CN103491698B - A kind of micro-focal X-ray source dynamic focus control method - Google Patents
A kind of micro-focal X-ray source dynamic focus control method Download PDFInfo
- Publication number
- CN103491698B CN103491698B CN201310455201.6A CN201310455201A CN103491698B CN 103491698 B CN103491698 B CN 103491698B CN 201310455201 A CN201310455201 A CN 201310455201A CN 103491698 B CN103491698 B CN 103491698B
- Authority
- CN
- China
- Prior art keywords
- focus
- ray
- voltage
- size
- arm lower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000001514 detection method Methods 0.000 claims abstract description 21
- 238000012544 monitoring process Methods 0.000 claims abstract description 8
- 238000012360 testing method Methods 0.000 claims description 15
- 238000012545 processing Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000002601 radiography Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 description 6
- 238000012858 packaging process Methods 0.000 description 5
- 238000000691 measurement method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009659 non-destructive testing Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000000205 computational method Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002784 hot electron Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012372 quality testing Methods 0.000 description 1
Landscapes
- X-Ray Techniques (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
本发明公开了一种微聚焦X射线源动态焦点控制方法,该方法通过检测装置对X射线焦点进行实时监测,根据监测数据决定是否需要重设焦点尺寸,当焦点大于6μm时,ARM下位机查找内建的焦点与输出功率对应关系表得到相应的管电压和管电流参数,并将其发送至高频高压发生器,高频高压发生器根据接收到的数据调节管电压、电流从而实现调焦,最终达到焦点的动态范围稳定于2-6μm目的,突破封闭式微聚焦X射线难以突破5μm以下的难题。本发明能控制X射线焦点稳定于6μm以下,特别适用于要求高分辨率X光图的精密检测系统。
The invention discloses a dynamic focus control method of a micro-focus X-ray source. The method monitors the X-ray focus in real time through a detection device, and decides whether to reset the focus size according to the monitoring data. When the focus is greater than 6 μm, the ARM lower computer searches The built-in focus and output power correspondence table obtains the corresponding tube voltage and tube current parameters, and sends them to the high-frequency high-voltage generator, and the high-frequency high-voltage generator adjusts the tube voltage and current according to the received data to achieve focusing , Finally, the dynamic range of the focus is stabilized at 2-6 μm, and it is difficult to break through the closed micro-focus X-ray problem below 5 μm. The invention can control the X-ray focus to be stable below 6 μm, and is especially suitable for precision detection systems requiring high-resolution X-ray images.
Description
技术领域technical field
本发明涉及IC封装过程中的无损检测领域,尤其是指一种微聚焦X射线源动态焦点控制方法。The invention relates to the field of non-destructive testing in the IC packaging process, in particular to a dynamic focus control method of a micro-focus X-ray source.
背景技术Background technique
随着电子元件正变得日趋小型且更加复杂,高分辨率无损检测技术已广泛应用于电子制造业的产品质量检测中,X射线机就是其中一种主要的射线装置。作为X射线机的重要性能指标之一,X射线管焦点的大小在很大程度上决定成像质量的优劣。焦点越小,所拍摄物体的影像清晰度就愈高,那么IC封装过程中的无损检测愈为准确。可见,X射线管是X射线成像设备的核心部件。As electronic components are becoming smaller and more complex, high-resolution nondestructive testing technology has been widely used in product quality testing in the electronics manufacturing industry, and X-ray machines are one of the main ray devices. As one of the important performance indicators of the X-ray machine, the size of the focus of the X-ray tube determines the quality of the image to a large extent. The smaller the focal point, the higher the image definition of the captured object, and the more accurate the non-destructive testing in the IC packaging process. It can be seen that the X-ray tube is the core component of the X-ray imaging equipment.
