CN103509489B - A low temperature hot melt adhesive - Google Patents
A low temperature hot melt adhesive Download PDFInfo
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- CN103509489B CN103509489B CN201310401046.XA CN201310401046A CN103509489B CN 103509489 B CN103509489 B CN 103509489B CN 201310401046 A CN201310401046 A CN 201310401046A CN 103509489 B CN103509489 B CN 103509489B
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- melt adhesive
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- ethylene
- hot melt
- temperature hot
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- 239000004831 Hot glue Substances 0.000 title claims abstract description 17
- 239000002994 raw material Substances 0.000 claims abstract description 13
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 7
- 229920001577 copolymer Polymers 0.000 claims abstract description 7
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 7
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 claims abstract description 5
- 235000019837 monoammonium phosphate Nutrition 0.000 claims abstract description 5
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 8
- 150000003505 terpenes Chemical class 0.000 claims description 6
- 235000007586 terpenes Nutrition 0.000 claims description 6
- -1 polypropylene Polymers 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- MPPQGYCZBNURDG-UHFFFAOYSA-N 2-propionyl-6-dimethylaminonaphthalene Chemical compound C1=C(N(C)C)C=CC2=CC(C(=O)CC)=CC=C21 MPPQGYCZBNURDG-UHFFFAOYSA-N 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- BJZYYSAMLOBSDY-QMMMGPOBSA-N (2s)-2-butoxybutan-1-ol Chemical compound CCCCO[C@@H](CC)CO BJZYYSAMLOBSDY-QMMMGPOBSA-N 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 abstract description 5
- 235000010354 butylated hydroxytoluene Nutrition 0.000 abstract description 5
- 229940057995 liquid paraffin Drugs 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 229920001911 maleic anhydride grafted polypropylene Polymers 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000010276 construction Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000003208 petroleum Substances 0.000 description 4
- 229940043810 zinc pyrithione Drugs 0.000 description 4
- PICXIOQBANWBIZ-UHFFFAOYSA-N zinc;1-oxidopyridine-2-thione Chemical compound [Zn+2].[O-]N1C=CC=CC1=S.[O-]N1C=CC=CC1=S PICXIOQBANWBIZ-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 229920000747 poly(lactic acid) Polymers 0.000 description 2
- 239000004626 polylactic acid Substances 0.000 description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
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- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明公开了一种低温热熔胶，它是由下述重量份的原料组成的：茂金属乙烯-辛烯共聚物40-50、乙烯-丙烯酸乙酯共聚物40-50、松香6-10、马来酸酐接枝聚丙烯6-10、2,6-二叔丁基对甲酚1-2、丙烯酸异辛酯2-3、液体石蜡3-4、磷酸二氢铵0.2-0.3、增粘剂7-8；本发明制备的热熔胶在低温环境中具有良好的剥离强度和施工性能，具有很好的粘结性、密封性和稳定性，工艺简单，成本低。The invention discloses a low-temperature hot-melt adhesive, which is composed of the following raw materials in parts by weight: metallocene ethylene-octene copolymer 40-50, ethylene-ethyl acrylate copolymer 40-50, rosin 6-10 , maleic anhydride grafted polypropylene 6-10, 2,6-di-tert-butyl p-cresol 1-2, isooctyl acrylate 2-3, liquid paraffin 3-4, ammonium dihydrogen phosphate 0.2-0.3, Adhesives 7-8: The hot melt adhesive prepared by the present invention has good peel strength and construction performance in a low temperature environment, has good cohesiveness, sealing and stability, simple process and low cost.
Description
技术领域 technical field
本发明主要涉及一种热熔胶粉末，尤其涉及一种低温热熔胶。 The invention mainly relates to a hot-melt adhesive powder, in particular to a low-temperature hot-melt adhesive.
背景技术 Background technique
热熔胶是一种可塑性的粘合剂，在一定温度范围内其物理状态随温度改变而改变，而化学特性不变，其无毒无味，属环保型化学产品。 Hot melt adhesive is a kind of plastic adhesive. Its physical state changes with temperature within a certain temperature range, but its chemical properties remain unchanged. It is non-toxic and tasteless, and is an environmentally friendly chemical product.
发明内容 Contents of the invention
本发明目的就是提供一种低温热熔胶。 The object of the present invention is to provide a low-temperature hot-melt adhesive.
