CN103311163A - Check valve applied to semiconductor storage device - Google Patents
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Abstract
Description
技术领域 technical field
本发明是有关于一种半导体存储设备,特别是有关于一种配置于半导体存储设备中的逆止阀;其中,半导体存储设备可以是掩膜盒或是晶圆盒。The present invention relates to a semiconductor storage device, in particular to a check valve configured in the semiconductor storage device; wherein, the semiconductor storage device may be a mask box or a wafer box.
背景技术 Background technique
近代半导体科技发展迅速,其中光学光刻技术(Optical Lithography)扮演重要的角色,只要是关于图形(pattern)定义,皆需仰赖光学光刻技术。光学光刻技术在半导体的应用上,是将设计好的线路制作成具有特定形状可透光的掩膜(photo mask)。利用曝光原理,则光源通过掩膜投影至硅晶圆(silicon wafer)可曝光显示特定图案。由于任何附着于掩膜上的尘埃颗粒(如微粒、粉尘或有机物)都会造成投影成像的质量劣化,用于产生图形的掩膜必须保持绝对洁净,而被投射的硅晶圆或者其他半导体投射体亦必须保持绝对清静,因此在一般的晶圆工艺中,都提供无尘室(cleanroom)的环境以避免空气中的颗粒污染。然而,目前的无尘室也无法达到绝对无尘状态。The rapid development of modern semiconductor technology, in which optical lithography (Optical Lithography) plays an important role, as long as it is about the definition of patterns, it needs to rely on optical lithography. In the application of optical lithography technology to semiconductors, the designed circuit is made into a light-transmitting mask (photo mask) with a specific shape. Using the exposure principle, the light source is projected onto the silicon wafer (silicon wafer) through a mask to expose and display a specific pattern. Since any dust particles (such as particles, dust or organic matter) attached to the mask will cause the quality of projection imaging to deteriorate, the mask used to generate graphics must be kept absolutely clean, and the projected silicon wafer or other semiconductor projection body It must also be kept absolutely quiet, so in general wafer processes, a cleanroom environment is provided to avoid particle contamination in the air. However, the current clean room cannot achieve absolute dust-free status.
因此,现代的半导体工艺皆利用抗污染的存储设备进行掩膜及晶圆的保存与运输,以使掩膜及晶圆保持洁净;也利用抗污染的半导体元件存储设备进行半导体元件的保存与运输,以使半导体元件保持洁净。Therefore, modern semiconductor processes use anti-pollution storage equipment for storage and transportation of masks and wafers to keep masks and wafers clean; anti-pollution semiconductor storage equipment is also used for storage and transportation of semiconductor components , to keep semiconductor components clean.
半导体元件存储设备是在半导体工艺中用于存放半导体元件,以利半导体元件在机台之间的搬运与传送,并隔绝半导体元件与大气的接触,避免半导体元件被杂质污染而产生变化。因此,在先进的半导体元件厂中,通常会要求掩膜存储设备与半导体元件存储设备的洁净度要符合机械标准接口(Standard Mechanical Interface;SMIF),也就是说保持洁净度在Class 1以下。故,在掩膜存储设备与半导体元件存储设备中充入气体便是目前解决的手段之一。Semiconductor component storage equipment is used to store semiconductor components in the semiconductor process, to facilitate the handling and transmission of semiconductor components between machines, and to isolate the semiconductor components from contact with the atmosphere, and to prevent the semiconductor components from being polluted by impurities and changing. Therefore, in advanced semiconductor component factories, the cleanliness of mask storage equipment and semiconductor component storage equipment is usually required to comply with the Standard Mechanical Interface (SMIF), that is to say, to keep the cleanliness below
一般会经由逆止阀来对存储设备进行充气及抽气的动作,如图1所示,阀体通常具有一阀体a配置于阀体收纳筒b内,一压扣c,一弹性结构d夹于阀体a及弹性结构d之间,及一滤器e,配置于压扣c后方;当要对逆止阀充气时,会按压阀体a,使阀体a脱离阀体收纳筒b形成一通道,气体便经由通道通过阀体收纳筒b,在经由压扣c及后方的滤器e进入存储设备内;而当停止充气时,停止按压阀体a,通过弹性结构d将阀体a弹回阀体收纳筒b,以形成封闭状态。Generally, the storage device is inflated and pumped through the check valve. As shown in Figure 1, the valve body usually has a valve body a disposed in the valve body storage tube b, a buckle c, and an elastic structure d It is sandwiched between the valve body a and the elastic structure d, and a filter e is arranged behind the buckle c; when the check valve is to be inflated, the valve body a will be pressed, so that the valve body a is separated from the valve body storage tube b to form Once there is a channel, the gas passes through the valve body storage tube b through the channel, and enters the storage device through the buckle c and the rear filter e; when the inflation is stopped, stop pressing the valve body a, and bounce the valve body a through the elastic structure d Return to the valve body storage tube b to form a closed state.