X射线管是一种特殊结构高压二极管,由阴极、阳极及真空密封外壳组成。阴极内螺旋灯丝产生的热电子在高压电场作用下,高速轰击阳极靶面,产生所需的X射线。阳极靶面上受到高速电子束撞击的区域为实际焦斑,X射线就是从这个区域向半球空间发射。然而,随着X射线管使用时间增长,X射线机的焦点尺寸会发生变化。引起变化的因素主要有射线管阴极灯丝与聚焦性能发生变化、阳极靶受损等。阴极灯丝形状及聚焦性能发生变化时,电子束流在阳极靶上撞击区域发生变化,导致焦点尺寸发生变化;此外,随着X射线管的使用时间增长,阳极靶受损程度增大,阳极表面变得凸凹不平,导致漫射线增加,引起焦点尺寸发生变化。The X-ray tube is a high-voltage diode with a special structure, which is composed of a cathode, an anode and a vacuum-sealed casing. Under the action of a high-voltage electric field, the hot electrons generated by the spiral filament in the cathode bombard the anode target surface at high speed to generate the required X-rays. The area on the anode target surface hit by the high-speed electron beam is the actual focal spot, and X-rays are emitted from this area to the hemispherical space. However, as the X-ray tube ages, the focal spot size of the X-ray machine will change. The factors causing the change mainly include the change of the cathode filament and focusing performance of the ray tube, and the damage of the anode target. When the shape and focusing performance of the cathode filament change, the impact area of the electron beam on the anode target changes, resulting in a change in the focal spot size; in addition, as the X-ray tube’s service time increases, the damage of the anode target increases, and the surface of the anode Becoming bumpy, causing diffuse lines to increase, causing focal spot size to change.
为确定X射线机焦点尺寸,学者们相继提出不同的焦点尺寸测量方法。这些方法大体上可分为三类:扫描法、成像法、计算法。扫描法直接采用机械扫描方式,以辐射计数测量焦点的辐射强度分布,从而确定焦点尺寸。成像法中比较典型的有针孔法、狭缝法,首先获得焦点的射线照相图像,从图像直接确定焦点尺寸。计算法包括星卡法、边界法等,利用高吸收材料获得射线照相图像,测量图像强度再进行计算或转换后确定焦点尺寸。不同测量方法的适用范围、适用对象和焦点表示方式有所不同。即使同一种测量方法,当测试目的和用途不同时,其测试条件和过程也略有差异。因此,在进行焦点尺寸测量时一定要根据具体的X射线机参数、测试目的和相关规定选择合适的测量方法。In order to determine the focal point size of X-ray machines, scholars have successively proposed different focal point size measurement methods. These methods can be roughly divided into three categories: scanning methods, imaging methods, and computational methods. The scanning method directly adopts a mechanical scanning method to measure the radiation intensity distribution of the focal point by radiation counting, so as to determine the focal point size. The typical imaging methods are the pinhole method and the slit method. First, the radiographic image of the focus is obtained, and the size of the focus is directly determined from the image. Calculation methods include star card method, boundary method, etc., using high-absorbing materials to obtain radiographic images, measuring image intensity and then calculating or converting to determine the focus size. The scope of application, applicable objects, and focal points of different measurement methods are different. Even with the same measurement method, when the purpose and application of the test are different, the test conditions and procedures are slightly different. Therefore, when measuring the focal spot size, it is necessary to select the appropriate measurement method according to the specific X-ray machine parameters, test purpose and relevant regulations.
在面向极大规模集成电路封装过程的X射线检测系统中,X射线机焦点的动态变化对X光图像质量、检测结果都有不利影响。如何稳定控制焦点大小,使之处于合适尺寸范围成为面向IC封装过程的X射线成像检测的重点和难点,也是本发明主要解决的问题。In the X-ray detection system for the packaging process of very large scale integrated circuits, the dynamic change of the focus of the X-ray machine has adverse effects on the quality of the X-ray image and the detection results. How to stably control the focus size so that it is in a suitable size range has become the focus and difficulty of X-ray imaging detection for the IC packaging process, and is also the main problem to be solved by the present invention.
当前,封闭式微聚焦X射线管的最小焦点可低至几微米,因此被广泛应用于X射线检测系统中。然而,很多实际应用场合都忽视了X射线管焦点动态变化这一事实,从而导致获取的X光图以及检测结果有时不如人意。为保证焦点尺寸稳定,有必要发明一种方法,使得焦点发生变化后及时调整到合适尺寸,以提高检测精度。At present, the minimum focus of the closed micro-focus X-ray tube can be as low as several microns, so it is widely used in X-ray inspection systems. However, the fact that the focal point of the X-ray tube changes dynamically is ignored in many practical applications, resulting in sometimes unsatisfactory X-ray images and detection results. In order to ensure the stability of the focus size, it is necessary to invent a method to adjust the focus to an appropriate size in time after the focus changes, so as to improve the detection accuracy.
