CN103489027A - Low-cost ceramic-based radio frequency identification (RFID) tag and manufacturing method thereof - Google Patents
Low-cost ceramic-based radio frequency identification (RFID) tag and manufacturing method thereof Download PDFInfo
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- CN103489027A CN103489027A CN201310448002.2A CN201310448002A CN103489027A CN 103489027 A CN103489027 A CN 103489027A CN 201310448002 A CN201310448002 A CN 201310448002A CN 103489027 A CN103489027 A CN 103489027A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 31
- 238000005245 sintering Methods 0.000 claims description 17
- 238000002360 preparation method Methods 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- 230000014759 maintenance of location Effects 0.000 claims description 5
- 238000001465 metallisation Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000033228 biological regulation Effects 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract 6
- 239000011241 protective layer Substances 0.000 abstract 1
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000010953 base metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 description 1
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000001925 catabolic effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 description 1
- 229910001958 silver carbonate Inorganic materials 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The invention relates to a low-cost ceramic-based radio frequency identification (RFID) tag and a manufacturing method of the low-cost ceramic-based RFID tag. The low-cost ceramic-based RFID tag is characterized by comprising a ceramic substrate, an antenna film layer A, an antenna film layer B and a protective layer, wherein the antenna film layer A and the antenna film layer B are located on the ceramic substrate. The low-cost ceramic-based radio frequency identification tag and the manufacturing method have the advantages that the technical scheme is simple and cost is low; a metal antenna layer graph can be designed according to technical requirements of a related RFID antenna, and the graph is diversified and has the low-cost characteristic of an integrated antenna; according to the RFID tag, a highly sensitive antenna is still be provided due to the fact that the sufficient area is ensured for the antenna layers, and the minimum line width of the designed graph can reach 0.1mm; by the adoption of the method, the manufactured metalized ceramic substrate has the advantages of being simple in technique, high in yield and size precision, low in production cost, and free of pollution and public nuisance, and strength is easy to control.
Description
Technical field
The present invention relates to electronic tag, relate in particular to low-cost ceramic base electronic tag and preparation method thereof, belong to the electronic tag ceramic substrate processing technique field of radio-frequency (RF) identification (RFID) technology.
Background technology
RFID antenna (Radio Frequency Identification:RFID), be commonly called as electronic tag, is a ring important in current Internet of Things field.Its effect is the identity of recognition object, and its performance quality, cost height play important impact to the performance of whole Internet of things system.
Ceramic electronic label frequency of operation is 860 ~ 920MHZ, reads distance and can reach 20m, relevant with read write line.It is based on the electronic tag of stupalith encapsulation, has very high electric characteristic and anti-high-performance, frangible anti-transfer.The electronic label antenna of making on ceramic substrate, its dielectric loss is little, and high flat characteristic is good, and antenna performance is stable; Highly sensitive, be one of inexorable trend of future microwave radio frequency discrimination RFID technical development.It is widely used in the fields such as traffic administration, intelligent charging, logistic track.
The technology of manufacturing at present the ceramic electronic label substrate mainly contains the multiple ceramic metalizing process such as molybdenum manganese method, gold-plated method, copper-plating method, zinc-plated method, nickel plating method, and the metallized technique of ceramic substrate commonly used is divided into thick-film technique at present.Thick-film technique mainly adopts screen printing technique, adopts the silver electrode paste often used both at home and abroad.Wholely cover silver-colored process and mainly comprise following several stages: binder volatilization catabolic phase, temperature range is 90 ~ 325 ℃; Silver carbonate or silver oxide reduction phase, temperature range is 410 ~ 600 ℃; Cosolvent changes the colloid stage into, and temperature range is 520 ~ 600 ℃; Argent and product surface strong bonded stage, temperature range is more than 600 ℃.Due to metal and ceramic engaging force strong; Metal and ceramic joint are closely knit, and thermal diffusivity is better, but silver is precious metal material, and Costco Wholesale is always high, and price is not easy to large-scale popularization along with silver-colored price fluctuates always,
So a kind of ceramic base cheaply of exigence electronic tag and preparation method thereof.
Summary of the invention
In order to solve the problem of above-mentioned existence, the invention discloses a kind of ceramic base electronic tag simple in structure, lower-cost and preparation method thereof, meet the electronic tag usability simultaneously, and effectively reducing the production cost of electronic tag.
