CN103455191A - Composite film structure and touch panel with same - Google Patents
Composite film structure and touch panel with same Download PDFInfo
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- CN103455191A CN103455191A CN2012101819069A CN201210181906A CN103455191A CN 103455191 A CN103455191 A CN 103455191A CN 2012101819069 A CN2012101819069 A CN 2012101819069A CN 201210181906 A CN201210181906 A CN 201210181906A CN 103455191 A CN103455191 A CN 103455191A
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Abstract
The invention discloses a composite film structure and a touch panel with the same. The composite film structure comprises a resistive adhesive layer and a capacitive adhesive layer which are stacked up and down. The touch panel comprises at least one conductive layer, at least one composite film and a covering plate. The covering plate is adhered on the resistive adhesive layer of the composite film, the capacitive adhesive layer of the composite film is adhered on the conductive layer, so that acidic adhesive of the resistive adhesive layer is prevented from spreading to the conductive layer, and the conductive layer is protected from being etched by the acidic adhesive; meanwhile, according to the composite film structure, residual bubbles can be avoided, and optical properties of the touch panel can be maintained.
Description
Technical field
The contact panel that the present invention relates to a kind of combined type film structure and there is this combined type film structure.
Background technology
Contact panel is the device be attached on liquid crystal panel, utilizes finger or pointer as operation-interface, in the mode of touching, is chosen the project input or mobilely waits action, the man-machine interface of genus instinct type.In recent years, contact panel is widely used in consumption electronic products, and extends to main flow 3C electronics applications, and comprising mobile phone, GPS, PDA, flat computer, e-book etc. all has very big market, and its following growth is expected.
Contact panel mainly can be divided into the contact panel of resistance-type, condenser type, acoustic wave, optical profile type and electromagnetic type, and occupies 95% market rate with resistance-type and capacitive contact panel.
The capacitance type touch-control panel structure can be divided into the capacitance touching control panel of diaphragm type and glass type.The thin-film type capacitance contact panel is that polyester (PET) substrate surface is processed to (the Indium Tin Oxide through ITO; tin indium oxide) plated film; pass through again the gold-tinted processing procedure; be made into touch sensing (paste two ITO films or paste a slice ITO film) and fit with protective seam (glass/PMMA (polymethylmethacrylate)/PC (polycarbonate)) and TFT-LCD (thin film transistor-liquid crystal display) liquid crystal panel again, make touch panel module.The glass type capacitance touching control panel is by after glass substrate processing, through the ITO plated film, then passes through the gold-tinted processing procedure, is made into touch sensing, then fits with protective seam (glass/PMMA/PC) and TFT-LCD liquid crystal panel, makes touch panel module.Capacitance type touch-control panel is to utilize the capacitance variations that between transparency electrode and human body, electrostatical binding produces, and from produced induced current, detects its coordinate.
Yet, at present in capacitance type touch-control panel, it is ITO conductive material on plastic plate or glass plate sputter, due to ITO to the acidic materials sensitivity, easily by acid corrosion, so, when sheet is sticked together in capacitance type touch-control panel laminating pressure-sensitive, wish that the viscose that sheet is sticked together in this condenser type pressure-sensitive is partial neutral PH, but its adhesion and excessive glue amount are not good.
In view of this, need a kind of contact panel for display device, the protection conductive material is avoided being corroded by Aci-Jel, and then maintains the optical characteristics of contact panel.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of combined type film structure and there is the contact panel of combined type film structure, can protect conductive material to avoid being corroded by Aci-Jel, and then maintain the optical characteristics of contact panel.
The present invention for the technical scheme that solves its technical matters and adopt is:
A kind of contact panel with combined type film structure, be provided with at least one conductive layer, at least one combined type film and an overlay, described combined type film has resistance-type gluing layer and the condenser type gluing layer of stacked on top, and described combined type film fits in described conductive layer in its condenser type gluing layer place; Described overlay fits on the resistance-type gluing layer that is positioned at outermost combined type film.
