CN103542940B - A kind of infrared imaging detection chip measured based on wave vector - Google Patents

Abstract

The invention discloses an infrared imaging detection chip based on wave vector measurement, which includes an area array infrared refraction microlens, an area array uncooled infrared detector and a drive control preprocessing module; wherein the area array uncooled infrared detector is located in the At the focal plane of the area array infrared refracting microlens, it is divided into a plurality of sub-array uncooled infrared detectors distributed in arrays, and each sub-array uncooled infrared detector includes multiple arrays distributed in the same number and arrangement. The photosensitive element; the area array infrared refraction microlens includes a plurality of unit infrared refraction microlenses distributed in an array, and each unit of the infrared refraction microlens corresponds to a sub-array uncooled infrared detector. The infrared imaging detection chip of the present invention can measure a wide range of infrared wave vector directions, high measurement accuracy, compact structure, good environmental adaptability, and is easy to match and couple with conventional infrared optical systems, electronic and mechanical devices.

Description

An infrared imaging detection chip based on wave vector measurement

technical field

The invention belongs to the technical field of infrared imaging detection, and more specifically relates to an infrared imaging detection chip based on wave vector measurement.

Background technique

Generally speaking, when the multi-directional infrared beams emitted from the target are transmitted in the atmosphere, they show a spatial distribution form such as gradual divergence. The difference in energy transfer effectiveness of beams with different wave vector directions reflects the different properties of the target and its different parts in their ability to project infrared energy into the surrounding airspace. This property can be attributed to the directional difference of the power flow distribution of the optical field caused by the change of the wave vector direction of the transmission beam. That is to say, closely related to the structure, shape, attitude, orientation and distance of the target, the changes in the spatial distribution and evolution of the energy flow field of the infrared outgoing light wave are related to the spatial distribution and propagation form of the wave vector of the infrared beam. difference, there is a causal or recursive association. The above-mentioned differences or correlations can be reproduced in the form of planar electronic attitude images with changes in the topographical features of the target through conventional imaging detection operations, thus forming the physical and technical basis for imaging detection based on wave vector measurement.

In the aspect of imaging detection based on wave vector measurement, the current work mainly focuses on the visible spectrum domain. It is manifested by measuring the three-dimensional distribution and evolution of the target light wave based on the wave vector, obtaining the electronic target image corresponding to the wave vector cluster with only subtle direction differences, and the sequence electronic target image corresponding to the multi-wave vector cluster; developing high-speed and efficient algorithms Classify, expand, refine and modify electronic image information. Progress in key imaging detection architectures and digital image information processing is currently extremely rapid. Typical technical features include: (1) three-dimensional electronic target image reconstruction based on sequenced plane electronic attitude images; (2) expanding electronic image sequences based on digital means to obtain a more complete and delicate electronic target image set; Concentrate on selecting a certain (category) image to realize the electronic refocusing of the digital image target, and further clarify or blur the image; (4) In the electronic target scene, by selecting different areas or depths of field, it is equivalent to the object space New objects with different distances are used as focus points to clear or fade or blur the scene; (5) Adjust the electronic target posture by selecting a specific image sequence to form a three-dimensional effect similar to conventional three-dimensional images, etc. The imaging detection technology based on wave vector measurement is moving towards the direction of fast and even real-time construction of target images based on the hardware improvement of ultra-large area array optical/optical architecture and algorithm enhancement, thereby significantly improving the imaging detection efficiency.

So far, although infrared imaging detection technology has been widely used, because the wavelength of infrared electromagnetic radiation is much longer than that of visible light, the imaging spot on the infrared focal plane is much larger than that of visible light, which makes the infrared image more accurate in terms of clarity, contrast and details. , compared with the visible light image, it presents an intrinsic gap and degrades the image. In addition, considering the low energy state of infrared electromagnetic radiation, the photoelectric sensitivity of area array photosensitive structures based on infrared CCD, CMOS or FPAs is still much lower than that of visible light. In order to obtain sufficient photoelectric response signal strength, the unit photosensitive element still needs to have a sufficiently large surface size. This structure requires that the array scale of the current arrayed infrared photosensitive structure is much smaller than that of visible light. The above factors lead to the fact that the image quality of infrared imaging detection based on focal plane architecture is much lower than that of visible light images, and this situation will remain for a long time. Therefore, how to extend the imaging detection architecture based on wavevector measurement in the visible spectral domain to the infrared spectral domain, and find technical measures that can make up for or even overcome the above-mentioned defects to improve the infrared image quality and imaging detection efficiency, is still blank at present, and it is also necessary to develop advanced infrared The key and difficult issues faced by imaging detection technology urgently need new breakthroughs.