发明内容Contents of the invention
本发明的目的在于克服现有技术的不足,提供一种合理、可靠,面向IC封装过程的微聚焦X射线源动态焦点控制方法。The purpose of the present invention is to overcome the deficiencies of the prior art and provide a reasonable and reliable micro-focus X-ray source dynamic focus control method oriented to the IC packaging process.
为实现上述目的,本发明所提供的技术方案为:一种微聚焦X射线源动态焦点控制方法,包括以下步骤:In order to achieve the above object, the technical solution provided by the present invention is: a dynamic focus control method of a micro-focus X-ray source, comprising the following steps:
(1)焦点检测装置实时监测焦点尺寸,根据监测数据决定是否需要重设焦点尺寸;(1) The focus detection device monitors the focus size in real time, and decides whether to reset the focus size according to the monitoring data;
(2)若焦点尺寸小于6μm,不作任何处理,否则转至步骤(3);(2) If the focus size is less than 6 μm, do not do any processing, otherwise go to step (3);
(3)焦点尺寸大于6μm时,PC上位机会发出调节X射线源焦点至6μm以下的指令给ARM下位机,ARM下位机接收指令后,查找内建的焦点与输出功率对应关系表得到调焦所需输出功率参数值以及对应的管电压、电流值,再将电压、电流值发送至高频高压发生器;(3) When the focus size is greater than 6 μm, the PC host computer sends an instruction to adjust the X-ray source focus to below 6 μm to the ARM lower computer. After receiving the instruction, the ARM lower computer searches the built-in focus and output power correspondence table to obtain the focus adjustment It is necessary to output the power parameter value and the corresponding tube voltage and current value, and then send the voltage and current value to the high frequency and high voltage generator;
(4)高频高压发生器根据接收数据调整X射线管功率至指定值,使焦点尺寸至6μm以下。(4) The high-frequency and high-voltage generator adjusts the power of the X-ray tube to a specified value according to the received data, so that the focus size is below 6 μm.
在步骤(1)中,所述焦点检测装置获取当前焦点尺寸,并发送给ARM下位机,ARM下位机通过数据传输通道使之显示于PC上位机界面,进而实现实时焦点监测。In step (1), the focus detection device acquires the current focus size and sends it to the ARM lower computer, and the ARM lower computer displays it on the PC upper computer interface through a data transmission channel, thereby realizing real-time focus monitoring.
所述焦点检测装置是通过测量图像几何不清晰度间接测量焦点尺寸,包括以下设备:测试物、射线成像装置、图像处理设备;所述测试物采用金属十字丝,其交叉角度为90°±3°,所述金属十字丝应在固定架上穿过圆形的孔固定好,穿过点位于孔的中心位置,所述固定架要使测试物非常接近X射线管的窗口,所述图像处理设备要能够在相互正交的方向上制造X光图像线性增强轮廓,并且能够测量距离。The focus detection device indirectly measures the focus size by measuring the geometric unsharpness of the image, and includes the following equipment: a test object, a radiography device, and an image processing device; the test object adopts a metal cross wire, and its intersection angle is 90°±3 °, the metal cross wire should be fixed on the fixed frame through a circular hole, the passing point is located at the center of the hole, the fixed frame will make the test object very close to the window of the X-ray tube, the image processing The device should be capable of producing linearly enhanced contours of X-ray images in mutually orthogonal directions and capable of measuring distances.
在步骤(2)中,PC上位机接收来自ARM下位机的当前焦点尺寸,判断它是否大于6μm,若小于6μm,不作任何处理,继续监测焦点。In step (2), the PC upper computer receives the current focus size from the ARM lower computer, and judges whether it is larger than 6 μm. If it is smaller than 6 μm, it does not perform any processing and continues to monitor the focus.
在步骤(4)中,高频高压发生器根据接收数据调整X射线管功率至指定值,包括以下步骤:In step (4), the high-frequency high-voltage generator adjusts the power of the X-ray tube to a specified value according to the received data, including the following steps:
1)高频高压发生器接收来自ARM下位机的管电压、电流参数;1) The high-frequency and high-voltage generator receives the tube voltage and current parameters from the ARM lower computer;
2)接收数据后高频高压发生器直接产生相应的电压、电流并作用于X射线管;2) After receiving the data, the high-frequency and high-voltage generator directly generates the corresponding voltage and current and acts on the X-ray tube;
3)X射线管在该电压和电流驱动下形成对应的焦点,实现将动态焦点稳定于2-6μm范围内。3) The X-ray tube forms a corresponding focus under the drive of the voltage and current, and realizes the stability of the dynamic focus within the range of 2-6 μm.