The thickness of described resistance-type gluing layer is 12 to 200 microns.
The thickness of described condenser type gluing layer is 12 to 200 microns.
Also comprise photic zone, described photic zone is formed between the resistance-type gluing layer and condenser type gluing layer of described combined type film.
Described euphotic thickness is 25 to 300 microns.
Described conductive layer and combined type film all are provided with some, and each described conductive layer is spliced by described combined type film, wherein, each described conductive layer has base material and is formed at the conductive material layer on described base material, and the condenser type gluing layer of described combined type film fits on the conductive material layer of described conductive layer.
Also comprise LCD MODULE, and described combined type film is provided with somely, described LCD MODULE and described conductive layer are spliced by described combined type film.
A kind of combined type film structure, be provided with resistance-type gluing layer and the condenser type gluing layer of stacked on top, and wherein, the thickness of described resistance-type gluing layer and condenser type gluing layer is respectively 12 to 200 microns.
Also comprise the photic zone be formed between described resistance-type gluing layer and condenser type gluing layer.
Described euphotic thickness is 25 to 300 microns.
The invention has the beneficial effects as follows: the present invention utilizes to have the resistance-type gluing layer of stacked on top and the combined type film of condenser type gluing layer, make condenser type gluing layer and the conductive layer laminating of this combined type film, be diffused into this conductive layer with the Aci-Jel that prevents resistance-type gluing layer, protect this conductive layer can not be subject to the Aci-Jel corrosion; Simultaneously, combined type film of the present invention also can be avoided the entrapped air pockets phenomenon, maintains the optical characteristics of contact panel.
The accompanying drawing explanation
The combined type film structure schematic diagram that Fig. 1 is the embodiment of the present invention 1;
The combined type film structure schematic diagram that Fig. 2 is the embodiment of the present invention 2;
The structural representation of the contact panel with combined type film structure that Fig. 3 is the embodiment of the present invention 3;
The structural representation of the contact panel with combined type film structure that Fig. 4 is the embodiment of the present invention 4.
Embodiment
Below, by specific instantiation explanation the specific embodiment of the present invention, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can other different mode be implemented, and, under not departing from disclosed category, can give different modifications and change that is.
Embodiment 1: a kind of combined type film structure, as shown in Figure 1, this combined type film 100 consists of resistance-type gluing layer 110 and the condenser type gluing layer 120 that is formed on this resistance-type gluing layer 110, wherein, the thickness of this resistance-type gluing layer 110 and condenser type gluing layer 120 is separately between 12 to 200 microns.
Embodiment 2: a kind of combined type film structure, as shown in Figure 2, this combined type film 200, comprise resistance-type gluing layer 210 and be formed at the condenser type gluing layer 220 on this resistance-type gluing layer 210, also comprise the photic zone 230 be formed between this resistance-type gluing layer 210 and condenser type gluing layer 220, photic zone 230 is diffused into condenser type gluing layer 220 in order to the Aci-Jel that further prevents resistance-type gluing layer 210, and also because enough thickness is arranged, when follow-up making contact panel, in laminating overlay process, avoid producing bubble between overlay and combined type film.
The example of photic zone 230 comprises the photic zone of being made by polycarbonate, the photic zone of being made by the acrylic acid series resin, the photic zone of being made by polyesters or the photic zone of being made by tri acetyl cellulose, and the photic zone made from polycarbonate is for better.
Photic zone can be for by homogenous material or combine list layer or the many sublayers photic zone that two or more material is made.
Preferably, this euphotic thickness is 25 to 300 microns, and the thickness of this resistance-type gluing layer and condenser type gluing layer is separately between 12 to 200 microns.