Contents of the invention

In view of the above defects or improvement needs of the prior art, the present invention provides an infrared imaging detection chip based on wave vector measurement, which has a large range of change in the measurable infrared wave vector direction, high measurement accuracy, compact structure, and good environmental adaptability , easy to match and couple with conventional infrared optical systems, electronics and mechanical devices.

In order to achieve the above object, the present invention provides an infrared imaging detection chip, which is characterized in that it includes an area array infrared refraction microlens, an area array uncooled infrared detector and a drive control preprocessing module; wherein the area array uncooled The infrared detector is located at the focal plane of the infrared refracting microlens of the area array, and is divided into a plurality of sub-array uncooled infrared detectors distributed in arrays, and each sub-array uncooled infrared detector includes the same number and arrangement A plurality of photosensitive elements distributed in an array; the area array infrared refraction microlens includes a plurality of unit infrared refraction microlenses distributed in an array, and each unit of the infrared refraction microlens corresponds to a sub-array uncooled infrared detector; the surface The array of infrared refraction microlenses is used to focus the target infrared light waves. Each unit of infrared refraction microlenses discretizes the incident light waves in different wave vector directions, and directional converges on the sub-surface array corresponding to the unit's infrared refraction microlenses for uncooled infrared detection. On the corresponding photosensitive element of the detector, the said area array infrared refracting microlens makes the incident light in the same wave vector direction focus on the photosensitive element at the same position of the multiple sub-array uncooled infrared detectors; the said area array uncooled infrared detector The device is used to convert the light waves focused on multiple sub-array uncooled infrared detectors into electrical signals, and obtain the arrayed infrared photoelectric response signals corresponding to the infrared beams in different wave vector directions; the drive control preprocessing module is used for The arrayed infrared photoelectric response signals are quantified and corrected for non-uniformity, and the sequence infrared image data corresponding to the wave vector distribution and space transmission of the target outgoing beam is obtained.

Preferably, the sub-array uncooled infrared detector has m×n elements, where m and n are both integers greater than 1.

Preferably, the control preprocessing module quantifies the arrayed infrared photoelectric response signals, solves them and performs non-uniformity correction.

Preferably, the control preprocessing module adopts a structure combining SoC and FPGA.

Preferably, the drive control preprocessing module is also used to provide driving and regulation signals for the area array uncooled infrared detector, to drive the area array uncooled infrared detector to work, and to control the area array uncooled infrared detector. The electrical signal converted by the detector is regulated.

Preferably, it also includes a ceramic housing and a metal supporting cooling plate; wherein, the ceramic housing is located above the metal supporting cooling plate, and the metal supporting cooling plate is fixedly connected with the ceramic housing for supporting and dissipating heat. The drive and control preprocessing module, the area array uncooled infrared detector and the area array infrared refracting microlens are coaxially placed in the ceramic housing, wherein the area array uncooled infrared detector is located in the The top of the control preprocessing module, the area array infrared refraction microlens is located above the area array uncooled infrared detector, and the light incident surface of the area array infrared refraction microlens is opened through the face of the ceramic shell The holes are exposed.

Preferably, the drive and control preprocessing module is provided with a second port and a second indicator light, and the area array uncooled infrared detector is provided with a third port and a third indicator light; the second port is used for Outputting the drive and regulation signals provided by the driving and control preprocessing module to the area array uncooled infrared detector, and the second port is also used to input the driving and control signals provided by the area array uncooled infrared detector to the driving control preprocessing The infrared photoelectric response signal of the processing module, the second port is also used to receive the work instruction input from the external device to the infrared large depth-of-field imaging detection chip, and the second indicator light is used to indicate whether the drive control preprocessing module is In a normal working state; the third port is used to input the drive and regulation signals provided by the driving and control preprocessing module to the area array uncooled infrared detector, and the third port is also used to output the area array uncooled infrared detector The array of uncooled infrared detectors provides infrared photoelectric response signals to the drive control preprocessing module, and the third indicator light is used to indicate whether the uncooled infrared detectors are in a normal working state.

Preferably, the control preprocessing module is provided with a fourth port and a fourth indicator light, the fourth port is used to output the sequence infrared image data from the control preprocessing module, and the fourth The indicator light is used to indicate whether the drive control preprocessing module is in a normal data output state.