To achieve these goals; technical scheme of the present invention is as follows; a kind of low-cost ceramic base electronic tag; it is characterized in that; described electronic tag comprises ceramic substrate, metal antenna thin layer, protective seam, and wherein the metal antenna thin layer comprises metal antenna thin layer A and metal antenna thin layer B; described antenna thin layer A is positioned on ceramic substrate, and antenna thin layer B is at antenna thin layer A or be positioned on ceramic substrate.Antenna thin layer A is the controllable electric resistance layer, and it can effectively play the dead angle of controlling the read-write radio range and reducing dipole antenna; Antenna thin layer B is antenna stack, the success ratio to 99.99% that it can play the effect while of radio-frequency antenna and can improve binding chip.
As a modification of the present invention, the microwave dielectric property of described ceramic substrate is 5≤ε r relative dielectric constant≤200, the ceramic substrate that-50ppm/ ℃≤τ f is temperature coefficient of resonance frequency≤50ppm/ ℃.Routine is selected 96 aluminium oxide ceramics, BaTiO
3, MgTiO
3deng media ceramic, its stability that can use under different environments for use radio range and the antenna of antenna plays a role.
As a modification of the present invention, described metal antenna thin layer A is copper antenna thin layer, wherein Cu content is 40 ~ 85.5% or the aluminum antenna thin layer, wherein Al content be 40 ~ 83% or filamentary silver print the film antenna layer, wherein Ag content be 40 ~ 65% or nickel wire print the film antenna layer, wherein Ni content is 40 ~ 75%.Wherein the film antenna layer material is selected the base metal material, can greatly reduce the cost of antenna metallization raw material.
As a modification of the present invention, described metal antenna thin layer B is silver-colored antenna thin layer, and antenna thin layer B plays welding lead, and has the thin layer of radio-frequency antenna effect.Wherein Ag content is 60 ~ 85%.This film antenna layer can play the effect while of radio-frequency antenna and can effectively improve the binding unfailing performance.
A kind of production method of low-cost ceramic base electronic tag, is characterized in that, said method comprising the steps of, and adopts ceramic membrane technique, and concrete production stage comprises, 1), ceramic substrate determines and type selecting; 2), the surface preparation of substrate, specifically adopt ultrasonic surface treatment, time 5 ~ 30min, or adopt powder ion sputtering pre-service; 3) preparation of substrate antenna thin layer A; 4), by the etching of photo-mask process completing substrate front metal film pattern; 5), with glue, cover the part that does not need second metallization; 6), the preparation of substrate antenna thin layer B; 7), electroplate and thicken; 8), clean; 9), printing protective seam; 10), drying and packaging.
As a modification of the present invention, the thicknesses of layers of described antenna thin layer A and B is 0.1 ~ 1 μ m; Antenna thin layer A and B, during by sintering furnace, temperature is 400 ~ 900 ℃, and temperature retention time is 5 ~ 30min.
A kind of production method of low-cost ceramic base electronic tag, is characterized in that, said method comprising the steps of, and adopts ceramic thick film technique, 1) the determining and type selecting of ceramic substrate; 2), graphic making printing screen in accordance with regulations; Its minimum feature of described antenna thin layer A figure can reach 0.1mm; 3), substrate surface carries out pre-service, specifically adopts ultrasonic surface treatment, time 5 ~ 30min, or adopt powder ion sputtering pre-service; 4), at printed antenna thin layer A of substrate, thicknesses of layers is 1 ~ 50 μ m; 5) substrate that, produces figure is sent in sintering furnace the metal film sintering curing; 6), secondary printing antenna thin layer B, thicknesses of layers is 1 ~ 50 μ m; 7), produce in the sintering furnace that the substrate of figure sends into the metal film sintering curing; 8), printing protective seam; 9), dry, pack.
As a modification of the present invention, the thicknesses of layers of described antenna thin layer A and B is 1 ~ 50 μ m; Antenna thin layer A and B, during by sintering furnace, temperature is 400 ~ 900 ℃, and temperature retention time is 5 ~ 30min.
With respect to prior art, advantage of the present invention is as follows, 1) technical scheme of the present invention is simple, cost is lower, 2) the metal antenna layer pattern can be designed according to the technical requirement of relevant RFID radio-frequency antenna, and figure can be diversified, and have antenna integrated low cost; 3) the RFID label, by keeping enough areas of antenna stack, still provides highly sensitive antenna; In its design configuration, minimum feature can reach 0.1mm; 4) adopt metallized ceramic substrate that said method is prepared to have that technique is simple, yield rate is high, dimensional accuracy is high, intensity is easily controlled, production cost is low, pollution-free, non-harmful characteristics.
The accompanying drawing explanation
The example structure schematic diagram that Fig. 1 is RFID label of the present invention;
The vertical view that Fig. 2 is Fig. 1;
In figure: 1-ceramic substrate, 2-antenna thin layer A, 3-antenna thin layer B, 4-chip, 5-protective seam.