然而,经由阀体a多次的运作后,会与逆止阀多个元件产生多次摩擦,因此容易产生许多的微粒(Particle),而微粒便会污染存放于存储设备内的掩膜及晶圆,会使得掩膜或晶圆遭受到污染,导致无法再使用而必须报废的窘境,使得制造成本增加。因此提供一个不会产生污染物的充气设备,是一个重要的议题。However, after many times of operation of the valve body a, it will rub against the components of the check valve for many times, so it is easy to generate a lot of particles, and the particles will contaminate the mask and crystal stored in the storage device. If the wafer is not round, the mask or wafer will be polluted, resulting in the dilemma that it cannot be used anymore and must be scrapped, which will increase the manufacturing cost. Therefore, it is an important issue to provide an inflatable device that does not generate pollutants.
有鉴于此,本发明所提供掩膜存储设备与晶圆存储设备的逆止阀,乃针对先前技术加以改良。In view of this, the non-return valves of the mask storage device and the wafer storage device provided by the present invention are improvements to the prior art.
发明内容 Contents of the invention
为了解决上述问题,本发明的一主要目的在于提供一种逆止阀配置于晶圆盒内,通过具有弹性的单一元件本身的开合,防止过多微粒产生,以避免污染晶圆盒内的晶圆。In order to solve the above problems, a main purpose of the present invention is to provide a check valve arranged in the wafer box, through the opening and closing of the elastic single element itself, to prevent the generation of excessive particles, so as to avoid contamination of the wafer box. wafer.
依据上述目的,本发明提供一种晶圆盒,主要包括一盒体,在盒体的一侧面是形成一开口,及一门体,门体是与开口相结合,并形成一容置空间,提供晶圆放置,其中晶圆盒的特征在于:在盒体内配置至少一对逆止阀,每一逆止阀包括一圆形柱及一逆止件,圆形柱为一中空柱体,并将逆止件嵌置在圆形柱内,其中逆止件包括:一圆形穹顶体,具有一隆起顶端及一圆形底端;一圆环,形成并环绕于圆形底端;及至少一条切割线,由隆起顶端的中央处往圆形底端延伸。According to the above purpose, the present invention provides a wafer box, which mainly includes a box body, an opening is formed on one side of the box body, and a door body, the door body is combined with the opening to form an accommodating space, Wafer placement is provided, wherein the wafer box is characterized in that: at least a pair of check valves are arranged in the box body, each check valve includes a circular column and a check piece, the circular column is a hollow cylinder, and The backstop is embedded in the circular column, wherein the backstop includes: a circular dome with a raised top and a circular bottom; a ring formed and surrounding the circular bottom; and at least A cut line extending from the center of the raised top to the rounded bottom.
本发明的另一主要目的在于提供一种逆止阀配置于掩膜盒内,通过单一元件本身的开合,防止过多微粒产生,以避免污染掩膜盒内的掩膜。Another main purpose of the present invention is to provide a non-return valve disposed in the mask box, through the opening and closing of a single element itself, to prevent excessive particles from being generated, so as to avoid contamination of the mask in the mask box.
依据上述目的,本发明提供一种掩膜盒,主要包括一上盖及一下盖,上盖是与下盖相结合,并形成一容置空间,提供掩膜放置,其中掩膜盒的特征在于:在掩膜盒内配置至少一对逆止阀,每一逆止阀包括一圆形柱及一逆止件,圆形柱为一中空柱体,并将逆止件嵌置在圆形柱内,其中逆止件包括:一圆形穹顶体,具有一隆起顶端及一圆形底端;一圆环,形成并环绕于圆形底端;及至少一条切割线,由隆起顶端的中央处往圆形底端延伸。According to the above purpose, the present invention provides a mask box, which mainly includes an upper cover and a lower cover. The upper cover is combined with the lower cover to form an accommodating space for placing the mask. The mask box is characterized in that : Dispose at least one pair of check valves in the mask box, each check valve includes a circular post and a check piece, the round post is a hollow cylinder, and the check piece is embedded in the round post Inside, wherein the backstop includes: a circular dome with a raised top and a rounded bottom; a ring formed and encircled around the rounded bottom; and at least one cutting line extending from the center of the raised top Extend towards the rounded bottom.