The resistance-type gluing layer of combined type film of the present invention can be by being reacted and formed with isocyanate compound by acrylic acid series polymeric compounds and oligomer, wherein, the weight average molecular weight of this acrylic acid series polymeric compounds is 500000 to 900000, the monomer of this polymkeric substance comprises at least one (methyl) alkyl acrylate (wherein, this alkyl is containing 4 to 12 carbon atoms) as the principal monomer composition (for example: (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) acrylic acid tributyl, (methyl) acrylic acid n-octyl, (methyl) Isooctyl acrylate monomer) and at least one is containing carboxylic monomer.The weight average molecular weight of oligomer is 3000 to 6000, and the monomer of this oligomer comprises at least one ethylenically unsaturated monomer as the principal monomer composition, the monomer of oligomer used there is no particular restriction, as long as it is ethylenically unsaturated monomer, and can obtain glass transition temperature (T
g) be that the homopolymer that 60 to 190 ℃ and molecule have a ring texture gets final product, as T
gthe cyclenes that contains that is 60 to 190 ℃ belongs to unsaturated monomer, the example is (but being not limited to) for example: containing (methyl) esters of acrylic acid of non-aromatic ring, for example (methyl) acrylic acid cycloalkanes ester class, reach (methyl) isobornyl acrylate such as (methyl) cyclohexyl acrylate; Containing it (methyl) esters of acrylic acid of aromatic rings, (methyl) aryl acrylate class for example, such as (methyl) phenyl acrylate, (methyl) acrylic acid aryloxy group alkyl ester class, such as (methyl) acrylic acid phenoxy ethyl, and (methyl) acrylic acid aryl alkane ester class, such as (methyl) benzyl acrylate; And styrene monomer, for example styrene and α-methyl styrene.
The condenser type gluing layer of combined type film of the present invention can be by by acrylic acid series polymeric compounds and oligomer, with isocyanate compound, being reacted and formed, but course of reaction need be added catalyst, and acrylic acid series polymeric compounds and oligomer can not contain acidic group.
For example, for example can be (but being not limited to) for acrylic acid series polymeric compounds of the present invention: poly-(methyl) methyl acrylate, poly-(methyl) ethyl acrylate, poly-(methyl) n-butyl acrylate, poly-(methyl) isobutyl acrylate, poly-(methyl) acrylic acid tributyl, poly-(methyl) acrylic acid n-octyl, poly-(methyl) Isooctyl acrylate monomer.
Be used for oligomer of the present invention such as can be (but being not limited to): the oligomer of the vinyl acetate such as vinyl acetate; The oligomer of cyano-containing group, as (methyl) vinyl cyanide; The oligomer of phosphinylidyne-containing amine group, as (methyl) acrylamide and N, N-dimethyl (methyl) acrylamide; Oligomer containing glycidyl group, as: (methyl) Glycidyl Acrylate, (methyl) acrylic acid 3,4-epoxy radicals cyclohexyl methyl esters, glycidyl vinethene, 3,4-epoxy radicals cyclohexyl vinethene, glycidyl (methyl) allyl ether, 3,4-epoxy radicals cyclohexyl (methyl) allyl ether etc.
Be used for isocyanates of the present invention such as can be (but being not limited to): the aromatic polyisocyanates such as XDI, methyl diphenylene diisocyanate, triphenylmethane triisocyanate tolyl methane diisocyanate.
In addition, catalyst used for example can be (but being not limited to): the ethylene imine compound is N for example, N-hexa-methylene two (1-ethylene imine formamide), di-2-ethylhexylphosphine oxides [N-(1-aziridinyl carbonyl)-4-aniline], tetramethylol methane-tri-(β-aziridinyl propionic ester), trimethylolpropane-tri-(β-aziridinyl propionic ester) etc., perhaps, also can suitably use commercial goods, for example, purchased from TAZO or the TAZM of Japan mutual pharmaceutical worker incorporated company; CHEMITITE PZ-33 purchased from Nippon Catalytic Chem Ind.