Embodiment
Below in conjunction with the drawings and specific embodiments, further illustrate the present invention.Should understand following embodiment only is not used in and limits the scope of the invention for the present invention is described.It should be noted that, word 'fornt', 'back', " left side ", " right side ", "up" and "down" that use is described below refer to the direction in accompanying drawing, word " interior " and " outward " refer to respectively towards or away from the direction of particular elements geometric center.
embodiment 1:referring to Fig. 1; a kind of low-cost ceramic base electronic tag; described electronic tag comprises ceramic substrate 1, metal antenna thin layer; protective seam 4; wherein the metal antenna thin layer comprises metal antenna thin layer A2 and metal antenna thin layer B3; described antenna thin layer A2 is positioned on ceramic substrate 1, and antenna thin layer B3 is at antenna thin layer A 2 or be positioned on ceramic substrate 1.Antenna thin layer A is the controllable electric resistance layer, and it can effectively play the dead angle of controlling the read-write radio range and reducing dipole antenna; Antenna thin layer B is antenna stack, the success ratio to 99.99% that it can play the effect while of radio-frequency antenna and can improve binding chip; This ceramic base electronic tag one-piece construction is simple, cost is lower, is convenient to promote the use of on a large scale.
embodiment 2:as a modification of the present invention, the microwave dielectric property of described ceramic substrate 1 is 5≤ε r relative dielectric constant≤200, the ceramic substrate that-50ppm/ ℃≤τ f is temperature coefficient of resonance frequency≤50ppm/ ℃.Routine is selected 96 aluminium oxide ceramics, BaTiO
3, MgTiO
3deng media ceramic, its stability that can use under different environments for use radio range and the antenna of antenna plays a role.All the other structures and advantage and embodiment 1 are identical.
embodiment 3:as a modification of the present invention, described metal antenna thin layer A is copper antenna thin layer, wherein Cu content is 40 ~ 85.5% or the aluminum antenna thin layer, wherein Al content be 40 ~ 83% or filamentary silver print the film antenna layer, wherein Ag content be 40 ~ 65% or nickel wire print the film antenna layer, wherein Ni content is 40 ~ 75%.Wherein the film antenna layer material is selected the base metal material, can greatly reduce the cost of antenna metallization raw material.All the other structures and advantage and embodiment 1 are identical.
embodiment 4:as a modification of the present invention, described metal antenna thin layer B is silver-colored antenna thin layer, and antenna thin layer B plays welding lead, and has the thin layer of radio-frequency antenna effect.Wherein Ag content is 60 ~ 85%.This film antenna layer can play the effect while of radio-frequency antenna and can effectively improve the binding unfailing performance.All the other structures and advantage and embodiment 1 are identical.
embodiment 5:a kind of production method of low-cost ceramic base electronic tag, said method comprising the steps of, and adopts ceramic membrane technique, and concrete production stage comprises, 1), ceramic substrate determines and type selecting; 2), the surface preparation of substrate, specifically adopt ultrasonic surface treatment, time 5 ~ 30min, or adopt powder ion sputtering pre-service; 3) preparation of substrate antenna thin layer A, the thicknesses of layers of antenna thin layer A is 1 ~ 50 μ m; 4), by the etching of photo-mask process completing substrate front metal film pattern; 5), with glue, cover the part that does not need second metallization; 6), the preparation of substrate antenna thin layer B, the thicknesses of layers of antenna thin layer B is 1 ~ 50 μ m; 7), electroplate and thicken; 8), clean; 9), printing protective seam; 10), drying and packaging.
embodiment 6:a kind of production method of low-cost ceramic base electronic tag, said method comprising the steps of, and adopts ceramic thick film technique, 1) the determining and type selecting of ceramic substrate; 2), graphic making printing screen in accordance with regulations; Its minimum feature of described antenna thin layer A figure can reach 0.1mm; 3), substrate surface carries out pre-service, specifically adopts ultrasonic surface treatment, time 5 ~ 30min, or adopt powder ion sputtering pre-service; 4), at printed antenna thin layer A of substrate, thicknesses of layers is 1 ~ 50 μ m; 5), the substrate that produces figure sends in sintering furnace the metal film sintering curing, during by sintering furnace, temperature is 400 ~ 900 ℃, temperature retention time is 5 ~ 30min; 6), secondary printing antenna thin layer B, thicknesses of layers is 1 ~ 50 μ m; 7), produce in the sintering furnace that the substrate of figure sends into the metal film sintering curing; 8), printing protective seam; 9), dry, pack.
The present invention can also be combined to form new embodiment by least one and embodiment 1 in embodiment 2,3,4,5,6 described technical characterictics.
It should be noted that above-described embodiment is only preferred embodiment of the present invention, be not used for limiting protection scope of the present invention, protection scope of the present invention is as the criterion with claims.
Claims (8)
1. a low-cost ceramic base electronic tag; it is characterized in that; described electronic tag comprises ceramic substrate (1), metal antenna thin layer; protective seam (4); wherein the metal antenna thin layer comprises metal antenna thin layer A(2) and metal antenna thin layer B(3); described antenna thin layer A(2) be positioned at ceramic substrate (1) above, antenna thin layer B(3) at antenna thin layer A(2) or be positioned on ceramic substrate (1).
2. low-cost ceramic base electronic tag according to claim 1, it is characterized in that, described ceramic substrate (1) is 1≤ε r relative dielectric constant≤200 for microwave dielectric property, the ceramic substrate that-50ppm/ ℃≤τ f is temperature coefficient of resonance frequency≤50ppm/ ℃.
3. low-cost ceramic base electronic tag according to claim 2, it is characterized in that, described metal antenna thin layer A is copper antenna thin layer, wherein Cu content is 40 ~ 85.5% or the aluminum antenna thin layer, wherein Al content is 40 ~ 83% or silver-colored film antenna layer, wherein Ag content is 40 ~ 65% or nickel film antenna layer, and wherein Ni content is 40 ~ 75%.
4. according to the described low-cost ceramic base electronic tag of claim 2 or 3, it is characterized in that, described metal antenna thin layer B is silver-colored antenna thin layer, and wherein Ag content is 60 ~ 85%.
5. as the production method of the described low-cost ceramic base electronic tag of claim 1-4 any one claim, it is characterized in that, said method comprising the steps of, adopt ceramic membrane technique, concrete production stage comprises, 1), ceramic substrate determines and type selecting; 2), the surface preparation of substrate, specifically adopt ultrasonic surface treatment, time 5 ~ 30min, or adopt powder ion sputtering pre-service; 3) preparation of substrate antenna thin layer A; 4), by the etching of photo-mask process completing substrate front metal film pattern; 5), with glue, cover the part that does not need second metallization; 6), the preparation of substrate antenna thin layer B; 7), electroplate and thicken; 8), clean; 9), printing protective seam; 10), drying and packaging.
6. the production method of low-cost ceramic base electronic tag according to claim 5, is characterized in that, the thicknesses of layers of described antenna thin layer A and B is 1 ~ 50 μ m; Antenna thin layer A and B, during by sintering furnace, temperature is 400 ~ 900 ℃, and temperature retention time is 5 ~ 30min.
7. as the production method of the described low-cost ceramic base electronic tag of claim 1-4 any one claim, it is characterized in that, said method comprising the steps of, adopt ceramic thick film technique, 1) the determining and type selecting of ceramic substrate; 2), graphic making printing screen in accordance with regulations; 3), substrate surface carries out pre-service, specifically adopts ultrasonic surface treatment, time 5 ~ 30min, or adopt powder ion sputtering pre-service; 4), at printed antenna thin layer A of substrate; 5) substrate that, produces figure is sent in sintering furnace the metal film sintering curing; 6), secondary printing antenna thin layer B; 7), produce in the sintering furnace that the substrate of figure sends into the metal film sintering curing; 8), printing protective seam; 9), dry, pack.
8. the production method of low-cost ceramic base electronic tag according to claim 7, is characterized in that, the thicknesses of layers of described antenna thin layer A and B is 1 ~ 50 μ m; Antenna thin layer A and B, during by sintering furnace, temperature is 400 ~ 900 ℃, and temperature retention time is 5 ~ 30min.
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| CN201310448002.2A CN103489027A (en) | 2013-09-27 | 2013-09-27 | Low-cost ceramic-based radio frequency identification (RFID) tag and manufacturing method thereof |
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| CN201310448002.2A CN103489027A (en) | 2013-09-27 | 2013-09-27 | Low-cost ceramic-based radio frequency identification (RFID) tag and manufacturing method thereof |
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| CN108550977A (en) * | 2018-03-30 | 2018-09-18 | 深圳市振华微电子有限公司 | RFID antenna, RFID tag and RFID antenna production method |
| CN109677148A (en) * | 2019-01-23 | 2019-04-26 | 西安理工大学 | A kind of printing method of flexibility RFID reader antenna |
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Application publication date: 20140101 |