CN103338582A - Flexible printed circuit board and electronic device using the flexible printed circuit board - Google Patents

Abstract

A flexible circuit board comprises a lead and a connecting part. The connecting part comprises a substrate, and connecting pads and dummy connecting pads which are arranged on the substrate, wherein the connecting pads are electrically connected with the conducting wires, and the dummy connecting pads are arranged between the adjacent connecting pads and are insulated from the connecting pads and the conducting wires. The invention also provides an electronic device using the flexible circuit board. Compared with the prior art, the flexible circuit board and the electronic device using the flexible circuit board can effectively avoid the short circuit phenomenon between the connecting pads.

Description

Flexible printed circuit board and electronic device using the flexible printed circuit board

technical field

The invention relates to a flexible circuit board and an electronic device using the flexible circuit board.

Background technique

At present, electronic devices such as mobile phones, computers, and monitors are usually equipped with flexible printed circuit boards (Flexible Printed Circuit, FPC), through which different parts of the circuit can be connected. A flexible printed circuit usually has several connection pads spaced apart from each other. Since Anisotropic Conductive Film (ACF) has the characteristics of conducting in the Z-axis and insulating in the X-axis and Y-axis, it is often used when the flexible circuit board is bonded to the electronic device. The film bonds the flexible circuit board to the electronic device. However, when laminating in this way, a short circuit often occurs between the connection pads in the flexible circuit board.

Contents of the invention

In view of the above, it is necessary to provide a flexible circuit board, including wires and connecting parts. The connection part includes a substrate, a connection pad and a dummy connection pad arranged on the substrate, the connection pad is electrically connected to the wire, and the dummy connection pad is arranged between adjacent connection pads and connected to the connection pad. Pad and wire insulation set.

It is also necessary to provide an electronic device, including an interface portion and the flexible circuit board, the interface portion includes a main body and an interface disposed on the main body, the interface is formed of conductive material, and is arranged corresponding to the connection pad, so The interface and the connection pad are bonded together through an anisotropic conductive adhesive film to realize the connection of electrical signals.

It is also necessary to provide an electronic device, including an interface and a flexible circuit board, the interface includes a main body and a contact piece arranged on the main body, the contact piece can conduct electricity, and the flexible circuit board includes a base and a set Connection pads and dummy connection pads on the base, the connection pads are arranged correspondingly to the contact pads, the dummy connection pads are arranged between adjacent connection pads, and the contact pads and the connection pads pass through Conductive adhesive films are bonded together to realize the connection of electrical signals.

It is also necessary to provide an electronic device, including an interface, a second interface and a flexible circuit board, the interface includes a main body and a contact piece arranged on the main body, the second interface includes a second main body and a contact piece arranged on the second main body The second contact piece on the board, the contact piece and the second contact piece can conduct electricity, and the flexible circuit board includes a base, a connection pad and a dummy connection pad arranged on one side of the base, and an opposite pad arranged on the base. The second connection pad and the second dummy connection pad on the back side of the connection pad and the dummy connection pad, the contact piece is arranged correspondingly to the connection pad, the second contact piece is arranged correspondingly to the second connection pad, and the The flexible circuit board is interposed between the interface and the second interface, and the contact piece and the connection pad and the second contact piece and the second connection pad are respectively bonded together by an anisotropic conductive adhesive film, To realize the connection of electrical signals.

Compared with the prior art, the flexible circuit board and the electronic device using the flexible circuit board of the present invention can effectively avoid the short circuit between the connection pads and the connection pads.

Description of drawings

FIG. 1 is a schematic diagram of an electronic device of the present invention.

FIG. 2 is a schematic plan view of the flexible circuit board in FIG. 1 .

Fig. 3 is a sectional view taken along the line ABCD in Fig. 1 .

FIG. 4 is a cross-sectional view of another embodiment of the electronic device of the present invention.