经由本发明所提供的设计,使晶圆盒及掩膜盒在进行充气及抽气的动作时,可防止过多微粒产生,以避免污染存储设备内的半导体元件。Through the design provided by the present invention, when the wafer box and the mask box are inflated and pumped, excessive particles can be prevented from polluting the semiconductor elements in the storage device.
附图说明 Description of drawings
为能更清楚地说明本发明,以下列举较佳实施例并配合附图详细说明如后,其中:In order to illustrate the present invention more clearly, preferred embodiments are listed below and described in detail in conjunction with the accompanying drawings, wherein:
图1是为已知逆止阀示意图;Fig. 1 is a schematic diagram of a known check valve;
图2是为本发明的逆止阀示意图;Fig. 2 is a schematic diagram of a check valve of the present invention;
图3A是为本发明的逆止件充气示意图;Fig. 3A is a schematic diagram of inflating the backstop of the present invention;
图3B是为本发明的逆止件停止充气示意图;Fig. 3B is a schematic diagram of stopping inflation of the backstop of the present invention;
图4是为本发明安装于晶圆盒的逆止阀示意图;Fig. 4 is a schematic diagram of the check valve installed in the wafer box for the present invention;
图5是为本发明安装于掩膜盒的逆止阀剖示图。FIG. 5 is a cross-sectional view of a check valve installed in a mask box according to the present invention.
具体实施方式 Detailed ways
由于本发明是揭露一种逆止阀,特别是配置于晶圆盒及掩膜盒的逆止阀;其中所利用到的一些关于弹性材质、过滤膜,是利用现有技术来达成,故在下述说明中,并不作完整描述。此外,于下述内文中的附图,亦并未依据实际的相关尺寸完整绘制,其作用仅在表达与本发明特征有关的示意图。Since the present invention discloses a check valve, especially a check valve configured in a wafer box and a mask box; some of the elastic materials and filter membranes used in it are achieved by using the existing technology, so the following In the above description, it is not fully described. In addition, the drawings in the following texts are not completely drawn according to the actual relevant dimensions, and their function is only to express the schematic diagrams related to the features of the present invention.
首先,请参阅图2,是为本发明的逆止阀示意图。如图2所示,逆止阀1包括一圆形柱10及一逆止件20,圆形柱10为一中空柱体,并将逆止件20嵌置在圆形柱10内,其中逆止件20包括:一圆形穹顶体201具有一隆起顶端2011及一圆形底端2013;一圆环203,形成并环绕于圆形底端2013;至少一条切割线205,由隆起顶端2011的中央处2015往圆形底端2013延伸;本发明的切割线205为多条直线形状切割,并且为两两相互对称,本实施例共有三对,但本发明并不对切割线205的切割线条形状及数量加以限制。逆止件20的材质为弹性材质,例如:氟化橡胶、硅胶或橡胶等,但本发明并不对弹性材质加以限定。First, please refer to FIG. 2 , which is a schematic diagram of the check valve of the present invention. As shown in Figure 2, the
另外,在圆形柱10内,逆止件20的上方,配置一过滤膜30,过滤膜30为微孔结构,主要过滤气体的尘埃及杂质;本发明过滤膜30所使用的材质为聚四氟乙烯(PTFE),但本发明并不对过滤膜30的材质加以限定。In addition, in the
接着,请参阅图3A,是为本发明的逆止件充气示意图。如图3A所示,当对逆止阀1充气时,气体先由A端进入,气体的流体压力会撑开逆止件20的至少一个切割线205所形成的瓣膜207(N对切割线可形成2N片瓣膜,N=1以上自然数),由撑开的瓣膜207所形成的通道209充气进去;经过通道209后,气体再经由过滤膜30过滤充进去的气体,然后到达逆止阀1的B端,完成整个充气的步骤。Next, please refer to FIG. 3A , which is a schematic diagram of inflating the backstop member of the present invention. As shown in Figure 3A, when the
再接着,请参阅图3B,是为本发明的逆止件停止充气示意图。如图3B所示,当气体停止充气时,瓣膜207会因为本身的弹性材质,而回复到各个瓣膜207相互关闭的状态;由于逆止件20为一穹顶状,再加上本身具有一厚度,因此在内部的流体气压无法推动瓣膜207,可防止气体逆流。Next, please refer to FIG. 3B , which is a schematic diagram of stopping inflation of the non-return member of the present invention. As shown in Figure 3B, when the gas stops inflating, the
本发明的实施例,在逆止件20其直径大小为13公厘的情况下,瓣膜207(即逆止件)的厚度为1.5公厘;而相对的当逆止件20越大时,其厚度议会相对增大,但本发明并不对直径大小与厚度的相对比例加以限制;另外本发明的逆止阀1亦可用于液体,或其它流体,本发明亦不对处理的流体类型加以限制。In the embodiment of the present invention, when the diameter of the
请参阅图4,是为本发明安装于晶圆盒的逆止阀示意图。如图4所示,晶圆盒4,主要包括一盒体40,在盒体40的一侧面是形成一开口401,及一门体42,门体42是与开口401相结合,并形成一容置空间,提供晶圆放置;在晶圆盒4的底部403上配置一对逆止阀1,此对逆止阀1为一充气阀4031及一抽气阀4033;由于逆止阀1为单一方向进气,因此充气阀4031及抽气阀4033的逆止阀1内部的逆止件20为相互上下颠倒配置。Please refer to FIG. 4 , which is a schematic diagram of the check valve installed in the wafer box according to the present invention. As shown in Figure 4, the
一般在晶圆盒4内,会在里面充入惰性气体来保护里面的晶圆,因此在一段时间后,会需要替换里面的气体;因此,当要替换气体时,先对充气阀4031充气,同时再对抽气阀4033抽气,使内部的气体替换成新的气体。在此要强调,本发明并不限定充气阀4031及抽气阀4033配置位置,亦不限定配置数,只要符合本发明的实施作用,皆为本发明的实施范围。Generally, in the
请参阅图5,是为本发明安装于掩膜盒的逆止阀剖示图。如图5所示,掩膜盒5,主要包括一上盖50及一下盖52,上盖50是与下盖52相结合,并形成一容置空间,提供掩膜放置;在掩膜盒5的下盖52上配置一对逆止阀1,此对逆止阀1为一充气阀521及一抽气阀523;由于逆止阀1为单一方向进气,因此充气阀521及抽气阀523的逆止阀1内部的逆止件20为相互上下颠倒配置。Please refer to FIG. 5 , which is a cross-sectional view of the check valve installed in the mask box according to the present invention. As shown in Figure 5, the
一般在掩膜盒5内,会在里面充入惰性气体来保护里面的掩膜,因此在一段时间后,会需要替换里面的气体;因此,当要替换气体时,先对充气阀521充气,同时再对抽气阀523抽气,使内部的气体替换成新的气体。在此要强调,本发明并不限定充气阀521及抽气阀523配置位置,亦不限定配置数,只要符合本发明的实施作用,皆为本发明的实施范围。Generally, in the
虽然本发明以前述的较佳实施例揭露如上,然其并非用以限定本发明,任何熟习相像技术者,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,因此本发明的专利保护范围须视本发明的权利要求范围所界定的为准。Although the present invention is disclosed above with the foregoing preferred embodiments, it is not intended to limit the present invention. Any person familiar with the similar technology can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The scope of patent protection of the present invention must be defined by the scope of the claims of the present invention.
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| CN108109896A (en) * | 2017-12-15 | 2018-06-01 | 上海华力微电子有限公司 | Reduce the method and device of high current implanter particle contamination |
| CN112343821A (en) * | 2019-08-06 | 2021-02-09 | 上海海立电器有限公司 | One-way conduction valve, refrigerant injection structure comprising same and compressor |
| JP2023036543A (en) * | 2021-09-02 | 2023-03-14 | 家登精密工業股▲ふん▼有限公司 | Quick exhaust valve, substrate container with quick exhaust valve, and attaching/detaching method for quick exhaust valve |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108109896A (en) * | 2017-12-15 | 2018-06-01 | 上海华力微电子有限公司 | Reduce the method and device of high current implanter particle contamination |
| CN107982068A (en) * | 2018-01-02 | 2018-05-04 | 吴伟祥 | A kind of medical collection case for being used to vomit patient after drinking |
| CN112343821A (en) * | 2019-08-06 | 2021-02-09 | 上海海立电器有限公司 | One-way conduction valve, refrigerant injection structure comprising same and compressor |
| JP2023036543A (en) * | 2021-09-02 | 2023-03-14 | 家登精密工業股▲ふん▼有限公司 | Quick exhaust valve, substrate container with quick exhaust valve, and attaching/detaching method for quick exhaust valve |
| JP7397929B2 (en) | 2021-09-02 | 2023-12-13 | 家登精密工業股▲ふん▼有限公司 | Quick exhaust valve, substrate container with quick exhaust valve, how to attach and remove the quick exhaust valve |
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Application publication date: 20130918 |