本发明是通过以下技术方案实现的： The present invention is achieved through the following technical solutions:
一种低温热熔胶，它是由下述重量份的原料组成的： A kind of low-temperature hot-melt adhesive, it is made up of the raw material of following parts by weight:
茂金属乙烯-辛烯共聚物40-50、乙烯-丙烯酸乙酯共聚物40-50、松香6-10、马来酸酐接枝聚丙烯6-10、2,6-二叔丁基对甲酚1-2、丙烯酸异辛酯2-3、液体石蜡3-4、磷酸二氢铵0.2-0.3、增粘剂7-8； Metallocene ethylene-octene copolymer 40-50, ethylene-ethyl acrylate copolymer 40-50, rosin 6-10, maleic anhydride grafted polypropylene 6-10, 2,6-di-tert-butyl p-cresol 1-2, isooctyl acrylate 2-3, liquid paraffin 3-4, ammonium dihydrogen phosphate 0.2-0.3, tackifier 7-8;
所述的增粘剂是由下述重量份的原料组成的： Described tackifier is made up of the raw material of following weight part:
萜烯树脂30-40、C5石油树脂20-30、氟硅酸钠3-5、硅烷偶联剂KH-5501-2、吡啶硫酮锌0.2-0.3、聚乳酸2-3、聚四氢呋喃醚二醇1-2； Terpene resin 30-40, C5 petroleum resin 20-30, sodium fluorosilicate 3-5, silane coupling agent KH-5501-2, zinc pyrithione 0.2-0.3, polylactic acid 2-3, polytetrahydrofuran ether two Alcohol 1-2;
将上述萜烯树脂与C5石油树脂混合加热到100-150℃，加入氟硅酸钠，保温搅拌10-15分钟，降低温度为70-75℃，加入吡啶硫酮锌，充分混合，降低温度为60-65℃，加入硅烷偶联剂KH-550，600-800转/分搅拌分散4-6分钟，加入剩余各原料，充分混合，即得所述增粘剂。 Mix the above terpene resin and C5 petroleum resin and heat to 100-150°C, add sodium fluorosilicate, keep stirring for 10-15 minutes, reduce the temperature to 70-75°C, add zinc pyrithione, mix well, reduce the temperature to At 60-65°C, add silane coupling agent KH-550, stir and disperse at 600-800 rpm for 4-6 minutes, add the remaining raw materials, and mix thoroughly to obtain the tackifier.
一种低温热熔胶的制备方法，包括以下步骤： A preparation method for low-temperature hot melt adhesive, comprising the following steps:
（1）将上述茂金属乙烯-辛烯共聚物、乙烯-丙烯酸乙酯共聚物、松香、2,6-二叔丁基对甲酚、丙烯酸异辛酯、液体石蜡混合加热到130-200℃，保温搅拌30-40分钟； (1) Mix the above-mentioned metallocene ethylene-octene copolymer, ethylene-ethyl acrylate copolymer, rosin, 2,6-di-tert-butyl-p-cresol, isooctyl acrylate, and liquid paraffin and heat it to 130-200°C , heat preservation and stirring for 30-40 minutes;
（2）加入增粘剂，在150-200℃下继续保温搅拌10-15分钟，加入剩余各原料，充分混合后，制成胶片或颗粒，即得所述低温热熔胶。 (2) Add a tackifier, keep warm and stir at 150-200°C for 10-15 minutes, add the remaining raw materials, mix well, and make a film or granule to obtain the low-temperature hot-melt adhesive.
本发明的优点是： The advantages of the present invention are:
本发明制备的热熔胶在低温环境中具有良好的剥离强度和施工性能，具有很好的粘结性、密封性和稳定性，工艺简单，成本低。 The hot-melt adhesive prepared by the invention has good peeling strength and construction performance in a low-temperature environment, good adhesion, sealing and stability, simple process and low cost.
具体实施方式 detailed description
实施例1 Example 1
一种低温热熔胶，它是由下述重量份（公斤）的原料组成的： A low-temperature hot-melt adhesive, which is composed of the following raw materials in parts by weight (kg):
茂金属乙烯-辛烯共聚物50、乙烯-丙烯酸乙酯共聚物50、松香10、马来酸酐接枝聚丙烯7、2,6-二叔丁基对甲酚2、丙烯酸异辛酯3、液体石蜡3、磷酸二氢铵0.3、增粘剂7； Metallocene ethylene-octene copolymer 50, ethylene-ethyl acrylate copolymer 50, rosin 10, maleic anhydride grafted polypropylene 7, 2,6-di-tert-butyl-p-cresol 2, isooctyl acrylate 3, Liquid paraffin 3, ammonium dihydrogen phosphate 0.3, tackifier 7;
所述的增粘剂是由下述重量份的原料组成的： Described tackifier is made up of the raw material of following weight part:
萜烯树脂40、C5石油树脂30、氟硅酸钠5、硅烷偶联剂KH-5501、吡啶硫酮锌0.3、聚乳酸2-3、聚四氢呋喃醚二醇1； Terpene resin 40, C5 petroleum resin 30, sodium fluorosilicate 5, silane coupling agent KH-5501, zinc pyrithione 0.3, polylactic acid 2-3, polytetrahydrofuran ether glycol 1;
将上述萜烯树脂与C5石油树脂混合加热到100℃，加入氟硅酸钠，保温搅拌15分钟，降低温度为75℃，加入吡啶硫酮锌，充分混合，降低温度为65℃，加入硅烷偶联剂KH-550，800转/分搅拌分散6分钟，加入剩余各原料，充分混合，即得所述增粘剂。 Mix the above terpene resin and C5 petroleum resin and heat to 100°C, add sodium fluorosilicate, keep stirring for 15 minutes, reduce the temperature to 75°C, add zinc pyrithione, mix well, reduce the temperature to 65°C, add silane Joint agent KH-550, stirred and dispersed at 800 rpm for 6 minutes, added the remaining raw materials and mixed thoroughly to obtain the thickener.
一种低温热熔胶的制备方法，包括以下步骤： A preparation method for low-temperature hot melt adhesive, comprising the following steps:
（1）将上述茂金属乙烯-辛烯共聚物、乙烯-丙烯酸乙酯共聚物、松香、2,6-二叔丁基对甲酚、丙烯酸异辛酯、液体石蜡混合加热到160℃，保温搅拌40分钟； (1) Mix the above-mentioned metallocene ethylene-octene copolymer, ethylene-ethyl acrylate copolymer, rosin, 2,6-di-tert-butyl-p-cresol, isooctyl acrylate, and liquid paraffin and heat to 160°C, keep warm Stir for 40 minutes;
（2）加入增粘剂，在200℃下继续保温搅拌15分钟，加入剩余各原料，充分混合后，制成胶片或颗粒，即得所述低温热熔胶。 (2) Add a tackifier, continue to heat and stir at 200°C for 15 minutes, add the remaining raw materials, mix well, and make a film or granule to obtain the low-temperature hot-melt adhesive.
性能测试： Performance Testing:
23℃对PE粘接强度N/cm（≥70）：105； Adhesive strength to PE at 23°C N/cm (≥70): 105;
23℃对环氧底漆钢粘接强度N/cm（≥70）：104。 Adhesive strength to epoxy primer steel at 23°C N/cm (≥70): 104.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310401046.XA CN103509489B (en) | 2013-09-06 | 2013-09-06 | A low temperature hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310401046.XA CN103509489B (en) | 2013-09-06 | 2013-09-06 | A low temperature hot melt adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103509489A CN103509489A (en) | 2014-01-15 |
| CN103509489B true CN103509489B (en) | 2016-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310401046.XA Expired - Fee Related CN103509489B (en) | 2013-09-06 | 2013-09-06 | A low temperature hot melt adhesive |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111909637A (en) * | 2020-06-24 | 2020-11-10 | 杭州可靠护理用品股份有限公司 | Low temperature hot melt adhesive for diaper processing and processing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559078A (en) * | 2011-12-28 | 2012-07-11 | 广州鹿山新材料股份有限公司 | Hot melt adhesive membrane for bonding bi-metallic composite plate and preparing method thereof |
| CN103045111A (en) * | 2012-12-25 | 2013-04-17 | 广州鹿山新材料股份有限公司 | Polyester hot melt adhesive for bonding polar polymer with metal |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8197947B2 (en) * | 2009-12-01 | 2012-06-12 | Equistar Chemicals, Lp | Adhesive compositions |
| JP5789382B2 (en) * | 2011-02-25 | 2015-10-07 | ヘンケルジャパン株式会社 | Hot melt adhesive |
| CA2832601C (en) * | 2011-04-08 | 2019-06-04 | Bostik, Inc. | Polyolefin based hot melt adhesive containing a solid plasticizer |
| JP5850682B2 (en) * | 2011-09-16 | 2016-02-03 | ヘンケルジャパン株式会社 | Hot melt adhesive |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559078A (en) * | 2011-12-28 | 2012-07-11 | 广州鹿山新材料股份有限公司 | Hot melt adhesive membrane for bonding bi-metallic composite plate and preparing method thereof |
| CN103045111A (en) * | 2012-12-25 | 2013-04-17 | 广州鹿山新材料股份有限公司 | Polyester hot melt adhesive for bonding polar polymer with metal |
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| CN103509489A (en) | 2014-01-15 |
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Effective date of registration: 20160510 Address after: 241200 Anhui city of Wuhu province Fanchang County Economic and Technological Development Zone Beisi entrepreneurial Science Park Patentee after: Fanchang Beisi Productivity Promotion Center Co., Ltd. Address before: 241200 Anhui city of Wuhu province Fanchang County Economic Development Zone Science and technology park business times thinking Patentee before: Wuhu City Zheng Tong Electric Appliance Equipment Co., Ltd |
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Effective date of registration: 20180425 Address after: 510000 Guangzhou, Liwan District, Guangdong Province, South China Street, Hailong Road, 36, Mount Huang Gang hill, 8 two. Patentee after: Guangzhou Ke BondA Plastic Co., Ltd. Address before: 241200 Anhui County Wuhu City Fanchang County Economic and Technological Development Zone Bi Si pioneering science and Technology Park Patentee before: Fanchang Beisi Productivity Promotion Center Co., Ltd. |
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