本发明与现有技术相比,具有如下优点与有益效果:通过测量、监测焦点后自适应调焦,使焦点的动态范围稳定控制在2-6μm以内,突破封闭式微聚焦X射线难以突破5μm以下的难题。Compared with the prior art, the present invention has the following advantages and beneficial effects: through self-adaptive focusing after measuring and monitoring the focus, the dynamic range of the focus can be stably controlled within 2-6 μm, and it is difficult to break through the closed micro-focusing X-rays below 5 μm problem.
附图说明Description of drawings
图1为本发明的功能结构图。Fig. 1 is a functional structural diagram of the present invention.
图2为本发明的焦点检测原理框图。Fig. 2 is a block diagram of the focus detection principle of the present invention.
图3为本发明的方法流程图。Fig. 3 is a flow chart of the method of the present invention.
具体实施方式detailed description
下面结合具体实施例对本发明作进一步说明。The present invention will be further described below in conjunction with specific examples.
如图1所示,本实施例所述的微聚焦X射线源动态焦点控制方法,采用如下设备:X射线管、PC上位机、ARM下位机、高频高压发生器、焦点检测装置、电源,其中,所述高频高压发生器分别与X射线管、ARM下位机、电源连接,该焦点检测装置分别与X射线管和ARM下位机连接,ARM下位机与电源连接,并与PC上位机之间通过以太网连接。所述的焦点检测装置是通过测量图像几何不清晰度间接测量焦点尺寸,包括以下设备:测试物、射线成像装置、图像处理设备;所述测试物采用金属十字丝,其交叉角度为90°±3°,所述金属十字丝应在固定架上穿过圆形的孔固定好,穿过点位于孔的中心位置,所述固定架要使测试物非常接近X射线管的窗口,所述图像处理设备要能够在相互正交的方向上制造X光图像线性增强轮廓,并且能够测量距离。如图2所示,为焦点检测装置的原理框图,在图中,1为X射线管阳极,2为测试物,3为成像平面,M为放大位数且M=(a+b)/a,a为测试物至X射线管阳极之间的距离,b为测试物至成像平面间的距离。As shown in Figure 1, the micro-focus X-ray source dynamic focus control method described in this embodiment adopts the following equipment: X-ray tube, PC upper computer, ARM lower computer, high frequency and high voltage generator, focus detection device, power supply, Wherein, the high-frequency high-voltage generator is respectively connected with the X-ray tube, the ARM lower computer, and the power supply, and the focus detection device is connected with the X-ray tube and the ARM lower computer respectively, and the ARM lower computer is connected with the power supply, and connected with the PC upper computer. are connected via Ethernet. The focus detection device is to indirectly measure the focus size by measuring the geometric unsharpness of the image, and includes the following equipment: a test object, a radiography device, and an image processing device; the test object adopts a metal cross wire, and its intersection angle is 90°± 3°, the metal cross wire should be fixed through a circular hole on the fixing frame, and the passing point is located at the center of the hole. The fixing frame should make the test object very close to the window of the X-ray tube, and the image The processing equipment should be able to produce linear enhancement contours of X-ray images in mutually orthogonal directions and be able to measure distances. As shown in Figure 2, it is the principle block diagram of the focus detection device. In the figure, 1 is the anode of the X-ray tube, 2 is the test object, 3 is the imaging plane, M is the magnification number and M=(a+b)/a , a is the distance between the test object and the anode of the X-ray tube, b is the distance between the test object and the imaging plane.