Embodiment 3: a kind of contact panel with combined type film structure, as shown in Figure 3, this contact panel comprises at least one conductive layer 350 (explaining with one deck in the present embodiment) and the combined type film 300 that fits in described conductive layer 350, this combined type film 300 has the resistance-type gluing layer 310 and condenser type gluing layer 320 of stacked on top, and these condenser type gluing layer 320 this conductive layers 350 of laminating.Particularly, conductive layer of the present invention has base material and is formed at the conductive material layer on this base material, and conductive material layer is ITO for example, and this condenser type gluing layer fits on this conductive material layer.Contact panel of the present invention also comprises overlay 340, fits on the resistance-type gluing layer 310 of this outermost combined type film 300; Contact panel of the present invention also comprises LCD MODULE 360.In the present embodiment, this combined type film 300 is a plurality of for being provided with, with this LCD MODULE 360 and conductive layer 350 of splicing by this combined type film 300.
Embodiment 4: a kind of contact panel with combined type film structure, as shown in Figure 4, this contact panel comprises a plurality of conductive layers 450 and fits in the combined type film 400 on this conductive layer 450 respectively, this combined type film 400 has the resistance-type gluing layer 410 and condenser type gluing layer 420 of stacked on top, and these condenser type gluing layer 420 this conductive layers 450 of laminating, particularly, conductive layer of the present invention has base material and is formed at the conductive material layer on this base material, conductive material layer is ITO for example, and this condenser type gluing layer fits on this conductive material layer; This contact panel also comprises overlay 440, and this overlay 440 fits on the resistance-type gluing layer 410 of this outermost combined type film 400; This contact panel also comprises LCD MODULE 460, and this LCD MODULE 460 fits on the most inboard conductive layer 450 by this combined type film 400, makes this combined type film 400 splice this LCD MODULE 460 and conductive layer 450.
Preferably, contact panel of the present invention also comprises photic zone, photic zone is formed between the resistance-type gluing layer and condenser type gluing layer of this combined type film, wherein, the thickness of this resistance-type gluing layer and condenser type gluing layer is separately between 12 to 200 microns, and this euphotic thickness is between 25 to 300 microns.
Overlay of the present invention is for contacting with finger or pointer, and its material can be glass, polymethylmethacrylate (PMMA), polycarbonate (PC) or polyethylene terephthalate (PET).Conductive layer has base material and is formed at the conductive material layer on this base material.Preferably, conductive layer used can be a side surface and is formed with electro-conductive glass base material and the conductive plastics base material as ITO conduction material, the example is (but being not limited to) for example: polymethylmethacrylate is made plastic basis material, plastic basis material made by polycarbonate or polyethylene terephthalate is made plastic basis material, and makes ITO palladium material best results on the plastic basis material sputter with polyethylene terephthalate.
In the present invention, because of resistance-type gluing layer good to the adhesion of overlay, therefore overlay is attached on the resistance-type gluing layer of combined type film; And, because the IT0 conduction material of conductive layer is afraid of acid, therefore the condenser type gluing layer of combined type film and the conductive material layer of conductive layer are binded, with the protection conductive layer, be not subject to the Aci-Jel corrosion.
Preparation example 1: the preparation method of the embodiment of the present invention 1 combined type film is as follows:
By 75.5 %(weight) poly-(methyl) n-butyl acrylate, poly-(methyl) isobutyl acrylate and poly-(methyl) acrylic acid tributyl mixed liquor and 24 %(weight) (methyl) acrylate, (methyl) isobornyl acrylate and (methyl) benzyl acrylate mixed liquor and 0.5 %(weight) XDI and the methyl diphenylene diisocyanate mixed liquor resistance-type glue that reacts formation evenly be applied on release film, through 70 to 100 ℃ of dryings after 8 minutes, then stick release film and re-use the roller roll extrusion, rolling process need check confirms that this resistance-type film is without obvious bubble, then at room temperature slaking is 3 to 7 days.
Then, by 80 %(weight) poly-(methyl) ethyl acrylate, poly-(methyl) n-butyl acrylate and poly-(methyl) isobutyl acrylate mixed liquor and 19 %(weight) vinyl acetate, (methyl) acrylate and (methyl) isobornyl acrylate mixed liquor and 0.5 %(weight) butylidene diisocyanate and cyclohexylidene diisocyanate mixed liquor and 0.5 %(weight) di-n-butyl pair (acetylacetone based) tin catalyst condenser type glue of reacting formation evenly be applied on release film, through 70 to 100 ℃ of dryings 8 minutes, then stick release film and re-use the roller roll extrusion, rolling process need check confirms that the condenser type film is without obvious bubble, then at room temperature slaking is 3 to 7 days.
Afterwards, get the resistance-type film and the condenser type film that cut, tear release film, the end alignment that resistance-type film and condenser type film are torn is to pasting, and uses the roller roll extrusion, and rolling process, need to check and confirm that combined type film test pieces is without obvious bubble.
Preparation example 2: the preparation method of the combined type film of the embodiment of the present invention 2 is as follows:
By 75.5 %(weight) poly-(methyl) n-butyl acrylate, poly-(methyl) isobutyl acrylate and poly-(methyl) acrylic acid tributyl mixed liquor and 24 %(weight) (methyl) acrylate, (methyl) isobornyl acrylate and (methyl) benzyl acrylate mixed liquor and 0.5 %(weight) XDI and the methyl diphenylene diisocyanate mixed liquor resistance-type glue that reacts formation evenly be applied on release film, through 70 to 100 ℃ of dryings after 8 minutes, then stick release film and re-use the roller roll extrusion, rolling process need check confirms that this condenser type film is without obvious bubble, then at room temperature slaking is 3 to 7 days.
Then, poly-(methyl) ethyl acrylate by 80 % (weight), poly-(methyl) n-butyl acrylate and poly-(methyl) isobutyl acrylate mixed liquor and 19 %(weight) vinyl acetate, (methyl) acrylate and (methyl) isobornyl acrylate mixed liquor and 0.5 %(weight) butylidene diisocyanate and cyclohexylidene diisocyanate mixed liquor and 0.5 %(weight) di-n-butyl pair (acetylacetone based) tin catalases condenser type glue of reacting formation evenly be applied on release film, through 100 ℃ of dryings after 8 minutes, then stick release film and re-use the roller roll extrusion, rolling process need check confirms that this condenser type film is without obvious bubble, then at room temperature slaking is 3 to 7 days.
Afterwards, the transparent plastic substrate that to get the resistance-type film, condenser type film and the material that cut be polyethylene terephthalate, tear release film, the end alignment that resistance-type film and condenser type film are torn is to being affixed on the transparent plastic substrate two sides, and use roller roll extrusion, rolling process to check and confirm that combined type film test pieces is without obvious bubble.
Test case: will be according to the prepared combined type film of method of the structure of embodiment 1 and 2 and preparation example 1 and 2 as test pieces, and to this test pieces carry out peel strength, overflow glue amount, weatherability and optical characteristic test, test result is recorded in table two.
One, peel strength test
According to ASTM-D3330, use the combined type film test pieces of test pieces 1 to 4 different-thickness in table two, after tearing release film off, with roller, be attached to respectively on glass (overlay with plate ITO electro-conductive glass) or steel plate (being fixed in the contact panel side), carefully avoid Bubble formation during laminating, then after maintaining 23 ℃ of temperature and relative humidity and being 50% time 30 minutes, use universal tensile testing machine (JIA-802-PC), being 180 ° in peel angle is that 300mm/min measures peel strength with detachment rate.
Two, excessive glue measures examination
Use the combined type film test pieces of test pieces 1 to 4 different-thickness in table two, after tearing a release film off, use the polyimide PI (purchased from reach advanced in years) of roller roll extrusion to post 1mil, with puncher (JZ-918CQ) punching (1/2,1/16 inch), after posting 1Oz ED Copper Foil (spacious purchased from day), at 180 ℃ with 100kgf/cm
2press soon (squeeze time 10 seconds is being pressed 60 seconds time).Before test, use the spiral dial gauge to measure its thickness, its test piece size is 100mm * 100mm.Herein, the glue amount finger pressure that overflows closes rear combined type film and measures test piece glue and overflow the hole scope, the measured length (mm) from the inside measuring distance of the edge side of hole.
