9是1×8阵列波导光栅输出光谱图;Fig. 9 is a 1×8 arrayed waveguide grating output spectrum diagram;

图10是光谱平坦化的1×8阵列波导光栅版图;Figure 10 is a spectrum flattened 1 × 8 arrayed waveguide grating layout;

图11是1×8阵列波导光栅扫描电镜图;Figure 11 is a scanning electron microscope image of a 1×8 arrayed waveguide grating;

图12是光电探测器结构示意图;Fig. 12 is a structural schematic diagram of a photodetector;

图13是光电探测器与光栅耦合器连接示意图;Fig. 13 is a schematic diagram of the connection between the photodetector and the grating coupler;

图14是实验测试所得2×2多模干涉耦合器输出光谱图;Figure 14 is the output spectrum diagram of the 2×2 multimode interference coupler obtained in the experimental test;

图15是实验测试所得1×8阵列波导光栅输出光谱图。Fig. 15 is the output spectrum diagram of the 1×8 arrayed waveguide grating obtained in the experimental test.

具体实施方式Detailed ways

以下结合技术方案和附图详细叙述本发明的具体实施例。Specific embodiments of the present invention will be described in detail below in conjunction with technical solutions and accompanying drawings.

本发明将LED光源,2×2光波导耦合器,光纤布拉格光栅阵列,1×8阵列波导光栅,光电探测器阵列进行异构集成,图1是阵列波导光栅解调集成微系统示意图,具体实施步骤为:The present invention carries out heterogeneous integration of LED light source, 2×2 optical waveguide coupler, fiber Bragg grating array, 1×8 arrayed waveguide grating, and photodetector array. The steps are:

1.C波段片上LED光源1. C-band on-chip LED light source

InP基C波段片上LED光源的基本结构如图2所示,在InP衬底上连续生长4层,依次为n-InP缓冲层、InGaAsP有源层、p-InP限制层和p-InGaAsP顶层,n-InP缓冲层厚度为0.5μm,InGaAsP有源层厚度为0.1μm,p-InP限制层厚度为0.5μm,p-InGaAsP顶层厚度为0.5μm。利用Silvaco仿真软件对LED进行建模、仿真,得到LED的基本结构、输出光谱曲线以及输出光功率曲线。在正偏电压为0.8V时,LED最大正偏电流为100mA,发光功率为2mW,波长带宽为100nm。采用2×2LED阵列作为阵列波导光栅解调集成微系统的输入光源。The basic structure of the InP-based C-band on-chip LED light source is shown in Figure 2. Four layers are grown continuously on the InP substrate, which are n-InP buffer layer, InGaAsP active layer, p-InP confinement layer and p-InGaAsP top layer. The thickness of the n-InP buffer layer is 0.5 μm, the thickness of the InGaAsP active layer is 0.1 μm, the thickness of the p-InP confinement layer is 0.5 μm, and the thickness of the p-InGaAsP top layer is 0.5 μm. Using Silvaco simulation software to model and simulate the LED, the basic structure, output spectrum curve and output optical power curve of the LED are obtained. When the forward bias voltage is 0.8V, the maximum forward bias current of the LED is 100mA, the luminous power is 2mW, and the wavelength bandwidth is 100nm. A 2×2 LED array is used as the input light source of the arrayed waveguide grating demodulation integrated microsystem.

2.光栅耦合器2. Grating coupler

采用光栅耦合法将C波段片上LED光源与2×2光波导耦合器波导1进行耦合。图3中片上LED光源垂直照射到光栅耦合器,通过光栅将光衍射进入2×2光波导耦合器波导1。图4中在SOI晶片上刻蚀光栅,波导层刻蚀深度为50nm,周期为570nm,占空比为0.74,在光栅耦合反方向加分布式布拉格反射镜以提高耦合效率,光栅耦合方向末端通过锥形波导与2×2光波导耦合器波导1相连,从而实现光源与2×2光波导耦合器波导1的耦合。根据上述参数建立光栅耦合器模型,利用FDTD算法对光栅耦合器进行模拟仿真。在光源垂直照射的情况下,耦合效率可达到49%。The C-band on-chip LED light source is coupled with the 2×2 optical waveguide coupler waveguide 1 by grating coupling method. In Figure 3, the on-chip LED light source is vertically irradiated to the grating coupler, and the light is diffracted into the waveguide 1 of the 2×2 optical waveguide coupler through the grating. In Figure 4, the grating is etched on the SOI wafer. The etching depth of the waveguide layer is 50nm, the period is 570nm, and the duty cycle is 0.74. A distributed Bragg reflector is added in the opposite direction of the grating coupling to improve the coupling efficiency. The end of the grating coupling direction passes through The tapered waveguide is connected with the waveguide 1 of the 2×2 optical waveguide coupler, so as to realize the coupling of the light source and the waveguide 1 of the 2×2 optical waveguide coupler. The grating coupler model is established according to the above parameters, and the FDTD algorithm is used to simulate the grating coupler. In the case of vertical illumination of the light source, the coupling efficiency can reach 49%.

3.2×2光波导耦合器3.2×2 Optical Waveguide Coupler

2×2光波导耦合器采用SOI基2×2多模干涉耦合器。多模干涉耦合器输入/输出波导采用倒锥形,锥形波导大端宽度均设为1μm。为与阵列波导光栅输入波导尺寸相匹配,将和阵列波导光栅相连的锥形波导末端宽度设为0.35μm。其余锥形波导的末端宽度设为0.65μm。图5中耦合器尺寸为6μm×100μm,其中多模干涉区尺寸为6μm×57μm。优化前,耦合器的附加损耗为1.09dB,不均匀性为0.44dB。优化后,其附加损耗减小,偏振特性得到了明显改善,图6中在TE偏振中心波长为1.55μm时,器件附加损耗为0.46dB,不均匀性为0.06dB。在1.49-1.59μm波长范围内耦合器的附加损耗小于1.55dB。结果表明所设计的2×2多模干涉耦合器具有体积小、附加损耗低、波长响应范围宽、分光均匀等优点。导出2×2光波导耦合器版图,选取顶层硅厚度为0.22μm、掩埋SiO2层厚度为2μm的SOI晶片,利用电子束曝光和反应耦合等离子工艺,进行光刻板的制作,图7为2×2多模干涉耦合器实物图。The 2×2 optical waveguide coupler adopts SOI-based 2×2 multimode interference coupler. The input/output waveguide of the multimode interference coupler adopts an inverted tapered shape, and the width of the large end of the tapered waveguide is set to 1 μm. In order to match the size of the input waveguide of the arrayed waveguide grating, the end width of the tapered waveguide connected to the arrayed waveguide grating is set to 0.35 μm. The end width of the remaining tapered waveguides was set to 0.65 μm. In Figure 5, the size of the coupler is 6 μm×100 μm, and the size of the multimode interference area is 6 μm×57 μm. Before optimization, the additional loss of the coupler is 1.09dB, and the non-uniformity is 0.44dB. After optimization, the additional loss is reduced and the polarization characteristics are significantly improved. In Figure 6, when the TE polarization center wavelength is 1.55μm, the additional loss of the device is 0.46dB, and the non-uniformity is 0.06dB. The additional loss of the coupler is less than 1.55dB in the wavelength range of 1.49-1.59μm. The results show that the designed 2×2 multimode interference coupler has the advantages of small size, low additional loss, wide wavelength response range and uniform light splitting. The layout of the 2×2 optical waveguide coupler is derived, and the SOI wafer with the thickness of the top silicon layer of 0.22 μm and the thickness of the buried SiO 2 layer of 2 μm is selected, and the photolithography plate is made by electron beam exposure and reactive coupled plasma technology. Figure 7 shows the 2× 2 The physical picture of the multimode interference coupler.

4.1×8阵列波导光栅4.1×8 arrayed waveguide grating

SOI基1×8阵列波导光栅采用如图8所示的马鞍型阵列波导光栅结构,波导宽度为0.35μm,器件尺寸仅为267μm×381μm,阵列波导光栅的相邻阵列波导长度差为19.7μm,波导焦距为67μm,自由光谱区为55.39μm。图9表明八个输出通道的中心波长分别为1.5427μm、1.5446μm、1.5461μm、1.548μm、1.550μm、1.5528μm、1.5549μm、1.5567μm,通道间隔约为0.002526μm,光谱分布均匀。所优化设计的1×8阵列波导光栅的插入损耗仅为3.15dB且串扰仅为25.5dB,相比于同等微米级的阵列波导光栅,损耗和串扰均有所减小。The SOI-based 1×8 arrayed waveguide grating adopts a saddle-shaped arrayed waveguide grating structure as shown in Figure 8. The waveguide width is 0.35 μm, the device size is only 267 μm×381 μm, and the length difference between adjacent arrayed waveguides of the arrayed waveguide grating is 19.7 μm. The focal length of the waveguide is 67 μm, and the free spectral region is 55.39 μm. Figure 9 shows that the central wavelengths of the eight output channels are 1.5427 μm, 1.5446 μm, 1.5461 μm, 1.548 μm, 1.550 μm, 1.5528 μm, 1.5549 μm, and 1.5567 μm, the channel interval is about 0.002526 μm, and the spectral distribution is uniform. The insertion loss of the optimally designed 1×8 arrayed waveguide grating is only 3.15dB and the crosstalk is only 25.5dB. Compared with the same micron arrayed waveguide grating, the loss and crosstalk are both reduced.

在1×8阵列波导光栅输入平板波导前端接一段锥形多模波导,在锥形多模干涉耦合器之前和1×8阵列波导光栅输出平板波导之后各插入一段锥形预展宽波导,得到如图10所示的光谱平坦化的1×8阵列波导光栅,可获得具有低色度色散的平坦化光谱,降低了阵列波导光栅的输出光谱串扰。结果表明,光谱平坦化的1×8阵列波导光栅八个输出通道的中心波长分别为1.542μm、1.544μm、1.546μm、1.548μm、1.550μm、1.552μm、1.554μm、1.556μm、1.558μm,通道间隔为2nm,3dB带宽为1.31nm,插入损耗为4.36,串扰约为21.9dB。光谱平坦化后1×8阵列波导光栅通道间隔展宽,相邻通道的串扰降低。A tapered multimode waveguide is connected to the front end of the 1×8 arrayed waveguide grating input slab waveguide, and a section of tapered pre-stretched waveguide is inserted before the tapered multimode interference coupler and after the 1×8 arrayed waveguide grating output slab waveguide. The spectrally flattened 1×8 arrayed waveguide grating shown in FIG. 10 can obtain a flattened spectrum with low chromatic dispersion, which reduces the output spectral crosstalk of the arrayed waveguide grating. The results show that the central wavelengths of the eight output channels of the spectrally flattened 1×8 arrayed waveguide grating are 1.542μm, 1.544μm, 1.546μm, 1.548μm, 1.550μm, 1.552μm, 1.554μm, 1.556μm, 1.558μm. The spacing is 2nm, the 3dB bandwidth is 1.31nm, the insertion loss is 4.36, and the crosstalk is about 21.9dB. After the spectrum is flattened, the channel interval of the 1×8 arrayed waveguide grating is widened, and the crosstalk between adjacent channels is reduced.

导出1×8阵列波导光栅的版图,确定SOI晶片参数,利用电子束曝光和反应耦合等离子工艺,完成1×8阵列波导光栅的制作。图11为1×8阵列波导光栅扫描电镜图。The layout of the 1×8 arrayed waveguide grating is derived, the parameters of the SOI wafer are determined, and the fabrication of the 1×8 arrayed waveguide grating is completed by electron beam exposure and reactive coupled plasma technology. Fig. 11 is a scanning electron microscope image of a 1×8 arrayed waveguide grating.

5.光电探测器阵列5. Photodetector array

InGaAs/InP PIN型光电探测器结构如图12所示,在InP衬底上连续生长3层,依次为:n-InP缓冲层、i-InGaAs本征吸收层、p-InP层。n-InP缓冲层厚度为1μm,i-InGaAs本征吸收层厚度为3μm,p-InP层厚度为1μm。为消除电极对光的有害吸收以及满足光耦合的相位匹配条件,分别对电极结构和本征吸收层厚度进行了改进和优化,并使用Si1vaco仿真软件对光电探测器结构进行模拟仿真。利用硅和III-V族材料的异质集成技术,采用苯并环丁烯(BCB)聚合物晶片粘合工艺,制作出硅基InGaAs/InP PIN型光电探测器。采用光栅耦合器将1×8阵列波导光栅输出波导的光垂直衍射至其上方的光电探测器阵列,图13所示的耦合方式好处在于可以采用比较厚的BCB粘合层。光电探测器尺寸不大于460×460×170μm3,在5V偏压下的暗电流小于0.5nA,灵敏度约为3nW,光敏面积为40μm,在1.1μm-1.65μm波段响应度超过0.9A/W。通过优化和稳定工艺参数,制作出含8个光电探测器的光电探测器阵列。The InGaAs/InP PIN photodetector structure is shown in Figure 12. Three layers are continuously grown on the InP substrate, which are: n-InP buffer layer, i-InGaAs intrinsic absorption layer, and p-InP layer. The thickness of the n-InP buffer layer is 1 μm, the thickness of the i-InGaAs intrinsic absorption layer is 3 μm, and the thickness of the p-InP layer is 1 μm. In order to eliminate the harmful absorption of light by the electrode and meet the phase matching conditions of optical coupling, the electrode structure and the thickness of the intrinsic absorption layer were improved and optimized, and the photodetector structure was simulated using Si1vaco simulation software. Utilizing the heterogeneous integration technology of silicon and III-V materials, the silicon-based InGaAs/InP PIN photodetector is fabricated by using the benzocyclobutene (BCB) polymer wafer bonding process. The grating coupler is used to vertically diffract the light from the output waveguide of the 1×8 arrayed waveguide grating to the photodetector array above it. The advantage of the coupling method shown in Figure 13 is that a relatively thick BCB adhesive layer can be used. The size of the photodetector is not larger than 460×460×170μm 3 , the dark current under 5V bias is less than 0.5nA, the sensitivity is about 3nW, the photosensitive area is 40μm, and the responsivity in the 1.1μm-1.65μm band exceeds 0.9A/W. By optimizing and stabilizing the process parameters, a photodetector array with 8 photodetectors was fabricated.

6.实验测试结果6. Experimental test results

采用端面耦合法对已经制作完成的2×2光波导耦合器和1×8阵列波导光栅进行了测试,使用锥形光纤与光波导进行对接,以提高耦合效率。图14为2×2多模干涉耦合器输出光谱图,其中P为光源输出光谱,PO为光纤对接时光谱,P1、P2分别为2×2光波导耦合器两输出波导的输出光谱。实验结果表明,2×2光波导耦合器的附加损耗为0.5423dB,不均匀性为0.0053dB。图15为1×8阵列波导光栅8个输出通道的输出光谱图,实验结果表明,1×8阵列波导光栅的通道间隔为1.91nm,插入损耗为3.18dB,串扰为-23.1dB,不均匀性为1.35dB。The finished 2×2 optical waveguide coupler and 1×8 arrayed waveguide grating were tested by end-face coupling method, and the tapered optical fiber was used to connect with the optical waveguide to improve the coupling efficiency. Figure 14 is the output spectrum diagram of the 2×2 multimode interference coupler, where P is the output spectrum of the light source, PO is the spectrum when the optical fiber is connected, and P1 and P2 are the output spectra of the two output waveguides of the 2×2 optical waveguide coupler. The experimental results show that the additional loss of the 2×2 optical waveguide coupler is 0.5423dB, and the non-uniformity is 0.0053dB. Figure 15 is the output spectrum of the 8 output channels of the 1×8 arrayed waveguide grating. The experimental results show that the channel spacing of the 1×8 arrayed waveguide grating is 1.91nm, the insertion loss is 3.18dB, the crosstalk is -23.1dB, and the non-uniformity is 1.35dB.