如图3所示,本实施例上述微聚焦X射线源动态焦点控制方法,具体情况如下:As shown in Figure 3, the above-mentioned micro-focus X-ray source dynamic focus control method in this embodiment, the specific conditions are as follows:
(1)焦点检测装置获取当前焦点尺寸,并发送给ARM下位机,ARM下位机通过数据传输通道使之显示于PC上位机界面,进而实现实时焦点监测;(1) The focus detection device obtains the current focus size and sends it to the ARM lower computer, and the ARM lower computer displays it on the PC upper computer interface through the data transmission channel, thereby realizing real-time focus monitoring;
(2)PC上位机接收来自ARM下位机的当前焦点尺寸,判断它是否大于6μm,若小于6μm,说明当前焦点尺寸满足要求,不作任何处理,否则转至步骤(3);(2) The PC upper computer receives the current focus size from the ARM lower computer, and judges whether it is larger than 6 μm. If it is smaller than 6 μm, it means that the current focus size meets the requirements and does not do any processing, otherwise go to step (3);
(3)焦点尺寸大于6μm时,PC上位机会发出调节X射线源焦点至6μm以下的指令并通过以太网将指令传递给ARM下位机,ARM下位机接收指令后,查找内建的焦点与输出功率对应关系表得到调焦所需输出功率参数值以及对应的管电压、电流值,再将电压、电流值发送至高频高压发生器;(3) When the focus size is greater than 6 μm, the PC host will issue an instruction to adjust the focus of the X-ray source to below 6 μm and transmit the instruction to the ARM lower computer through Ethernet. After receiving the instruction, the ARM lower computer will search for the built-in focus and output power The corresponding relationship table obtains the output power parameter values required for focusing and the corresponding tube voltage and current values, and then sends the voltage and current values to the high-frequency and high-voltage generator;
(4)高频高压发生器根据接收数据调整X射线管功率至指定值,使焦点尺寸至6μm以下,包括以下步骤:(4) The high-frequency and high-voltage generator adjusts the power of the X-ray tube to a specified value according to the received data, so that the focus size is below 6 μm, including the following steps:
1)高频高压发生器接收来自ARM下位机的管电压、电流参数;1) The high-frequency and high-voltage generator receives the tube voltage and current parameters from the ARM lower computer;
2)接收数据后高频高压发生器直接产生相应的电压、电流并作用于X射线管;2) After receiving the data, the high-frequency and high-voltage generator directly generates the corresponding voltage and current and acts on the X-ray tube;
3)X射线管在该电压和电流驱动下形成对应的焦点,实现将动态焦点稳定于2-6μm范围内。3) The X-ray tube forms a corresponding focus under the drive of the voltage and current, and realizes the stability of the dynamic focus within the range of 2-6 μm.
在采用以上方案后,本发明通过焦点检测装置对X射线焦点进行实时监测,根据监测数据决定是否需要重设焦点尺寸,从而将焦点的动态范围稳定控制在2-6μm以内,突破了封闭式微聚焦X射线难以突破5μm以下的难题。相比现有技术,本发明能有效控制X射线焦点稳定于6μm以下,特别适用于要求高分辨率X光图的精密检测系统,值得推广。After adopting the above scheme, the present invention monitors the X-ray focus in real time through the focus detection device, and decides whether to reset the focus size according to the monitoring data, thereby stably controlling the dynamic range of the focus within 2-6 μm, breaking through the closed micro-focus It is difficult for X-rays to break through the problem below 5 μm. Compared with the prior art, the present invention can effectively control the X-ray focus to be stable below 6 μm, and is especially suitable for precision detection systems requiring high-resolution X-ray images, and is worthy of popularization.
以上所述之实施例子只为本发明之较佳实施例,并非以此限制本发明的实施范围,故凡依本发明之形状、原理所作的变化,均应涵盖在本发明的保护范围内。The implementation examples described above are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all changes made according to the shape and principles of the present invention should be covered within the protection scope of the present invention.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310455201.6A CN103491698B (en) | 2013-09-29 | 2013-09-29 | A kind of micro-focal X-ray source dynamic focus control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310455201.6A CN103491698B (en) | 2013-09-29 | 2013-09-29 | A kind of micro-focal X-ray source dynamic focus control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103491698A CN103491698A (en) | 2014-01-01 |
| CN103491698B true CN103491698B (en) | 2016-07-27 |
Family
ID=49831555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310455201.6A Active CN103491698B (en) | 2013-09-29 | 2013-09-29 | A kind of micro-focal X-ray source dynamic focus control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103491698B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307370A (en) * | 2015-11-19 | 2016-02-03 | 丹东华日理学电气股份有限公司 | Microfocus X-ray source device based on Ethernet control |