Description of main component symbols

electronic device 100 interface 10 main body 11 Contact sheet 12 Anisotropic Conductive Film 20 flexible circuit board 30 Conduction Department 31 Connection 32 wire 311 base 321 connection pad 322 dummy connection pad 323 second connection pad 324 second dummy connection pad 325 second interface 40 second subject 41 second contact piece 42

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

Aiming at the short-circuit phenomenon that often occurs between the connection pads in the flexible circuit board, it is found through research that because the gap between the connection pads of the flexible circuit board is usually large, so that there is a gap between the flexible circuit board and the electronic circuit board. After the device is pasted by the anisotropic conductive adhesive film, the anisotropic conductive adhesive film will gather in a large amount in the gap between the adjacent connection pads when squeezed. The anisotropic conductive adhesive film is an adhesive with a plurality of conductive particles. In the gap, the conductive particles in the anisotropic conductive adhesive film are easy to gather, thereby causing a short circuit between two adjacent connection pads. Therefore, the researchers of the present invention have designed a flexible circuit board that makes the anisotropic conductive adhesive film not easy to gather between the connection pads, and thus realizes a short circuit.

As shown in FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes an interface 10 and a flexible circuit board 30 . The interface 10 is used to connect with the flexible circuit board 30 to realize the transmission of electrical signals. The electronic device 100 may be, but not limited to, a mobile phone, a computer, a display screen, a remote controller, and the like. It can be understood that, according to different electronic devices 100 , the electronic device 100 may also include other components, such as circuit boards, driver ICs, display modules, mechanical keys, and the like.

Please further refer to FIG. 2 , the flexible circuit board 30 includes a conductive portion 31 and a connecting portion 32, the conductive portion 31 includes a plurality of wires 311, and the connecting portion 32 includes a number of connections electrically connected to the wires 311. pads 322 , and dummy connection pads 323 disposed between the connection pads 322 . The connection pads 322 are formed of conductive metal materials, such as copper. The flexible circuit board 30 is electrically connected to the interface 10 through the connection pad 322 to realize the connection of electrical signals, and is conducted through the wires on the conducting part 31 . The dummy connection pad 323 is insulated from the connection pad 322 and the wire 311 .

As shown in FIG. 3 , the interface 10 and the flexible circuit board 30 are bonded together through an anisotropic conductive adhesive film 20 . Wherein, the interface 10 includes a main body 11 and a contact piece 12 , the contact piece 12 is formed of a conductive material and disposed on the main body 11 . The contact piece 12 is used to connect to the connection pad 322 on the flexible circuit board 30 , and conducts with the connection pad 322 to transmit electrical signals. The connection portion 32 includes a base 321 , connection pads 322 and dummy connection pads 323 . The connection pads 322 and the dummy connection pads 323 are disposed on the base 321 , the connection pads 322 are disposed corresponding to the contacts 12 , and the dummy connection pads 323 are disposed between the connection pads 322 . The electronic device 100 is docked with the contact piece 12 and the connection pad 322 of the flexible circuit board 30 through the interface 10 to realize the transmission of electrical signals.

A number of dummy connection pads 323 are arranged between any two adjacent connection pads 322 to separate the adjacent connection pads 322. At the same time, the connection pads 322 are adjacent to the dummy connection pads 323 on both sides and leave a certain gap. . Wherein, the number of dummy connection pads 323 between two adjacent connection pads 322 can be set according to the specifications of the flexible circuit board 30 and the distance between the connection pads 322 in a specific product. In this embodiment, no less than two dummy connection pads 323 are arranged between the adjacent connection pads 322; When the width of the connection pad 323 or one dummy connection pad 323 is designed to be close to the adjacent connection pads 322 on both sides, only one dummy connection pad 323 may be provided between the adjacent connection pads 322 . In this embodiment, the material of the dummy connection pad 323 is the same as that of the connection pad 322 , and it can be made by only one light irradiation or etching process, which is easy to manufacture and does not increase the use of materials.

In this way, after the interface 10 of the electronic device 100 and the flexible circuit board 30 are bonded by the anisotropic conductive adhesive film 20, a large amount of anisotropic conductive adhesive film 20 will not gather in the gap between adjacent connection pads 322, Thus avoiding the short circuit phenomenon caused by the aggregation of conductive particles.

The above-mentioned embodiment is adopted for the single-sided flexible circuit board 30 with only one circuit layer, but the design of setting the dummy connection pads 323 between the connection pads 322 to prevent short circuit can also be applied to the double-sided flexible circuit board with two circuit layers. surface flexible circuit board 30 . As shown in FIG. 4 , in another embodiment of the present invention, the electronic device 100 further includes a second interface 40. Correspondingly, the second interface 40 includes a second body 41 and is disposed on the second body 41. The second contact piece 42 on. The flexible circuit board 30 is sandwiched between the interface 10 and the second interface 40, and the flexible circuit board 30 also includes a second connection pad 324 and a second dummy connection pad 325, the second connection The pad 324 and the second dummy connection pad 325 are arranged on the back side of the substrate 321 relative to the connection pad 322 and the dummy connection pad 323, and the second connection pad 324 is arranged corresponding to the second contact piece 42, so The second dummy connection pads 325 are disposed between the second connection pads 324 . The flexible circuit board 30 is attached to the interface 10 and the second interface 40 through the anisotropic conductive adhesive film 20 . It can be understood that, the conducting part 31 further includes several second wires, and the second wires are connected to the second connection pads 324 .

The above embodiments are only used to illustrate the technical solutions of the present invention without limitation. Although the present invention has been described in detail with reference to preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced. Without departing from the spirit and scope of the technical solution of the present invention.

Claims (10)

1. flexible circuit board, comprise lead and connecting portion, described connecting portion comprises substrate and is arranged at described suprabasil connection gasket and pseudo-connection gasket that described connection gasket is electrically connected with lead, described pseudo-connection gasket is arranged between the adjacent connection gasket, and with described connection gasket and wire insulation setting.

2. flexible circuit board as claimed in claim 1 is characterized in that: described connection gasket with and its nearest pseudo-connection gasket between have the space.

3. flexible circuit board as claimed in claim 1 is characterized in that: be provided with between the described adjacent connection gasket and be no less than two pseudo-connection gaskets.

4. flexible circuit board as claimed in claim 1 is characterized in that: be provided with a pseudo-connection gasket between the described adjacent connection gasket.

5. flexible circuit board as claimed in claim 1, it is characterized in that: described connection gasket is formed by conductive metallic material.

6. flexible circuit board as claimed in claim 5, it is characterized in that: described pseudo-connection gasket is identical with described connection gasket material, and is made by same procedure.

7. flexible circuit board as claimed in claim 1, it is characterized in that: described flexible circuit board also comprises second lead, described connecting portion also comprises second connection gasket and the second pseudo-connection gasket that is arranged in the substrate with respect to the dorsal part of described connection gasket and pseudo-connection gasket, wherein, described second connection gasket is electrically connected with second lead, the described second pseudo-connection gasket is arranged between the second adjacent connection gasket, and with described second connection gasket and the second wire insulation setting.

8. electronic installation, comprise interface portion and as each described flexible circuit board among the claim 1-7, described interface portion comprises main body and is arranged at contact chip on the main body, described contact chip is formed by electric conducting material, and corresponding setting with connection gasket, described contact chip and connection gasket are bonded together by anisotropic conductive film, to realize the connection of the signal of telecommunication.

9. electronic installation, comprise interface and flexible circuit board, described interface comprises main body and is arranged at contact chip on the described main body, described contact chip can conduct electricity, described flexible circuit board comprises substrate and is arranged at described suprabasil connection gasket and pseudo-connection gasket, described connection gasket and pseudo-connection gasket are made by a procedure by electric conducting material, the corresponding setting with described contact chip of described connection gasket, described pseudo-connection gasket is arranged between the adjacent connection gasket, described contact chip and connection gasket are bonded together by anisotropic conductive film, to realize the connection of the signal of telecommunication.

10. electronic installation, comprise interface, second interface and flexible circuit board, described interface comprises main body and is arranged at contact chip on the main body, described second interface comprises second main body and is arranged at second contact chip on second main body, described contact chip and second contact chip can conduct electricity, described flexible circuit board comprises substrate, be arranged at connection gasket and the pseudo-connection gasket of described substrate one side and be arranged in the described substrate second connection gasket and the second pseudo-connection gasket with respect to the dorsal part of described connection gasket and pseudo-connection gasket, described connection gasket, pseudo-connection gasket, second connection gasket and the second pseudo-connection gasket form by identical electric conducting material, the corresponding setting with connection gasket of described contact chip, the corresponding setting with second connection gasket of described second contact chip, described flexible circuit board is located between described interface and second interface, and described contact chip and connection gasket and described second contact chip and second connection gasket are bonded together by anisotropic conductive film respectively, to realize the connection of the signal of telecommunication.

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