Preferably, the drive control preprocessing module is provided with a first port and a first indicator light, the first port is used to connect the power line to connect to an external power supply, and the first indicator light is used to indicate whether the power supply is connected Pass.

Generally speaking, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:

1. Single-chip imaging detection of the three-dimensional spatial characteristics of the target. By coupling the area array infrared refraction microlens with the area array uncooled infrared detector, the capture and imaging detection operations of infrared radiation in different wave vector directions are realized, and it has the characteristics of acquiring sequential target images based on a single-chip functional infrared detection array.

2. High measurement accuracy. The invention adopts an area array refraction microlens and an area array uncooled infrared detector, both of which have extremely high array scale and are mixed and integrated to have extremely high structural stability.

3. The measurement range of the infrared wave vector direction is large. Since the present invention adopts a detection framework of one-to-one correspondence between the infrared refracting microlens and the sub-array uncooled infrared detector, it has the advantage of a large measurable range of the wave vector direction of the target light wave.

4. Good environmental adaptability. Since the present invention adopts an uncooled infrared detector based on thermal effects, and an infrared refracting microlens with a fixed shape, has a wide measurement spectrum and works at room temperature, the present invention has the advantage of good environmental adaptability.

5. Easy to use. The area array infrared refraction microlens, area array uncooled infrared detector and drive control preprocessing module of the present invention are integrated on a single chip, which has the advantages of convenient plugging and easy matching and coupling with conventional infrared optical systems, electronic and mechanical devices .

Description of drawings

Fig. 1 is a schematic structural view of an infrared imaging detection chip according to an embodiment of the present invention;

Fig. 2 is a working principle diagram of the infrared imaging detection chip according to an embodiment of the present invention, wherein (A) is a working principle diagram for a strong radiation target; (B) is a working principle diagram for a weak radiation target; (C) is a working principle diagram for a weak radiation target; An example of the focal spot distribution formed by the wave vector direction infrared beam on the sub-array uncooled infrared detector.

In Figure 1: 1-first indicator light, 2-first port, 3-second indicator light, 4-third indicator light, 5-second port, 6-third port, 7-drive control preprocessing module , 8-area uncooled infrared detector, 9-area infrared refracting microlens, 10-the fourth indicator light, 11-the fourth port, 12-metal support cooling plate, 13-ceramic shell.

detailed description

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

Generally speaking, the infrared outgoing light wave of the target spreads and propagates in a gradually increasing airspace. The difference in energy transfer efficiency of beams with different wave vector directions reflects the property that the ability of the target or its different parts to project infrared energy to the surrounding airspace is different, which can be attributed to the transmission light field due to its wave vector direction The difference in the direction of the energy flow distribution of the light field caused by the difference. This difference is presented as a sequence of electronic images in which the characteristics of the target change through the infrared imaging detection operation. Similar to this, the infrared targets at different object distances will also be converted into sequential electronic target images with changed characteristics by the imaging system based on the differences in the spatial distribution and transmission form of the wave vector of the outgoing light field. In other words, the changes in the spatial distribution and evolution of the infrared outgoing light wave energy flow field, which are closely related to the structure, shape, attitude, orientation, and distance of the target, are different from the spatial distribution and propagation form of the wave vector of the target light field. Causal or recursive association. The aforementioned differences are reproduced in the form of sequential electronic images of altered target characteristics through imaging detection operations. Therefore, by acquiring electronic images that are sensitive to the beam transmission direction of the target light field, and constructing the three-dimensional target and its spatial motion behavior based on the sequence image information, it constitutes the basis for infrared imaging detection based on wave vector measurement.

As shown in FIG. 1 , the infrared imaging detection chip of the present invention includes: a drive and control preprocessing module 7 , an area array uncooled infrared detector 8 , an area array infrared refracting microlens 9 , a ceramic shell 13 and a metal support cooling plate 12 .

The ceramic shell 13 is located above the metal supporting heat dissipation plate 14 . The metal supporting heat dissipation plate 14 is fixedly connected with the ceramic shell 13 for supporting and dissipating heat. The drive and control preprocessing module 7 , the area array uncooled infrared detector 8 and the area array infrared refraction microlens 9 are coaxially placed in the ceramic shell 13 in sequence. Among them, the drive control preprocessing module 7 adopts a structure combining SoC and FPGA, the area array uncooled infrared detector 8 is located above the drive control preprocessing module 7, and the area array infrared refracting microlens 9 is located at the area array uncooled infrared detector 8 The top and its light incident surface are exposed through the face opening of the ceramic shell 13 .