Claims (6)

1. integrated micro-system of array waveguide grating demodulation, it is characterized in that comprising led light source on the C-band sheet that links to each other successively, 2 * 2 optical waveguide couplers, the Fiber Bragg Grating FBG array, 1 * 8 array waveguide grating, photodetector array, above-mentioned each ingredient isomery is integrated on a slice backing material, wherein 2 * 2 optical waveguide couplers and 1 * 8 AWG Fabrication are on the SOI wafer, and C-band led light source, photodetector array are produced on the InP substrate.
2. the integrated micro-system of array waveguide grating demodulation according to claim 1, it is characterized in that: C-band led light source luminescent center wavelength is 1550nm, wavelength bandwidth is 100nm, basic structure is to grow 4 layers continuously on the InP substrate, is followed successively by n-InP cushion, InGaAsP active layer, p-InP limiting layer and p-InGaAsP top layer.
3. the integrated micro-system of array waveguide grating demodulation according to claim 1, it is characterized in that: at 2 * 2 optical waveguide coupler input waveguide place etched diffraction gratings, add distributed bragg reflector mirror in the other direction in the grating coupling, grating coupling direction end links to each other with 2 * 2 optical waveguide coupler waveguides 1 by tapered transmission line, the led light source vertical irradiation is to grating coupler on the C-band sheet, with optical diffraction to 2 * 2 optical waveguide coupler waveguides 1, thus the coupling of realization light source and 2 * 2 optical waveguide coupler waveguides 1.
4. the integrated micro-system of array waveguide grating demodulation according to claim 1, it is characterized in that: make 2 * 2 optical waveguide couplers at the SOI wafer, waveguide 1 links to each other with grating by one section tapered transmission line, waveguide 2 links to each other with the Fiber Bragg Grating FBG array, waveguide 3 links to each other with 1 * 8 array waveguide grating input waveguide, receive the light of optical grating diffraction by waveguide 1, waveguide 2 is introduced the Fiber Bragg Grating FBG array with light, by waveguide 2,3 Fiber Bragg Grating FBG array reflected light is introduced 1 * 8 array waveguide grating again.
5. the integrated micro-system of array waveguide grating demodulation according to claim 1, it is characterized in that: make 1 * 8 array waveguide grating at the SOI wafer, its structure is saddle-shape, input waveguide links to each other with 2 * 2 optical waveguide coupler waveguides 3, output waveguide links to each other with photodetector array, by one section taper multimode waveguide of termination before 1 * 8 array waveguide grating input planar waveguide, before the taper multi-mode interference coupler and after 1 * 8 array waveguide grating output planar waveguide, respectively insert one section pre-broadening waveguide of taper, obtain 1 * 8 array waveguide grating of spectrum planarization, can obtain to have the planarization spectrum of low chromatic dispersion, reduce the output spectrum of array waveguide grating and crosstalk.
6. the integrated micro-system of array waveguide grating demodulation according to claim 1, it is characterized in that: at 1 * 8 array waveguide grating output waveguide place etched diffraction grating, with the light vertical diffraction of 1 * 8 array waveguide grating output waveguide photodetector array to its top, it comprises 8 photodetectors, the light signal of 8 output channels of 1 * 8 array waveguide grating is converted to electric signal, photodetector is substrate with the InP material, on the InP substrate, grow 3 layers continuously, be followed successively by n-InP cushion, i-InGaAs intrinsic absorption layer, p-InP layer.
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Application publication date: 20130807