Three, weatherability test
The combined type film test pieces of 1 to 4 different-thickness of test pieces in table two is placed on to constant temperature and humidity machine (THS-C) inner.Place under 80 ℃ of environment of high temperature 240 hours respectively, place 240 hours under ℃ environment of low temperature-20, and at hot and humid 60 ℃/90%RH, check whether outward appearance has xanthochromia, have or not air pocket, minute bubbles and lamination produce.
Four, optical test
Use the combined type film test pieces of test pieces 1 to 4 different-thickness in table two, after tearing ultralight release film off, tested respectively mist degree, transmittance and colourity.
The evaluation method of optical characteristics and weatherability is as shown in following table one.
Mist degree: H=" Td/Tt " * 100%; Td: diffuse transmittance (Diffuse transmittance), Tt: total light transmittance (Total transmittance).
Transmittance: T (Transmittance%)=I
0/ I
1; I
0: incident intensity (Intensity of incident light), I
1: all transmitted intensities (Intensity of all transmitted light).
Colourity: it is that data according to champac light (measuring according to ASTM E308 standard) are foundation that the measurement of b value is less than 0.5%, b value.
Table one
Table two
With same method test individual layer resistance-type or capacitive gluing layer (taking from Asia Electric works Co., Ltd) as a comparative example, its result is embedded in table three.
Table three
Known according to the test result of table two and table three, the excessive glue amount of combined type film of the present invention is large, can reduce the laminating process and produce bubble phenomenon in laminating overlay process, and there is excellent optical characteristics, be applicable to utilization finger or the pointer liquid crystal panel as operation-interface.
Above-mentioned embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Protection scope of the present invention, should be as listed as claims.
Claims (10)
1. the contact panel with combined type film structure, it is characterized in that: be provided with at least one conductive layer, at least one combined type film and an overlay, described combined type film has resistance-type gluing layer and the condenser type gluing layer of stacked on top, and described combined type film fits in described conductive layer in its condenser type gluing layer place; Described overlay fits on the resistance-type gluing layer that is positioned at outermost combined type film.
2. the contact panel with combined type film structure as claimed in claim 1, it is characterized in that: the thickness of described resistance-type gluing layer is 12 to 200 microns.
3. the contact panel with combined type film structure as claimed in claim 1, it is characterized in that: the thickness of described condenser type gluing layer is 12 to 200 microns.
4. the contact panel with combined type film structure as claimed in claim 1, it is characterized in that: also comprise photic zone, described photic zone is formed between the resistance-type gluing layer and condenser type gluing layer of described combined type film.
5. the contact panel with combined type film structure as claimed in claim 4, it is characterized in that: described euphotic thickness is 25 to 300 microns.
6. the contact panel with combined type film structure as claimed in claim 1, it is characterized in that: described conductive layer and combined type film all are provided with some, and each described conductive layer is spliced by described combined type film, wherein, each described conductive layer has base material and is formed at the conductive material layer on described base material, and the condenser type gluing layer of described combined type film fits on the conductive material layer of described conductive layer.
7. the contact panel with combined type film structure as claimed in claim 1 is characterized in that: also comprise LCD MODULE, and described combined type film is provided with somely, described LCD MODULE and described conductive layer are spliced by described combined type film.
8. a combined type film structure, it is characterized in that: be provided with resistance-type gluing layer and the condenser type gluing layer of stacked on top, wherein, the thickness of described resistance-type gluing layer and condenser type gluing layer is respectively 12 to 200 microns.
9. combined type film structure as claimed in claim 8, is characterized in that: also comprise the photic zone be formed between described resistance-type gluing layer and condenser type gluing layer.
10. combined type film structure as claimed in claim 9, it is characterized in that: described euphotic thickness is 25 to 300 microns.
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Application publication date: 20131218 |