The area array uncooled infrared detector 8 is located at the focal plane of the area array infrared refracting microlens 9 . The area array uncooled infrared detector 8 is divided into a plurality of array sub-array uncooled infrared detectors, and each sub-array uncooled infrared detector includes a plurality of array-distributed photosensitive elements with the same number and arrangement. The area array infrared refraction microlens 9 includes a plurality of unit infrared refraction microlenses distributed in an array, each unit of the infrared refraction microlens corresponds to a sub-array uncooled infrared detector, and the sub-array uncooled infrared detector is m×n elements , where m and n are both integers greater than 1. For example, the sub-array uncooled infrared detector can be a 2×2 element, 4×4 element, 8×8 element or even larger array.

The area array infrared refraction microlens 9 is used to focus the target infrared light wave. Each unit of the infrared refraction microlens discretizes the incident light rays in different wave vector directions, and directional converges on the sub-array uncooled corresponding to the unit infrared refraction microlens. On the corresponding photosensitive elements of the infrared detector, the area array infrared refracting microlens 9 directs the incident light in the same wave vector direction to converge on the photosensitive elements at the same position of the multiple sub-array uncooled infrared detectors.

The area array uncooled infrared detector 8 is used to convert light waves converged on multiple sub-array uncooled infrared detectors into electrical signals to obtain arrayed infrared photoelectric response signals corresponding to infrared beams with different wave vector directions.

The drive and control preprocessing module 7 is used to quantify the arrayed infrared photoelectric response signals and perform non-uniformity correction to obtain sequence infrared image data corresponding to the wave vector distribution and spatial transmission of the target outgoing beam.

The drive and control preprocessing module 7 is also used to provide driving and regulation signals for the area array uncooled infrared detector 8, drive the area array uncooled infrared detector 8 to work, and regulate the electrical signal converted by the area array uncooled infrared detector 8 .

The drive control preprocessing module 7 is provided with a first port 2 , a second port 5 , a fourth port 11 , a first indicator light 1 , a second indicator light 3 and a fourth indicator light 10 . Among them, the first port 2 is used to connect the power line to connect to an external power supply, and the second port 5 is used to output the drive and control signals provided by the drive control preprocessing module 7 to the area array uncooled infrared detector 8, and is also used to input The area array uncooled infrared detector 8 provides the infrared photoelectric response signal to the drive control preprocessing module 7, and is also used to receive work instructions input from external equipment to the detector. The fourth port 11 is used to transfer the sequence infrared image data from the drive control The output of the preprocessing module 7, the first indicator light 1 is used to indicate whether the power is turned on, the first indicator light 1 is on when the power is turned on, otherwise it is extinguished, and the second indicator light 3 is used to indicate whether the driving and control preprocessing module 7 is in the In the normal working state, if the driving and control preprocessing module 7 is in the normal working state, the second indicator light 3 will flicker, otherwise it will be off, and the fourth indicator light 10 is used to indicate whether the driving and control preprocessing module 7 is in the normal data output state, and the driving and control When the pre-processing module 7 is in the normal data output state, the fourth indicator light 10 is blinking, otherwise it is off.

The area array uncooled infrared detector 8 is provided with a third port 6 and a third indicator light 4 . Among them, the third port 6 is used to input the drive and control signals provided by the drive control preprocessing module 7 to the area array uncooled infrared detector 8, and is also used to output the area array uncooled infrared detector 8 to be provided to the drive control preprocessing module 7 infrared photoelectric response signal, the third indicator light 4 is used to indicate whether the area array uncooled infrared detector 8 is in a normal working state, the third indicator light 4 flashes when the uncooled infrared detector 8 is in a normal working state, otherwise off.

The first port 2, the second port 5, the third port 6, the fourth port 11, the first indicator light 1, the second indicator light 3, the third indicator light 4 and the fourth indicator light 10 all pass through the ceramic shell 13. Facial openings are exposed.

The working process of the infrared imaging detection chip of the embodiment of the present invention will be described below with reference to FIG. 1 .

First connect the second port 5 and the third port 6 with a parallel signal line, connect the parallel communication line to the second port 5, connect the parallel data line to the fourth port 11, and connect the power line to the first port 2. The second port 5 sends a power-on command through the parallel communication line, and the detector starts self-checking. At this time, the first indicator light 1, the second indicator light 3, the third indicator light 4, and the fourth indicator light 10 are switched on and blink. After the self-test is passed, the first indicator light 1 lights up, the second indicator light 3, the third indicator light 4, and the fourth indicator light 10 go out, and the detector enters the working state. After the start-up command is sent from the second port 5 through the parallel communication line, the detector starts to measure the photoelectric response signal. The drive and control preprocessing module 7 inputs driving and regulation signals to the area array uncooled infrared detector 8 through the second port 5 and the third port 6, and the area array uncooled infrared detector 8 passes through the second port 5 and the third port 6 to the The driving control preprocessing module 7 outputs an infrared photoelectric response signal, and at this time, the second indicator light 3 and the third indicator light 4 are turned on and blink again. The sequence of infrared image data obtained after the infrared photoelectric response signal is processed by the drive control preprocessing module 7 is output by the fourth port 11 , and at this time the fourth indicator light 10 is turned on and blinks again.

Fig. 2 is a working principle diagram of the infrared imaging detection chip of the embodiment of the present invention when detecting an infrared image target. In order to enable those skilled in the art to better understand the present invention, the following describes in detail the infrared imaging detection chip of the present invention in conjunction with Fig. 2 working principle.

As shown in Figure 2(A), any object point on the image target emits a radial multi-directional conical beam to the surrounding airspace, and evolves into a traveling light with a relatively fixed transmission direction, and its direction is the wave vector direction. The area array infrared refraction microlens is matched and coupled with the area array uncooled infrared detector to form an infrared imaging detection framework based on wave vector measurement. Under the set array scale or spatial resolution mode, each unit of infrared refracting microlens corresponds to a 4×4 element sub-array uncooled infrared detector. For strong radiation targets, through the directional focusing effect of each unit infrared refraction microlens on the specific wave vector incident beam, the slight difference in wave vector direction of the linearized conical beam, through the discrete arrangement of the incident beam by the micro lens It is displayed, and is further directed and focused on the corresponding photosensitive elements of the sub-array uncooled infrared detectors corresponding to the infrared refracting microlenses of each unit. The area array infrared refraction microlens makes the incident light in the same wave vector direction converge on the photosensitive element at the same position of multiple sub-array uncooled infrared detectors, so that the incident light passes through the micro lens array according to its wave vector direction, realizing wave-based Arrayed discretization and refocusing in the sagittal direction. typically by The focal spot formed by the infrared beam represented by the wave vector is shown in Fig. 2 (A). In order to make the graphic expression clear, each 4×4 element sub-array uncooled infrared detector in the figure corresponds to an infrared beam in the direction of the wave vector The focal spot, the optical path of the other two wave vector infrared beams and the focal spot formed by them are omitted and not shown.

The area array uncooled infrared detector converts the incident light wave into an electrical signal, and obtains an array of infrared photoelectric response signals corresponding to arrayed infrared beams in different wave vector directions. The drive and control preprocessing module (not shown in the figure) quantifies the arrayed infrared photoelectric response signals and performs non-uniformity correction to obtain the sequence infrared image data corresponding to the wave vector distribution of the target outgoing beam, that is, to obtain Multiple plane pose image data of the target observed from different angles of view within the range.

As shown in Figure 2(B), for weak radiation targets, it is necessary to use the imaging optical system composed of the primary mirror to improve the collection ability of the infrared outgoing beam of the target. The infrared image information capture operation is carried out by placing the infrared imaging detection chip based on the wave vector measurement at the focal plane of the primary mirror or performing a weak defocus configuration. Since the imaging optical system first performs a converging operation on the infrared target light wave, that is, the primary mirror performs a beamforming compression on it, the wave vector distribution of the infrared target beam will change accordingly. Considering this factor, after quantifying the infrared photoelectric signal through the drive control preprocessing module, it is necessary to perform corresponding calculations, and then perform non-uniformity correction to obtain the sequence infrared image data of the target.

Figure 2(C) shows a typical distribution of focal spots formed by infrared beams with different wave vector directions on a sub-array uncooled infrared detector. As shown in the figure, the unit infrared refracting microlens will The discretization of the light beam in the direction is then focused on the specific photosensitive element of the sub-array uncooled infrared detector.

The infrared imaging detection chip of the present invention can measure The infrared wave vector has a large range of changes, high measurement accuracy, and can realize imaging detection of dynamic/static target space features. It has good environmental adaptability, is easy to use, and is easy to match and couple with conventional infrared optical systems, auxiliary electronics and mechanical devices.

It is easy for those skilled in the art to understand that the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention, All should be included within the protection scope of the present invention.

Claims (8)

1. An infrared imaging detection chip is characterized by comprising an area array infrared refraction micro lens, an area array uncooled infrared detector and a driving and controlling preprocessing module; wherein,

the area array uncooled infrared detector is positioned at the focal plane of the area array infrared refraction micro lens and is divided into a plurality of sub-area array uncooled infrared detectors distributed in an array, and each sub-area array uncooled infrared detector comprises a plurality of photosensitive elements distributed in an array in the same number and arrangement mode;

the area array infrared refraction micro lens comprises a plurality of unit infrared refraction micro lenses distributed in an array, and each unit infrared refraction micro lens corresponds to one sub-area array uncooled infrared detector;

the area array infrared refraction micro lens is used for focusing target infrared light waves, each unit of infrared refraction micro lens enables incident light waves in different wave vector directions to be distributed in a discretization mode and directionally converged on corresponding photosensitive elements of the sub-area array uncooled infrared detector corresponding to the unit of infrared refraction micro lens, and the area array infrared refraction micro lens enables incident light rays in the same wave vector direction to be directionally converged on the photosensitive elements at the same position of the plurality of sub-area array uncooled infrared detectors;

the area array uncooled infrared detector is used for converting light waves focused on the plurality of sub-area array uncooled infrared detectors into electric signals to obtain arrayed infrared photoelectric response signals corresponding to infrared beams in different wave vector directions;

the driving and controlling preprocessing module adopts a structure of combining SoC and FPGA and is used for quantizing the arrayed infrared photoelectric response signals and carrying out non-uniformity correction to obtain sequence infrared image data corresponding to wave vector distribution and space transmission conditions of target emergent beams.

2. The infrared imaging detection chip of claim 1, wherein the non-refrigerated infrared detector of the sub-area array is an m x n element, where m and n are integers greater than 1.

3. The infrared imaging detection chip of claim 1, characterized in that the actuation preprocessing module quantizes, resolves, and corrects non-uniformity the arrayed infrared photoelectric response signals.

4. The infrared imaging detection chip of any one of claims 1 to 3, wherein the driving and controlling preprocessing module is further configured to provide driving and controlling signals for the area array uncooled infrared detector, drive the area array uncooled infrared detector to operate, and control the photoelectric signal converted by the area array uncooled infrared detector.

5. The infrared imaging detection chip of any one of claims 1 to 3, further comprising a ceramic housing and a metal supporting heat sink; wherein,

the ceramic package is located the top of metal-support heating panel, the metal-support heating panel with the ceramic package links admittedly for support and heat dissipation, drive accuse preprocessing module non-refrigeration infrared detector of area array with the coaxial order of area array infrared refraction microlens is arranged in the ceramic package, wherein, area array non-refrigeration infrared detector is located drive the top of accuse preprocessing module, area array infrared refraction microlens is located area array non-refrigeration infrared detector's top, just the light incident plane of area array infrared refraction microlens passes through the facial trompil of ceramic package exposes outside.

6. The infrared imaging detection chip of claim 5, wherein the driving and controlling preprocessing module is provided with a second port and a second indicator light, and the area array uncooled infrared detector is provided with a third port and a third indicator light;

the second port is used for outputting a driving and regulating signal provided by the driving and controlling preprocessing module for the area array uncooled infrared detector, inputting an infrared photoelectric response signal provided by the area array uncooled infrared detector for the driving and controlling preprocessing module, receiving a working instruction input by external equipment to the infrared imaging detection chip, and indicating whether the driving and controlling preprocessing module is in a normal working state by the second indicator light;

the third port is used for inputting driving and regulating signals provided by the driving and controlling preprocessing module for the area array uncooled infrared detector, the third port is also used for outputting infrared photoelectric response signals provided by the area array uncooled infrared detector for the driving and controlling preprocessing module, and the third indicator light is used for indicating whether the uncooled infrared detector is in a normal working state or not.

7. The infrared imaging detection chip of claim 6, wherein a fourth port and a fourth indicator light are disposed on the driving preprocessing module, the fourth port is configured to output the sequence infrared image data from the driving preprocessing module, and the fourth indicator light is configured to indicate whether the driving preprocessing module is in a normal data output state.

8. The infrared imaging detection chip of claim 7, wherein the driving and preprocessing module is provided with a first port and a first indicator light, the first port is used for connecting a power line to connect an external power supply, and the first indicator light is used for indicating whether the power supply is turned on.