| CN109269774A (en) * | 2018-09-17 | 2019-01-25 | 浙江万森电子科技有限公司 | Using the X-ray tube Microfocus X-ray tester of digital photographing technique |
| CN110049610B (en) | 2019-04-24 | 2021-01-22 | 上海联影医疗科技股份有限公司 | Control method, device, device and storage medium for focus size |
| CN114928930B (en) * | 2022-05-19 | 2025-07-01 | 杭州斯派锐电子有限公司 | A multifunctional detection method and device for imaging quality of X-ray tube assembly |
| CN115440553B (en) * | 2022-09-21 | 2023-07-04 | 无锡日联科技股份有限公司 | Control system and method for micro-focus X-ray source |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4400823A (en) * | 1980-07-02 | 1983-08-23 | Siemens Aktiengesellschaft | X-Ray diagnostic installation for radiography and fluoroscopy |
| CN101756707A (en) * | 2009-12-31 | 2010-06-30 | 苏州和君科技发展有限公司 | Method for carrying out scanning reconstruction on long target object by using Micro-CT imaging system |
| CN101966086A (en) * | 2009-07-27 | 2011-02-09 | 株式会社东芝 | X-ray CT apparatus and method for controlling X-ray tube |
| CN103249238A (en) * | 2012-02-10 | 2013-08-14 | 南京普爱射线影像设备有限公司 | Integrated grid-controlled cold cathode x-ray generating device used for X-ray unit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2819720B2 (en) * | 1990-01-18 | 1998-11-05 | 株式会社島津製作所 | X-ray high voltage equipment |
-
2013
- 2013-09-29 CN CN201310455201.6A patent/CN103491698B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4400823A (en) * | 1980-07-02 | 1983-08-23 | Siemens Aktiengesellschaft | X-Ray diagnostic installation for radiography and fluoroscopy |
| CN101966086A (en) * | 2009-07-27 | 2011-02-09 | 株式会社东芝 | X-ray CT apparatus and method for controlling X-ray tube |
| CN101756707A (en) * | 2009-12-31 | 2010-06-30 | 苏州和君科技发展有限公司 | Method for carrying out scanning reconstruction on long target object by using Micro-CT imaging system |
| CN103249238A (en) * | 2012-02-10 | 2013-08-14 | 南京普爱射线影像设备有限公司 | Integrated grid-controlled cold cathode x-ray generating device used for X-ray unit |
Non-Patent Citations (2)
| Title |
|---|
| 射线实时成像检测图像质量的改进方法;高志凌 等;《无损检测》;20080831;第30卷(第8期);第504至507页 * |
| 微焦点X射线检测技术的现状与应用;孔凡琴;《无损检测》;20081231;第30卷(第12期);论文章节2,章节3.1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103491698A (en) | 2014-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103491698B (en) | A kind of micro-focal X-ray source dynamic focus control method | |
| CN102954972B (en) | X-ray analysis equipment and method | |
| US8351682B2 (en) | X-ray examination region setting method, X-ray examination apparatus and X-ray examination region setting program | |
| KR101241007B1 (en) | Method and apparatus for measuring thickness of thin film using x-ray | |
| US10357222B2 (en) | X-ray diagnostic imaging apparatus, monitoring server and anomaly detection method | |
| JPH02501411A (en) | Automatic laminography system for testing electronics | |
| US11422099B2 (en) | Inspection position identification method, three-dimensional image generation method, and inspection device | |
| Wang et al. | Microfocus X-ray printed circuit board inspection system | |
| CN110672035A (en) | Vision measurement method and device | |
| CN101839871B (en) | X-ray layered photography detection method and system | |
| JP2014009976A (en) | Three-dimensional shape measurement x-ray ct device and three-dimensional shape measurement method by x-ray ct device | |
| CN106872499A (en) | Defect inspection device and method for grouting sleeve test piece | |
| WO2021215217A1 (en) | Inspection apparatus | |
| US20180252656A1 (en) | X-ray inspection apparatus | |
| CN115427797A (en) | Check device | |
| US20160183892A1 (en) | Method for imaging by means of an x-ray device and x-ray device | |
| RU2674567C1 (en) | Method of measuring dimensions of effective focus spot of microfocus x-ray tubes | |
| JP5487519B2 (en) | Industrial X-ray CT apparatus and imaging method | |
| JP4630305B2 (en) | X-ray inspection apparatus, X-ray inspection method, and control program for X-ray inspection apparatus | |
| JP3933548B2 (en) | X-ray inspection apparatus, X-ray inspection method, and X-ray inspection control program | |
| Michalska | Overview of the use of x-ray equipment in electronics quality tests | |
| JP2022010384A (en) | X-ray CT device | |
| JP2023053558A (en) | Inspection device | |
| CN109602430B (en) | Orthopedic Radiography | |
| JP2023050960A (en) | Charged particle beam image processing device and charged particle beam apparatus having the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |